CN106125864A - A kind of cpu heat of CNT heat conduction - Google Patents
A kind of cpu heat of CNT heat conduction Download PDFInfo
- Publication number
- CN106125864A CN106125864A CN201610480237.3A CN201610480237A CN106125864A CN 106125864 A CN106125864 A CN 106125864A CN 201610480237 A CN201610480237 A CN 201610480237A CN 106125864 A CN106125864 A CN 106125864A
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- thermal conducting
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
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- Organic Chemistry (AREA)
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Abstract
The invention provides the cpu heat of a kind of CNT heat conduction, including heat radiator body and radiator fan, described heat radiator body includes that radiating fin and thermal conducting agent, described thermal conducting agent are the CNT thermal conducting agent that following parts by weight of component forms: heat conductive silica gel 30 40 parts, CNT 39 parts, silane coupler 26 parts, Tissuemat E 26 parts, TNEDIS 3.6 10.8 parts, boron nitride 6 10 parts, aluminium oxide 6 10 parts, 24 parts of argentum powder, Pulvis Talci 15 25 parts.Cpu heat compact conformation of the present invention, heat radiation is efficiently, the present invention uses rational component proportion, being combined by heat conductive silica gel and CNT, heat conductivity is high, and heat conduction and heat radiation is effective, reasonable employment amount of filler, thermal impedance is relatively low, has good coating and the performance that paves, ensures the insulating properties of material simultaneously.
Description
Technical field
The invention belongs to electronic-device radiator apparatus field, be specifically related to the cpu heat of a kind of CNT heat conduction.
Background technology
Along with high power, the high integration of integrated circuit, the packing density of electronic devices and components continues to increase and equipment
Physical dimension is constantly reduced, and its power consumption output is increased dramatically.Therefore, in order to ensure the reliability of operation of Sensitive Apparatus and longer
Service life so that the research of the heat-conducting insulation material that heat produced by heating electronic component can be discharged in time is increasingly
Important.
CPU is a ultra-large integrated circuit, is computing and the control core of computer.Along with constantly sending out of computer
Exhibition, CPU constantly updates, and the number of transistors in CPU is continuously increased；The caloric value of device is consequently increased.In order to ensure to calculate
The good of machine runs and the radiating efficiency of CPU, needs to dispel the heat CPU.It is currently used for CPU heat radiation and the heat conduction of computer
Realization is by following approach, and between fin with CPU, heat transfer is main by directly contacting realization between fin with CPU.
In order to solve electronic component heat conduction and heat radiation problem, industrial quarters is installed radiator at electronical elements surface and is dispelled the heat, radiator
And use silicone grease to be filled with between CPU, make the laminating between fin and CPU tightr.But during actually used,
These three layers of contact surfaces after laminating of CPU silicone grease fin can not reach preferable burnishing surface, still deposits in interface gaps
There is air, increase interface resistance, seriously hinder the conduction of heat, and silicone grease is during smearing, can not well control
The smearing thickness of silicone grease processed, the radiating effect that impact is overall, the efficiency causing heat conduction and heat radiation is undesirable.
Summary of the invention
It is an object of the invention to, it is provided that a kind of compact conformation, the cpu heat of efficient CNT heat conduction of dispelling the heat,
Thermal conducting agent formula is reasonable, has good coating and the performance that paves, and heat conductivity is high, and heat conduction and heat radiation is effective, heat filling
In right amount, thermal impedance is little.
For solving above-mentioned technical problem, it is achieved above-mentioned purpose, technical scheme is as follows:
The cpu heat of a kind of CNT heat conduction of the present invention, including heat radiator body and radiator fan, described heat radiation
Body includes radiating fin and thermal conducting agent；Described thermal conducting agent includes the CNT thermal conducting agent that following parts by weight of component forms:
Heat conductive silica gel 30-40 part, CNT 3-9 part, silane coupler 2-6 part, Tissuemat E 2-6 part, TNEDIS 3.6-10.8
Part, boron nitride 6-10 part, aluminium oxide 6-10 part, argentum powder 2-4 part, Pulvis Talci 15-25 part.
Preferably, it is made up of the component of following weight portion: heat conductive silica gel 32-38 part, CNT 5-7 part, silane coupled
Agent 3-5 part, Tissuemat E 3-5 part, TNEDIS 6-8.4 part, boron nitride 7-9 part, aluminium oxide 7-9 part, argentum powder 2-3 part, Pulvis Talci
18-22 part.
Preferably, be made up of the component of following weight portion: heat conductive silica gel 35 parts, CNT 6 parts, silane coupler 4 parts,
Tissuemat E 4 parts, TNEDIS 7.2 parts, boron nitride 8 parts, aluminium oxide 8 parts, 3 parts of argentum powder, Pulvis Talci 20 parts.
Preferably, described heat conductive silica gel is the one in de-oxime type silica gel or dealcoholized type silica gel.
Preferably, described CNT is diameter 10-30nm, the high conductivity multi-walled carbon nano-tubes of length 5-30 μm.
Preferably, described silane coupler be the one in organo silane coupling agent or silane coupling agent or
Two kinds.
Beneficial effect: cpu heat compact conformation of the present invention, heat radiation is efficiently.The present invention uses rational component proportion, logical
Crossing heat conductive silica gel and CNT is combined, heat conductivity is high, and heat conduction and heat radiation is effective, reasonable employment amount of filler, and thermal impedance is relatively
Low, there is good coating and the performance that paves, ensure the insulating properties of material simultaneously.
Detailed description of the invention
Below by specific embodiment, the present invention is described further, but embodiment is not limiting as the protection of the present invention
Scope.
Embodiment 1
The cpu heat of a kind of CNT heat conduction, including heat radiator body and radiator fan, described heat radiator body includes heat radiation
Fin and thermal conducting agent；Described thermal conducting agent includes the CNT thermal conducting agent that following parts by weight of component forms: heat conductive silica gel 40 parts,
CNT 3 parts, silane coupler 2 parts, Tissuemat E 2 parts, TNEDIS 3.6 parts, boron nitride 6 parts, aluminium oxide 6 parts, argentum powder 2
Part, Pulvis Talci 15 parts.
Embodiment 2
The cpu heat of a kind of CNT heat conduction, including heat radiator body and radiator fan, described heat radiator body includes heat radiation
Fin and thermal conducting agent；Described thermal conducting agent includes the CNT thermal conducting agent that following parts by weight of component forms: heat conductive silica gel 30 parts,
CNT 9 parts, silane coupler 6 parts, Tissuemat E 6 parts, TNEDIS 10.8 parts, boron nitride 10 parts, aluminium oxide 10 parts, silver
4 parts of powder, Pulvis Talci 25 parts.
Embodiment 3
The cpu heat of a kind of CNT heat conduction, including heat radiator body and radiator fan, described heat radiator body includes heat radiation
Fin and thermal conducting agent；Described thermal conducting agent includes the CNT thermal conducting agent that following parts by weight of component forms: heat conductive silica gel 38 parts,
CNT 5 parts, silane coupler 3 parts, Tissuemat E 3 parts, TNEDIS 6 parts, boron nitride 7 parts, aluminium oxide 7 parts, 2 parts of argentum powder,
Pulvis Talci 18 parts.
Embodiment 4
The cpu heat of a kind of CNT heat conduction, including heat radiator body and radiator fan, described heat radiator body includes heat radiation
Fin and thermal conducting agent；Described thermal conducting agent includes the CNT thermal conducting agent that following parts by weight of component forms: heat conductive silica gel 32 parts,
CNT 7 parts, silane coupler 5 parts, Tissuemat E 5 parts, TNEDIS 8.4 parts, boron nitride 9 parts, aluminium oxide 9 parts, argentum powder 3
Part, Pulvis Talci 22 parts.
Embodiment 5
The cpu heat of a kind of CNT heat conduction, including heat radiator body and radiator fan, described heat radiator body includes heat radiation
Fin and thermal conducting agent；Described thermal conducting agent includes the CNT thermal conducting agent that following parts by weight of component forms: heat conductive silica gel 35 parts,
CNT 6 parts, silane coupler 4 parts, Tissuemat E 4 parts, TNEDIS 7.2 parts, boron nitride 8 parts, aluminium oxide 8 parts, argentum powder 3
Part, Pulvis Talci 20 parts.
The CNT thermal conducting agent coefficient of heat transfer of the cpu heat of above-described embodiment 1-5 is 455 ~ 478W/m.K, computer
Cpu temperature ascensional range is less and can the most effectively run, generate heat less.
It should be noted that above example is only in order to illustrate technical scheme and unrestricted.Although with reference to relatively
The present invention has been described in detail by good embodiment, it will be understood by those within the art that, can be to the technology of invention
Scheme is modified or equivalent, and without deviating from the scope of technical solution of the present invention, it all should contain the power in the present invention
In profit claimed range.
Claims (5)
1. a cpu heat for CNT heat conduction, including heat radiator body and radiator fan, described heat radiator body includes dissipating
Hot fin and thermal conducting agent, it is characterised in that described thermal conducting agent is CNT thermal conducting agent.
The cpu heat of a kind of CNT heat conduction the most as claimed in claim 1, it is characterised in that described CNT
Thermal conducting agent is made up of the component of following weight portion: heat conductive silica gel 30-40 part, CNT 3-9 part, silane coupler 2-6 part, poly-
Ethylene waxes 2-6 part, TNEDIS 3.6-10.8 part, boron nitride 6-10 part, aluminium oxide 6-10 part, argentum powder 2-4 part, Pulvis Talci 15-25
Part.
The cpu heat of a kind of CNT heat conduction the most as claimed in claim 2, it is characterised in that described heat conductive silica gel
For the one in de-oxime type silica gel or dealcoholized type silica gel.
The cpu heat of a kind of CNT heat conduction the most as claimed in claim 2, it is characterised in that described CNT
For diameter 10-30nm, the high conductivity multi-walled carbon nano-tubes of length 5-30 μm.
The cpu heat of a kind of CNT heat conduction the most as claimed in claim 2, it is characterised in that described is silane coupled
Agent is the one or two kinds of in organo silane coupling agent or silane coupling agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610480237.3A CN106125864A (en) | 2016-06-28 | 2016-06-28 | A kind of cpu heat of CNT heat conduction |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610480237.3A CN106125864A (en) | 2016-06-28 | 2016-06-28 | A kind of cpu heat of CNT heat conduction |
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| Publication Number | Publication Date |
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| CN106125864A true CN106125864A (en) | 2016-11-16 |
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| CN201610480237.3A Pending CN106125864A (en) | 2016-06-28 | 2016-06-28 | A kind of cpu heat of CNT heat conduction |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108929577A (en) * | 2018-07-11 | 2018-12-04 | 桐城市新瑞建筑工程有限公司 | A kind of low thermally conductive carbon nanotube and preparation method thereof |
| CN109032303A (en) * | 2018-08-07 | 2018-12-18 | 陕西理工大学 | A kind of thermally conductive ointment preparation of computer CPU heat sink |
| JP2020026458A (en) * | 2018-08-09 | 2020-02-20 | Ｋｊ特殊紙株式会社 | Exothermic coating material, planar heating element, and method for producing exothermic coating material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1697167A (en) * | 2004-05-15 | 2005-11-16 | 鸿富锦精密工业（深圳）有限公司 | Heat sink and manufacturing method |
| CN103159437A (en) * | 2011-12-15 | 2013-06-19 | 张国庆 | Temperature adjusting humidity adjusting coating and preparation method thereof |
| CN204360312U (en) * | 2015-01-11 | 2015-05-27 | 泉州三欣新材料科技有限公司 | A kind of CPU heat abstractor with Graphene heat dissipating layer |
| CN104672911A (en) * | 2015-03-03 | 2015-06-03 | 矽照光电（厦门）有限公司 | Preparation method of carbon nanotube doped weather-proof heat conductive silicone grease for LED |
-
2016
- 2016-06-28 CN CN201610480237.3A patent/CN106125864A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1697167A (en) * | 2004-05-15 | 2005-11-16 | 鸿富锦精密工业（深圳）有限公司 | Heat sink and manufacturing method |
| CN103159437A (en) * | 2011-12-15 | 2013-06-19 | 张国庆 | Temperature adjusting humidity adjusting coating and preparation method thereof |
| CN204360312U (en) * | 2015-01-11 | 2015-05-27 | 泉州三欣新材料科技有限公司 | A kind of CPU heat abstractor with Graphene heat dissipating layer |
| CN104672911A (en) * | 2015-03-03 | 2015-06-03 | 矽照光电（厦门）有限公司 | Preparation method of carbon nanotube doped weather-proof heat conductive silicone grease for LED |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108929577A (en) * | 2018-07-11 | 2018-12-04 | 桐城市新瑞建筑工程有限公司 | A kind of low thermally conductive carbon nanotube and preparation method thereof |
| CN109032303A (en) * | 2018-08-07 | 2018-12-18 | 陕西理工大学 | A kind of thermally conductive ointment preparation of computer CPU heat sink |
| JP2020026458A (en) * | 2018-08-09 | 2020-02-20 | Ｋｊ特殊紙株式会社 | Exothermic coating material, planar heating element, and method for producing exothermic coating material |
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Application publication date: 20161116 |