CN206562400U - A kind of CPU heat transmissions heat conduction foam pad - Google Patents
A kind of CPU heat transmissions heat conduction foam pad Download PDFInfo
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- CN206562400U CN206562400U CN201720169799.6U CN201720169799U CN206562400U CN 206562400 U CN206562400 U CN 206562400U CN 201720169799 U CN201720169799 U CN 201720169799U CN 206562400 U CN206562400 U CN 206562400U
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Abstract
The utility model discloses a kind of CPU heat transmissions heat conduction foam pad, including the fire-retardant foam of heat resistance, heat-insulated thermosol, heat-conducting layer, heat conduction pressure sensitive adhesive and release liners, the fire-retardant foam of heat resistance passes through heat-insulated PUR and heat-conducting layer molding bonded, the bottom of the heat-conducting layer is provided with heat conduction pressure sensitive adhesive, the heat conduction pressure sensitive adhesive opposite side has release liners, the heat-conducting layer includes the coat of metal, PET film, graphene layer, conductive graphite paper and heat conductive insulating silica gel successively from inside to outside, and the both sides of the edge position of the heat conductive insulating silica gel is provided with heat-conducting glue.Heat conduction foam pad elasticity of the present utility model is preferably, and using after a period of time, its elasticity only has minor variations with the time, its elasticity is still very good after long-time use, heat conduction foam pad use simultaneously will not bend after a while and the thermal conductivity factor of heat conduction foam pad is better than like product so that the radiating efficiency of whole radiator is greatly improved.
Description
Technical field
The utility model is related to CPU field of radiating, and in particular to a kind of CPU heat transmissions heat conduction foam pad.
Background technology
PC and electronic product now, in supper-fast development model.Therefore, the heating of electronic original part has become
The bottleneck of restriction microelectric technique.With the continuous propulsion of technology, CPU power and performance also more and more higher, it is contemplated that CPU
Caloric value in unit area is very surprising.Therefore, CPU heat dispersion is also increasingly taken seriously.
Cpu heat plays very crucial effect, good cpu heat, it is ensured that CPU is steady to the performance of system
Fixed efficient operating, extends CPU service life.Current CPU radiating modes mainly divide three major types, and a class is wind-cooling heat dissipating, one
Class is heat pipe heat radiation, and it is exactly water-cooling to also have one kind.
Cpu heat the more commonly used at present is the combined process of wind-cooling heat dissipating or heat pipe heat radiation or both, and both dissipate
Hot mode, although radiating efficiency is not as good as water-cooling, but its is cheap, very Jing Yin in running.Therefore, as general
The first choice of computer clients.With the continuous improvement of cpu performance, the radiating efficiency of both radiating modes is all unable to catch up with its development
Trend, is limited in two kinds of radiating modes and will use heat conductive silica gel pad, this pad thermal conductivity factor is only wherein topmost
There is 5W/ (m.k) left and right, its copper pipe and aluminium flake have 300W/ by contrast（m.k）The thermal conductivity factor of left and right, therefore, thermal conductive silicon rubber cushion
Piece has had a strong impact on the radiating efficiency of whole radiator.
Utility model content
The technical problems to be solved in the utility model is to overcome the defect of prior art there is provided a kind of CPU heat transmissions heat conduction
Foam pad.
In order to solve the above-mentioned technical problem, the utility model provides following technical scheme：A kind of CPU heat transmissions heat conduction
Foam pad, including the fire-retardant foam of heat resistance, heat-insulated thermosol, heat-conducting layer, heat conduction pressure sensitive adhesive and release liners, the heat resistance resistance
Foam is fired by heat-insulated PUR and heat-conducting layer molding bonded, and the bottom of the heat-conducting layer is provided with heat conduction pressure sensitive adhesive, the heat conduction
Pressure sensitive adhesive opposite side has release liners, and the heat-conducting layer includes the coat of metal, PET film, graphene layer, led successively from inside to outside
Hot graphite paper and heat conductive insulating silica gel, the both sides of the edge position of the heat conductive insulating silica gel is provided with heat-conducting glue, two heat conduction
Conductive graphite paper and graphene layer are provided between glue, the conductive graphite paper is connected with graphene layer, the heat-conducting glue respectively with
Heat conductive insulating silica gel is connected with PET film, and the PET film bottom is connected with the coat of metal.
It is preferred that, the fire-retardant foam of heat resistance is treated polyurethane foam, and thickness is 0.5mm-30mm.
It is preferred that, the heat-insulated PUR is PA PURs, EVA hot-melt adhesive, one kind of PE PURs.
It is preferred that, the thickness of the heat-conducting layer is 0.5mm-2.0mm, and the thickness of the conductive graphite paper is 0.05mm-
0.5mm, the thickness of the graphene layer is 0.005mm-0.02mm, and the thickness of the PET film is 0.1mm-0.5mm, described
The thickness of heat conductive insulating silica gel is 0.2mm-1.0mm, and the thickness of the coat of metal is 0.005mm-0.02mm, and the heat conduction is exhausted
The width of edge silica gel is greater than the width of conductive graphite paper and graphene layer, and the width of the PET film is greater than heat conductive insulating
The width of silica gel.
It is preferred that, the coat of metal is one kind in copper, nickel, silver, gold plate.
It is preferred that, the thickness of the heat conduction pressure sensitive adhesive is 0.03mm-0.08mm, specially a kind of heat conduction acrylic pressure sensitive
Glue.
It is preferred that, the thickness of the release liners is 0.05mm-0.1mm, and the off-type force of the release liners is 15g-20g.
The beneficial effect that the utility model is reached is：
1. the elastic difference compared with the heat conduction foam pad that the utility model patent is used of heat conductive silica gel pad is far, and
And heat conductive silica gel pad, using after a period of time, its heat conductive silica gel can be hardened, and the heat conduction bubble that the utility model patent is used
Cotton pad piece elasticity only has minor variations with the time, and its elasticity is still very good after long-time use.
2. heat conductive silica gel pad using that can bend after a period of time, heat dispersion is had a strong impact on, and this practicality is new
The heat conduction foam pad that type patent is used will not then bend.
3. the heat conduction foam pad thermal conductivity factor that the utility model patent is used is better than like product so that whole radiating
The radiating efficiency of device is greatly improved.
Brief description of the drawings
Accompanying drawing is used for providing further understanding to of the present utility model, and constitutes a part for specification, with this practicality
New embodiment is used to explain the utility model together, does not constitute to limitation of the present utility model.In the accompanying drawings：
Fig. 1 is a kind of CPU heat transmissions heat conduction foam gasket construction schematic diagram of the utility model；
Fig. 2 is a kind of CPU heat transmissions heat conduction foam pad cross-sectional view of the utility model；
Fig. 3 is the structural representation of heat-conducting layer in a kind of CPU heat transmissions heat conduction foam pad of the utility model；
Fig. 4 is the structural representation that a kind of CPU heat transmissions heat conduction foam pad of the utility model is applied in cpu heat
Figure；
In figure：1st, the fire-retardant foam of heat resistance；2nd, heat-insulated thermosol；3rd, heat-conducting layer；4th, heat conduction pressure sensitive adhesive；5th, release liners；6、
Conductive graphite paper；7th, heat conductive insulating silica gel；8th, graphene layer；9th, heat-conducting glue；10th, PET film；11st, the coat of metal；12nd, radiate
Fan；13rd, fin；14th, heat conduction foam pad；15th, cpu chip；16th, PCB.
Embodiment
Preferred embodiment of the present utility model is illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein excellent
Select embodiment to be merely to illustrate and explain the utility model, be not used to limit the utility model.
Embodiment 1
As shown in Figure 1-Figure 3, a kind of CPU heat transmissions heat conduction foam pad of the present embodiment, including the fire-retardant foam of heat resistance
1st, heat-insulated thermosol 2, heat-conducting layer 3, heat conduction pressure sensitive adhesive 4 and release liners 5, the fire-retardant foam 1 of heat resistance pass through heat-insulated PUR 2
With the molding bonded of heat-conducting layer 3, the bottom of the heat-conducting layer 3 is provided with heat conduction pressure sensitive adhesive 4, and the opposite side of heat conduction pressure sensitive adhesive 4 has
Release liners 5, the heat-conducting layer 3 includes the coat of metal 11, PET film 10, graphene layer 8, conductive graphite paper 6 successively from inside to outside
With heat conductive insulating silica gel 7, the both sides of the edge position of the heat conductive insulating silica gel 7 is provided with heat-conducting glue 9, two heat-conducting glues 9 it
Between be provided with conductive graphite paper 6 and graphene layer 8, the conductive graphite paper 6 is connected with graphene layer 8, the heat-conducting glue 9 respectively with
Heat conductive insulating silica gel 7 is connected with PET film 10, and the bottom of PET film 10 is connected with the coat of metal 11.
The fire-retardant foam 1 of heat resistance is treated polyurethane foam, and thickness is 5mm, and the heat-insulated PUR 2 is
PA PURs；The thickness of the heat-conducting layer 3 is 0.765mm, and the thickness of the conductive graphite paper 6 is 0.2mm, the graphene layer
8 thickness is 0.005mm, and the thickness of the PET film 10 is 0.3mm, and the thickness of the heat conductive insulating silica gel 7 is 0.25mm,
The thickness of the coat of metal 11 is 0.01mm, and the width of the heat conductive insulating silica gel 7 is greater than conductive graphite paper 6 and graphene
The width of layer 8, the width of the PET film 10 is greater than the width of heat conductive insulating silica gel 7；The coat of metal 11 is electro-coppering
Layer；The thickness of the heat conduction pressure sensitive adhesive 4 is 0.05mm, specially heat conduction acrylate pressure sensitive adhesive；The thickness of the release liners 5 is
0.05mm, the off-type force of the release liners 5 is 15g.
Embodiment：As shown in figure 4, Fig. 4 is the specific knot for the cpu heat that the utility model is applied in CPU
Structure schematic diagram, including radiator fan 12, fin 13, heat conduction foam pad 14, cpu chip 15 and PCB 16, it is described to dissipate
Hot-air fan 12 is located at the top of cpu heat, and the radiator fan 12 is connected with fin 13, and the fin 13 can also be replaced
Radiating tube is changed to, the bottom of the fin 13 is provided with heat conduction foam pad 14, the bottom of heat conduction foam pad 14 and CPU cores
Piece 15 is connected, and the bottom of cpu chip 15 is connected with CPU line road plate 16, the heat conduction stone used in the heat conduction foam pad 14
Black paper 6 holds up to 1000W/（m.k）Thermal conductivity factor, can preferably conduct heat, aid in the superconduction hot merit of graphene layer 8
Can, heat-transfer rate faster, while graphite paper 6 and graphite can be prevented using heat conductive insulating layer of silica gel 7 as heat conductive insulating protective layer
Alkene 8 dry linting of layer or the short circuit risk brought that comes off.
Finally it should be noted that：Preferred embodiment of the present utility model is the foregoing is only, this is not limited to
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Carry out equivalent substitution.It is all it is of the present utility model spirit and principle within, any modification, equivalent substitution and improvements made etc.,
It should be included within protection domain of the present utility model.
Claims (7)
1. a kind of CPU heat transmissions heat conduction foam pad, including the fire-retardant foam of heat resistance（1）, heat-insulated thermosol（2）, heat-conducting layer
（3）, heat conduction pressure sensitive adhesive（4）And release liners（5）, the fire-retardant foam of heat resistance（1）Pass through heat-insulated thermosol（2）With heat-conducting layer
（3）Molding bonded, the heat-conducting layer（3）Bottom be provided with heat conduction pressure sensitive adhesive（4）, the heat conduction pressure sensitive adhesive（4）Opposite side has
Release liners（5）, the heat-conducting layer（3）Include the coat of metal successively from inside to outside（11）, PET film（10）, graphene layer（8）、
Conductive graphite paper（6）With heat conductive insulating silica gel（7）, the heat conductive insulating silica gel（7）Both sides of the edge position be provided with heat-conducting glue
（9）, two heat-conducting glues（9）Between be provided with conductive graphite paper（6）And graphene layer（8）, the conductive graphite paper（6）With stone
Black alkene layer（8）It is connected, the heat-conducting glue（9）Respectively with heat conductive insulating silica gel（7）And PET film（10）It is connected, the PET film
（10）Bottom and the coat of metal（11）It is connected.
2. a kind of CPU heat transmissions heat conduction foam pad according to claim 1, it is characterised in that:The heat resistance is fire-retardant
Foam（1）For treated polyurethane foam, thickness is 0.5mm-30mm.
3. a kind of CPU heat transmissions heat conduction foam pad according to claim 1, it is characterised in that:The heat-insulated thermosol
（2）For PA thermosols, EVA thermosols, one kind of PE thermosols.
4. a kind of CPU heat transmissions heat conduction foam pad according to claim 1, it is characterised in that:The heat-conducting layer（3）'s
Thickness is 0.5mm-2.0mm, the conductive graphite paper（6）Thickness be 0.05mm-0.5mm, the graphene layer（8）Thickness
For 0.005mm-0.02mm, the PET film（10）Thickness be 0.1mm-0.5mm, the heat conductive insulating silica gel（7）Thickness
For 0.2mm-1.0mm, the coat of metal（11）Thickness be 0.005mm-0.02mm, the heat conductive insulating silica gel（7）Width
Degree is greater than conductive graphite paper（6）And graphene layer（8）Width, the PET film（10）Width be greater than heat conductive insulating
Silica gel（7）Width.
5. a kind of CPU heat transmissions heat conduction foam pad according to claim 1, it is characterised in that:The coat of metal
（11）For one kind in copper, nickel, silver, gold plate.
6. a kind of CPU heat transmissions heat conduction foam pad according to claim 1, it is characterised in that:The heat conduction pressure sensitive adhesive
（4）Thickness be 0.03mm-0.08mm, specially a kind of heat conduction acrylate pressure sensitive adhesive.
7. a kind of CPU heat transmissions heat conduction foam pad according to claim 1, it is characterised in that:The release liners（5）'s
Thickness is 0.05mm-0.1mm, the release liners（5）Off-type force be 15g-20g.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720169799.6U CN206562400U (en) | 2017-02-24 | 2017-02-24 | A kind of CPU heat transmissions heat conduction foam pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720169799.6U CN206562400U (en) | 2017-02-24 | 2017-02-24 | A kind of CPU heat transmissions heat conduction foam pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206562400U true CN206562400U (en) | 2017-10-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720169799.6U Active CN206562400U (en) | 2017-02-24 | 2017-02-24 | A kind of CPU heat transmissions heat conduction foam pad |
Country Status (1)
| Country | Link |
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| CN (1) | CN206562400U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11483948B2 (en) | 2019-08-28 | 2022-10-25 | Laird Technologies, Inc. | Thermal interface materials including memory foam cores |
-
2017
- 2017-02-24 CN CN201720169799.6U patent/CN206562400U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11483948B2 (en) | 2019-08-28 | 2022-10-25 | Laird Technologies, Inc. | Thermal interface materials including memory foam cores |
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