CN206394135U - A kind of heat conductive silica gel pad - Google Patents
A kind of heat conductive silica gel pad Download PDFInfo
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- CN206394135U CN206394135U CN201720030143.6U CN201720030143U CN206394135U CN 206394135 U CN206394135 U CN 206394135U CN 201720030143 U CN201720030143 U CN 201720030143U CN 206394135 U CN206394135 U CN 206394135U
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- silica gel
- heat conductive
- conductive silica
- basic unit
- layer
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Abstract
The utility model discloses a kind of heat conductive silica gel pad, epoxy resin layer is followed successively by from top to bottom, graphite linings, upper heat conductive silica gel basic unit and lower heat conductive silica gel basic unit, heat conductive silica gel sandwich layer is provided with the middle of the epoxy resin layer upper surface, the heat conductive silica gel sandwich layer two ends are provided with insulating rubber insulating barrier, and insulating rubber insulating barrier is sticked on epoxy resin layer by pressure-sensitive adhesive layer, and insulating rubber insulating barrier is flushed with the heat conductive silica gel core layer surface in centre position, connected between the upper heat conductive silica gel basic unit and lower heat conductive silica gel basic unit by gluing oxidant layer, the lower surface of the lower heat conductive silica gel basic unit is equidistantly provided with some downwardly convex heat conductive silica gel bed courses, and heat conductive silica gel bed course is integrally formed with lower heat conductive silica gel basic unit, sufficiently effective the heat passed down can be shed, and contribute to cooling, also ensure that pad effectively radiates contact area in addition, avoiding pad outer layer from being back to heat needs other positions of heat dissipation equipment.
Description
Technical field
The utility model is related to heat conductive silica gel applied technical field, specially a kind of heat conductive silica gel pad.
Background technology
With the development of the assembling densification of integrated technology and microelectronics, the heat produced by electronic equipment accumulates rapidly,
Increase.And as the rise of electronic component self-temperature can directly result in the performance and reliability decrease of itself, therefore energy
No timely radiating, which turns into, influences the key factor of its service life.To ensure that electronic component remains to protect at a temperature of use environment
Normal operating conditions is held, one layer of heat conductive insulating film would generally be set to be used as heat conduction on the heat exchange interface of related component
Boundary material, rapidly by heater element heat transfer to heat dissipation equipment, to ensure that electronic equipment is normally run.
The heat-conducting insulation material provided in the market is mainly exhausted using a kind of individual layer silicon rubber heat conduction simple in construction
Edge pad, silicon rubber is a kind of conventional insulating gasket material, with performances such as excellent heat-resisting, cold-resistant and resistance to ozone, but
Shortcomings are gone back in terms of heat conduction and shock resistance causes the performance of insulation spacer of the prior art also to exist not
Foot, its material need to be improved, and combination property need further to improve and improve, and in some precision instruments, it is led
Hot property is also much not up to best effect.
Utility model content
To achieve the above object, the utility model provides following technical scheme：A kind of heat conductive silica gel pad, from top to bottom according to
Secondary is in the middle of epoxy resin layer, graphite linings, upper heat conductive silica gel basic unit and lower heat conductive silica gel basic unit, the epoxy resin layer upper surface
Provided with heat conductive silica gel sandwich layer, the heat conductive silica gel sandwich layer two ends are provided with insulating rubber insulating barrier, and insulating rubber insulating barrier passes through
Pressure-sensitive adhesive layer is sticked on epoxy resin layer, and insulating rubber insulating barrier is flushed with the heat conductive silica gel core layer surface in centre position,
Connected between the upper heat conductive silica gel basic unit and lower heat conductive silica gel basic unit by gluing oxidant layer, under the lower heat conductive silica gel basic unit
Surface is equidistantly provided with some downwardly convex heat conductive silica gel bed courses, and heat conductive silica gel bed course and lower heat conductive silica gel basic unit one
Shaping.
As a kind of preferred technical scheme of the utility model, the upper heat conductive silica gel basic unit is than lower heat conductive silica gel basic unit
The small 0.1mm-0.8mm of thickness.
As a kind of preferred technical scheme of the utility model, the thickness of the heat conductive silica gel bed course is 0.5-1mm.
As a kind of preferred technical scheme of the utility model, the heat conductive silica gel sandwich layer accounts for three points of whole pad length
One of.
Compared with prior art, the beneficial effects of the utility model are：The utility model is used based on heat conductive silica gel material
Two layers of heat conductive silica gel basic unit above and below body structural material, and design, is connected by gluing oxidant layer therebetween, and in lower heat conductive silica gel basic unit
Some downwardly convex heat conductive silica gel bed courses of bottom-layer design, sufficiently effective can shed the heat passed down, and contribute to cold
But, in addition, setting graphite linings in upper heat conductive silica gel basic unit upper surface, and using epoxy resin layer as protection, in its upper end, design is led
Hot silica gel sandwich layer, and design insulating rubber insulating barrier at its two ends, it is ensured that pad effectively radiates contact area, it is to avoid outside pad
Heat is back to by layer needs other positions of heat dissipation equipment.
Brief description of the drawings
Fig. 1 is the utility model structural representation；
In figure：1- epoxy resin layers；2- graphite linings；The upper heat conductive silica gel basic units of 3-；Heat conductive silica gel basic unit under 4-；5- thermal conductive silicons
Glue sandwich layer；6- insulating rubber insulating barriers；7- pressure-sensitive adhesive layers；The gluing oxidant layer of 8-；9- heat conductive silica gel bed courses.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Embodiment：
Referring to Fig. 1, the utility model provides a kind of technical scheme：A kind of heat conductive silica gel pad, is followed successively by from top to bottom
In epoxy resin layer 1, graphite linings 2, upper heat conductive silica gel basic unit 3 and lower heat conductive silica gel basic unit 4, the upper surface of epoxy resin layer 1
Between be provided with heat conductive silica gel sandwich layer 5, the two ends of heat conductive silica gel sandwich layer 5 are provided with insulating rubber insulating barrier 6, and insulating rubber insulating barrier
6 are sticked on epoxy resin layer 1 by pressure-sensitive adhesive layer 7, and insulating rubber insulating barrier 6 and the heat conductive silica gel sandwich layer 5 in centre position
Surface is flushed, and is connected between the upper heat conductive silica gel basic unit 3 and lower heat conductive silica gel basic unit 4 by gluing oxidant layer 8, the lower heat conduction
The lower surface of silica gel basic unit 4 is equidistantly provided with some downwardly convex heat conductive silica gel bed courses 9, and heat conductive silica gel bed course 9 is with
Heat conductive silica gel basic unit 4 is integrally formed.
The upper heat conductive silica gel basic unit 3 is than the small 0.1mm-0.8mm of thickness of lower heat conductive silica gel basic unit 4, the heat conductive silica gel
The thickness of bed course 9 is 0.5-1mm, and the heat conductive silica gel sandwich layer 5 accounts for 1/3rd of whole pad length.
Heat conductive silica gel：Heat conductive silica gel is high-end heat conduction compound, and will not solidification, characteristic that will not be conductive can be with
Avoid such as short circuit equivalent risk.
Specifically used mode and advantage：The utility model uses heat conductive silica gel material for main body structural material, and designs
Lower two layers of heat conductive silica gel basic unit, is connected by gluing oxidant layer therebetween, and some convex downwards in lower heat conductive silica gel basic unit bottom-layer design
The heat conductive silica gel bed course risen, sufficiently effective can shed the heat passed down, and contribute to cooling, in addition, in upper thermal conductive silicon
Matrix layer upper surface sets graphite linings, and using epoxy resin layer as protection, designs heat conductive silica gel sandwich layer in its upper end, and its two
End design insulating rubber insulating barrier, it is ensured that pad is effectively radiated contact area, it is to avoid heat is back to needs by pad outer layer
Other positions of heat dissipation equipment.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and
And in the case of without departing substantially from spirit or essential attributes of the present utility model, can realize that this practicality is new in other specific forms
Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new
The scope of type limits by appended claims rather than described above, it is intended that the equivalency fallen in claim is contained
All changes in justice and scope are included in the utility model.Any reference in claim should not be considered as limitation
Involved claim.
Claims (4)
1. a kind of heat conductive silica gel pad, it is characterised in that：Epoxy resin layer is followed successively by from top to bottom（1）, graphite linings（2）, on lead
Hot silica gel basic unit（3）With lower heat conductive silica gel basic unit（4）, the epoxy resin layer（1）Heat conductive silica gel sandwich layer is provided with the middle of upper surface
（5）, the heat conductive silica gel sandwich layer（5）Two ends are provided with insulating rubber insulating barrier（6）, and insulating rubber insulating barrier（6）By pressure-sensitive
Glue-line（7）Stick to epoxy resin layer（1）On, and insulating rubber insulating barrier（6）With the heat conductive silica gel sandwich layer in centre position（5）Table
Face is flushed, the upper heat conductive silica gel basic unit（3）With lower heat conductive silica gel basic unit（4）Between pass through gluing oxidant layer（8）Connect, it is described under
Heat conductive silica gel basic unit（4）Lower surface equidistantly be provided with some downwardly convex heat conductive silica gel bed courses（9）, and thermal conductive silicon rubber cushion
Layer（9）With lower heat conductive silica gel basic unit（4）It is integrally formed.
2. a kind of heat conductive silica gel pad according to claim 1, it is characterised in that：The upper heat conductive silica gel basic unit（3）Than
Lower heat conductive silica gel basic unit（4）The small 0.1mm-0.8mm of thickness.
3. a kind of heat conductive silica gel pad according to claim 1, it is characterised in that：The heat conductive silica gel bed course（9）Thickness
Spend for 0.5-1mm.
4. a kind of heat conductive silica gel pad according to claim 1, it is characterised in that：The heat conductive silica gel sandwich layer（5）Account for whole
/ 3rd of individual pad length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720030143.6U CN206394135U (en) | 2017-01-11 | 2017-01-11 | A kind of heat conductive silica gel pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720030143.6U CN206394135U (en) | 2017-01-11 | 2017-01-11 | A kind of heat conductive silica gel pad |
Publications (1)
| Publication Number | Publication Date |
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| CN206394135U true CN206394135U (en) | 2017-08-11 |
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ID=59514267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720030143.6U Active CN206394135U (en) | 2017-01-11 | 2017-01-11 | A kind of heat conductive silica gel pad |
Country Status (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113555190A (en) * | 2021-07-20 | 2021-10-26 | 珠海格力电器股份有限公司 | Inductor assisting in heat dissipation of electronic element and novel electrical box |
-
2017
- 2017-01-11 CN CN201720030143.6U patent/CN206394135U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113555190A (en) * | 2021-07-20 | 2021-10-26 | 珠海格力电器股份有限公司 | Inductor assisting in heat dissipation of electronic element and novel electrical box |
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