CN208127195U - A kind of thermally conductive phase transformation gasket of high intensity - Google Patents
A kind of thermally conductive phase transformation gasket of high intensity Download PDFInfo
- Publication number
- CN208127195U CN208127195U CN201820508431.2U CN201820508431U CN208127195U CN 208127195 U CN208127195 U CN 208127195U CN 201820508431 U CN201820508431 U CN 201820508431U CN 208127195 U CN208127195 U CN 208127195U
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- layer
- phase transformation
- thermally conductive
- gasket
- silica gel
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Abstract
The utility model discloses a kind of thermally conductive phase transformation gaskets of high intensity,Including phase transformation shim body,The middle of the phase transformation shim body is provided with chip groove,And the left and right ends of the phase transformation shim body are symmetrically installed with half disk of lockhole,Absorption circular groove is provided at the center of the chip groove,And in the groove bottom of the chip groove and one layer of phase-change microcapsule layer is provided on the surface of four groove sidewalls,The lower layer of the phase-change microcapsule layer is equipped with thermally conductive foamed cotton layer,The lower layer of the thermally conductive foamed cotton layer is provided with silica gel base layer,And the centre of the thermally conductive foamed cotton layer be equipped with hemisphere dash forward it is convex,The silica gel base layer is internally provided with reinforcing rib piece,And the downside of the silica gel base layer is connected with graphite material lamella by Graphite pad,The lower layer of the graphite material lamella is connected with adhesive layer by copper foil layer,Release paper is posted on the outer surface of the adhesive layer,Pass through phase-change microcapsule and Graphite pad,To improve heat-conducting effect,And reinforce absorption property.
Description
Technical field
The utility model relates to heat-conducting pad field, specially a kind of thermally conductive phase transformation gasket of high intensity.
Background technique
Heat-conducting pad is the air gap filled between heating device and cooling fin or metab, their flexibility, bullet
Property feature can be used to cover the surface of unusual out-of-flatness.Heat is transmitted to metal shell from discrete device or entire PCB
Or on diffuser plate, so as to improve the efficiency and service life of heating electronic package；
Thermally conductive phase-transition material（PC）It is heat enhancing polymer, designed for making power consumption type electronic device and therewith
Resistance to heat between connected cooling fin is reduced to minimum, but in the prior art, the thermally conductive phase transformation gasket of chip cooling is big
Have the following disadvantages problem more：
（1）The absorption of common thermally conductive phase transformation gasket is poor, when thermally conductive phase transformation gasket fever expansion, is easy chip top
Thermally conductive phase transformation gasket out；
（2）The structural strength of general thermally conductive phase transformation gasket is low, so that the service life of the thermally conductive phase transformation gasket is reduced,
And the heat-conducting effect of existing thermally conductive phase transformation gasket is poor.
Summary of the invention
In order to overcome the shortcomings of prior art, the utility model provides a kind of thermally conductive phase transformation gasket of high intensity, both
It solves the problems, such as that common thermally conductive phase transformation gasket bring uses, and considerably increases the usable degree of thermally conductive phase transformation gasket, to lead
Heat construction provides bigger convenience, also improves adsorption effect, and improve the structural strength of gasket, can effectively solve back
The problem of scape technology proposes.
Technical solution adopted by the utility model to solve its technical problems is：
A kind of thermally conductive phase transformation gasket of high intensity, including phase transformation shim body, it is characterised in that：The phase transformation shim body
Middle be provided with chip groove, and the left and right ends of the phase transformation shim body are symmetrically installed with half disk of lockhole, described
Absorption circular groove is provided at the center of chip groove, and in the groove bottom of the chip groove and surface of four groove sidewalls
It is provided with one layer of phase-change microcapsule layer；
The lower layer of the phase-change microcapsule layer is equipped with thermally conductive foamed cotton layer, and the lower layer of the thermally conductive foamed cotton layer is provided with silica gel
Base layer, and the centre of the thermally conductive foamed cotton layer is equipped with hemisphere and dashes forward convex, and the silica gel base layer is internally provided with reinforcing rib
Piece, and the downside of the silica gel base layer is connected with graphite material lamella, the lower layer of the graphite material lamella by Graphite pad
It is connected with adhesive layer by copper foil layer, posts release paper on the outer surface of the adhesive layer.
Further, the consistency of thickness of the thickness of half disk of lockhole and phase transformation shim body, and half disk of the lockhole
Center at be provided with threaded hole.
Further, low viscous protective film is provided on the surface of phase transformation shim body on the outside of the chip groove.
Further, the hemisphere dash forward convex internal structure be Down-Up disposed with copper foil layer, graphite material lamella and
Silica gel base layer.
Further, wire is provided between reinforcing rib piece in the silica gel base layer.
Further, there is gap between the Graphite pad, and between the Graphite pad and graphite material lamella
Using splicing form.
Compared with prior art, the utility model has the beneficial effects that：
（1）Be provided in the phase transformation shim body of the utility model absorption circular groove and hemisphere dash forward it is convex, by absorption circular groove with
And hemisphere is dashed forward convex deformation effects, will be adsorbed air in circular groove and is discharged, thus using air pressure chip stabilization is adsorbed on core
In piece groove, so that chip is not easy to fall out from the thermally conductive phase transformation gasket；
（2）Reinforcing rib piece is set in the phase transformation shim body of the utility model, the knot of gasket is improved by reinforcing rib piece
Structure intensity to extend the service life of the thermally conductive phase transformation gasket, but also has phase-change microcapsule layer and Graphite pad, from
And improve heat-conducting effect.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the overlooking structure diagram of the utility model.
Figure label：
1- chip groove；Half disk of 2- lockhole；3- adsorbs circular groove；4- phase-change microcapsule layer；The thermally conductive foamed cotton layer of 5-；6- silica gel base
Body layer；7- hemisphere is dashed forward convex；8- reinforcing rib piece；9- Graphite pad；10- graphite material lamella；11- copper foil layer；12- adhesive layer；13- from
Type paper；
The low viscous protective film of 101-；201- threaded hole；601- wire；The gap 901-.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As depicted in figs. 1 and 2, the utility model provides a kind of thermally conductive phase transformation gasket of high intensity, including phase transformation gasket
The middle of ontology, the phase transformation shim body is provided with chip groove 1, is used for chip placement by chip groove 1, wherein institute
It states and is provided with low viscous protective film 101 on the surface of 1 outside phase transformation shim body of chip groove, so that chip is embedded in chip groove
In 1, to improve the adsorptivity of gasket, and the left and right ends of the phase transformation shim body are symmetrically installed with half disk 2 of lockhole,
Described in the thickness of half disk 2 of lockhole and the consistency of thickness of phase transformation shim body, and be provided at the center of half disk 2 of the lockhole
The thermally conductive phase transformation gasket can be effectively fixedly installed in heat dissipation by half disk 2 of lockhole and threaded hole 201 by threaded hole 201
On piece or metab,
Be provided at the center of the chip groove 1 absorption circular groove 3, by absorption circular groove 3 and hemisphere dash forward convex 7 deformation
Chip is firmly adsorbed in chip groove 1 by effect, so that chip is not easy to fall out from the thermally conductive phase transformation gasket, and institute
It states in the groove bottom of chip groove 1 and is provided with one layer of phase-change microcapsule layer 4 on the surface of four groove sidewalls, it is micro- by phase transformation
Capsule layer 4 is to improve heat-conducting effect；
As shown in Figure 1, the lower layer of the phase-change microcapsule layer 4 is equipped with thermally conductive foamed cotton layer 5, the thermally conductive foamed cotton layer 5
Lower layer is provided with silica gel base layer 6, and phase-change microcapsule layer 4 is absorbed into heat by thermally conductive foamed cotton layer 5 and is quickly conveyed to silica gel
Base layer 6, and the centre of the thermally conductive foamed cotton layer 5 is equipped with hemisphere and dashes forward convex 7, convex 7 internal structure wherein the hemisphere is dashed forward
It is Down-Up disposed with copper foil layer 11, graphite material lamella 10 and silica gel base layer 6, which is mounted on core
When between piece and cooling fin, which will receive extruding, and so that hemisphere dashes forward convex 7, deformation occurs, will adsorb circular groove 3
Interior air discharge, thus using air pressure chip stabilization to be adsorbed in chip groove 1；
The silica gel base layer 6 is internally provided with reinforcing rib piece 8, wherein in the silica gel base layer 6 between reinforcing rib piece 8
It is provided with wire 601, by the reinforcing rib piece 8 and wire 601 in silica gel base layer 6, on the one hand improves the knot of gasket
On the other hand structure intensity improves heat-conducting effect, and the downside of the silica gel base layer 6 is connected with graphite by Graphite pad 9
Tablet layer 10, wherein there is gap 901 between the Graphite pad 9, and the Graphite pad 9 and graphite material lamella 10 it
Between use splicing form, by gap 901 to adapt to the heated expansion of the thermally conductive phase transformation gasket, to change the thermally conductive phase transformation pad
The lower layer of the structural stability of piece, the graphite material lamella 10 is connected with adhesive layer 12 by copper foil layer 11, passes through Graphite pad 9
Heat is conducted to graphite material lamella 10 and copper foil layer 11, then heat is conducted on cooling fin or metab, institute
It states and posts release paper 13 on the outer surface of adhesive layer 12, by release paper 13 not use the thermally conductive phase transformation gasket, to the pad
The stickiness of piece adhesive layer 12 is protected.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
Claims (6)
1. a kind of thermally conductive phase transformation gasket of high intensity, including phase transformation shim body, it is characterised in that：The phase transformation shim body
Middle is provided with chip groove (1), and the left and right ends of the phase transformation shim body are symmetrically installed with half disk of lockhole (2),
Absorption circular groove (3) is provided at the center of the chip groove (1), and in the groove bottom of the chip groove (1) and four
One layer of phase-change microcapsule layer (4) is provided on the surface of groove sidewall,
The lower layer of the phase-change microcapsule layer (4) is equipped with thermally conductive foamed cotton layer (5), lower layer's setting of the thermally conductive foamed cotton layer (5)
Have silica gel base layer (6), and the centre of the thermally conductive foamed cotton layer (5) is equipped with hemisphere and dashes forward convex (7), the silica gel base layer
(6) it is internally provided with reinforcing rib piece (8), and the downside of the silica gel base layer (6) is connected with graphite by Graphite pad (9)
The lower layer of tablet layer (10), the graphite material lamella (10) is connected with adhesive layer (12), the adhesive layer by copper foil layer (11)
(12) release paper (13) are posted on outer surface.
2. a kind of thermally conductive phase transformation gasket of high intensity according to claim 1, it is characterised in that：Half disk of lockhole (2)
Thickness and phase transformation shim body consistency of thickness, and threaded hole (201) are provided at the center of half disk of the lockhole (2).
3. a kind of thermally conductive phase transformation gasket of high intensity according to claim 1, it is characterised in that：The chip groove (1)
Low viscous protective film (101) is provided on the surface of outside phase transformation shim body.
4. a kind of thermally conductive phase transformation gasket of high intensity according to claim 1, it is characterised in that：The hemisphere dashes forward convex (7)
Internal structure be Down-Up disposed with copper foil layer (11), graphite material lamella (10) and silica gel base layer (6).
5. a kind of thermally conductive phase transformation gasket of high intensity according to claim 1, it is characterised in that：The silica gel base layer
(6) wire (601) are provided between reinforcing rib piece (8) in.
6. a kind of thermally conductive phase transformation gasket of high intensity according to claim 1, it is characterised in that：The Graphite pad (9)
Between exist gap (901), and between the Graphite pad (9) and graphite material lamella (10) use splicing form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820508431.2U CN208127195U (en) | 2018-04-11 | 2018-04-11 | A kind of thermally conductive phase transformation gasket of high intensity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820508431.2U CN208127195U (en) | 2018-04-11 | 2018-04-11 | A kind of thermally conductive phase transformation gasket of high intensity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208127195U true CN208127195U (en) | 2018-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820508431.2U Expired - Fee Related CN208127195U (en) | 2018-04-11 | 2018-04-11 | A kind of thermally conductive phase transformation gasket of high intensity |
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| CN (1) | CN208127195U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109496117A (en) * | 2019-01-02 | 2019-03-19 | 苏州沛德导热材料有限公司 | A kind of graphite heat conducting and heat radiating fin |
-
2018
- 2018-04-11 CN CN201820508431.2U patent/CN208127195U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109496117A (en) * | 2019-01-02 | 2019-03-19 | 苏州沛德导热材料有限公司 | A kind of graphite heat conducting and heat radiating fin |
| CN109496117B (en) * | 2019-01-02 | 2023-05-26 | 湖南沛德新材料有限公司 | Graphite heat conduction radiating fin |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181120 Termination date: 20190411 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |