CN210840473U - Novel heat radiation structure of heat dissipation silica gel piece - Google Patents
Novel heat radiation structure of heat dissipation silica gel piece Download PDFInfo
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- CN210840473U CN210840473U CN201921486774.4U CN201921486774U CN210840473U CN 210840473 U CN210840473 U CN 210840473U CN 201921486774 U CN201921486774 U CN 201921486774U CN 210840473 U CN210840473 U CN 210840473U
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- heat
- silica gel
- gel piece
- heat dissipation
- heat conduction
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Abstract
The utility model relates to the technical field of heat dissipation silica gel pieces, in particular to a heat dissipation structure of a novel heat dissipation silica gel piece, which comprises a silica gel piece, wherein the bottom of the silica gel piece is provided with an adhesive layer, the bottom of the adhesive layer is covered with a protective film, a plurality of supporting heat conduction pipes are horizontally and equidistantly arranged inside the silica gel piece, the top of each supporting heat conduction pipe is fixedly connected with a first sealing fixed disc, and the bottom of each supporting heat conduction pipe is fixedly connected with a second sealing fixed disc; the utility model discloses heat radiation structure of heat dissipation silica gel piece, through the support heat pipe and the conduction oil that set up for the specific heat capacity increase of this silica gel piece utilizes the conduction oil in a plurality of support heat pipes to make this silica gel piece can absorb a large amount of heats in the twinkling of an eye simultaneously, can absorb more heats for silica gel piece in the past, has solved traditional heat dissipation silica gel piece and can't absorb more thermal problem in the twinkling of an eye.
Description
Technical Field
The utility model relates to a heat dissipation silica gel piece technical field specifically is a novel heat radiation structure of heat dissipation silica gel piece.
Background
The heat dissipation silica gel is a heat conduction material with low thermal resistance, high heat conduction performance and high flexibility. The high flexibility that this material has can reduce the required pressure between components and parts, thereby cover the surface of microcosmic unevenness simultaneously and make components and parts fully contact and improve heat conduction efficiency, is particularly suitable for the heat conduction demand that the space is restricted.
Because the heat dissipation silica gel piece is mostly installed between electronic component heat source and heat abstractor, play a transfer heat, and reduce the effect of thermal resistance, consequently often need absorb a large amount of heats in the twinkling of an eye, give heat abstractor with the heat of absorption fast transfer again, but most heat dissipation silica gel piece itself specific heat capacity is limited at present, consequently can't absorb more heat in the twinkling of an eye, lead to the unable quick transfer of heat, serious can lead to electronic component to burn out even, cause certain economic loss, consequently, need design a novel heat dissipation silica gel piece that can absorb great heat in the twinkling of an eye.
SUMMERY OF THE UTILITY MODEL
The utility model provides a novel heat radiation structure of heat dissipation silica gel piece possesses the advantage such as can absorb great heat in the twinkling of an eye, has solved traditional heat dissipation silica gel piece and can't absorb more thermal problem in the twinkling of an eye.
The utility model provides a novel heat radiation structure of heat dissipation silica gel piece, includes the silica gel piece, the bottom of silica gel piece is provided with the viscose layer, the bottom on viscose layer covers there is the one deck protection film, the inside of silica gel piece is provided with many supporting heat pipes, every along the horizontal equidistance of level the first sealed fixed disk of the equal fixedly connected with in top of supporting heat pipe, every the sealed fixed disk of the equal fixedly connected with second in bottom of supporting heat pipe.
The utility model discloses heat radiation structure of heat dissipation silica gel piece, wherein the first heat conduction piece of top fixedly connected with of first sealed fixed disk, the bottom fixedly connected with second heat conduction piece of second sealed fixed disk, this structure can utilize the second heat conduction piece quick with the heat of electronic component heat source department transmit to support in the heat conduction pipe fast, can utilize the quick heat transfer with in the conduction oil of first heat conduction piece to go out simultaneously for the heat conduction speed of this silica gel piece.
The utility model discloses heat radiation structure of heat dissipation silica gel piece, wherein fixedly connected with heat conduction post between first sealed fixed disk and the second sealed fixed disk, the top fixedly connected with conducting strip of first heat conduction piece, this structure can utilize the conducting strip to make the heat can be faster transmit the other end from the one end of silica gel piece, utilize conducting strip and heat abstractor closely to laminate simultaneously, make the heat that is derived can be quick give off by heat abstractor.
The utility model discloses heat radiation structure of heat dissipation silica gel piece, wherein every supports all to fill in the heat conduction pipe has conduction oil, every the top and the bottom of supporting the heat conduction pipe seal through first sealed fixed disk and second sealed fixed disk respectively, and this structure can utilize the effectual specific heat capacity who increases this silica gel piece of conduction oil, makes this silica gel piece can absorb more heats.
The utility model discloses heat radiation structure of heat dissipation silica gel piece, wherein the silica gel piece will every support including heat pipe, first sealed fixed disk, the sealed fixed disk of second, first heat conduction piece and the equal parcel of second heat conduction piece, this structure can utilize the softness of silica gel piece, will support heat pipe, first sealed fixed disk, the sealed fixed disk of second, first heat conduction piece and the parcel of second heat conduction piece isotructure, make the silica gel piece can not influence the leakproofness in the use.
The utility model discloses heat radiation structure of heat dissipation silica gel piece, wherein every support heat pipe, first sealed fixed disk, the sealed fixed disk of second, first heat conduction piece and second heat conduction piece and be a copper and make, this structure can utilize the good heat conductivity of copper, makes the device can be quick in the use derive the heat.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the utility model discloses heat radiation structure of heat dissipation silica gel piece, support heat pipe and conduction oil through setting up, make the specific heat capacity increase of this silica gel piece, utilize the conduction oil in a plurality of support heat pipes to make this silica gel piece can absorb a large amount of heats in the twinkling of an eye simultaneously, can absorb more heats for silica gel piece in the past, utilize the heat conduction post simultaneously, first heat conduction piece and second heat conduction piece isotructure, the effectual heat conduction speed of this silica gel piece of having strengthened, the heat that makes electronic component operation produce can be quick transmit for heat abstractor through this silica gel piece, the heat absorption capacity of this silica gel piece has both been increased, the speed of this silica gel piece heat transfer has also been accelerated, the problem that traditional fin can't absorb more heat in the twinkling of an eye has been solved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a schematic overall side view and sectional structure of the present invention;
FIG. 2 is a schematic view of the overall top view structure of the present invention;
FIG. 3 is a schematic view of the front view of the supporting heat pipe of the present invention;
fig. 4 is the utility model discloses support heat pipe looks sideways at the sectional structure sketch map.
In the figure: 01. a silica gel sheet; 02. an adhesive layer; 03. supporting the heat conduction pipe; 04. a first seal fixing disc; 05. a second sealed fixed disk; 06. a first heat-conducting block; 07. a second heat-conducting block; 08. heat conducting oil; 09. a heat-conducting column; 10. a heat conductive sheet.
Detailed Description
In the following description, numerous implementation details are set forth in order to provide a more thorough understanding of the present invention. It should be understood, however, that these implementation details should not be used to limit the invention. That is, in some embodiments of the invention, details of these implementations are not necessary. In addition, some conventional structures and components are shown in simplified schematic form in the drawings.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for description purposes, not specifically referring to the order or sequence, and are not intended to limit the present invention, but only to distinguish the components or operations described in the same technical terms, and are not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1-4, the utility model discloses a novel heat radiation structure of heat dissipation silica gel piece, including silica gel piece 01, the bottom of silica gel piece 01 is provided with adhesive layer 02, and the bottom of adhesive layer 02 covers there is the one deck protection film, and the inside of silica gel piece 01 is provided with many supporting heat pipe 03 along horizontal equidistance, and the top of every supporting heat pipe 03 all fixedly connected with seals fixed disk 04, and the bottom of every supporting heat pipe 03 all fixedly connected with seals fixed disk 05.
First heat conduction piece 06 of top fixedly connected with of first sealed fixed disk 04, the bottom fixedly connected with second heat conduction piece 07 of second sealed fixed disk 05, this structure can utilize second heat conduction piece 07 quick with the heat of electronic component heat source department transmit support heat pipe 03 fast in, can utilize the quick heat transfer with in the conduction oil 08 of first heat conduction piece 06 to go out simultaneously for this silica gel sheet 01's heat conduction speed.
Fixedly connected with heat conduction post 09 between first sealed fixed disk 04 and the sealed fixed disk 05 of second, the top fixedly connected with conducting strip 10 of first heat conduction piece 06, this structure can utilize conducting strip 09 to make the heat can be faster transmit the other end from the one end of silica gel piece 01, utilize conducting strip 10 and heat abstractor closely to laminate simultaneously, make the heat that is derived can be quick give off by heat abstractor.
Each supporting heat conduction pipe 03 is filled with heat conduction oil 08, the top and the bottom of each supporting heat conduction pipe 03 are respectively sealed through a first sealing fixing disc 04 and a second sealing fixing disc 05, and the structure can effectively increase the specific heat capacity of the silica gel sheet 01 by utilizing the heat conduction oil 08, so that the silica gel sheet 01 can absorb more heat.
The silica gel sheet 01 wraps each of the supporting heat conduction pipes 03, the first sealing fixed disk 04, the second sealing fixed disk 05, the first heat conduction block 06 and the second heat conduction block 07, and the supporting heat conduction pipes 03, the first sealing fixed disk 04, the second sealing fixed disk 05, the first heat conduction block 06, the second heat conduction block 07 and other structures can be wrapped by the silica gel sheet 01 due to the softness of the silica gel sheet 01, so that the sealing performance of the silica gel sheet 01 cannot be affected when the silica gel sheet 01 is used.
Each supporting heat pipe 03, the first sealing fixing disc 04, the second sealing fixing disc 05, the first heat conducting block 06 and the second heat conducting block 07 are made of copper, and the structure can utilize the good heat conductivity of copper, so that the device can rapidly lead out heat in use.
When using the utility model discloses the time: firstly tearing off the protective film on the adhesive layer 02, then aligning the adhesive layer 02 to a heat source of an electronic element for bonding, bonding the silica gel sheet 01 to the heat source by using the adhesive layer 02, then fixing the heat dissipation device on the top of the silica gel sheet 01 and keeping the heat dissipation device in contact with the top of the silica gel sheet 01, when the electronic element operates, generating more heat, the heat can be transferred into the silica gel sheet 01 through the adhesive layer 02, because the inside of the silica gel sheet 01 is provided with a plurality of supporting heat conduction pipes 03, a first heat conduction block 06 and a second heat conduction block 07, and the supporting heat conduction pipes 03 are all made of copper, the heat can be rapidly guided into the supporting heat conduction pipes 03 by the second heat conduction block 07 in a specific heat guide way, meanwhile, because the supporting heat conduction pipes 03 are filled with heat conduction oil 08, and the heat conduction oil 08 has a larger heat capacity, a large amount of heat can be absorbed, and when the heat is absorbed by the heat conduction, since the heat conductive sheet 10 is closely attached to the bottom of the heat sink, heat can be rapidly transferred to the heat sink, and the heat can be rapidly discharged by the heat sink.
The above description is only an embodiment of the present invention, and is not intended to limit the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (6)
1. The utility model provides a heat radiation structure of novel heat dissipation silica gel piece, includes silica gel piece (01), its characterized in that: the bottom of silica gel piece (01) is provided with viscose layer (02), the bottom of viscose layer (02) covers there is the one deck protection film, the inside of silica gel piece (01) is provided with many supporting heat pipe (03) along the horizontal equidistance of level, every the first sealed fixed disk of the equal fixedly connected with in top (04) of supporting heat pipe (03), every the sealed fixed disk of the equal fixedly connected with second (05) in bottom of supporting heat pipe (03).
2. The heat dissipation structure of the novel heat dissipation silica gel sheet according to claim 1, wherein: the top of the first sealing fixed disk (04) is fixedly connected with a first heat-conducting block (06), and the bottom of the second sealing fixed disk (05) is fixedly connected with a second heat-conducting block (07).
3. The heat dissipation structure of the novel heat dissipation silica gel sheet according to claim 2, wherein: and a heat-conducting column (09) is fixedly connected between the first sealing fixed disk (04) and the second sealing fixed disk (05), and a heat-conducting fin (10) is fixedly connected to the top of the first heat-conducting block (06).
4. The heat dissipation structure of the novel heat dissipation silica gel sheet according to claim 1, wherein: the heat conduction oil (08) is filled in each supporting heat conduction pipe (03), and the top and the bottom of each supporting heat conduction pipe (03) are respectively sealed through a first sealing fixed disc (04) and a second sealing fixed disc (05).
5. The heat dissipation structure of the novel heat dissipation silica gel sheet according to claim 1, wherein: the silica gel sheet (01) wraps each supporting heat conduction pipe (03), the first sealing fixed disk (04), the second sealing fixed disk (05), the first heat conduction block (06) and the second heat conduction block (07).
6. The heat dissipation structure of the novel heat dissipation silica gel sheet according to claim 1, wherein: each supporting heat conduction pipe (03), the first sealing fixed disc (04), the second sealing fixed disc (05), the first heat conduction block (06) and the second heat conduction block (07) are made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921486774.4U CN210840473U (en) | 2019-09-09 | 2019-09-09 | Novel heat radiation structure of heat dissipation silica gel piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921486774.4U CN210840473U (en) | 2019-09-09 | 2019-09-09 | Novel heat radiation structure of heat dissipation silica gel piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210840473U true CN210840473U (en) | 2020-06-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921486774.4U Expired - Fee Related CN210840473U (en) | 2019-09-09 | 2019-09-09 | Novel heat radiation structure of heat dissipation silica gel piece |
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| CN (1) | CN210840473U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113115557A (en) * | 2021-02-05 | 2021-07-13 | 吕建忠 | Heat dissipation silica gel piece of embedded heat conduction group |
-
2019
- 2019-09-09 CN CN201921486774.4U patent/CN210840473U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113115557A (en) * | 2021-02-05 | 2021-07-13 | 吕建忠 | Heat dissipation silica gel piece of embedded heat conduction group |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200623 Termination date: 20210909 |