CN216057982U - Light and thin heat dissipation device for electrical equipment - Google Patents
Light and thin heat dissipation device for electrical equipment Download PDFInfo
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- CN216057982U CN216057982U CN202121619906.3U CN202121619906U CN216057982U CN 216057982 U CN216057982 U CN 216057982U CN 202121619906 U CN202121619906 U CN 202121619906U CN 216057982 U CN216057982 U CN 216057982U
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Abstract
The utility model discloses a light and thin heat dissipation device for electrical equipment, which belongs to the technical field of heat dissipation and comprises a body and a chip fixed on the body, wherein a heat-conducting medium and a heat dissipation element are sequentially arranged on the other side, opposite to the body, of the chip; the heat-conducting medium is uniformly covered on the surface of the chip; the chip is of a cuboid structure, and the radiating element is of a cuboid box-shaped structure with an opening on one surface; the opening of the cuboid box-shaped structure faces towards the chip, so that the card covers the outside of the chip. The light and thin heat dissipation device of the utility model uses the heat-conducting medium and the heat dissipation element in a matching way, so that the heat dissipation efficiency is higher, the structure is lighter and thinner, and the application field is wider.
Description
Technical Field
The utility model belongs to the technical field of heat dissipation, and particularly relates to a light and thin heat dissipation device for electrical equipment.
Background
In order to improve the working efficiency of the electric equipment, one or more chips are arranged in the electric equipment applied to the current social life, such as a solid state disk, an optical module, a laser television, a communication base station, a television, an electric vehicle and the like, so that the electric equipment plays roles of control, cache and the like, a large amount of heat can be generated in the working process of the electric equipment, the heat needs to be diffused out in time, otherwise, the temperature of the electric equipment is overhigh, and the use performance of the electric equipment is influenced.
Most of heat dissipation structures in the existing electrical equipment are aluminum extrusion structures, the traditional aluminum extrusion heat dissipation structure is low in heat dissipation efficiency, slow in heat transmission, large in thermal resistance and uneven in heat transmission, and chip heat cannot be dissipated timely when a hard disk reads and writes data for a long time, so that the temperature of the electrical equipment is extremely high, the normal work of the electrical equipment is influenced, and even the electrical equipment is burnt out; and the traditional aluminum extruded radiating structure has larger volume and thicker thickness, can not be installed in thinner products, and has limited application range.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a light and thin heat dissipation device for electrical equipment, so as to solve the technical problems mentioned in the background art.
In order to achieve the purpose, the utility model discloses a light and thin heat dissipation device for electrical equipment, wherein the electrical equipment comprises a body and a chip fixed on the body, and a heat-conducting medium and a heat dissipation element are sequentially arranged on the other side, opposite to the body, of the chip; the heat-conducting medium is uniformly covered on the surface of the chip; the chip is the cuboid structure, and heat radiating element is one side open-ended cuboid box structure, and cuboid box structure's opening is towards the chip to the card covers in the outside of chip.
Furthermore, a graphene film is arranged on one side, far away from the chip, of the heat dissipation element. The graphene film can be designed in a shape of Chinese character 'ji' according to the appearance structure size of the heat dissipation element, and is not limited, and the graphene film is light in weight, thin in thickness and high in heat dissipation efficiency, so that the heat dissipation effect of the whole heat dissipation device can be greatly improved.
Further, the graphene film completely covers the exposed surface of the heat dissipation element.
Further, the chips are 2 groups, and the 2 groups of chips are respectively positioned on the upper side and the lower side of the body.
Further, the chips are 1 group and are positioned on one side of the body.
Further, the heat-conducting medium is heat-conducting silica gel, heat-conducting silicone grease or a heat-conducting silica gel gasket. The heat conducting medium has the characteristic of unlimited heat conducting coefficient, can quickly conduct heat on the chip to the heat radiating element, and has small thermal resistance. The heat-conducting medium has certain adhesiveness, and the heat-radiating structures on two sides of the heat-conducting medium can be more tightly attached together, so that the structure is more compact, and the heat-radiating effect is better.
Further, the heat dissipation element is a heat pipe or a vapor chamber. The number, size and shape of the heat dissipation elements can be determined according to the specific structure of the body and the chip. When heat transmission is to radiating element on, radiating element inside working medium can vaporize in the twinkling of an eye, conducts the heat along one-dimensional linear direction rapidly, more can derive the heat in high temperature region rapidly, effectively reduces the heat and piles up, and the radiating efficiency is higher, can take away a large amount of heats on the chip fast, the heat can not appear and pile up the phenomenon.
The heat pipe and the soaking plate are thin, and the thickness of the whole heat dissipation device cannot be influenced, so that the heat dissipation device is light and thin in structure and high in heat dissipation efficiency.
Compared with the existing products, the light and thin heat dissipation device for the electrical equipment has the following advantages:
according to the utility model, the heat-conducting silica gel, the heat-conducting silicone grease or the heat-conducting silica gel gasket is used in combination with the heat pipe, the vapor chamber and the graphene film, so that the light and thin heat dissipation device for the electrical equipment is combined.
Drawings
FIG. 1: the overall structure of the light and thin heat sink for electrical equipment in embodiments 1 and 2 is schematically illustrated.
FIG. 2: an explosion structure diagram of the light and thin heat dissipation device for electrical equipment in embodiment 1.
FIG. 3: an explosion structure diagram of the light and thin heat dissipation device for electrical equipment in embodiment 2.
FIG. 4: the overall structure of the light and thin heat sink for electrical equipment in embodiments 3 and 4 is schematically illustrated.
FIG. 5: an explosion structure diagram of the light and thin heat dissipation device for electrical equipment in embodiment 3.
FIG. 6: an explosion structure diagram of the light and thin heat dissipation device for electrical equipment in embodiment 4.
FIG. 7: the overall structure of the light and thin heat dissipating device for electrical appliances in embodiments 5 and 6 is schematically illustrated.
FIG. 8: an explosion structure diagram of the light and thin heat dissipation device for electrical equipment in embodiment 5.
FIG. 9: an explosion structure diagram of the light and thin heat dissipation device for electrical equipment in embodiment 6.
Description of reference numerals: 1-body; 2-chip; 3-heat conducting silica gel gasket; 4-a heat-dissipating element; 5-graphene films.
Detailed Description
The technical solution of the present invention will be described in detail by the following specific examples.
Example 1
Fig. 1 and 2 are schematic views of the overall and partial connection structure of the light and thin heat dissipation device for electrical equipment in embodiment 1.
In the electrical equipment, a structure needing heat dissipation is a chip 2, the chip 2 is installed on a body 1 capable of bearing the chip, the upper side and the lower side of the body 1 are respectively provided with the chip 2, and the other side, opposite to the body 1, of the chip 2 is sequentially provided with a heat-conducting medium, a heat-radiating element 4 and a graphene film 5, wherein the heat-conducting medium is a heat-conducting silica gel gasket 3, and the heat-radiating element 4 is a heat pipe or a soaking plate.
Specifically, pins of the chip 2 are welded on the body 1, so that the chip 2 is fixed on the body 1, the chip 2 is in a cuboid structure, 1 heat-conducting silica gel gasket 3 is respectively adhered on 5 exposed surfaces on the chip 2, the size of each 1 heat-conducting silica gel gasket 3 is equal to that of the corresponding surface of the chip 2, and the exposed surfaces of the chip 2 are completely covered by the heat-conducting silica gel gaskets 3;
the structure of the heat pipe or the vapor chamber is a cuboid box-shaped structure with one open side, the opening of the box-shaped structure faces the chip 2, so that the heat pipe or the vapor chamber is covered outside the chip 2, and the heat pipe or the vapor chamber is adhered to the outer surface of the chip 2 by utilizing the viscosity of the heat-conducting silica gel gasket 3; 1 graphene film 5 is respectively stuck on 5 exposed surfaces outside the cuboid box-shaped structure of the heat pipe or the vapor chamber, and the size of each 1 graphene film 5 is equal to the size of the surface on the corresponding heat pipe or the vapor chamber, so that the exposed surfaces of the heat pipe or the vapor chamber are completely covered by the graphene film 5.
Example 2
In embodiment 2, the structure of the light and thin heat sink for electric appliances is substantially the same as that of embodiment 1, and as shown in fig. 1 and 3, in embodiment 2:
in the electrical equipment, a structure needing heat dissipation is a chip 2, the chip 2 is installed on a body 1 capable of bearing the chip 2, the upper side and the lower side of the body 1 are respectively provided with the chip 2, the other side, opposite to the body 1, of the chip 2 is sequentially provided with a heat dissipation element 4 and a graphene film 5, and the heat dissipation element 4 is a heat pipe or a vapor chamber.
Specifically, pins of the chip 2 are welded on the body 1, so that the chip 2 is fixed on the body 1, and the structure of the chip 2 is a cuboid structure; respectively and uniformly coating a layer of heat-conducting silica gel or heat-conducting silicone grease on the 5 exposed surfaces of the chip 2, wherein the heat-conducting silica gel or the heat-conducting silicone grease is in a paste shape and is directly coated on the surface of the chip 2; the structure of the heat pipe or the vapor chamber is also designed to be a cuboid box-shaped structure with an opening on one surface, the opening of the box-shaped structure faces the chip 2, so that the card covers the outside of the chip 2, and the vapor chamber is adhered to the outer surface of the chip 2 by utilizing the viscosity of the heat-conducting silica gel or the heat-conducting silicone grease; and then covering the soaking plate card with the box-shaped structure outside the chip 2.
1 graphene film 5 is respectively stuck on 5 exposed surfaces outside the cuboid box-shaped structure of the heat pipe or the vapor chamber, and the size of each 1 graphene film 5 is equal to the size of the surface on the corresponding heat pipe or the vapor chamber, so that the exposed surfaces of the heat pipe or the vapor chamber are completely covered by the graphene film 5.
Example 3
As shown in fig. 4 and 5, in the electrical apparatus, a structure to be cooled is a chip 2, the chip 2 is mounted on a body 1 capable of carrying the chip 2, the number of the chips 2 is one, the chip 2 is disposed on one side of the body 1, and a heat dissipation element 4 and a graphene film 5 are sequentially disposed on the other side of the chip 2 opposite to the body 1, wherein the heat dissipation element 4 is a heat pipe or a heat spreader.
Specifically, pins of the chip 2 are welded on the body 1, so that the chip 2 is fixed on the body 1, the chip 2 is in a cuboid structure, 1 heat-conducting silica gel gasket 3 is respectively adhered on 5 exposed surfaces on the chip 2, the size of each 1 heat-conducting silica gel gasket 3 is equal to that of the corresponding surface of the chip 2, and the exposed surfaces of the chip 2 are completely covered by the heat-conducting silica gel gaskets 3;
the structure of the heat pipe or the vapor chamber is a cuboid box-shaped structure with one open side, the opening of the box-shaped structure faces the chip 2, so that the heat pipe or the vapor chamber is covered outside the chip 2, and the heat pipe or the vapor chamber is adhered to the outer surface of the chip 2 by utilizing the viscosity of the heat-conducting silica gel gasket 3; 1 graphene film 5 is respectively stuck on 5 exposed surfaces outside the cuboid box-shaped structure of the heat pipe or the vapor chamber, and the size of each 1 graphene film 5 is equal to the size of the surface on the corresponding heat pipe or the vapor chamber, so that the exposed surfaces of the heat pipe or the vapor chamber are completely covered by the graphene film 5.
Example 4
As shown in fig. 4 and 6, in the electrical apparatus, the structure to be cooled is a chip 2, the chip 2 is mounted on a body 1 capable of carrying the chip 2, the number of the chips 2 is one, the chip 2 is disposed on one side of the body 1, and a heat dissipation element 4 and a graphene film 5 are sequentially disposed on the other side of the chip 2 opposite to the body 1, wherein the heat dissipation element 4 is a heat pipe or a heat spreader.
Specifically, pins of the chip 2 are welded on the body 1, so that the chip 2 is fixed on the body 1, and the structure of the chip 2 is a cuboid structure; respectively and uniformly coating a layer of heat-conducting silica gel or heat-conducting silicone grease on the 5 exposed surfaces of the chip 2, wherein the heat-conducting silica gel or the heat-conducting silicone grease is in a paste shape and is directly coated on the surface of the chip 2; the structure of the heat pipe or the vapor chamber is also designed to be a cuboid box-shaped structure with an opening on one surface, the opening of the box-shaped structure faces the chip 2, so that the card covers the outside of the chip 2, and the vapor chamber is adhered to the outer surface of the chip 2 by utilizing the viscosity of the heat-conducting silica gel or the heat-conducting silicone grease; and then covering the soaking plate card with the box-shaped structure outside the chip 2.
1 graphene film 5 is respectively stuck on 5 exposed surfaces outside the cuboid box-shaped structure of the heat pipe or the vapor chamber, and the size of each 1 graphene film 5 is equal to the size of the surface on the corresponding heat pipe or the vapor chamber, so that the exposed surfaces of the heat pipe or the vapor chamber are completely covered by the graphene film 5.
Example 5
As shown in fig. 7 and 8, in the electrical apparatus, a structure to be radiated is a chip 2, the chip 2 is mounted on a body 1 capable of carrying the chip 2, two chips 2 are respectively disposed on upper and lower sides of the body 1, and a radiating element 4 is disposed on the other side of the chip 2 opposite to the body 1, wherein the radiating element 4 is a heat pipe or a vapor chamber.
Specifically, pins of a chip 2 are welded on a body 1, so that the chip 2 is fixed on the body 1, the chip 2 is in a cuboid structure, 1 heat-conducting silica gel gasket 3 is respectively adhered on 5 exposed surfaces on the chip 2, the size of each 1 heat-conducting silica gel gasket 3 is equal to that of the corresponding chip surface, and the exposed surfaces of the chip 2 are completely covered by the heat-conducting silica gel gaskets 3;
the structure of heat pipe or vapor chamber is open-ended cuboid box-shaped structure for the one side, and the opening of box-shaped structure is towards the chip to the card covers in the outside of chip 2, and utilizes the viscidity of heat conduction silica gel gasket 3 to bond heat pipe or vapor chamber on the surface of chip 2 simultaneously.
Example 6
As shown in fig. 7 and 9, in the electrical apparatus, a structure to be radiated is a chip 2, the chip 2 is mounted on a body 1 capable of carrying the chip 2, two chips 2 are respectively disposed on upper and lower sides of the body 1, and a heat dissipation element 4 is disposed on the other side of the chip 2 opposite to the body 1, wherein the heat dissipation element 4 is a heat pipe or a vapor chamber.
Specifically, pins of the chip 2 are welded on the body 1, so that the chip 2 is fixed on the body 1, and the structure of the chip 2 is a cuboid structure; respectively and uniformly coating a layer of heat-conducting silica gel or heat-conducting silicone grease on the 5 exposed surfaces of the chip 2, wherein the heat-conducting silica gel or the heat-conducting silicone grease is in a paste shape and is directly coated on the surface of the chip 2; the structure of the heat pipe or the vapor chamber is also designed to be a cuboid box-shaped structure with an opening on one surface, the opening of the box-shaped structure faces the chip 2, so that the card covers the outside of the chip 2, and the vapor chamber is adhered to the outer surface of the chip 2 by utilizing the viscosity of the heat-conducting silica gel or the heat-conducting silicone grease; and then covering the soaking plate card with the box-shaped structure outside the chip 2.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like made within the design concept of the present invention should be included in the scope of the present invention.
Claims (7)
1. The utility model provides a frivolous type heat abstractor for electrical equipment which characterized in that: the electrical equipment comprises a body and a chip fixed on the body, wherein a heat-conducting medium and a heat-radiating element are sequentially arranged on the other side, opposite to the body, of the chip; the heat-conducting medium is uniformly covered on the surface of the chip; the chip is the cuboid structure, and heat radiating element is one side open-ended cuboid box structure, and cuboid box structure's opening is towards the chip to the card covers in the outside of chip.
2. The thin and light heat sink for electric appliances according to claim 1, wherein: and a graphene film is arranged on one side of the heat dissipation element, which is far away from the chip.
3. The thin and light heat sink for electric appliances according to claim 2, wherein: the graphene film completely covers the exposed surface of the heat dissipation element.
4. The thin and light heat sink for electric appliances according to claim 1, wherein: the chips are 2 groups, and the 2 groups of chips are respectively positioned on the upper side and the lower side of the body.
5. The thin and light heat sink for electric appliances according to claim 1, wherein: the chips are 1 group and are positioned on one side of the body.
6. The thin and light heat sink for electric appliances according to claim 1, wherein: the heat-conducting medium is heat-conducting silica gel, heat-conducting silicone grease or a heat-conducting silica gel gasket.
7. The thin and light heat sink for electric appliances according to claim 1, wherein: the heat dissipation element is a heat pipe or a vapor chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121619906.3U CN216057982U (en) | 2021-07-16 | 2021-07-16 | Light and thin heat dissipation device for electrical equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121619906.3U CN216057982U (en) | 2021-07-16 | 2021-07-16 | Light and thin heat dissipation device for electrical equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216057982U true CN216057982U (en) | 2022-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121619906.3U Active CN216057982U (en) | 2021-07-16 | 2021-07-16 | Light and thin heat dissipation device for electrical equipment |
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| CN (1) | CN216057982U (en) |
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- 2021-07-16 CN CN202121619906.3U patent/CN216057982U/en active Active
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