CN218104027U - Heat dissipation device for electric equipment - Google Patents
Heat dissipation device for electric equipment Download PDFInfo
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- CN218104027U CN218104027U CN202222297494.7U CN202222297494U CN218104027U CN 218104027 U CN218104027 U CN 218104027U CN 202222297494 U CN202222297494 U CN 202222297494U CN 218104027 U CN218104027 U CN 218104027U
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- heat
- mounting groove
- radiator
- pipe
- electric equipment
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Abstract
The application discloses a heat abstractor for on consumer, includes: the heat conduction pipe and the radiator, the heat conductivity of heat conduction pipe is higher than the heat conductivity of radiator, the side that is close to consumer on the radiator is the heat absorption surface, the side that is far away from consumer is the radiating surface, be equipped with the mounting groove on the heat absorption surface, along the radiating surface normal direction, be formed with the cylinder face portion that the bore reduces gradually on the mounting groove inner wall earlier, then be formed with the first plane portion that the bore increases gradually, the degree of depth of mounting groove is less than the diameter of heat conduction pipe, the mounting groove internal surface area is greater than or equal to the surface area of heat conduction pipe rather than the sum of opening surface area, be used for laying the heat conduction pipe in the mounting groove, it has adhesive medium to fill between heat conduction pipe and the mounting groove. The heat dissipation device has more uniform heat dissipation performance.
Description
Technical Field
The present application relates generally to the field of electrical equipment cooling, and more particularly, to a heat dissipation device for use on an electrical device.
Background
All kinds of consumer can produce unnecessary heat in the work engineering, in order to avoid too much heat to influence consumer normal work, generally need install heat abstractor additional on its lateral wall. Generally, the price of a material with high heat conductivity is too high, the cost of the whole electric equipment can be increased by laying the heat pipe with high heat conductivity in an installation groove on the surface of a radiator with relatively low heat conductivity, so that the heat on the surface of the electric equipment can be quickly absorbed through the heat pipe, and the heat can be transferred to the radiator and dissipated to the air through a grid on the radiator. In order to make the heat that the heat pipe absorbed fast transfer to the radiator on, generally can pour into bonding medium into between radiator and heat pipe, nevertheless current mounting groove is convenient for restrict the heat pipe in its inside, generally adopts the design of binding off, so on the one hand not convenient for pour into bonding medium into, on the other hand not convenient for observe whether fill up bonding medium in the mounting groove, in case can not fill up and can cause local heat conductivity to descend, and then influence the normal work of consumer.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a heat dissipation device for use in an electrical device with enhanced heat dissipation.
The specific technical scheme is as follows:
the application provides a heat abstractor for on consumer, includes: the heat conduction pipe is higher than that of the radiator, one side, close to the electric equipment, of the radiator is a heat absorption surface, one side, far away from the electric equipment, of the radiator is a heat dissipation surface, a mounting groove is formed in the heat absorption surface, a cylindrical surface portion with the caliber gradually reduced is formed on the inner wall of the mounting groove along the normal direction of the heat dissipation surface, then a first plane portion with the caliber gradually increased is formed, the depth of the mounting groove is smaller than the diameter of the heat conduction pipe, the sum of the inner surface area of the mounting groove and the opening surface area of the mounting groove is larger than or equal to the surface area of the heat conduction pipe, the heat conduction pipe is laid in the mounting groove, and an adhesive medium is filled between the heat conduction pipe and the mounting groove.
Optionally, after the heat pipe is laid in the installation groove, a part of the heat pipe extending out of the opening surface of the installation groove is stressed to form a heat conduction plane coplanar with the opening surface of the installation groove.
Optionally, a second flat portion with a constant caliber along the normal direction of the heat dissipation surface is further formed between the cylindrical portion and the first flat portion on the inner wall of the mounting groove, and the caliber of the mounting groove at the second flat portion is greater than or equal to the diameter of the heat conduction pipe.
Optionally, the bottom of the mounting groove is a third plane part parallel to the opening surface of the mounting groove.
Optionally, an included angle between the normal direction of the first plane portion and the normal direction of the heat dissipation surface is 45 degrees.
Optionally, the heat conduction pipe is made of copper, and a heat conduction medium with heat conductivity higher than that of copper is arranged in the heat conduction pipe; the radiator is made of aluminum.
Optionally, the bonding medium is solder.
The beneficial effect of this application lies in:
through cylindrical surface portion can will be put into in the mounting groove the heat pipe card in the mounting groove, and first plane portion be convenient for to inject bonding medium in the mounting groove, and when bonding medium be covered with the heat pipe with when between the mounting groove, also be convenient for observe. Therefore, the heat conducting pipe and the radiator are tightly attached by the bonding medium, so that heat absorbed by the heat conducting pipe is uniformly transferred to the radiator, and one side of the electric equipment, which is in contact with the radiating surface, can be fully and uniformly cooled. The normal use of the electric equipment is ensured.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present disclosure;
reference numbers in the figures: 1, a heat conduction pipe; 2, a radiator; 20, mounting grooves; 201, a cylindrical surface part; 202, a first planar portion; 203, a second planar portion; 204, third planar portion
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1, a heat dissipation device for an electric device provided in this embodiment includes: the heat pipe comprises a heat pipe 1 and a radiator 2, wherein the heat conductivity of the heat pipe 1 is higher than that of the radiator 2, one side, close to the electric equipment, of the radiator 2 is a heat absorption surface, one side, far away from the electric equipment, of the radiator 2 is a heat dissipation surface, a mounting groove 20 is arranged on the heat absorption surface, along the normal direction of the heat dissipation surface, a cylindrical surface portion 201 with a gradually reduced caliber is formed on the inner wall of the mounting groove 20, then a first plane portion 202 with a gradually increased caliber is formed, the depth of the mounting groove 20 is smaller than the diameter of the heat pipe 1, the sum of the inner surface area of the mounting groove 20 and the opening surface area of the mounting groove 20 is larger than or equal to the surface area of the heat pipe 1, the heat pipe 1 is laid in the mounting groove 20, and an adhesive medium is filled between the heat pipe 1 and the mounting groove 20.
The heat pipe 1 placed in the installation groove 20 can be clamped in the installation groove 20 by the cylindrical surface part 201, and the first plane part 202 facilitates the injection of an adhesive medium into the installation groove and the observation when the adhesive medium is fully distributed between the heat pipe 1 and the installation groove 20. Therefore, the heat pipe 1 and the radiator 2 can be tightly attached by the adhesive medium through the design, so that the heat absorbed by the heat pipe 1 is uniformly transferred to the radiator 2, and the side of the electric equipment, which is in contact with the radiating surface, can be sufficiently and uniformly cooled. The normal use of the electric equipment is ensured.
In the preferred embodiment of the present invention, after the heat conducting pipe 1 is laid in the installation groove 20, the portion of the heat conducting pipe extending out of the opening surface of the installation groove 20 is forced to form a heat conducting plane coplanar with the opening surface of the installation groove 20.
Through will stretch out on the heat pipe 1 the part of mounting groove 20 opening face set up to with opening face coplane heat conduction plane has increased the area of contact of heat pipe 1 and consumer, and then be favorable to adsorbing the heat that produces on the consumer more and come to reduce its temperature. Therefore, the heat dissipation performance of the heat dissipation device is enhanced.
In a preferred embodiment of reducing the equipment cost investment, a second flat surface 203 having a constant diameter in the normal direction of the heat radiating surface is further formed between the cylindrical surface 201 and the first flat surface 202 on the inner wall of the mounting groove 20, and the diameter of the mounting groove 20 at the second flat surface 203 is greater than or equal to the diameter of the heat conductive pipe 1.
Because the second plane part 203 is additionally arranged between the cylindrical surface part 201 and the first plane part 202 on the inner wall of the mounting groove 20, the diameter of the cylindrical surface part 201 can be reduced, and meanwhile, the depth of the mounting groove 20 is ensured to be enough to accommodate the heat-conducting pipe 1 after being deformed by force. This eliminates the need for specially sized milling tools to machine the cylindrical surface portion 201 of the mounting groove 20 in order to meet the above conditions. And from this point of view this design can reduce the investment costs of the equipment.
Wherein in a preferred embodiment for ensuring the stability of the heat sink in use, the bottom of the mounting groove 20 is a third plane part 204 parallel to the opening plane thereof.
Because the bottom of the installation groove 20 is the third flat surface portion 204 parallel to the opening surface thereof, after the heat conduction pipe 1 is laid in the installation groove 20 and in the process of flattening the portion of the heat conduction pipe 1 extending out of the opening surface of the installation groove 20, the side of the heat conduction pipe 1 far away from the opening surface can be in full contact with the bottom surface of the installation groove 20, so that the heat dissipation device is prevented from cracking in the process, and the use stability of the heat dissipation device is further ensured.
Preferably, an angle between a normal direction of the first plane portion 202 and a normal direction of the heat dissipating surface is 45 degrees.
In a preferred embodiment of further reducing the equipment cost investment, the heat conduction pipe 1 is made of copper, and a heat conduction medium with heat conductivity higher than that of copper is arranged in the heat conduction pipe; the radiator 2 is made of aluminum.
Through the arrangement, on the premise of realizing the same expected cooling effect, the use of heat-conducting media with higher price can be reduced, so that the equipment cost is reduced.
In a preferred embodiment of the present invention, the bonding medium is solder.
The bonding medium is replaced by soldering tin from glue in the prior art, so that the firmness of the fixed heat-conducting pipe 1 can be improved, and the heat conductivity of the heat-conducting pipe can be improved. Therefore, the heat dissipation performance of the radiator is further improved.
The foregoing description is only exemplary of the preferred embodiments of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (7)
1. A heat dissipation device for use on an electrical device, comprising: the heat pipe comprises a heat pipe (1) and a radiator (2), wherein the heat conductivity of the heat pipe (1) is higher than that of the radiator (2), one side, close to electric equipment, of the radiator (2) is a heat absorption surface, one side, far away from the electric equipment, of the radiator is a heat dissipation surface, a mounting groove (20) is formed in the heat absorption surface, a cylindrical surface portion (201) with the gradually reduced caliber is formed in the inner wall of the mounting groove (20) along the normal direction of the heat dissipation surface, then a first plane portion (202) with the gradually increased caliber is formed, the depth of the mounting groove (20) is smaller than the diameter of the heat pipe (1), the sum of the area of the inner surface of the mounting groove (20) and the area of the opening surface of the mounting groove is larger than or equal to the surface area of the heat pipe (1), the heat pipe (1) is used for laying in the mounting groove (20), and an adhesive medium is filled between the heat pipe (1) and the mounting groove (20).
2. The heat sink for electric equipment according to claim 1, wherein the heat conducting pipe (1) is laid in the mounting groove (20), and a portion of the heat conducting pipe extending out of the opening surface of the mounting groove (20) is forced to form a heat conducting plane coplanar with the opening surface of the mounting groove (20).
3. The heat sink for electric equipment according to claim 1, wherein a second flat portion (203) having a constant diameter along a normal direction of the heat dissipating surface is further formed between the cylindrical portion (201) and the first flat portion (202) on the inner wall of the mounting groove (20), and a diameter of the mounting groove (20) at the second flat portion (203) is greater than or equal to a diameter of the heat pipe (1).
4. The heat sink device for electric equipment according to claim 1, wherein the bottom of the mounting groove (20) is a third planar portion (204) parallel to the opening surface thereof.
5. The heat sink for electric equipment according to claim 1, wherein an angle between a normal direction of the first plane portion (202) and a normal direction of the heat dissipating surface is 45 degrees.
6. The heat dissipation device for electric equipment according to any one of claims 1 to 5, wherein the heat pipe (1) is made of copper, and a heat conducting medium having a thermal conductivity higher than that of copper is disposed inside the heat pipe; the radiator (2) is made of aluminum.
7. The heat sink device as claimed in any one of claims 1 to 5, wherein the bonding medium is solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222297494.7U CN218104027U (en) | 2022-08-31 | 2022-08-31 | Heat dissipation device for electric equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222297494.7U CN218104027U (en) | 2022-08-31 | 2022-08-31 | Heat dissipation device for electric equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218104027U true CN218104027U (en) | 2022-12-20 |
Family
ID=84450057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222297494.7U Active CN218104027U (en) | 2022-08-31 | 2022-08-31 | Heat dissipation device for electric equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218104027U (en) |
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2022
- 2022-08-31 CN CN202222297494.7U patent/CN218104027U/en active Active
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