CN112040741A - Heat dissipation cooling device for high heat flow heating element - Google Patents
Heat dissipation cooling device for high heat flow heating element Download PDFInfo
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- CN112040741A CN112040741A CN202010930950.XA CN202010930950A CN112040741A CN 112040741 A CN112040741 A CN 112040741A CN 202010930950 A CN202010930950 A CN 202010930950A CN 112040741 A CN112040741 A CN 112040741A
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- heat
- graphene
- heating element
- conducting
- layer
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 46
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 20
- 238000001816 cooling Methods 0.000 title claims abstract description 18
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 58
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000741 silica gel Substances 0.000 claims abstract description 22
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 22
- 229910002804 graphite Inorganic materials 0.000 claims description 9
- 239000010439 graphite Substances 0.000 claims description 9
- -1 graphite alkene Chemical class 0.000 claims description 9
- 238000010622 cold drawing Methods 0.000 claims description 5
- 230000004907 flux Effects 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims 2
- 238000012546 transfer Methods 0.000 abstract description 7
- 239000002826 coolant Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Abstract
The invention relates to a heat dissipation and cooling device for a high-heat-flow heating element, which consists of a cold plate, a first heat-conducting silica gel layer, a graphene heat-conducting layer, a second heat-conducting silica gel layer and a heating element, wherein the graphene heat-conducting layer consists of a metal shell, a plurality of graphene and a plurality of metal sheets, the graphene and the metal sheets are sequentially stacked from left to right and are vertically arranged between the cold plate and the heating element, and heat-conducting silica gel is filled between the cold plate and the graphene heat-conducting layer as well as between the graphene heat-conducting layer and the heating element. According to the invention, the ultrahigh thermal conductivity of graphene along the plane direction is fully utilized, the heat generated by the heating element is conducted to the cold plate with a larger area from the heating element with a small surface area, meanwhile, the thermal contact resistance in the heat transfer process can be effectively reduced by the heat conducting silica gel layer, the heat generated by the heating element can be quickly dissipated to the external environment through the cooling medium in the cold plate, and the heat dissipation efficiency is greatly improved.
Description
Technical Field
The invention relates to the technical field of heat dissipation and cooling, in particular to a heat dissipation and cooling device for a high-heat-flow heating element.
Background
The high-speed development of a new generation of information technology puts higher calculation requirements on electronic information equipment, the packaging number and packaging density of transistors in chips such as a high-performance CPU/GPU are rapidly increased, the heat productivity is rapidly increased, and the surface heat flow density of a heating element is sharply increased under the condition that the size of the heating element is basically unchanged or even reduced. However, the existing heat dissipation and cooling technologies have limited heat dissipation capability, the heat flow density is difficult to meet the heat dissipation and cooling requirements of the high heat flow heating element, and the problem of overheating and downtime often occurs.
The graphene has very good heat conduction performance, the heat conduction coefficient is as high as 5300W/m.K, and the graphene is a material with the highest heat conduction coefficient so far, and is suitable for heat dissipation and cooling of high-heat-flow-density elements. However, graphene thermal conductivity is anisotropic, with the perpendicular direction thermal conductivity being much lower than the in-plane direction thermal conductivity.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a heat dissipation and cooling device for a high-heat-flow heating element, which makes full use of the ultrahigh heat conductivity of graphene along the plane direction, so that the heat generated by the heating element is conducted from the heating element with a smaller surface area to a cold plate with an area larger than that of the heating element, meanwhile, the heat-conducting silica gel layer can effectively reduce the contact thermal resistance in the heat transfer process, the heat generated by the heating element can be quickly dissipated to the external environment through a cooling medium in the cold plate, and the heat dissipation efficiency is greatly improved.
In order to achieve the purpose, the invention adopts the technical scheme that:
a heat dissipation and cooling device for a high-heat-flow heating element comprises a cold plate, a first heat conduction silica gel layer, a graphene heat conduction layer, a second heat conduction silica gel layer and a heating element which are sequentially arranged from top to bottom; the graphene heat-conducting layer is composed of a metal shell, a plurality of graphene and a plurality of metal sheets, the graphene and the metal sheets are sequentially stacked from left to right and are vertically arranged between the cold plate and the heating element, and heat-conducting silica gel is filled between the cold plate and the graphene heat-conducting layer as well as between the graphene heat-conducting layer and the heating element.
Preferably, the area of the lower surface of the cold plate is equal to the area of the upper surface of the graphene heat conduction layer, and the area of the lower surface of the graphene heat conduction layer is equal to the area of the upper surface of the heating element.
Preferably, the area of the upper surface of the graphene heat conduction layer is larger than that of the lower surface of the graphene heat conduction layer.
Preferably, the length of the upper surface of the graphene heat conduction layer in the direction in which the graphene and the metal sheet are sequentially stacked is equal to the length of the lower surface in the direction in which the graphene and the metal sheet are sequentially stacked.
Preferably, the graphene heat conduction layer is in a trapezoid or a step shape with a large top and a small bottom.
Compared with the prior art, the invention has the beneficial effects that:
1. the graphene heat conduction layer is composed of a metal shell, a plurality of layers of graphene and a plurality of metal sheets, the graphene and the metal sheets are sequentially stacked from left to right and are vertically arranged between the cold plate and the heating element, the ultrahigh heat conductivity of the graphene along the plane direction is fully utilized, and the heat conduction heat flow of the graphene heat conduction layer is greatly improved.
2. The heat that graphite alkene heat-conducting layer produced heating element conducts the surface area from the very little heating element of surface area to be greater than the cold drawing of heating element surface area, and the thermal conductive silica gel layer can reduce the thermal contact resistance of heat transfer process effectively simultaneously, and the heat that heating element produced can distribute to external environment through the inside coolant of cold drawing fast in, and the radiating efficiency obtains promoting by a wide margin.
Drawings
Fig. 1 is a front view of a heat dissipation and cooling device for a high heat flow heating element according to a first embodiment;
FIG. 2 is a side view of the heat sink cooling device for a high heat flow heating element according to the first embodiment;
fig. 3 is an external view of the graphene thermal conductive layer with a trapezoidal profile according to the first embodiment;
FIG. 4 is a side view of the heat sink cooling device for a high heat flux heating element according to the second embodiment;
fig. 5 is an external view of the graphene thermal conductive layer with the step-shaped profile according to the second embodiment;
description of reference numerals: 1-a cold plate; 2-a first heat-conducting silica gel layer; 3-a graphene heat conducting layer; 30-a metal housing; 31-graphene; 32-metal flakes; 4-a second heat-conducting silica gel layer; 5-heating element.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of embodiments of the present invention, and not all embodiments.
In the description of the present invention, it is to be understood that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
Example one
As shown in fig. 1 to fig. 3, the heat dissipation and cooling device for a high heat flow heating element in this embodiment includes a cold plate 1, a first heat conductive silicone layer 2, a graphene heat conductive layer 3, and a second heat conductive silicone layer 4.
The cold plate 1, the first heat-conducting silica gel layer 2, the graphene heat-conducting layer 3 and the second heat-conducting silica gel layer 4 are sequentially arranged on the heating element 5 from top to bottom.
The graphene heat conduction layer 3 mainly comprises a metal shell 30, a plurality of graphene layers 31 and a plurality of metal sheets 32, wherein the graphene layers 31 and the metal sheets 32 are sequentially stacked from left to right and are vertically arranged between the cold plate 1 and the heating element 5.
Preferably, the area of the lower surface of the cold plate 1 is equal to the area of the upper surface of the graphene heat conduction layer 3, and the area of the lower surface of the graphene heat conduction layer 3 is equal to the area of the upper surface of the heating element 5.
In order to further improve the heat dissipation efficiency, the area of the upper surface of the graphene heat conduction layer 3 needs to be larger than the area of the lower surface of the graphene heat conduction layer 3. Therefore, in the present embodiment, the graphene 31 and the metal sheet 32 are formed as trapezoidal sheets with large top and small bottom, and are sequentially bonded to form a trapezoidal body. As will be readily understood, since the graphene 31 and the metal sheet 32 are vertically stacked in this order, the length of the upper surface of the graphene heat conduction layer 3 in the stacking direction is equal to the length of the lower surface in the stacking direction.
During operation, the heat that heating element 5 produced transmits the graphite alkene heat-conducting layer 3 that the appearance is the trapezoidal body through second heat conduction silica gel layer 4, and the graphite alkene heat-conducting layer 3 that the appearance is the trapezoidal body gives first heat conduction silica gel layer 2 with heat transfer again, and first heat conduction silica gel layer 2 gives cold plate 1 with heat transfer again, and the absorptive heat of cold plate 1 gives off fast in the environment on every side through cooling medium with the compulsory convection current mode, so realizes heating element 5's heat dissipation cooling.
Example two
As shown in fig. 4 and 5, the heat dissipation and cooling device for a high heat flow heating element in this embodiment is different from the first embodiment in that the graphene 31 and the metal sheet 32 are stepped sheets with large top and small bottom, and both sides of the graphene and the metal sheet are stepped.
During operation, the heat that heating element 5 produced transmits the graphite alkene heat-conducting layer 3 that the appearance is the step ladder-shaped body through second heat conduction silica gel layer 4, and the graphite alkene heat-conducting layer 3 that the appearance is the step ladder-shaped body gives first heat conduction silica gel layer 2 with heat transfer again, and first heat conduction silica gel layer 2 gives cold drawing 1 with heat transfer again, and the absorptive heat of cold drawing 1 distributes to the surrounding environment through cooling medium fast with the compulsory convection mode in, so realizes heating element 5's heat dissipation cooling.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention accordingly, and not to limit the protection scope of the present invention accordingly. All equivalent changes or modifications made in accordance with the spirit of the present disclosure are intended to be covered by the scope of the present disclosure.
Claims (5)
1. A heat dissipation cooling device for a high heat flow heating element is characterized in that: the heat-conducting plate comprises a cold plate, a first heat-conducting silica gel layer, a graphene heat-conducting layer, a second heat-conducting silica gel layer and a heating element which are sequentially arranged from top to bottom; the graphene heat-conducting layer is composed of a metal shell, a plurality of graphene and a plurality of metal sheets, the graphene and the metal sheets are sequentially stacked from left to right and are vertically arranged between the cold plate and the heating element, and heat-conducting silica gel is filled between the cold plate and the graphene heat-conducting layer as well as between the graphene heat-conducting layer and the heating element.
2. A high heat flux, heat generating component, heat sink and cooler as recited in claim 1, further comprising: the area of cold drawing lower surface equals with the area of graphite alkene heat-conducting layer upper surface, and the area of graphite alkene heat-conducting layer lower surface equals with the area of heating element upper surface.
3. A high heat flux, heat generating component, heat sink and cooler as recited in claim 1, further comprising: the area of graphite alkene heat-conducting layer upper surface is greater than the area of graphite alkene heat-conducting layer lower surface.
4. A high heat flux, heat generating component, heat sink and cooler as recited in claim 3, further comprising: the length that graphene heat-conducting layer upper surface stacked the direction in proper order along graphene and foil equals with the length that the direction was stacked in proper order along graphene and foil to the lower surface.
5. The heat sink and cooler for high heat flow heat generating component as claimed in claim 4, wherein: the graphene heat conduction layer is in a trapezoid or step shape with a large upper part and a small lower part.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010930950.XA CN112040741A (en) | 2020-09-07 | 2020-09-07 | Heat dissipation cooling device for high heat flow heating element |
| PCT/CN2021/109088 WO2021259385A1 (en) | 2020-09-07 | 2021-07-29 | Radiation cooling device for high-heat-flux heat generating element |
| AU2021294898A AU2021294898A1 (en) | 2020-09-07 | 2021-07-29 | Heat dissipation and cooling apparatus for high heat flux heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010930950.XA CN112040741A (en) | 2020-09-07 | 2020-09-07 | Heat dissipation cooling device for high heat flow heating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112040741A true CN112040741A (en) | 2020-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010930950.XA Pending CN112040741A (en) | 2020-09-07 | 2020-09-07 | Heat dissipation cooling device for high heat flow heating element |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN112040741A (en) |
| AU (1) | AU2021294898A1 (en) |
| WO (1) | WO2021259385A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021259385A1 (en) * | 2020-09-07 | 2021-12-30 | 中国科学院广州能源研究所 | Radiation cooling device for high-heat-flux heat generating element |
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| JP2014216443A (en) * | 2013-04-25 | 2014-11-17 | 京セラ株式会社 | Heat radiation substrate, package for storing electronic component, and electronic device |
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| KR20190124494A (en) * | 2018-04-26 | 2019-11-05 | 대전대학교 산학협력단 | Metal heat sink using graphene and manufacturing method |
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| CN212324647U (en) * | 2020-09-07 | 2021-01-08 | 中国科学院广州能源研究所 | Heat dissipation cooling device for high heat flow heating element |
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| KR101956278B1 (en) * | 2011-12-30 | 2019-03-11 | 삼성전자주식회사 | Heterogeneous laminate comprising graphene, thermoelectric material, thermoelectric module and thermoelectric apparatus comprising same |
| CN107645893A (en) * | 2017-10-23 | 2018-01-30 | 南京旭羽睿材料科技有限公司 | A kind of graphene heat dissipation film |
| CN109986866A (en) * | 2018-11-29 | 2019-07-09 | 安徽荣泽科技有限公司 | A kind of manufacture craft of high-temperature heat-conductive film |
| CN210630126U (en) * | 2019-07-31 | 2020-05-26 | 联想(北京)有限公司 | Heat dissipation device and electronic equipment |
| CN112040741A (en) * | 2020-09-07 | 2020-12-04 | 中国科学院广州能源研究所 | Heat dissipation cooling device for high heat flow heating element |
-
2020
- 2020-09-07 CN CN202010930950.XA patent/CN112040741A/en active Pending
-
2021
- 2021-07-29 WO PCT/CN2021/109088 patent/WO2021259385A1/en active Application Filing
- 2021-07-29 AU AU2021294898A patent/AU2021294898A1/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2014216443A (en) * | 2013-04-25 | 2014-11-17 | 京セラ株式会社 | Heat radiation substrate, package for storing electronic component, and electronic device |
| CN206341549U (en) * | 2017-01-11 | 2017-07-18 | 东莞市优旺电子科技有限公司 | One kind radiating graphite flake |
| KR20190124494A (en) * | 2018-04-26 | 2019-11-05 | 대전대학교 산학협력단 | Metal heat sink using graphene and manufacturing method |
| CN209133491U (en) * | 2018-12-04 | 2019-07-19 | 珠海格力电器股份有限公司 | A kind of heat conductive pad |
| CN210607227U (en) * | 2019-10-17 | 2020-05-22 | 深圳泰思特半导体有限公司 | Chip heat radiation structure and hard disk |
| CN212324647U (en) * | 2020-09-07 | 2021-01-08 | 中国科学院广州能源研究所 | Heat dissipation cooling device for high heat flow heating element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021259385A1 (en) * | 2020-09-07 | 2021-12-30 | 中国科学院广州能源研究所 | Radiation cooling device for high-heat-flux heat generating element |
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| Publication number | Publication date |
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| AU2021294898A1 (en) | 2022-11-03 |
| WO2021259385A1 (en) | 2021-12-30 |
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