CN214848596U - A high-efficient heat radiation structure for chip - Google Patents

Abstract

The utility model discloses a high-efficient heat radiation structure for chip, including composite cooling fin, composite cooling fin intermediate position is provided with heat dissipation copper foil substrate, heat dissipation copper foil substrate top and bottom are provided with graphite fin, lower graphite fin respectively, upper graphite fin top is provided with the metal conducting strip, lower graphite fin bottom is provided with the metal conducting strip down, upper metal conducting strip top is provided with aluminium base fin, metal conducting strip bottom is provided with first recess down, be provided with the heat conduction gasket in the first recess, be provided with the second recess with the convex font surface matched with of the chip that generates heat on the heat conduction gasket; the utility model discloses fill the wire in the thermal pad, the wire of packing is continuous distribution in the silica gel base member, has formed the heat transfer way that has a perfect understanding, has consequently improved the heat conductivility of heat-conducting layer body to the heat that the chip that will generate heat each heating surface conducts.

Description

A high-efficient heat radiation structure for chip

Technical Field

The utility model relates to a chip heat dissipation technical field, concretely relates to a high-efficient heat radiation structure for chip.

Background

At present, with the increase of complexity of the television system, the increase of the number of cores, the change of the core manufacturing process and the heat dissipation of the chip become one of the bottlenecks of the chip design. The heat generated by the chip is mainly dissipated through the surface of the chip except that a small part of the heat is dissipated outwards through the bottom carrier plate and the welding points. Therefore, a heat sink is usually added on the chip to dissipate heat of the chip, the heat sink itself is in contact with the chip through a silicone grease medium (a heat conductive material), the silicone grease conducts heat to the heat sink, and then the heat sink dissipates heat through heat radiation.

However, the amount of the silicone grease medium layer coated and the design error of the heat sink can affect the contact between the heat sink and the silicone grease medium and between the silicone grease medium and the chip, so that the heat sink, the silicone grease medium and the chip can not form a good heat conduction environment, and the heat dissipation effect is affected. In view of the above drawbacks, it is necessary to design an efficient heat dissipation structure for a chip.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high-efficient heat radiation structure for chip to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-efficient heat radiation structure for chip, includes composite heat sink, composite heat sink intermediate position is provided with heat dissipation copper foil substrate, heat dissipation copper foil substrate top and bottom are provided with graphite fin, graphite fin down respectively, it is provided with the metal conducting strip to go up graphite fin top, graphite fin bottom is provided with down the metal conducting strip down, it is provided with aluminium base fin to go up metal conducting strip top, metal conducting strip bottom is provided with first recess down, the inside heat conduction gasket that is provided with of first recess is provided with the second recess with the convex font surface matched with of the chip that generates heat on the heat conduction gasket, the inside chip that generates heat that is provided with of second recess.

Preferably, the top of the upper aluminum-based radiating fin is provided with radiating protrusions and radiating grooves, the radiating protrusions and the radiating grooves are arranged in a wave shape at intervals, and four corners of the composite radiating fin are provided with mounting holes respectively.

Preferably, the heat conduction gasket includes the heat-conducting layer and sets up in the fine enhancement layer of glass of heat-conducting layer one side, and the second recess sets up in the surface of heat-conducting layer, the heat-conducting layer includes the silica gel base member and fills the wire in the silica gel base member, all is provided with one deck phase change heat conduction material layer on the tank bottom surface of second recess and four groove lateral walls on the surface.

Preferably, a kidney-shaped groove is formed in the bottom of the lower metal heat conducting fin and communicated with the first groove, two limiting columns are arranged inside the first groove, and the first groove and the second groove are rectangular grooves.

Preferably, the heat dissipation copper foil substrate is arranged into a net structure.

Preferably, the metal wire is a silver wire, a copper wire or an aluminum wire.

Preferably, the heat conducting gasket is provided with two limiting holes, and the shape of the heat conducting gasket is square.

Compared with the prior art, the utility model relates to a high-efficient heat radiation structure for chip, compound a layer of fine enhancement layer of glass on the heat conduction gasket, improved the mechanical strength of heat conduction gasket under the prerequisite that does not increase heat conduction gasket thickness and thermal resistance, had good anti tearing and anti puncture performance, can not pricked by the stitch, avoided the emergence of electronic product short circuit problem; the utility model discloses compound graphite fin on netted heat dissipation copper foil substrate, owing to need not to use the adhesive, consequently greatly reduced interface thermal resistance, effectively avoid compound fin to produce the phenomenon of coming unstuck between the layer simultaneously, thereby make compound fin have excellent mechanical properties and heat conduction heat dispersion, graphite fin adopts graphite alkene, nanometer carbon, ferrite and tombarthite manual synthesis, have high coefficient of heat conductivity and higher radiating effect, moreover, the steam generator is simple in structure, therefore, the clothes hanger is strong in practicability, and production cost is saved, meanwhile, through being provided with heat dissipation bulge and heat dissipation groove on compound fin, heat dissipation bulge and heat dissipation groove interval are the structure of wave setting, heat transfer area has been enlarged, further improved the radiating effect; the second groove of the utility model can be tightly attached to the central surface and the peripheral side surface of the heating chip, and the phase change heat conduction material layer on the side wall of the second groove and the bottom surface of the groove is subjected to phase change when being heated, and is softened into semi-liquid state by the original solid layer, so that the second groove can be in closer contact with the surface of the heating chip from a microscopic angle, and the heat conduction performance is improved; the utility model discloses fill the wire in the thermal pad, the wire of packing is continuous distribution in the silica gel base member, has formed the heat transfer way that has a perfect understanding, has consequently improved the heat conductivility of heat-conducting layer body to the heat that the chip that will generate heat each heating surface conducts.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description, do not constitute a limitation of the invention, in which:

fig. 1 is a schematic structural view of an efficient heat dissipation structure for a chip according to the present invention;

fig. 2 is an exploded view of an efficient heat dissipation structure for a chip according to the present invention;

fig. 3 is a schematic view of a composite heat sink used in a high-efficiency heat dissipation structure of a chip according to the present invention;

fig. 4 is a schematic structural view of a heat conducting gasket used in a high-efficiency heat dissipation structure of a chip.

In the drawings:

1. a composite heat sink; 2. a heat-dissipating copper foil substrate; 3. mounting a graphite radiating fin; 4. a lower graphite heat sink; 5. an upper metal heat-conducting sheet; 6. a lower metal heat-conducting fin; 7. a first groove; 8. an upper aluminum-based heat sink; 9. a heat dissipation protrusion; 10. a heat dissipation groove; 11. a thermally conductive gasket; 12. a heat generating chip; 13. a second groove; 14. a heat conductive layer; 15. a glass fiber reinforced layer; 16. a silica gel substrate; 17. a metal wire; 18. a phase change heat conductive material layer; 19. a limiting column; 20. a kidney-shaped groove; 21. and (7) installing holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a high-efficient heat radiation structure for chip, includes composite heat sink 1, 1 intermediate position of composite heat sink is provided with heat dissipation copper foil substrate 2, 2 tops of heat dissipation copper foil substrate and bottom are provided with graphite fin 3, lower graphite fin 4 respectively, it is provided with metal conducting strip 5 to go up 3 tops of graphite fin, 4 bottoms of graphite fin are provided with down metal conducting strip 6 down, it is provided with aluminium base fin 8 to go up 5 tops of metal conducting strip, 6 bottoms of metal conducting strip are provided with first recess 7 down, it all is provided with radiating bulge 9 and radiating groove 10 to go up aluminium base fin 8 tops, radiating bulge 9 and radiating groove 10 interval are the wave setting, 1 four corners of composite heat sink respectively has mounting hole 21, the installation of composite heat sink 1 of being convenient for.

In this embodiment, the heat dissipation copper foil substrate 2 is set to be a mesh structure, the upper graphite heat dissipation fin 3 and the lower graphite heat dissipation fin 4 are graphite sheets artificially synthesized from graphene, nanocarbon, ferrite and rare earth, the upper metal heat conduction fin 5 and the lower metal heat conduction fin 6 are both made of a nanocoil material, the thicknesses of the upper metal heat conduction fin 5 and the lower metal heat conduction fin 6 are set to be 0.5mm, the upper aluminum-based heat dissipation fin 8 is provided with heat dissipation holes, and the heat dissipation copper foil substrate 2 is fixedly connected with the upper graphite heat dissipation fin 3 and the lower graphite heat dissipation fin 4 through composite extension.

In this embodiment, a heat conducting pad 11 is arranged inside the first groove 7, two limiting holes are formed in the heat conducting pad 11, the heat conducting pad 11 is square in shape, a second groove 13 matched with the convex-shaped surface of the heat generating chip 12 is formed in the heat conducting pad 11, the heat generating chip 12 is arranged inside the second groove 13, the heat conducting pad 11 comprises a heat conducting layer 14 and a glass fiber reinforced layer 15 arranged on one side of the heat conducting layer 14, the second groove 13 is formed in the surface of the heat conducting layer 14, the heat conducting layer 14 comprises a silica gel base body 16 and metal wires 17 filled in the silica gel base body 16, and a phase change heat conducting material layer 18 is arranged on the bottom surface of the second groove 13 and on the surfaces of the four groove side walls.

The metal wires 17 in this embodiment are silver wires, copper wires or aluminum wires, and the metal wires 17 extend in the direction perpendicular to the heat conducting pad in the silica gel substrate 16, so that each metal wire 17 forms a through heat conducting path.

In this embodiment, a kidney-shaped groove 20 is formed in the bottom of the lower metal heat conducting strip 6, the kidney-shaped groove 20 is communicated with the first groove 7, the heat conducting gasket 11 is conveniently placed due to the kidney-shaped groove 20, two limiting columns 19 are arranged inside the first groove 7, and the first groove 7 and the second groove 13 are rectangular grooves. The utility model discloses during the installation, install heat gasket 11 in composite heat sink 1's 7 for 19 chucking of spacing post are in heat gasket 11's spacing downthehole, make heat gasket 11 more firm fix in composite heat sink 1's first recess 7.

In this embodiment, the glass fiber reinforced layer 15 is compounded on the heat conducting gasket 11, so that the mechanical strength of the heat conducting gasket 11 is improved on the premise of not increasing the thickness and the thermal resistance of the heat conducting gasket, the heat conducting gasket has good tear resistance and puncture resistance, and cannot be punctured by pins, and the short circuit problem of an electronic product is avoided.

The utility model discloses compound graphite cooling fin on netted heat dissipation copper foil substrate 2, owing to need not to use the bonding agent, consequently greatly reduced interface thermal resistance, effectively avoid composite cooling fin to produce the phenomenon of coming unstuck between the layer simultaneously, thereby make composite cooling fin have excellent mechanical properties and heat conduction heat dispersion, graphite cooling fin adopts graphite alkene, nanometer carbon, ferrite and tombarthite manual synthesis, high coefficient of heat conductivity and higher radiating effect have, moreover, the steam generator is simple in structure, therefore, the clothes hanger is strong in practicability, and the production cost is saved, simultaneously through being provided with radiating protrusion 9 and radiating groove 10 on composite cooling fin, radiating protrusion 9 and radiating groove 10 interval are the structure that the wave set up, heat transfer area has been enlarged, the radiating effect has further been improved.

The utility model discloses a second recess 13 can closely laminate the central authorities face and the side on every side of the chip that generates heat to phase change heat conducting material layer 18 on second recess 13 lateral wall and the tank bottom surface carries out the phase transition when being heated, is softened into semi-liquid by original solid layer, thereby can follow the more inseparable contact of microcosmic angle the surface of the chip that generates heat, has improved the heat conductivility. The utility model discloses pack wire 17 in heat conduction gasket 11, the wire 17 of packing is continuous distribution in silica gel base member 16, has formed the heat transfer route that has a perfect understanding, has consequently improved the heat conductivility of heat-conducting layer 14 body to the heat that will generate heat chip 12 each heating surface conducts.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a high-efficient heat radiation structure for chip which characterized in that: comprises a composite radiating fin (1), a radiating copper foil substrate (2) is arranged in the middle of the composite radiating fin (1), the top and the bottom of the heat-radiating copper foil substrate (2) are respectively provided with an upper graphite heat-radiating fin (3) and a lower graphite heat-radiating fin (4), an upper metal heat conducting fin (5) is arranged at the top of the upper graphite radiating fin (3), a lower metal heat conducting fin (6) is arranged at the bottom of the lower graphite radiating fin (4), the top of the upper metal heat conducting fin (5) is provided with an upper aluminum-based radiating fin (8), the bottom of the lower metal heat conducting strip (6) is provided with a first groove (7), a heat conducting gasket (11) is arranged in the first groove (7), a second groove (13) matched with the convex-shaped surface of the heating chip (12) is formed in the heat conducting gasket (11), and the heating chip (12) is arranged in the second groove (13).

2. The efficient heat dissipation structure for chips of claim 1, wherein: go up aluminium base fin (8) top and all be provided with heat dissipation arch (9) and heat dissipation recess (10), heat dissipation arch (9) and heat dissipation recess (10) interval are the wave setting, composite cooling fin (1) four corners respectively has mounting hole (21).

3. The efficient heat dissipation structure for chips of claim 1, wherein: heat conduction gasket (11) include heat-conducting layer (14) and set up in the fine enhancement layer of glass (15) of heat-conducting layer (14) one side, and second recess (13) set up in the surface of heat-conducting layer (14), heat-conducting layer (14) include silica gel base member (16) and fill wire (17) in silica gel base member (16), all are provided with one deck phase change heat conduction material layer (18) on the tank bottom surface of second recess (13) and the surface of four groove lateral walls.

4. The efficient heat dissipation structure for chips of claim 1, wherein: the bottom of the lower metal heat conducting fin (6) is provided with a kidney-shaped groove (20), the kidney-shaped groove (20) is communicated with the first groove (7), two limiting columns (19) are arranged inside the first groove (7), and the first groove (7) and the second groove (13) are rectangular grooves.

5. The efficient heat dissipation structure for chips of claim 1, wherein: the heat dissipation copper foil substrate (2) is arranged to be of a net structure.

6. A high-efficiency heat dissipation structure for chips as defined in claim 3, wherein: the metal wire (17) is a silver wire, a copper wire or an aluminum wire.

7. The efficient heat dissipation structure for chips of claim 1, wherein: two limiting holes are formed in the heat conducting gasket (11), and the heat conducting gasket (11) is square.

Images