CN112040741B - High heat flow heating element heat dissipation cooling device - Google Patents
High heat flow heating element heat dissipation cooling device Download PDFInfo
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- CN112040741B CN112040741B CN202010930950.XA CN202010930950A CN112040741B CN 112040741 B CN112040741 B CN 112040741B CN 202010930950 A CN202010930950 A CN 202010930950A CN 112040741 B CN112040741 B CN 112040741B
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- heat
- graphene
- heating element
- heat conduction
- layer
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 47
- 238000001816 cooling Methods 0.000 title claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 17
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 64
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 62
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000741 silica gel Substances 0.000 claims abstract description 25
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 23
- 238000012546 transfer Methods 0.000 abstract description 7
- 239000002826 coolant Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 230000004907 flux Effects 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a heat dissipation and cooling device for a high-heat-flow heating element, which consists of a cold plate, a first heat-conducting silica gel layer, a graphene heat-conducting layer, a second heat-conducting silica gel layer and a heating element, wherein the graphene heat-conducting layer consists of a metal shell, a plurality of grapheme and a plurality of metal sheets, the grapheme and the metal sheets are sequentially stacked from left to right and are vertically arranged between the cold plate and the heating element, and heat-conducting silica gel is filled between the cold plate and the graphene heat-conducting layer, and between the grapheme heat-conducting layer and the heating element. According to the invention, the ultrahigh thermal conductivity of the graphene along the plane direction is fully utilized, heat generated by the heating element is conducted from the heating element with small surface area to the cold plate with large area, meanwhile, the heat-conducting silica gel layer can effectively reduce the contact thermal resistance in the heat transfer process, the heat generated by the heating element can be rapidly emitted to the external environment through the cooling medium in the cold plate, and the heat-radiating efficiency is greatly improved.
Description
Technical Field
The invention relates to the technical field of heat dissipation and cooling, in particular to a heat dissipation and cooling device for a high-heat-flow heating element.
Background
The high-speed development of the new generation information technology puts higher calculation requirements on electronic information equipment, the packaging quantity and packaging density of transistors in chips such as high-performance CPU/GPU (Central processing Unit/graphics processing Unit) and the like are rapidly increased, so that the heating value is rapidly increased, and the surface heat flux density of a heating element is rapidly increased under the condition that the size of the heating element is basically unchanged or even reduced. However, the existing heat dissipation cooling technology has limited heat dissipation capability, the heat dissipation cooling requirement of a high heat flow heating element is difficult to be met by heat extraction heat flow density, and the problem of overheat downtime frequently occurs.
The graphene has very good heat conduction performance, and the heat conduction coefficient is as high as 5300W/m.K, is the material with the highest heat conduction coefficient so far, and is suitable for heat dissipation and cooling of high heat flux density elements. But graphene thermal conductivity is anisotropic, with vertical thermal conductivity being much lower than thermal conductivity along the planar direction.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides the high heat flow heating element radiating and cooling device which fully utilizes the ultrahigh thermal conductivity of graphene along the plane direction to conduct heat generated by the heating element from the heating element with smaller surface area to the cold plate with larger area than the heating element, and meanwhile, the heat conduction silica gel layer can effectively reduce the contact thermal resistance in the heat transfer process, and the heat generated by the heating element can be rapidly radiated to the external environment through the cooling medium in the cold plate, so that the radiating efficiency is greatly improved.
In order to achieve the above purpose, the invention adopts the following technical scheme:
A heat dissipation cooling device of a high heat flow heating element comprises a cold plate, a first heat conduction silica gel layer, a graphene heat conduction layer, a second heat conduction silica gel layer and a heating element which are sequentially arranged from top to bottom; the graphene heat conduction layer is composed of a metal shell, a plurality of graphene and a plurality of metal sheets, the graphene and the metal sheets are sequentially stacked from left to right and are vertically arranged between the cold plate and the heating element, and heat conduction silica gel is filled between the cold plate and the graphene heat conduction layer and between the graphene heat conduction layer and the heating element.
Preferably, the area of the lower surface of the cold plate is equal to the area of the upper surface of the graphene heat conduction layer, and the area of the lower surface of the graphene heat conduction layer is equal to the area of the upper surface of the heating element.
Preferably, the area of the upper surface of the graphene heat conduction layer is larger than the area of the lower surface of the graphene heat conduction layer.
Preferably, the length of the upper surface of the graphene heat conduction layer along the stacking direction of the graphene and the metal sheet is equal to the length of the lower surface of the graphene heat conduction layer along the stacking direction of the graphene and the metal sheet.
Preferably, the graphene heat conduction layer is trapezoid or stepped with a large upper part and a small lower part.
Compared with the prior art, the invention has the beneficial effects that:
1. The graphene heat conduction layer is composed of a metal shell, a plurality of graphene layers and a plurality of metal sheets, wherein the graphene layers and the metal sheets are sequentially stacked from left to right, are vertically arranged between the cold plate and the heating element, the ultrahigh heat conductivity of the graphene along the plane direction is fully utilized, and the heat conduction heat flow of the graphene heat conduction layer is greatly improved.
2. The graphene heat conduction layer conducts heat generated by the heating element from the heating element with small surface area to the cold plate with surface area larger than that of the heating element, and meanwhile, the heat conduction silica gel layer can effectively reduce contact thermal resistance in the heat transfer process, and heat generated by the heating element can be rapidly emitted to the external environment through cooling medium in the cold plate, so that heat dissipation efficiency is greatly improved.
Drawings
Fig. 1 is a front view of a heat dissipating and cooling device for a high heat flux heating element according to a first embodiment;
FIG. 2 is a side view of a high heat flux heating element heat sink cooling device according to the first embodiment;
Fig. 3 is an external view of a graphene heat conduction layer in the shape of a trapezoid body according to the first embodiment;
FIG. 4 is a side view of a high heat flux heating element heat sink cooling device according to the second embodiment;
fig. 5 is an external view of a graphene heat conduction layer with a stepped shape in the second embodiment;
reference numerals illustrate: 1-a cold plate; 2-a first heat-conducting silica gel layer; 3-graphene thermally conductive layer; 30-a metal housing; 31-graphene; 32-foil; 4-a second heat-conducting silica gel layer; 5-heating element.
Detailed Description
In order to make the objects, technical solutions and advantageous effects of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments of the present invention.
In the description of the present invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the invention, unless otherwise indicated, the meaning of "a number" is two or more.
Example 1
As shown in fig. 1 to 3, a heat dissipation cooling device for a high heat flow heating element of the present embodiment includes a cold plate 1, a first heat conduction silica gel layer 2, a graphene heat conduction layer 3 and a second heat conduction silica gel layer 4.
The cold plate 1, the first heat-conducting silica gel layer 2, the graphene heat-conducting layer 3 and the second heat-conducting silica gel layer 4 are sequentially arranged on the heating element 5 from top to bottom.
The graphene heat conduction layer 3 mainly comprises a metal shell 30, a plurality of graphene layers 31 and a plurality of metal sheets 32, wherein the graphene layers 31 and the metal sheets 32 are sequentially stacked from left to right and are vertically arranged between the cold plate 1 and the heating element 5.
Preferably, the area of the lower surface of the cold plate 1 is equal to the area of the upper surface of the graphene heat conduction layer 3, and the area of the lower surface of the graphene heat conduction layer 3 is equal to the area of the upper surface of the heating element 5.
In order to further improve the heat dissipation efficiency, the area of the upper surface of the graphene heat conduction layer 3 needs to be larger than the area of the lower surface of the graphene heat conduction layer 3. For this reason, in the present embodiment, the graphene 31 and the metal sheet 32 are sequentially bonded to form a trapezoid body by using trapezoid sheets with large top and small bottom. It is easy to understand that since the graphene 31 and the metal sheet 32 are vertically stacked in this order, the length of the upper surface of the graphene heat-conducting layer 3 in the stacking direction is equal to the length of the lower surface in the stacking direction.
During operation, heat generated by the heating element 5 is transferred to the graphene heat conduction layer 3 with the trapezoid shape through the second heat conduction silica gel layer 4, the graphene heat conduction layer 3 with the trapezoid shape transfers heat to the first heat conduction silica gel layer 2, the first heat conduction silica gel layer 2 transfers heat to the cold plate 1, and the heat absorbed by the cold plate 1 is rapidly dissipated to the surrounding environment through a cooling medium in a forced convection mode, so that heat dissipation and cooling of the heating element 5 are realized.
Example two
As shown in fig. 4 and 5, the difference between the high heat flow heating element heat dissipation and cooling device of the present embodiment and the first embodiment is that the graphene 31 and the metal sheet 32 are stepped with large top and small bottom, and both sides are stepped.
During operation, heat generated by the heating element 5 is transferred to the graphene heat conduction layer 3 with the shape of a step-shaped body through the second heat conduction silica gel layer 4, the graphene heat conduction layer 3 with the shape of the step-shaped body transfers heat to the first heat conduction silica gel layer 2, the first heat conduction silica gel layer 2 transfers heat to the cold plate 1, and the heat absorbed by the cold plate 1 is rapidly emitted to the surrounding environment through a cooling medium in a forced convection mode, so that the heat dissipation and cooling of the heating element 5 are realized.
The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made in accordance with the essence of the present invention are intended to be included within the scope of the present invention.
Claims (2)
1. A heat dissipation cooling device of a high heat flow heating element is characterized in that: the solar heat collector comprises a cold plate, a first heat-conducting silica gel layer, a graphene heat-conducting layer, a second heat-conducting silica gel layer and a heating element which are sequentially arranged from top to bottom; the graphene heat conduction layer consists of a metal shell, a plurality of graphene and a plurality of metal sheets, wherein the graphene and the metal sheets are sequentially stacked from left to right and are vertically arranged between the cold plate and the heating element, a first heat conduction silica gel layer is filled between the cold plate and the graphene heat conduction layer, and a second heat conduction silica gel layer is filled between the graphene heat conduction layer and the heating element;
the area of the upper surface of the graphene heat conduction layer is larger than that of the lower surface of the graphene heat conduction layer;
The length of the upper surface of the graphene heat conduction layer along the stacking direction of the graphene and the metal sheet is equal to the length of the lower surface of the graphene heat conduction layer along the stacking direction of the graphene and the metal sheet;
The area of the lower surface of the cold plate is equal to the area of the upper surface of the graphene heat conduction layer, and the area of the lower surface of the graphene heat conduction layer is equal to the area of the upper surface of the heating element.
2. The high heat flow heat sink cooling device of claim 1, wherein: the shape of the graphene heat conduction layer is trapezoid or stepped with big top and small bottom.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010930950.XA CN112040741B (en) | 2020-09-07 | 2020-09-07 | High heat flow heating element heat dissipation cooling device |
| PCT/CN2021/109088 WO2021259385A1 (en) | 2020-09-07 | 2021-07-29 | Radiation cooling device for high-heat-flux heat generating element |
| AU2021294898A AU2021294898B2 (en) | 2020-09-07 | 2021-07-29 | Heat dissipation and cooling apparatus for high heat flux heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010930950.XA CN112040741B (en) | 2020-09-07 | 2020-09-07 | High heat flow heating element heat dissipation cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112040741A CN112040741A (en) | 2020-12-04 |
| CN112040741B true CN112040741B (en) | 2024-08-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010930950.XA Active CN112040741B (en) | 2020-09-07 | 2020-09-07 | High heat flow heating element heat dissipation cooling device |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN112040741B (en) |
| AU (1) | AU2021294898B2 (en) |
| WO (1) | WO2021259385A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040741B (en) * | 2020-09-07 | 2024-08-23 | 中国科学院广州能源研究所 | High heat flow heating element heat dissipation cooling device |
| CN114650707A (en) * | 2022-02-28 | 2022-06-21 | 安徽碳华新材料科技有限公司 | Artificial graphite high-conductivity heat dissipation structure for motor controller of electric vehicle |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014216443A (en) * | 2013-04-25 | 2014-11-17 | 京セラ株式会社 | Heat radiation substrate, package for storing electronic component, and electronic device |
| CN209133491U (en) * | 2018-12-04 | 2019-07-19 | 珠海格力电器股份有限公司 | Heat conducting pad |
| CN212324647U (en) * | 2020-09-07 | 2021-01-08 | 中国科学院广州能源研究所 | Heat dissipation cooling device for high heat flow heating element |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101956278B1 (en) * | 2011-12-30 | 2019-03-11 | 삼성전자주식회사 | Heterogeneous laminate comprising graphene, thermoelectric material, thermoelectric module and thermoelectric apparatus comprising same |
| CN206341549U (en) * | 2017-01-11 | 2017-07-18 | 东莞市优旺电子科技有限公司 | One kind radiating graphite flake |
| CN107645893A (en) * | 2017-10-23 | 2018-01-30 | 南京旭羽睿材料科技有限公司 | A kind of graphene heat dissipation film |
| KR102100381B1 (en) * | 2018-04-26 | 2020-04-16 | 대전대학교 산학협력단 | Metal heat sink using graphene and manufacturing method |
| CN109986866A (en) * | 2018-11-29 | 2019-07-09 | 安徽荣泽科技有限公司 | A kind of manufacture craft of high-temperature heat-conductive film |
| CN210630126U (en) * | 2019-07-31 | 2020-05-26 | 联想(北京)有限公司 | Heat dissipation device and electronic equipment |
| CN210607227U (en) * | 2019-10-17 | 2020-05-22 | 深圳泰思特半导体有限公司 | Chip heat radiation structure and hard disk |
| CN112040741B (en) * | 2020-09-07 | 2024-08-23 | 中国科学院广州能源研究所 | High heat flow heating element heat dissipation cooling device |
-
2020
- 2020-09-07 CN CN202010930950.XA patent/CN112040741B/en active Active
-
2021
- 2021-07-29 WO PCT/CN2021/109088 patent/WO2021259385A1/en active Application Filing
- 2021-07-29 AU AU2021294898A patent/AU2021294898B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014216443A (en) * | 2013-04-25 | 2014-11-17 | 京セラ株式会社 | Heat radiation substrate, package for storing electronic component, and electronic device |
| CN209133491U (en) * | 2018-12-04 | 2019-07-19 | 珠海格力电器股份有限公司 | Heat conducting pad |
| CN212324647U (en) * | 2020-09-07 | 2021-01-08 | 中国科学院广州能源研究所 | Heat dissipation cooling device for high heat flow heating element |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112040741A (en) | 2020-12-04 |
| WO2021259385A1 (en) | 2021-12-30 |
| AU2021294898A1 (en) | 2022-11-03 |
| AU2021294898B2 (en) | 2024-06-13 |
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