TW532057B - Manufacturing method of thermal super-conducting heat conduction block and the structure thereof - Google Patents

Manufacturing method of thermal super-conducting heat conduction block and the structure thereof Download PDF

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Publication number
TW532057B
TW532057B TW091106083A TW91106083A TW532057B TW 532057 B TW532057 B TW 532057B TW 091106083 A TW091106083 A TW 091106083A TW 91106083 A TW91106083 A TW 91106083A TW 532057 B TW532057 B TW 532057B
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Taiwan
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superconducting
block
heat
thermal
casting
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TW091106083A
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Chinese (zh)
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Jiun-Fu Liou
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Jiun-Fu Liou
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Priority to TW091106083A priority Critical patent/TW532057B/en
Priority to US10/396,759 priority patent/US20030182799A1/en
Priority to GB0306895A priority patent/GB2399943A/en
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Publication of TW532057B publication Critical patent/TW532057B/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • B22D19/0072—Casting in, on, or around objects which form part of the product for making objects with integrated channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A manufacturing method of thermal super-conducting heat conduction block and the structure thereof are disclosed, wherein a press casting or casting technology is utilized to associate the thermal conduction super-conducting tube, body and melted metal together, so that the thermal conduction super-conducting tube and body are wrapped in the metal thereby forming a block. The block can even form plural fins integrally at the same time, so that the block has a higher thermal conductivity, which is suitable for fixing the thermal conduction block at any location that requires the medium to conduct heat rapidly.

Description

532057 ^ 五、發明說明（1) 【發明領域】 本發明係提供一種熱超導導熱塊之製造方法與結構， 特別是有關於將具有高傳熱性質的熱傳導超導管、體與具 有良好導熱性質的金屬結合為一體之導熱塊的方法，藉以 提昇導熱塊的導熱性能而適合於任何需要媒介快速傳熱、 散熱之處者。 【發明背景】 目前產業界針對電腦中央處理器（CPU )或高熱源產 品所採用之散熱裝置，大多是利用具有高傳熱效率的鋁材 質散熱片（例如台灣公告第4 5 9 4 6 9號專利案所製造的散熱 體）的基座接觸於熱源’以將熱置吸收並傳遞到散熱片的 鰭片上，再利用風扇吹出冷空氣將散熱片上的熱量排除 者。 由於現今高效率之CPU所產生的高熱已非一般傳統的 鋁材質散熱片所能快速傳導、排除，因而利用導熱效率較 I呂金屬約高出一倍的銅金屬來傳導C P U的熱量乃是另一種 選擇；然而，鋁金屬的密度約2. 7g/cm3，而銅金屬的密度 為8.93g/cm3(相同體積的銅金屬重量約為&金屬的三倍 )，因此，若完全採用銅金屬製造成散熱片，則會因為銅 的重量過重無法通過落地實驗，或是裝在主機板上過久後 造成主機板變形。目前市面上所謂具有銅底的鋁材質散熱 片，乃是以鍛壓或焊接的技術將預先成型好的銅板嵌固於 鋁材質散熱片的基座底面；台灣專利公告第4 5 9 4 6 9號亦屬532057 ^ V. Description of the invention (1) [Field of the invention] The present invention provides a method and structure for manufacturing a thermal superconducting heat conducting block, and particularly relates to a heat conducting superconducting pipe having a high heat transfer property, a body, and a body having good heat transfer properties. The method of combining the metal with a heat conduction block as a whole to improve the thermal conductivity of the heat conduction block is suitable for anyone who needs a medium for rapid heat transfer and heat dissipation. [Background of the Invention] At present, most of the heat dissipation devices used in the industry for computer central processing units (CPUs) or high-heat source products are aluminum heat sinks with high heat transfer efficiency (for example, Taiwan Announcement No. 4 5 9 4 6 9 The base of the heat sink manufactured in the patent case is in contact with the heat source 'to absorb and transfer the heat to the fins of the heat sink, and then use the fan to blow out cold air to remove the heat from the heat sink. Since the high heat generated by today's high-efficiency CPUs is not as fast as conventional aluminum heat sinks, it can be quickly conducted and eliminated. Therefore, the use of copper metal that is about twice as efficient as I Lu metal to conduct heat from the CPU is another An option; however, the density of aluminum metal is about 2.7g / cm3, and the density of copper metal is 8.93g / cm3 (the copper metal with the same volume weighs about three times as much as & metal), so if copper metal is used entirely Manufactured into a heat sink, the weight of copper cannot pass the ground test, or the motherboard may be deformed after being installed on the motherboard for too long. At present, the so-called aluminum heat sink with a copper bottom on the market is a pre-formed copper plate embedded in the base surface of the aluminum heat sink using forging or welding technology; Taiwan Patent Bulletin No. 4 5 9 4 6 9 Also

第4頁 532057 五、發明說明（2) 於將銅板嵌固於鋁材質散熱片的設計。 雖然將小厚度的銅板嵌植於鋁材質的散熱片具有在較 輕的重量條件下提昇導熱性能的效果，但如果能將具有更 高導熱性質的物體結合在鋁材質之類的導熱塊，則更能使 導熱塊的導熱性能獲得進一步的提昇。 【創作之綜合說明】 本發明之主要目的在提供一種熱超導導熱塊之製造方 法，其係將具有高導熱性質的熱傳導超導管、體與具有良 好導熱性質之金屬結合在一起，以進一步提昇導熱性能之 方法。 本發明之次一目的在提供一種熱超導導熱塊之結構， 其在金屬塊内部一體結合熱傳導超導管、體，使得金屬塊 具有更優異的導熱性能，此一熱超導導熱塊適合於用來連 接於需要傳導熱量之元件之間，據以獲得高效率的導熱效 果者。 基於此，本創作所提供之熱超導導熱塊之製造方法與 結構，係以壓鑄或鑄造技術將熱傳導超導管、體與熔融的 金屬結合在一起，使得熱傳導超導管、體被包覆在金屬内 並形成塊狀體，該塊狀體甚至可以同時一體成型出複數鰭 片，使該塊狀體具有更高的導熱性能，適合於將該導熱塊 固定在任何需要媒介快速傳熱之處。 茲配合下列圖式將本創作之其它目的及功能做進一步 的說明。Page 4 532057 V. Description of the invention (2) Design for embedding copper plate in aluminum heat sink. Although a small thickness copper plate embedded in an aluminum heat sink has the effect of improving thermal conductivity under lighter weight conditions, if an object with higher thermal conductivity can be combined with a thermal block such as aluminum, then It can further improve the thermal conductivity of the thermal block. [Comprehensive description of creation] The main purpose of the present invention is to provide a method for manufacturing a thermal superconducting block, which combines a thermally conductive superconducting tube and body with high thermal conductivity and a metal with good thermal conductivity to further improve Method of thermal conductivity. A second object of the present invention is to provide a structure of a thermal superconducting heat conducting block, which integrates a thermally conducting superconducting tube and a body inside the metal block, so that the metal block has more excellent thermal conductivity. This thermal superconducting heat conducting block is suitable for use. It is connected between the components that need to conduct heat, according to those who get high heat conduction effect. Based on this, the manufacturing method and structure of the thermal superconducting block provided by this creation is to combine the thermally conductive superconducting tube and the body with the molten metal by die casting or casting technology, so that the thermally conductive superconducting tube and the body are covered with the metal Inside, a block is formed, and the block can even be integrally formed into a plurality of fins at the same time, so that the block has higher thermal conductivity and is suitable for fixing the thermal block to any place where rapid heat transfer of the medium is required. In conjunction with the following drawings, other purposes and functions of this creation are further explained.

第5頁 532057 五、發明說明（3) 【實施例說明】 本發明所提供之熱超導導熱塊之製造方法，係包括有 以下的步驟： a. 將熱傳導超導管、體與具有良好導熱性的熔融金屬置入 壓鑄或鑄造成型模内。 b. 由壓鑄或鑄造機以壓鑄或鑄造成型方式將該熱傳導超導 管、體與熔融金屬結合在一起並形成塊狀體，進而使該 熱傳導超導管、體被包覆在金屬塊狀體内而結合為一 體。 其中的熱傳導超導管、體係採用可自由彎折或變形之金 屬管體（例如銅、鋁或其它金屬管體），並在管、體的 内部充填或包含具有高速熱傳導性能之材料者，例如： 1、 無機高溫超導化合物材料，例如：紀鋇銅氧化合物（ YBC0 )超導材料、鉈鋇鈣銅氧化合物（TBCC0 )超導材 料、汞鋇妈銅氧化合物（HBCC0 )超導材料、麵總I弓銅 氧化合物（BSCC0 )超導材料、或其他無機超導材料。 2、 有機超導材料，例如：純水或其它有機超導材料。 3、 其它可達到高速熱傳導性材料。 其係將管、體的兩端加工封閉，以防止所述的導熱材 料漏出管體；藉由所述的金屬管、體與包含在其内部的導 熱材料構成熱傳導超導管、體；以上所述無機高超導材料 其所應用的原理，係利用管、體内的分子受熱時產生之高 速震盪與摩擦，讓熱能以波動方式快速熱傳；有機高溫超Page 5 532057 V. Description of the invention (3) [Explanation of the embodiment] The manufacturing method of the thermal superconducting heat conducting block provided by the present invention includes the following steps: a. The heat conducting superconducting tube, the body and the body have good thermal conductivity. The molten metal is placed in a die-casting or casting mold. b. The heat-conducting superconducting pipe and the body are combined with the molten metal by a die-casting or casting machine to form a block, and the heat-conducting super-conducting pipe and the body are covered in a metal block. Combined into one. The heat-conducting superconducting tubes and systems adopt metal tubes (such as copper, aluminum, or other metal tubes) that can be bent or deformed freely, and the interior of the tubes or tubes is filled with or contains materials with high-speed thermal conductivity, such as: 1. Inorganic high-temperature superconducting compound materials, such as: barium copper oxide (YBC0) superconducting materials, barium barium calcium copper oxide (TBCC0) superconducting materials, mercury barium mother copper oxide (HBCC0) superconducting materials, surfaces Total I bow copper oxy compound (BSCC0) superconducting material, or other inorganic superconducting materials. 2. Organic superconducting materials, such as pure water or other organic superconducting materials. 3. Other materials that can achieve high-speed thermal conductivity. The two ends of the tube and the body are processed and closed to prevent the thermally conductive material from leaking out of the tube body. The metal tube and the body and the thermally conductive material contained in the metal tube and the body form a thermally conductive superconducting tube and body; The principle of inorganic superconducting materials is based on the use of high-speed vibration and friction generated by molecules in the tube and the body when heated, so that heat can be rapidly transferred in a pulsating manner; organic high-temperature superconducting materials

532057 五、發明說明（4) 導材料，其所應用的原理，係利用金屬管、體内液體的分 子受熱時產生之相變化而快速傳熱，因傳輸速度非常快， 故稱為「熱傳導超導管、體」，且因熱傳導超導管、體由 熱端傳輸至冷端之傳輸時間很短，因此熱端與冷端之溫差 很小，可達到最佳導熱效果。經實驗證實，其傳熱的速率 約為銅的五倍以，更較一般鋁金屬之傳熱速度快十倍以 上。 藉由前述本發明的方法，其可以如第一圖所示地先將 熱傳導超導管、體2彎曲成矩形狀，然後將熔融的金屬1 1 壓鑄成型為矩形管狀，讓熱傳導超導管、體2被包覆在金 屬中，據以構成熱超導導熱塊；如此一來，當金屬塊狀體 接觸到熱源時，可以很快速地將熱量經由熱傳導超導管2 傳導到金屬的其它部位而提昇導熱塊的導熱效率。 本創作的方法也可將金屬11壓鑄或鑄造成型為如第二 圖所示的扁平狀，並且將熱傳導超導管、體2的一部份包 覆在金屬11内部，而另一部份則延伸出金屬1外，以便於 讓熱傳導超導管、體2連接至散熱片或散熱模組來進行導 熱。 第三圖顯示了本發明除了可以將金屬11壓鑄或鑄造成 型為如第二圖所示的扁平狀，以及將熱傳導超導管、體2 的中間一部份包覆在金屬1 1内部，而另一部份則延伸出金 屬1外部之外，其中的二支熱傳導超導管、體2的一端則完 全地被包覆在金屬1 1中，以使熱傳導超導管、體2可以連 接不同位置的散熱片或散熱模組來進行導熱及散熱。532057 V. Description of the invention (4) The principle of the conductive material is to use the phase change generated when the molecules of the liquid inside the metal tube and the body are heated to transfer heat quickly. Because the transfer speed is very fast, it is called "thermal conduction "Duct, body", and because the heat transfer super duct, the body transfer time from the hot end to the cold end is very short, so the temperature difference between the hot end and the cold end is small, which can achieve the best thermal conductivity. It has been confirmed by experiments that the heat transfer rate is about five times faster than that of copper, and more than ten times faster than that of ordinary aluminum metals. With the aforementioned method of the present invention, as shown in the first figure, the heat-conducting superconducting tube and the body 2 can be first bent into a rectangular shape, and then the molten metal 1 1 is die-casted into a rectangular tube, so that the heat-conducting superconducting tube and the body 2 are bent. It is covered in metal to form a thermal superconducting block; in this way, when the metal block is in contact with the heat source, heat can be quickly conducted to other parts of the metal through the heat-conducting superconducting tube 2 to improve heat conduction. Thermal conductivity of the block. The method of this creation can also die-cast or cast metal 11 into a flat shape as shown in the second figure, and cover a part of the heat-conducting superconducting tube and body 2 inside the metal 11 and extend the other part. It is out of the metal 1 so that the heat-conducting superconduit and the body 2 are connected to a heat sink or a heat dissipation module for heat conduction. The third figure shows that in the present invention, in addition to die-casting or casting the metal 11 into a flat shape as shown in the second figure, and enclosing the middle part of the heat-conducting superconduit and the body 2 inside the metal 1 1, the other One part extends beyond the outside of metal 1. One end of the two heat-conducting superconducting tubes and body 2 is completely covered in metal 1 1 so that the heat-conducting superconducting tube and body 2 can be connected to different places for heat dissipation. Chip or cooling module to conduct heat and heat.

532057 ^532057 ^

端 鑄 在 熱 弟:圖顯不了本發明可以將 放入兩組壓鑄或鏟、生上一丨如 ^ ^篮」的兩 或鑄造成兩個全屬^成杈内，然後將熔融的金屬11壓 !;二超導導熱塊之間，使得其中一熱；；= 連接 $後可以快速地值道^ 现及收 ι也傳V到另一組熱超導導熱塊。 入 兩明可以將熱傳導超導管2的兩端放 個金屬塊狀體，同時在金屬塊狀體的表面以 數’片12’讓熱傳導超導營2、，德垃. J禝 持之間，佶p甘士 V 2體連接在兩組熱超導導熱 , 侍，、中一熱超導導熱塊吸收熱量後可以快、# 傳導到另-組熱超導導熱塊，而藉由增設有：：Π: 超導導熱塊兼具有導熱及散熱功效。 吏… 第六圖係顯示本發明在壓鑄或鑄造熱超 時，先將熱傳導超導管2、體彎曲成〔形狀，然後、鬼1 的金屬11壓鑄或鑄造成型為〔形狀，讓熱傳導、:同 2被包覆在金屬巾，據以構成〔形之熱超導導熱塊广、體 第七圖係顯不本發明的方法也可將熱傳導其 2彎曲成矩形螺旋狀後再放入壓鑄或鑄造成型模、體 將熔融的金屬11壓鑄或鑄造成型為扁平形狀’值、^炎 導管2被包覆在金屬中’據以構成爲平矩形狀之^、、'傳V超 熱塊卜使用時，可以將該熱超導導塊丨的表面塗抹導^ 膠黏合於熱超導導熱塊！上面，藉由該熱導熱 將㈣所產生之熱量傳導到散熱片3的媒介而達End casting in the hot brother: the picture can not show that the present invention can be put into two sets of die-casting or shovel, give birth to two, such as ^ ^ basket "or cast into two all belong to ^ into the branch, and then the molten metal 11 Pressure !; between two superconducting heat conducting blocks, making one of them hot; = = can be quickly connected after connecting $, and the V is also transmitted to another group of thermal superconducting heat conducting blocks. Into Liangming, two ends of the heat-conducting superconducting tube 2 can be placed in a metal block, while the surface of the metal block is a number of 'sheets 12' to let the heat-conducting superconducting camp 2, Dela. J The 甘 p Ganshi V 2 body is connected to the two groups of thermal superconducting thermal conductivity, and the middle and first thermal superconducting thermal blocks can absorb heat quickly and # conduct to the other group of thermal superconducting thermal blocks, and by adding: : Π: Superconducting thermal block has both thermal and heat dissipation effects. Official… The sixth diagram shows that the present invention overheats the heat-conducting superconducting tube 2 and the body into a shape after die-casting or casting heat time. Then, the metal 11 of the ghost 1 is die-cast or cast into a shape. 2 is covered with a metal towel, according to which the shape of the thermal superconducting block is wide, and the seventh figure shows that the method of the present invention can also bend the heat conduction 2 into a rectangular spiral shape and then put it into die casting or casting The molding die and body are die-cast or cast into a flat shape by melting the metal 11, and the tube 2 is covered with metal to form a flat rectangular shape. , The surface of the thermal superconducting block can be coated with a guide ^ and glued to the thermal superconducting block! Above, the heat generated by the radon is conducted to the medium of the heat sink 3 by the heat conduction.

532057 五、發明說明（6) 熱的效果。 除了第七圖所示利用單層熱超導導熱塊1結合於CPU4 與散熱片1之間外，使用者也可以將複數個熱超導導熱塊1 堆疊結合成複層式的熱超導導熱塊，再將此熱超導導熱塊 1以導熱膠黏合於散熱片3的基座底面與CPU4之間，以更進 一步地提昇導熱效率。 藉由前述本發明之方法所製成的熱超導導熱塊，主要 是用於將熱源的熱量傳導到另外的散熱元件，以達到媒介 熱傳導功能而提昇傳熱效率者；例如，其可以將熱超導導 熱塊的一端接觸於熱源，而熱超導導熱塊的另一端則接觸 於散熱片或機殼等部位，以將熱量傳導到散熱的元件上再 配合風扇進行散熱，其適合於熱源所在之位置較狹小而不 易裝設散熱元件的設備，或是需要將熱量再分散傳導以提 昇散熱效果者，因此，本發明對於熱傳導超導管、體也可 以彎曲成3 D立體的形狀，以因應不同環境的需要而壓鑄 或鑄造成各種形狀的熱超導導熱塊。 以上所述者僅為用以解釋本創作之較佳實施例，並非 企圖據以對本創作作任何形式上之限制，是以，凡有在相 同之創作精神下所作有關本創作之任何修飾或變更，皆仍 應包括在本創作意圖保護之範疇。532057 5. Description of the invention (6) The effect of heat. In addition to using the single-layer thermal superconducting thermal block 1 as shown in the seventh figure to combine between the CPU4 and the heat sink 1, the user can also stack a plurality of thermal superconducting thermal blocks 1 to form a multi-layer thermal superconducting thermal conduction. Block, and then the thermal superconducting thermal conductive block 1 is bonded between the bottom surface of the base of the heat sink 3 and the CPU 4 with a thermal conductive adhesive to further improve the thermal conduction efficiency. The thermal superconducting thermal block made by the method of the present invention is mainly used to conduct heat from a heat source to another heat sink to achieve a medium heat conduction function and improve heat transfer efficiency; for example, it can transfer heat One end of the superconducting thermal block is in contact with the heat source, while the other end of the superconducting thermal block is in contact with the heat sink or the case to conduct heat to the heat-dissipating components and cooperate with the fan to dissipate the heat, which is suitable for the heat source. The device is relatively small and it is not easy to install heat-dissipating components, or those who need to disperse and conduct heat to improve the heat-dissipating effect. Therefore, the present invention can also bend the heat-conducting superconduit and body into a 3D three-dimensional shape to respond to different The environmental needs are die-casting or casting into various shapes of thermal superconducting blocks. The above are only for explaining the preferred embodiment of the creation, and are not intended to restrict the creation in any form. Therefore, any modification or change related to the creation under the same spirit of creation , Should still be included in the scope of protection of this creative intention.

532057 圖式簡單說明 【圖式簡要說明】 第一圖為顯示利用本發明所壓鑄或鑄造成型後之第一種實 施例之導熱塊。 第二圖為顯示利用本發明所壓鑄或鑄造成型後之第二種實 施例之導熱塊。 第三圖為顯示利用本發明所壓鑄或鑄造成型後之第三種實 施例之導熱塊。 第四圖為顯示利用本發明所壓鑄或鑄造成型後之第四種實 施例之導熱塊。 第五圖為顯示利用本發明所壓鑄或鑄造成型後之第五種實 施例之導熱塊。 第六圖為顯示利用本發明所壓鑄或鑄造成型後之第六種實 一施例之導熱塊。 — 第七圖為顯示利用本發明所製成之單層導熱塊搭配散熱片 組合應用於CPU之實施例立體分解圖。 第八圖為顯示利用本發明所製成之複層導熱塊搭配散熱片 組合應用於CPU之實施例立體分解圖。 【元件符號說明】 (1 )熱超導導熱塊 (11)金屬 (1 2 )鰭片 (2 )熱傳導超導管、體 (3 )散熱片532057 Brief description of the drawings [Brief description of the drawings] The first figure shows a first embodiment of a heat conducting block after die-casting or casting. The second figure is a heat conduction block of a second embodiment after die-casting or casting using the present invention. The third figure shows a third embodiment of a thermally conductive block after die-casting or casting using the present invention. The fourth figure is a heat conduction block according to a fourth embodiment of the present invention after die-casting or casting. The fifth figure is a heat conduction block according to a fifth embodiment of the present invention after die-casting or casting. The sixth figure is a heat conducting block according to a sixth embodiment of the present invention after die-casting or casting. — The seventh figure is a three-dimensional exploded view showing an embodiment in which a single-layer heat-conducting block made of the present invention and a heat sink are combined and applied to a CPU. The eighth figure is a three-dimensional exploded view showing an embodiment in which a multi-layered thermal block and a heat sink are combined and applied to a CPU. [Description of component symbols] (1) Thermal superconducting block (11) Metal (1 2) Fin (2) Thermally conductive superconductor, body (3) Heat sink

第10頁 532057Page 10 532057

Claims (1)

532057 六、申請專利範圍 '0^、 1. 一種熱超導導熱塊之製造方法，係將熱傳導超導 管、體與具有良好導熱性的熔融入壓鑄或鑄造成 型模内，再由壓鑄或鑄造機以壓鑄造成型方式將該 熱傳導超導管、體與熔融金屬結合在一起並形成塊狀 體，進而使該熱傳導超導管、體被包覆在金屬塊狀體 内。 2. —種熱超導導熱塊之結構，係在具有良好導熱性質的金 屬塊内部一體結合有熱傳導超導管、體。532057 VI. Application for patent scope '0 ^, 1. A method for manufacturing thermal superconducting heat conducting block, which fuses heat conducting superconducting tube, body and good thermal conductivity into a die-casting or casting mold, and then the die-casting or casting machine The heat-conducting superconducting tube and the body are combined with the molten metal by a die-casting molding method to form a block, and the heat-conducting superconducting tube and the body are covered in the metal block. 2. —The structure of a thermal superconducting block is a combination of a thermally conductive superconduit and a body integrated in a metal block with good thermal conductivity. 3 .依據申請專利範圍第2項所述之熱超導導熱塊之結構， 所述的金屬塊係一體成型有鰭片。 4.依據申請專利範圍第2項所述之熱超導導熱塊之結構， 所述的熱傳導超導管、體可以彎曲成螺旋形狀。 5 .依據一申請專利範圍第2項所述之熱超導導熱塊之一結構， 所述的熱傳導超導管、體可以彎曲成匚狀。 6. 依據申請專利範圍第2項所述之熱超導導熱塊之結構， 所述的熱傳導超導管、體可依需求彎曲或彎形成各種立 體形狀。 7. 依據申請專利範圍第2項所述之熱超導導熱塊之結構， 其熱傳導超導管、體可堆疊為複數組。3. According to the structure of the thermal superconducting heat conducting block described in item 2 of the scope of the patent application, the metal block is integrally formed with fins. 4. According to the structure of the thermal superconducting heat conducting block described in item 2 of the scope of the patent application, the heat conducting superconducting tube and body can be bent into a spiral shape. 5. According to a structure of a thermal superconducting block according to item 2 of the scope of an applied patent, the thermally conducting superconducting tube and the body can be bent into a 匚 shape. 6. According to the structure of the thermal superconducting heat conducting block described in item 2 of the scope of the patent application, the heat conducting superconducting tube and the body can be bent or bent to form various solid shapes as required. 7. According to the structure of the thermal superconducting heat conducting block described in item 2 of the scope of the patent application, the heat conducting superconducting tubes and bodies can be stacked into a complex array. 第12頁Page 12
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