1295554 Λ .· .'Hi· .. 細押與****1 ，年 /V#5 曰修(更)正本 九、發明說明： ； 【發明所屬之技術領域】 ‘ 本發明係關於一種散熱裝置，尤其係一種用於冷卻電 子元件之熱管散熱裝置。 【先前技術】 时隨著電子資訊業不斷發展，電子元件（尤其係中央處 理器）運行速度不斷提升。，准’高頻高速使電子元件產生 之熱量隨之增多，使得其溫度不斷升高’嚴重威脅著電子 元件運行呀之性能，為確保電子元件能正常運行，必須及 時排出電子元件所產生之大量熱量。 、 為此，業界通常使用一種散熱裝置進行散熱，該等現 有散熱裝置均包括-底座及設在底座上之複數散熱籍片， 該散熱底座底面為平滑之實體金屬，係供貼設在中央處理 器表面。而隨著中央處理器體積越來越小，其發熱亦更加 籲集中，因局限於金屬之傳熱性能，散熱底座中心處之熱量 往往過於集中，而無法有效傳遞到散熱裝置之四周，^而 嚴重影響整體散熱效果，使得中央處理器之性能下降，| 法保持有效工作。 為克服上述問題，業界採用熱管傳導熱量之散熱裝置 曰益增多，熱管係在金屬管體内設置毛細結構物（如粉末 燒結物、溝槽結構、絲網結構等），並密封裝入工作:體 (如水、酒精等），然後抽至真空狀態，依賴工作液體受 熱後進订液氣兩相變化而吸收、釋放熱量，由於熱管之傳 6 (/ 1295554 =:向熱距離長’而對散熱裝置性能之提升有較大 灣專利公告第16_號揭示一種熱管式 政…、，其包括11形埶 之中間部分焊接於底^ =熱W及底板。該u形熱管 之間。電子元件甚斗 i其兩平直端部穿設於散熱鰭片 熱量傳遞到上部λ之熱量傳遞到基座，然後通過熱管將 散發到；鬥二之散熱鰭片i ’最後通過散熱鰭片將熱量 氣中’達到冷卻電子元件之目的。惟，因該 速均句地分佈到:::片Γη能最大量地將熱量快 』政熟鰭片上，因此性能仍待提升。 【發明内容】 有鑒於此 之散熱裝置。 只有必要提供一種散熱效率高之具有熱管 -種散熱裝置，包括一與電子元件接觸之第一基板、 -散熱器以及將該第-基板與散熱器連接之至少一教 管及至少一第二熱管，該散孰哭 ” 狀…。0包括稷數平行間隔排列之 —^，該第—熱管及第二熱管均包括-與該基板連接 之吸熱段及-與該散熱器連接之放熱段，該第—敎管之放 熱段沿散熱鰭片長度方向佈置於散熱鰭片之頂部y該第二 熱管之放熱段穿設於散熱鰭片中。 Μ 一 與習知技術相比，上述散熱裝置之熱管在三維办門内 交叉設置’因將與熱源接觸之第—基座之熱量在三=向 均勻分佈在散熱鰭片上，從而提高散熱效率。 【實施方式】 7 % 1295554 請參閱圖1至圖4’本發明一較佳實施例之散熱裝置係 用來安裝在中央處理器（圖未示）等發熱電子元件上對其 進行散熱。該散熱裝置包括一與電子元件接觸之第一美板 忉、-位於第-基板1〇上之第二基板2〇、複數平行排餘 第二基板20上之散減片3〇、—貼設於散熱鰭片％頂部 之頂板4〇、一用於將熱量傳導到散熱鰭片30之第一熱其 50及-用於將熱傳導到頂板4G之第二熱管⑹及^ •該散熱裝置一侧之風扇模組7〇。 、 第一基板1〇由銅、銘等導熱性能良好之金屬材 :呈=二板1〇大致呈正方形’其上表面對稱開設有兩 、形之半圓凹槽12及14,該等凹槽12及14之平直 份均垂直於第-基板1()之側緣，它們之·f 10之中間並相對於基板10之對角線對稱佈置。 板 =基=20由銅、紹等導熱性能良好之金屬材料製 -弟一基板2〇之形狀大小與第一基板ι〇 —致 表面開設有與第一基板1〇 八下 ^ 24〇^^ - Α4 〇 12及Μ對應之凹槽22 及24該第—基板2〇可通過悍接或㈣ 1〇配合在一起，同時使凹挿1?、π a n基板 應形成兩圓形容置孔。另外曰，該 凹槽14、24分別對 一端分別對應開設有螺孔^丨土反2〇之兩向對侧緣 ，叹有螺孔26，該螺孔26 示）螺合而固定風扇模組7〇。 ”螺針（圖未 稷數散熱鰭片3〇垂直設置於第二基板 距平行地㈣’並均平行於基板！ ^互專 —曰片3G間形成Μ通道。每—散熱韓片30相對上下兩 1295554 ο 曰修(更)正, 端分別同向垂直彎折延伸有-μ 」 之兩端折邊31連續形& ρ "專政熱鰭片30 逆、、只形成上下兩平面，豆下芈 20上表面通過焊接方 八 /、弟一基座 式、、、口 5。同時每一散孰链片 置還設有一穿孔32,每一穿？丨咖田/…”、曰片30中心位 邊（未標號），從㈣等〜孔32垂直_折延伸有折 内接合面。 -專牙孔32之折.邊連續形成—管道之 頂板40形狀大小與第—、二基板1〇、2〇 —致，均大 致為正方形，由銅、叙蓉道 、專熱此良好之金屬材料製成， =40之頂面上開設一平直之半圓形凹槽a該凹押 42與政熱則3〇長度方向平行，位於頂板扣 曰 該頂板40對庫第一、一莫把1n 〇 r /Ί位置 丁 -弟一基板W、20之相對兩側緣之兩 各開設一用於固定風扇模組70之螺孔44。 第、—熱官50、60均由ϋ形熱管之一平直段之一端 垂直於U形熱管所在之平面彎折延伸而成。該第—敎管％ 包括一第一吸熱段54、一第一傳熱段56及一第一放熱段 58，其中該第一傳熱段56 一端連接第一吸熱段54，另一端 連接第一第一放熱段58,該第一吸熱段54呈L形彎曲，其 中第一吸熱段54呈L形彎曲之自由端部分與第一傳熱段56 及弟一放熱段58兩兩相互垂直。談第二熱管6〇包括一第 一吸熱段64、一第二傳熱段66及第二放熱段68，其形狀 構造與第一熱管50大致相同，其主要之區別在於該第二傳 熱段66之長度小於與其對應之第一傳熱段之長度。該 第一熱管50跨設於該散熱裝置上下兩側，其呈l形彎曲之 第一吸熱段54容置於第一、二基板1〇、20之凹槽12及24 9 务(更)正本 1295554 ^之L形容置孔内，其第—傳熱段％正對散熱籍片如 :成之氣流通道，其第一放熱段58嵌置於頂板4〇之半圓 ^凹槽々42内。該第二熱管60呈L形彎曲之第二吸熱段64 令置於第一：二基板1〇、2〇之凹槽14及Μ形成之L形容 置孔内，其第二傳熱段66位於與散熱鰭片3〇平行之一側， 與第-熱管50之吸熱段56所處一側相鄰，其第二放埶段 68穿設於散_片30中心之穿孔32與折邊形成之管道内。 風扇模組7〇安裝於散熱裝置之—侧正對散熱鰭片3〇 形成=空氣通道’以產生強制氣流迅速帶走散_片％上 之熱量。該散熱模組7〇之相對兩側各垂直弯折延伸一侧緣 71，該側緣71之兩端設置有與第二基板2〇之螺孔％及頂 板40之螺孔44對應之穿孔712，從而可與螺釘配合將散熱 模組70固定在散熱裝置一侧。 … 上述散熱裝置之第一、二熱管5〇、6〇並非相互平行且 地在同一平面内沿伸佈置，而係在三維空間内交叉設置， 因此以相對較少量之熱管將與熱源接觸之第一基座10之熱 置在三維方向均勻分佈在散熱鰭片30上，以便於散熱裝置 一側風扇模組70產生之強制氣流迅速將熱量帶走，從而提 南散熱效率。 可以理解，上述散熱裝置之第二基板20可以省略，而 係直接在散熱鰭片31底部開設與第一基板1〇上之凹槽Η 及14對應之凹槽，從而與凹槽12及14組合形成容置第一 熱官50之放熱段54及第二熱管60之放熱段64之容置槽。 綜上所述，本發明符合發明專利要件，爰依法提出專 1295554 产年/‘/月J妒修(更〉正本 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 热悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之立體分解圖。 圖2係圖1中散熱裝置之組裝圖。 圖3本發明散熱裝置之倒置立體分解圖。 圖4係圖3中散熱裝置之組裝圖。 【主要元件符號說明】 凹槽 12、14、22 第一基板 第二基板 散熱鰭片 穿孔 弟一敎管 ί、、、 pr 胃一傳熱段 第二熱管 第二傳熱段 風扇模組 10 20 30 32 50 56 60 66 70 螺孔 折邊 712頂板 第一 12 24 26 31 40 吸熱段54 14 42 44 第一放熱段58 第二吸熱段64 第二放熱段68 側緣 71 111295554 Λ .· .'Hi· .. Pit and ****1, year/V#5 曰修(more) 正本9, invention description: ; [Technical field of invention] 'The present invention relates to a heat dissipation The device, in particular, is a heat pipe heat sink for cooling electronic components. [Prior Art] As the electronic information industry continues to evolve, electronic components (especially central processors) continue to operate at an increasing rate. The quasi-high-frequency high-speed causes the heat generated by the electronic components to increase, which causes the temperature to rise continuously. This seriously threatens the performance of the electronic components. To ensure the normal operation of the electronic components, the large number of electronic components must be discharged in time. Heat. To this end, the industry generally uses a heat sink for heat dissipation. The existing heat sinks include a base and a plurality of heat sinks disposed on the base. The bottom surface of the heat sink base is a smooth solid metal for attachment to the central processing unit. Surface. As the size of the central processing unit is getting smaller and smaller, the heat is more concentrated. Because of the heat transfer performance of the metal, the heat at the center of the heat sink base is too concentrated, and cannot be effectively transmitted to the periphery of the heat sink. Seriously affect the overall heat dissipation effect, so that the performance of the central processing unit is reduced, and the method remains effective. In order to overcome the above problems, the heat dissipation device for heat conduction in the heat pipe is increased in the industry, and the heat pipe is provided with a capillary structure (such as powder sintered material, groove structure, wire mesh structure, etc.) in the metal pipe body, and is sealed and loaded into work: Body (such as water, alcohol, etc.), and then pumped to a vacuum state, depending on the two-phase change of the liquid and liquid after the working liquid is heated, absorbs and releases heat, because the heat pipe transmits 6 (/ 1295554 =: long heat distance to the heat sink) The performance improvement has a larger Bay Patent Publication No. 16_ revealing a heat pipe type policy, which includes an intermediate portion of the 11-shaped crucible welded to the bottom ^ = heat W and the bottom plate. The U-shaped heat pipe is between the electronic components. i. The two flat ends are passed through the heat dissipation fins and the heat transferred to the upper λ is transferred to the pedestal, and then radiated through the heat pipe; the heat sink fins of the hopper 2 are finally passed through the heat sink fins. The purpose of cooling the electronic components is achieved. However, since the speed is uniformly distributed to the :::: Γ η can maximize the heat on the fins, so the performance still needs to be improved. [Summary] It is only necessary to provide a heat pipe-type heat dissipating device with high heat dissipation efficiency, including a first substrate in contact with the electronic component, a heat sink, and at least one teaching tube connecting the first substrate and the heat sink and at least one The second heat pipe, the diverging crying "..0" includes a plurality of parallel rows arranged in parallel, the first heat pipe and the second heat pipe each comprise - an endothermic section connected to the substrate and - a heat releasing section connected to the heat sink The exothermic section of the first manifold is disposed along the length of the fins on the top of the fins y. The exothermic section of the second heat pipe is disposed in the fins. Μ The heat sink is compared with the prior art. The heat pipe is cross-arranged in the three-dimensional door, and the heat of the susceptor is uniformly distributed on the heat dissipation fins in the third direction, thereby improving the heat dissipation efficiency. [Embodiment] 7 % 1295554 Please refer to FIG. 1 to FIG. 4' The heat dissipating device of a preferred embodiment of the present invention is used for heat dissipation on a heat-generating electronic component such as a central processing unit (not shown). The heat dissipating device includes a contact with an electronic component. a first slab, a second substrate 2 位于 on the first substrate 1 , a plurality of slabs 3 平行 on the second substrate 20 , and a top plate 4 affixed to the top of the heat dissipation fins 〇 a first heat source 50 for conducting heat to the heat sink fins 30 and a second heat pipe (6) for conducting heat to the top plate 4G and a fan module 7〇 for the heat sink side. The substrate 1 is made of a metal material having good thermal conductivity such as copper or ingot: the first plate is 1 square, and the upper surface is symmetrically opened with two semicircular grooves 12 and 14 in the shape of the grooves 12 and 14 The straight portions are perpendicular to the side edges of the first substrate 1(), and are disposed symmetrically with respect to the diagonal of the substrate 10 in the middle of the f10. Plate = base = 20 metal having good thermal conductivity such as copper or sinter The material is made up of a substrate 2's shape and size and the first substrate is 〇 〇 〇 〇 〇 〇 〇 第一 第一 第一 第一 第一 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 - The substrate 2〇 can be joined together by splicing or (4) 1 ,, while the recessed 1?, π an substrate should form two circular receiving holes. In addition, the grooves 14 and 24 respectively have two opposite side edges of the screw hole 丨 反 反 , , , , , , , , , , , , , , , , , 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定7〇. "The screw pin (the figure is not set to the number of fins 3〇 vertically set on the second substrate from the parallel (four)' and is parallel to the substrate! ^ Mutual----3G form a meandering channel. Two 1295555 ο 曰修 (more) positive, the ends are respectively bent in the same direction and extended with -μ ′ at both ends of the hem 31 continuous shape & ρ " dictator heat fin 30 reverse, only forming the upper and lower planes, beans The upper surface of the lower jaw 20 is welded by the square VIII, the younger one pedestal type, and the mouth 5. At the same time, each of the sputum chain pieces is further provided with a perforation 32, each wearing a 丨 丨 / /...", 曰 30 The center side edge (not numbered), from (4), etc., to the hole 32, the vertical/folded extension has a folded inner joint surface. - The fold of the special tooth hole 32. The side is continuously formed - the shape of the top plate 40 of the pipe is the same as that of the first and second substrates. 2〇致致, are roughly square, made of copper, Syrian road, special hot metal material, a flat semicircular groove a on the top surface of =40. The political heat is 3 〇 parallel in the length direction, located in the top plate buckles the top plate 40 pairs of the library first, one Mo 1n 〇r / Ί position Ding-di brother a substrate W, 20 A screw hole 44 for fixing the fan module 70 is respectively disposed on each of the opposite side edges. The first and the hot members 50 and 60 are each bent from a plane perpendicular to the plane of the U-shaped heat pipe. The first heat transfer section 54 includes a first heat absorption section 54, a first heat transfer section 56, and a first heat release section 58, wherein one end of the first heat transfer section 56 is connected to the first heat absorption section 54, The other end is connected to the first first heat releasing portion 58. The first heat absorption portion 54 is bent in an L shape, wherein the first heat absorption portion 54 has an L-shaped curved free end portion and the first heat transfer portion 56 and the first heat release portion 58. The two heat pipes 6A include a first heat absorption section 64, a second heat transfer section 66, and a second heat release section 68, and have the same shape and configuration as the first heat pipe 50, the main difference being that the The length of the two heat transfer sections 66 is smaller than the length of the first heat transfer section corresponding thereto. The first heat pipe 50 is disposed on the upper and lower sides of the heat dissipating device, and the first heat absorption section 54 which is bent in the shape of l is firstly accommodated. , the first substrate 1 〇, 20 grooves 12 and 24 9 (more) original 1295554 ^ L-shaped accommodating holes, the first - heat transfer section% For the heat-dissipating film, such as the air flow channel, the first heat-dissipating portion 58 is embedded in the semi-circular groove 42 of the top plate 4, and the second heat pipe 60 is placed in the L-shaped curved second heat-absorbing portion 64. First, the second substrate 1 〇, 2 〇 groove 14 and the L-shaped accommodating hole formed by the ,, the second heat transfer portion 66 is located on one side parallel to the heat dissipation fin 3 ,, and the heat absorption of the first heat pipe 50 The side of the segment 56 is adjacent to each other, and the second releasing portion 68 is disposed in the pipe formed by the perforation 32 and the flange of the center of the diffusing film 30. The fan module 7 is mounted on the side of the heat dissipating device The fins 3〇 form an air passage' to generate a forced airflow that quickly carries away heat on the dispersion. The opposite sides of the heat dissipation module 7 are vertically bent to extend a side edge 71. The two ends of the side edge 71 are provided with a through hole 712 corresponding to the screw hole % of the second substrate 2 and the screw hole 44 of the top plate 40. Therefore, the heat dissipation module 70 can be fixed to the side of the heat sink with the screw. The first and second heat pipes 5〇, 6〇 of the heat dissipating device are not parallel to each other and are arranged in the same plane, but are arranged in a three-dimensional space, so that a relatively small amount of heat pipes will be in contact with the heat source. The heat of the first pedestal 10 is uniformly distributed on the heat dissipating fins 30 in the three-dimensional direction, so that the forced airflow generated by the fan module 70 on the side of the heat dissipating device can quickly take away the heat, thereby improving the heat dissipation efficiency of the south. It can be understood that the second substrate 20 of the heat dissipating device can be omitted, and the groove corresponding to the grooves 14 and 14 on the first substrate 1 is directly formed at the bottom of the heat dissipating fin 31, so as to be combined with the grooves 12 and 14. The accommodating groove for accommodating the heat releasing portion 54 of the first heat register 50 and the heat releasing portion 64 of the second heat pipe 60 is formed. In summary, the present invention complies with the requirements of the invention patent, and stipulates in accordance with the law that the application is only 1295554, and the application is only the preferred embodiment of the present invention. The equivalent modifications or variations of those skilled in the art of the present invention should be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat dissipating device of the present invention. 2 is an assembled perspective view of the heat sink of FIG. 1. Fig. 3 is an exploded perspective view of the heat sink of the present invention. Fig. 4 is an assembled view of the heat sink of Fig. 3. [Description of main components] Grooves 12, 14, 22 a substrate, a second substrate, a heat sink fin, a piercing tube, a ί, a pr, a heat transfer section, a second heat pipe, a second heat transfer section, a fan module, 10 20 30 32 50 56 60 66 70, a screw hole 712, a top plate A 12 24 26 31 40 heat absorption section 54 14 42 44 first heat release section 58 second heat absorption section 64 second heat release section 68 side edge 71 11