M264561 八、新型說明： 【新型所屬之技術領域】 本創作係關於-種散熱裝置’制係—種可有效冷卻電子元件之高效 率熱管散熱裝置。 【先前技術】 隨著電子資訊業不斷發展，電子元件（尤為中央處理器）運行頻率和 速度在不斷提升。但是，高頻高速將使電子元件産生之熱量隨之增多，使 得其溫度獨升高，嚴重威脅著電子元件運行時之性能，為顧電子元件 忐正常運作，必須及時排出電子元件所産生之大量熱量。 為此，業界通常使用一種散熱裝置進行散熱，該種散熱裝置一般包括 底座及设於底座上之複數散熱鰭片，該底座為底面平滑之實體金屬，係 供貼設於中央處理器表面。而隨著中央處理器體積越來越小，其發熱亦更 加木中，因局限於金屬之傳熱性能，散熱底座中心處熱量往往過於集中， 而無法有效傳遞至散熱裝置之四周，從而嚴重影響整體散熱效果，使得中 央處理器之性能下降，無法有效運算，甚至燒毀。 為克服上述問題，業界採用熱管傳導熱量之散熱裝置日益增多，熱管 係於金屬管體内設置毛細結構物（如粉末燒結物、溝槽結構、絲網結構等）, 並密封裝入工作液體（如水、酒精等），然後抽至真空狀態，依賴工作液 體义熱後進行液氣兩相變化而吸收、釋放熱量，由於熱管之傳熱不定向且 有一定之長度，可將熱量傳遞至較遠端。中華民國專利公告第532758号揭 示一种运用熱管之电子元件散熱装置，其包括一基座、設置於基座上之複 數散熱鳍片及二大致呈“口，，形之熱管。該基座底面與電子元件表面貼合， M264561 該基座上表面及散熱鰭片下端緣對應開設兩對半圓形凹槽，每一熱管一端 部通過導熱膠黏合或焊接於該凹槽中。該等散熱鰭片遠離基座之適當位置 開設穿孔，供套設於熱管另一端部上。電子元件産生之熱量傳遞至基座， 然後通過熱管將熱量傳遞至上部之散熱鰭片上，最後通過散熱鰭片將熱量 散發至周圍空氣中’達到冷卻電子元件之目的。然而，因熱管上端部與散 熱鰭片只接觸一次，傳導至散熱韓片上部之熱量相對較少，散熱過程中還 未能充分利用散熱鰭片之上方部位，未能充分發揮熱管之傳熱遠、傳熱快 之性能，該種情況於散熱籍片之縱向及水平尺寸較大時更為明顯。 【新型内容】 本創作之目的在於提供一種散熱效率高之具有熱管之散熱裝置。 本創作散熱裝置，用讀發電子元件產生之·，其包括—散熱器及 至少-熱管·’該散熱ϋ底端吸收電子元件之熱量，該熱端為蒸發部， 該洛發部與散熱n底端連接’該鮮連續料形成雜該蒸發部之複數冷 凝部，該散熱n具有由複數散熱脸域之散解，該散熱部對應熱管^ 冷滅部設有複韻狀接合面，該鮮之冷凝部分顺該散熱部之筒狀接合 面貼合。 ★本創作相比先前技術具有如下優點：由於本創作散熱裝置之熱管具有 複數冷凝部與散熱部接觸，散熱過財能充分彻散熱部之散* 分發揮熱管之傳熱遠、賴快之性能，提高熱管之率，提高了散充 置整體散熱效率。 ， …、 【實施方式】 請參閱第-駐第三圖卿，本創作散熱裝置_於安裝於中央處理 M264561 為（圖未不）等發熱電子树上對其進行散熱。該散熱裝置包括—散熱器 10及-對與散熱器10底部、中部及上部同時接合之熱管如。 該散熱器10包括-基座u及設置於基座U上表面之散熱部，該散执 部包括相互疊合形成之第一散熱片組Μ及第二散熱片組。該基座η下 表面與中央處理器表面相貼合，其上表面上開設有—對半圓筒狀凹槽⑽。 該第-散熱片組14由複數第—散熱則⑽並列組合而成。每—第一散熱 韓片⑽相對兩端分綱向垂轉折延伸形成折邊必該等第—散熱韓片 =〇之兩端折邊142分職續形成-平面，其—平面與基座η上表面相結 合，且該平面上相應基座U之凹槽12〇設有半圓筒狀凹口 144，從而形成 -對第-筒狀内接合面44。該第二散熱片組16由複數第二散鱗片⑽並 列組合而成。每一第二散熱籍片160相對兩端亦分別同向垂直彎折延伸形 成折邊162，該等第二散熱鰭#16〇之兩端折邊162分別連續形成一平面， 其-平面與第-散熱脸14之折邊W2組合形成之另—平面相疊合，且該 相疊合之兩平面上分別對應形成兩對半圓筒狀凹口 146、166，從而形成一 對第二筒狀内接合面46，同時每一散熱鰭片160靠近上端之適當位置還設 有-對穿孔164，每-穿孔164内周緣垂直彎折延伸形成折邊168，從而該 等穿孔164之折邊168連續形成第三筒狀内接合面66。其中，不難看出， 該第一筒狀接合面44還可以直接於基座11之内部穿孔形成。 該每一熱管20連續彎折形成第一水平段22、第二水平段24及第三水 平段26，從而每一熱管20整體上呈S字型。每一熱管2〇之第一水平段22 及第二水平段24可通過導熱膠贴接或錫貧焊接等方式分別貼合於該第一及 苐一琦狀内接合面44、46上’而母一熱管20之第三水平段％可通過錫膏 M264561 焊接或過盈配合等方式穿接於該第三筒狀内接合面的上。 k而’中央處理器工作時，產生之熱量傳遞至散熱器1〇之基座Η，其 一部分熱量直接傳遞至第一、第二散熱片組14、16， 母熱管20内之工作流體在第一水平段22受熱蒸發 同時另一部分熱量使 在第二水平段24及 第二水平段26被冷凝，使散熱器1()之底雜量麟快速料至其中部和 上方部位，最後第-、第二散熱則⑽、⑽將熱量散發至四周。 該散熱器1G-側可安裝至少—散熱風扇（圖未示），以提高散熱器ι〇 與周圍空氣之熱對流速度。 在上述實酬巾’本_散餘置之齡2()為_狀，其主要提供具 有第-水平段22，即-蒸發部，及第二水平段24和第三水平段％，即二 冷凝部。可㈣解地’關狀熱管2Q及板型鮮之傳熱原理及性能係基本 相同的’故，創作散熱裝置亦可使用s字型板型熱管，此時，第一 '第二 散熱片組Μ、16及基座U上之容設熱管蒸發部及冷凝部之各接合面相對 形成方形筒狀接合面即可。 上述實％例中，散熱器10具有一基座U，該基座u主要係吸收中央 處理器産生之熱4，然後分縣歸傳遞至散熱部錢及熱管2〇蒸發部。 本創作散熱裝置亦可只由第一、第二散熱片組l4、16和熱管2〇組成，此 時熱官2〇之第-水平段η (蒸發部）與第_散熱片組丨4下端之平面平齊 設置’可錢與巾域理輯發熱源無接觸即可。 上述各實施例中，熱管20包括連續彎折形成之一蒸發部及遠離該蒸發 部之二冷凝部。可以理解地，本創作散熱裝置之熱管還可以根據散熱需求， 經連續彎折而形成兩個以上之冷凝部，此時對應該複數冷凝料置由複數 M264561 散熱片組組成之散熱部， 部之筒狀接合面。 該散熱部上對麟料凝部分则彡絲置該冷凝 ^上所述’本創作符合新型專利要件，爰依法提出專利申請。惟，以 上所述者僅為本創作之較佳實施例，舉凡熟悉本案技藝之人士，在妥依本 創作精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 第一圖係本創作散熱裝置之立體分解圖。 第二圖係本創作散熱裝置之組裝狀態圖。 第三圖係本創作散熱裝置之立體組合圖。 【主要元件符號說明】 散熱器 10 凹槽 120 第一散"熱鰭片 140 凹口 144 、 146、 166 第二散熱鰭片 160 埶管 ”、、pr 20 第二水平段 24 第一筒狀接合面 44 第三筒狀接合面 66 基座 11 第一散熱鰭片組14 折邊 142、162、168 第二散熱鰭片組16 穿孔 164 第一水平段 22 第三水平段 26 第二筒狀接合面46M264561 8. Description of the new type: [Technical field to which the new type belongs] This creation is about-a kind of heat sink 'system-a high-efficiency heat pipe heat sink that can effectively cool electronic components. [Previous technology] With the continuous development of the electronic information industry, the operating frequency and speed of electronic components (especially central processing units) are constantly increasing. However, the high frequency and high speed will increase the heat generated by the electronic components, causing its temperature to rise independently, which seriously threatens the performance of the electronic components during operation. In order to ensure the normal operation of the electronic components, a large amount of the electronic components must be discharged in a timely manner. Heat. For this reason, the industry generally uses a heat dissipation device for heat dissipation, which generally includes a base and a plurality of heat dissipation fins provided on the base. The base is a solid metal with a smooth bottom surface and is attached to the surface of the central processing unit. As the size of the central processing unit becomes smaller and smaller, its heat generation becomes more woody. Due to the limited heat transfer performance of the metal, the heat at the center of the heat sink base is often too concentrated to be effectively transmitted to the surrounding heat sink, which seriously affects The overall heat dissipation effect makes the performance of the central processing unit degraded, unable to operate effectively, and even burned. In order to overcome the above problems, the industry uses more and more heat dissipation devices that conduct heat through the heat pipe. The heat pipe is provided with a capillary structure (such as a sintered powder, a groove structure, a wire mesh structure, etc.) inside a metal pipe, and is sealed with a working liquid ( (Such as water, alcohol, etc.), and then evacuated to a vacuum state, relying on the working liquid to heat and absorb two phases of liquid and gas to absorb and release heat. Because the heat transfer of the heat pipe is non-directional and has a certain length, it can transfer heat to a long distance. end. Republic of China Patent Bulletin No. 532758 discloses an electronic component heat dissipation device using a heat pipe, which includes a base, a plurality of heat radiating fins arranged on the base, and two heat pipes having a generally “mouth” shape. The bottom surface of the base Laminated with the surface of electronic components, two pairs of semi-circular grooves are formed on the upper surface of the base and the lower end edge of the heat sink fins, and one end of each heat pipe is bonded or welded into the groove by thermally conductive glue. A perforation is provided at an appropriate position away from the base, and is set on the other end of the heat pipe. The heat generated by the electronic components is transferred to the base, and then the heat is transferred to the upper heat dissipation fins through the heat pipe, and finally the heat is transferred through the heat dissipation fins. Dissipated into the surrounding air to achieve the purpose of cooling electronic components. However, because the upper end of the heat pipe contacts the heat sink fins only once, the heat transferred to the upper part of the heat sink is relatively small, and the heat sink fins have not been fully utilized during the heat dissipation process. The upper part fails to give full play to the performance of the heat transfer far and fast of the heat pipe. This situation occurs when the longitudinal and horizontal dimensions of the heat sink are large. It is obvious. [New content] The purpose of this creation is to provide a heat dissipation device with a heat pipe with high heat dissipation efficiency. The heat dissipation device of this creation is generated by reading and sending electronic components, which includes-a heat sink and at least-a heat pipe. The bottom end of the heat sink absorbs the heat of the electronic components. The hot end is the evaporation part. The hair extension part is connected to the bottom end of the heat dissipation n. The fresh continuous material forms a plurality of condensation parts that are mixed with the evaporation part. The heat dissipation n has a plurality of heat dissipation faces. In the dissolution of the field, the heat dissipation part is provided with a complex rhyme-shaped joint surface corresponding to the heat pipe ^ cold quenching part, and the fresh condensing part is attached along the cylindrical joint surface of the heat dissipation part. ★ This creation has the following advantages over the prior art: Since the heat pipe of this creative heat sink has multiple condensing parts in contact with the heat sink, the heat dissipation can fully disperse the heat sink's heat dissipation. * The performance of the heat pipe is far and fast, which improves the rate of the heat pipe and improves the bulk charge. Overall heat dissipation efficiency.,…, [Embodiment] Please refer to the third figure in Figure 3. This creative heat sink is installed on a central processing M264561 (figure not shown) and other heating electronic trees. It dissipates heat. The heat dissipating device includes-a heat sink 10 and-a heat pipe which is simultaneously connected to the bottom, middle and upper parts of the heat sink 10. The heat sink 10 includes-a base u and a heat sink provided on the upper surface of the base U The diffuser includes a first heat sink group M and a second heat sink group which are formed by being superposed on each other. The lower surface of the base η is in contact with the surface of the central processing unit, and the upper surface is provided with a half-cylinder The first radiating fin group 14 is composed of a plurality of radiating fins ⑽ side by side. Each of the first radiating fins ⑽ extends from the opposite ends of the two ends to a vertical turn to form a hem. Korean film = 〇 The folds at both ends of 142 continue to form a plane, which is combined with the upper surface of the base η, and the groove 12 of the corresponding base U on this plane is provided with a semi-cylindrical notch 144 Thus, a -to-first cylindrical inner joint surface 44 is formed. The second heat sink group 16 is composed of a plurality of second scattered scales ⑽ side by side. The opposite ends of each second heat sink 160 are also bent and extended in the same direction to form a flange 162, and the two flanges 162 at the two ends of the second heat sink fin # 16 are formed in a continuous plane. -Another formed by combining the folded edges W2 of the heat dissipation face 14-the planes are superimposed, and two pairs of semi-cylindrical recesses 146 and 166 are respectively formed on the superposed two planes, thereby forming a pair of second cylindrical shapes The inner joint surface 46 is provided with a pair of perforations 164 at a suitable position near the upper end of each heat sink fin 160. Each inner edge of the perforation 164 is vertically bent and extended to form a hem 168, so that the hem 168 of the perforations 164 is continuous. A third cylindrical inner joint surface 66 is formed. It is not difficult to see that the first cylindrical joint surface 44 can also be formed by perforating directly inside the base 11. Each heat pipe 20 is continuously bent to form a first horizontal section 22, a second horizontal section 24, and a third horizontal section 26, so that each heat pipe 20 is generally S-shaped. The first horizontal section 22 and the second horizontal section 24 of each heat pipe 20 may be respectively attached to the first and first inner joint surfaces 44 and 46 by means of thermally conductive adhesive bonding or tin-lead welding. The third horizontal section% of the female-heat pipe 20 can be connected to the third cylindrical inner joint surface by means of solder paste M264561 welding or interference fit. When the CPU is operating, the heat generated is transferred to the base of the radiator 10, and a part of the heat is directly transferred to the first and second heat sink groups 14, 16; the working fluid in the mother heat pipe 20 is A horizontal section 22 is heated and evaporated while another part of the heat is condensed in the second horizontal section 24 and the second horizontal section 26, so that the bottom amount of the radiator 1 () is quickly charged to the middle and upper parts, and finally the first,-, The second heat sink is ⑽, ⑽, which radiates heat to the surroundings. At least one cooling fan (not shown) can be installed on the 1G-side of the radiator to increase the heat convection speed between the radiator and the surrounding air. In the above-mentioned real pay towel, the age of the remaining 2 () is _ shape, which mainly provides the second horizontal section 22, that is, the evaporation section, and the second horizontal section 24 and the third horizontal section%, that is, two Condensing section. It can be explained that the heat transfer principle and performance of the closed-shaped heat pipe 2Q and the plate type are basically the same. Therefore, the s-shaped plate type heat pipe can also be used in the creative heat sink. At this time, the first and second heat sink groups Each of the joint surfaces on the M, 16 and the base U containing the heat pipe evaporation section and the condensation section may form a square cylindrical joint surface relatively. In the above example, the radiator 10 has a base U, which mainly absorbs heat 4 generated by the central processing unit, and then transfers it to the heat-dissipating unit and the heat-pipe 20 evaporation unit by county. This creative heat sink can also only consist of the first and second heat sink groups 14 and 16 and the heat pipe 20. At this time, the -horizontal section η (evaporation section) of the heat officer 20 and the lower end of the _ heat sink group 4 The plane can be set flush with each other, but the money can be in contact with the heating source of the towel. In each of the above embodiments, the heat pipe 20 includes one evaporation portion continuously formed by bending and two condensation portions remote from the evaporation portion. Understandably, the heat pipe of the radiating device of this creation can also be continuously bent to form more than two condensing parts according to the heat dissipation requirements. At this time, a plurality of M264561 heat sink groups should be provided for the plurality of condensing materials. Cylindrical joint surface. The condensing part of the heat sink is provided with the condensation. The above-mentioned creation conforms to the requirements of the new patent, and a patent application is filed in accordance with the law. However, the above is only a preferred embodiment of this creation. For those who are familiar with the skills of this case, equivalent modifications or changes made in accordance with the spirit of this creation should be covered by the following patent applications. [Brief description of the drawings] The first picture is a three-dimensional exploded view of the heat sink of this creation. The second figure is an assembly state diagram of the original heat sink. The third picture is a three-dimensional combined view of the heat sink of this creation. [Description of main component symbols] Radiator 10, groove 120, first diffuser " heat fin 140 notch 144, 146, 166, second heat sink fin 160, stern tube ", pr 20, second horizontal section 24, first cylindrical shape Joint surface 44 Third cylindrical joint surface 66 Base 11 First fin group 14 Flanged 142, 162, 168 Second fin group 16 Perforation 164 First horizontal section 22 Third horizontal section 26 Second cylindrical Joint surface 46