200848994 九、發明說明： -【發明所屬之技術領域】 本發明涉及一種散敎驴罢 元件熱量之散熱裝1衣置’尤係指一種用於散發電子 【先前技術】 運4Γ子產業飛速發展，電子元件（如中央處理器） 運订速度之不斷提升，運行時產生大量熱量，使1本身i 糸統溫度升高，繼而影響其系統之穩定性。為確件電子元 之熱量。 任，、上女衣放熱裝置，排出其所產生 -子=:::熱問題之傳統解決方案通常係在每個發妖 散熱器’該散熱器包括與電子元件緊； &板、设於底板上之複數散熱鰭片。隨著+子元 算速度與曰俱增，為進-步滿足散熱需求：二: 流動加快執量散發；:日士二頂，裝一風扇以促進空氣 :::隨著數碼資訊時代之到來，輕薄短小成:Γ;ΐ: 能方向趨：，其製造工藝亦不斷朝高密度封裝和多功 越來越元件如晶片之距離越來越小而發教量 離祀越大。，此在實際應用中’當多個發熱電子元件間距 ㈠妖而且Ν度不#時，如果分別採用獨立之散”置對 /、放熱以維持系統之正常運行，；衣置對 曰便系統之散熱結構 200848994 分散複雜造成系、统空間浪費，❿且由於電子元件間之間距 很小=會限定單獨散熱裝置之尺寸，而影響散熱效率。例200848994 IX. Description of the invention: - [Technical field to which the invention pertains] The present invention relates to a heat dissipating device for a dissipating component, and a device for dissipating heat. [Prior Art] The rapid development of the industry has been carried out. Electronic components (such as the central processing unit) continue to increase the speed of the operation, generate a large amount of heat during operation, and increase the temperature of the 1 itself, which in turn affects the stability of the system. To determine the heat of the electronic element. Any, the female clothing heat release device, the traditional solution that generates the heat-problem -::: heat problem is usually attached to each of the hair-radio radiators. The heat sink includes tight with electronic components; & A plurality of fins on the bottom plate. As the speed of the + sub-element increases, the demand for heat dissipation is further improved: Second: the flow speeds up the execution of the volume;: The Japanese top two, with a fan to promote the air::: With the advent of the digital information era Light, short and short: Γ; ΐ: The direction of the trend: the manufacturing process is also constantly moving toward high-density packaging and multi-function more and more components such as wafers are getting smaller and smaller and the amount of teaching is greater. In the actual application, when the distance between multiple heat-emitting electronic components (a) and the degree of ambiguity is not #, if separate separate sets are used, the heat is set to maintain the normal operation of the system, and the clothes are placed on the squatting system. Heat dissipation structure 200848994 Dissipation complexity causes waste of system and system space, and because the distance between electronic components is small = the size of the individual heat sinks will be limited, which will affect the heat dissipation efficiency.
如i當今流行之雙cpu電腦就係利用一個散熱器對兩cPU 進订散熱，該散熱器包括一同時與兩cpu接觸之底板及複 數沿底板長度方向分佈並平行間隔之散熱韓片，此外，還 可在邊散熱器-側設置一風扇提供強制氣流或利用系統風 扇產生之強制氣流從散熱鰭片間之流道一端入口進入，從 =熱量散發。然而，該用於雙cpu之散熱器底板及散 —片較長’使散熱鰭片間形成之流道風阻較大，故，流 =口㈣之風壓將遠大於流道出口附近之風壓，使散熱 二：鈿：熱：散發速度不-致，從而造成兩CPU散熱不 二進而景> 響它們運行之穩定性。 【發明内容】 件且明旨在提供一種可以同時適配兩個或多個電子元 件且散熱效果好之散熱裝置。 子兀 —種散熱裝置用於對兩個或多個電 括—基板、-第一散熱片組、 月L，/、匕 述基板與所述兩散熱和ί設於所 -散熱片、组均包括複數散熱片，且第一心：=-及弟 相鄰兩散熱片間形成氣流通道，:―政熱片組之 ，流流向第-散熱片組之空氣流；弟；；熱片 :组設置有供 相鄰兩散熱片間之氣流通道大。/亥工乳流這之寬度較 上述散熱裝置之兩散熱片組中，— 利於氣流通過之允衰、、六 政…、片組開設有 …’以減少氣流到達另第-散熱片 200848994 組之阻力並使氣流未經該第二散熱片組預熱而直接進入另 一散熱片組内^從而有效效除兩散熱片組由於相對氣流之 空間位置差異而產生之溫差。 【實施方式】 本發明散熱裝置係用來對多個發熱電子元件如CPU (圖未示）等進行散熱。請參閱圖1至圖3，本發明一優選 實施例中之散熱裝置，其包括與二CPU接觸之一基板10、 部分嵌置在基板10内之一熱管組20、間隔排列在基板10及 熱管組20之上之第一散熱片組30和第二散熱片組40、位於 基板10及第二散熱片組40—侧並通過熱管組20與基板10導 熱連接之第三散熱片組50。 上述基板10為一矩形平板，其由導熱性能良好之金屬 材料如銘、銅等洗鑄而成。該基板10上表面開設有複數容 置熱管組20之容置槽，在本實施例中包括一第一容置槽 12、一第二容置槽14及一第三容置槽16。該第一容置槽12 呈L形，其包括與基板10長邊緣垂直之一第一平行段120及 與該第一平行段120垂直並沿著基板10之一長邊緣延伸之 一第一垂直段122。該第一平行段120位於基板10上正對一 CPU及第一散熱片組30中部之位置。該第二容置槽14呈U 形，其包括二平行段140及垂直並連接兩平行段140之一第 二垂直段142。該兩第二平行段140相互平行間隔，且一第 二平行段140緊挨並平行第一平行段120排列，另一第二平 行段140正對另一CPU及第二散熱片組40，該第二垂直段 8 200848994 142平行並挨著第一垂直段122排列且垂直連接兩第二平行 段140。該第三容置槽16呈L形，其包括一第三平行段160和 與該第三平行段160垂直之一第三垂直段162，該第三平行 • 段160與第一平行段120及第二平行段140平行且緊挨第二 平行段140延伸，該第三垂直段162與第一垂直段122平行且 緊挨另一遠離第一垂直段122之基板10長邊緣延伸。 上述熱管組20包括複數均呈U形之扁平熱管，其包括一 第一熱管22、一第二熱管24和一第三熱管26。該第一熱管 22包括平行間隔之二第一平行部220和垂直連接兩第一平 行部220之一第一垂直部222，其中一第一平行部220容置於 基板10第一凹槽12對應之第一平行段120内，另一第一平行 部220位於基板10之一側並插置於第三散熱片組50内，該第 一垂直部222較第一凹槽12之第一垂直段122長，其大部分 容置於該第一垂直段122内，小部分向基板10外侧延伸而出 並連接位於該基板10—侧之另一第一平行部220。該第二熱 ， 管24包括相互平行間隔二平行部240及垂直連接該兩第二 平行部240之一第二垂直部242，該兩第二平行部240分別容 置於對應之基板10第二凹槽14之兩第二平行段140内，該第 二垂直部242容置於對應之第二凹槽14之第二垂直段142 内。該第三熱管26包括平行間隔之二第三平行部260和垂直 連接兩第三平行部260之一第三垂直部262,其中一第三平 行部260容置於基板10第三凹槽16之第三平行段160内，另 一第三平行部260位於基板10之一侧並插置於第三散熱片 組50内，該第三垂直部222較第三凹槽16之第三垂直段162 9 200848994 長，其大部分容置於該第三垂直段i62内，小部分向基板 . 延伸而出並連接位於該基板1〇-側之另-第三平行部 ^60。可見攻些第-熱管22、第二熱管24和第三熱管26分別 =置於基板10對應之第_容置槽12、第：容置槽三 片且該等熱管之頂面與基板1〇之頂面齊平而： 成一與散熱片組30、40接觸之平面。 上述第-散熱片組3〇設置於基板1〇一端上方， 稷數平行且等距間隔之第一散熱片％ 二 片％間形成有氣流通道，且每一第 ^政熱 向一側垂直延伸有折邊320,所有該等折邊3 ^邊^ :成。一及熱管組20頂面接觸之平面。該第緊= 另—端上方’其包括複數與第-散熱片 成氣产通言散熱片42’每相鄰兩第二散熱片42間形 、秦42n t —第二散熱片42底端邊緣垂直延伸有折 ^方：弟二散熱片組40在其中間位置並沿第二散埶片42 Μ方向開設一空氣流道44,該空 ；二:2 鄰弟二散熱片42之間之氣流通道大，以二： 片組30之氣产诵μ外― 扪於机向弟一散熱 之間設有==、^弟一散熱片組3〇與第二散熱片_ 第❹ 且連狀^ (未標幻。該 7:熱片組50設置於基板1〇靠近第二散熱片組4〇之— 第三散間？佈置之第三散熱片-，每相鄰兩 數，於第二散熱片組4。，故該:二 ==和 一散熱片έ且30乃筮一## u 、、之間隔大於第 及弟—放熱片組40氣流通道之間隔，以使第 10 200848994 三散熱片組50具有更小之空氣阻力，每一第三散熱片52開 設兩間隔之穿孔520，該等穿孔520設置有垂直延伸之折邊 (未標號），所有第三散熱片52之穿孔520及其折邊共同形 ‘ 成兩容置空間而分別容置該第一熱管22 —平行部220及該 第三熱管一第三平行部260於其内。該第三散熱片組50中間 形成有與第二散熱片組40空氣流道44對應連通之空氣流道 54，以利於流向第一散熱片組30之氣流通過，該第二散熱 r 片組40與第三散熱片組50之間設有與空氣流道44及54垂直 並連通之通道（未標號）。上述第一散熱片32、第二散熱 片42、第三散熱片52以及它們形成之氣流通道和空氣流道 44、54均與分別容置在基板10各凹槽12、14、16内之各熱 管22、24、26之平行部垂直。 上述散熱裝置在使用時，該基板10之第一凹槽12、第 二凹槽14及第三凹槽16分別對應容置第一熱管22、第二熱 管24及第三熱管26,其中該第一熱管22之一第一平行部220 ( 及第三熱管26之一第三平行260位於基板10—側且穿置在 第三散熱片50内，該第一散熱片組30及第二散熱片組40通 過焊接等方式固定在基板1〇及熱管組20上。 該散熱裝置在工作時，基板10底面吸收從兩CPU產生 之熱量，通過熱管組20將熱量均勻傳送到各散熱片組30、 40、50上，而散發到周圍環境中。該散熱裝置所在之系統 提供之氣流經第三散熱片組50、第二散熱片組40進入第一 散熱片組30，該第二散熱片組30和第三散熱片組40中間均 設置有較相鄰兩第二、三散熱片42、52間之氣流通道寬之 11 200848994 空氣流迢44，54，以減少氣流到達一丑 並使氣流能不經預熱直接進入第—政熱片組30之阻力 第二熱管24埋設在基板1〇内並將該=j、且30此外，泫 散熱片組4G通過導熱連接，該第—執政熱片組30與第二 將第三散熱片組50分別與第—散妖、片=和第三熱管26又 組4〇導熱連接，從而消除各散熱片組30、4二= 兩CPU進行散熱。 之以同步並均句地對 心综上所述，本發明符合發料利要件4依法提出專 ::二以上所述者僅為本發明之較佳實施例，舉： *哎1=技蟄之人士’在爰依本發明精神所作之等效修飾 或交化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之一優選實施例之立體組合圖。 圖2係圖1中散熱裝置之立體分解圖。 圖3係圖i中散熱裝置之俯視圖。 【主要元件符號說明】 基板 10 第一容置槽 12 第一平行段 120 第一垂直段 122 弟~'容置槽 14 第二平行段 140 第二垂直段 142 第三容置槽 16 第三平行段 160 第三垂直段 162 熱管組 20 第一熱管 22 12 200848994 第一平行部 220 第 一垂直部 222 第二熱管 24 第 二平行部 240 第二垂直部 242 第 三熱管 26 第三平行部 260 第 三垂直部 262 第一散熱片組 30 第 一散熱片 32 折邊 320 、 420 第 二散熱片組 40 第二散熱片 42 空氣流道 44、54 第三散熱片組 50 第 三散熱片 52 穿孔 520 13For example, i popular today's dual cpu computer uses a heat sink to heat the two cPUs. The heat sink includes a bottom plate that is in contact with two cpus at the same time, and a plurality of heat sinks that are distributed along the length of the bottom plate and are spaced apart in parallel. A fan can also be provided on the side of the radiator to provide forced airflow or a forced airflow generated by the system fan can be accessed from the inlet of one end of the flow path between the fins, from the heat dissipation. However, the base plate of the radiator for the double cpu and the long piece of the diffuser--the wind passage formed between the fins of the heat dissipating fins has a large wind resistance, so the wind pressure of the flow port (4) will be much larger than the wind pressure near the outlet of the flow channel. To make the heat dissipation two: 钿: heat: the speed of the emission is not-induced, which causes the two CPUs to dissipate heat and then the scenery > sounds the stability of their operation. SUMMARY OF THE INVENTION It is an object of the invention to provide a heat sink that can simultaneously adapt two or more electronic components and has a good heat dissipation effect. A heat sink is used for two or more electrical-substrate, a first heat sink, a moon L, a, a substrate, and two heat sinks, and a heat sink, a group The utility model comprises a plurality of heat sinks, and the first heart: =- and the adjacent two heat sinks form an air flow channel, wherein: - the political heat sheet group, the air flow to the first heat sink group; the younger; the hot film: the group It is provided with a large air flow passage between the adjacent two fins. The width of the galvanic milk flow is higher than that of the two heat sinks of the above heat dissipating device, which is favorable for the passage of the airflow, the six-regulation, the film set is opened, and the airflow reaches the other heat sink 200848994 group. The resistance causes the airflow to directly enter the other heat sink group without being preheated by the second heat sink group, thereby effectively eliminating the temperature difference between the two heat sink groups due to the spatial position difference of the relative airflow. [Embodiment] The heat sink of the present invention is used to dissipate heat from a plurality of heat-generating electronic components such as a CPU (not shown). Referring to FIG. 1 to FIG. 3, a heat dissipating device according to a preferred embodiment of the present invention includes a substrate 10 in contact with two CPUs, a heat pipe group 20 partially embedded in the substrate 10, and a substrate 10 and a heat pipe spaced apart. The first heat sink group 30 and the second heat sink group 40 above the group 20, and the third heat sink group 50 located on the side of the substrate 10 and the second heat sink group 40 and thermally connected to the substrate 10 through the heat pipe group 20 are disposed. The substrate 10 is a rectangular flat plate which is cast and cast from a metal material having good thermal conductivity such as ingot or copper. The upper surface of the substrate 10 is provided with a plurality of accommodating grooves for accommodating the heat pipe group 20, and includes a first accommodating groove 12, a second accommodating groove 14 and a third accommodating groove 16 in this embodiment. The first accommodating groove 12 has an L shape, and includes a first parallel segment 120 perpendicular to a long edge of the substrate 10 and a vertical portion perpendicular to the first parallel segment 120 and extending along one of the long edges of the substrate 10 Segment 122. The first parallel segment 120 is located on the substrate 10 opposite to a central portion of the CPU and the first heat sink group 30. The second receiving groove 14 has a U shape and includes two parallel segments 140 and a second vertical segment 142 perpendicular to and connected to one of the two parallel segments 140. The two parallel segments 140 are spaced apart from each other, and a second parallel segment 140 is aligned next to the first parallel segment 120 and the other second parallel segment 140 faces the other CPU and the second heat sink group 40. The second vertical segment 8 200848994 142 is parallel and next to the first vertical segment 122 and vertically connects the two second parallel segments 140. The third accommodating groove 16 has an L shape, and includes a third parallel segment 160 and a third vertical segment 162 perpendicular to the third parallel segment 160, the third parallel segment 160 and the first parallel segment 120 and The second parallel segment 140 extends parallel to and adjacent to the second parallel segment 140, the third vertical segment 162 extending parallel to the first vertical segment 122 and adjacent the other long edge of the substrate 10 remote from the first vertical segment 122. The heat pipe group 20 includes a plurality of flat heat pipes each having a U shape, and includes a first heat pipe 22, a second heat pipe 24, and a third heat pipe 26. The first heat pipe 22 includes two first parallel portions 220 that are parallelly spaced apart and a first vertical portion 222 that vertically connects the two first parallel portions 220. One of the first parallel portions 220 is received in the first groove 12 of the substrate 10. The first parallel portion 120 is located on one side of the substrate 10 and is inserted into the third heat sink group 50. The first vertical portion 222 is smaller than the first vertical portion of the first recess 12 The 122 is long, most of which is accommodated in the first vertical section 122, and a small portion extends toward the outside of the substrate 10 and connects to the other first parallel portion 220 on the side of the substrate 10. The second heat, the tube 24 includes two parallel portions 240 that are parallel to each other and a second vertical portion 242 that is perpendicularly connected to the two second parallel portions 240. The two second parallel portions 240 are respectively received in the corresponding substrate 10 The second vertical portion 242 is received in the second vertical segment 142 of the corresponding second recess 14 in the two second parallel segments 140 of the recess 14. The third heat pipe 26 includes two third parallel portions 260 that are parallelly spaced apart and a third vertical portion 262 that vertically connects the two third parallel portions 260, wherein a third parallel portion 260 is received in the third recess 16 of the substrate 10. The third parallel portion 160 is located on one side of the substrate 10 and is inserted into the third heat sink group 50. The third vertical portion 222 is smaller than the third vertical portion 162 of the third recess 16 . 9 200848994 is long, most of which is accommodated in the third vertical section i62, and a small portion extends toward the substrate. The other parallel-third parallel portion 60 is located on the side of the substrate. It can be seen that the first heat pipe 22, the second heat pipe 24, and the third heat pipe 26 are respectively disposed on the corresponding first accommodating groove 12, the third accommodating groove of the substrate 10, and the top surface of the heat pipes and the substrate 1 〇 The top surface is flush: a plane that is in contact with the heat sink groups 30, 40. The first heat sink group 3 is disposed above one end of the substrate 1 , and the air flow channel is formed between two parallel and equally spaced first heat sinks, and each of the first heats is perpendicular to one side. The extension has a hem 320, and all of the hem 3 ^ edges ^: into. A plane in contact with the top surface of the heat pipe group 20. The first tightness=the other end is the upper end of the second heat sink 42. The second heat sink 42 is adjacent to the second heat sink 42. The vertical extension has a folding side: the second heat sink group 40 has an air flow path 44 in the middle position thereof and in the direction of the second heat dissipation sheet 42 ,, the air; 2: 2 air flow between the two adjacent heat sinks 42 The channel is large, with two: The gas production of the film group 30 is outside ― 扪 扪 机 机 向 向 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 = = = = = = = = = = = = = = = = = = = = = (Unmarked. 7: The heat pack 50 is disposed on the substrate 1 〇 near the second heat sink group 4 — - the third heat sink is arranged in the third heat sink - each adjacent two, in the second heat sink The group of 4, so: the second == and a heat sink έ and 30 筮 筮 a ## u ,, the interval is greater than the interval between the first and the younger - heat release film group 40 air flow channel, so that the 10th 200848994 three heat sink The group 50 has a smaller air resistance, and each of the third fins 52 defines two spaced perforations 520 which are provided with vertically extending hem (not numbered), all of the third fins 52 The through hole 520 and the flange thereof are combined to form two accommodating spaces for respectively accommodating the first heat pipe 22 - the parallel portion 220 and the third heat pipe - the third parallel portion 260. The third heat sink group 50 An air flow passage 54 corresponding to the air flow passage 44 of the second heat sink group 40 is formed in the middle to facilitate the flow of air to the first heat sink group 30, and the second heat radiation fin group 40 and the third heat sink group 50 are formed. Channels (not labeled) that are perpendicular to and communicate with the air flow passages 44 and 54 are provided between the first heat sink 32, the second heat sink 42, the third heat sink 52, and the air flow passages and air passages 44 formed therein. And 54 are respectively perpendicular to the parallel portions of the heat pipes 22, 24, 26 respectively accommodated in the grooves 12, 14, 16 of the substrate 10. When the heat dissipating device is in use, the first groove 12 of the substrate 10, the first The two recesses 14 and the third recesses 16 respectively receive the first heat pipe 22, the second heat pipe 24 and the third heat pipe 26, wherein the first heat pipe 22 is one of the first parallel portions 220 (and one of the third heat pipes 26) The third parallel 260 is located on the side of the substrate 10 and is disposed in the third heat sink 50. The first heat sink group 30 and The two heat sink groups 40 are fixed on the substrate 1 and the heat pipe group 20 by soldering or the like. When the heat sink is in operation, the bottom surface of the substrate 10 absorbs heat generated from the two CPUs, and the heat is uniformly transmitted to the heat sinks through the heat pipe group 20. The group 30, 40, 50 is distributed to the surrounding environment. The airflow provided by the system in which the heat sink is located enters the first heat sink group 30 through the third heat sink group 50 and the second heat sink group 40, and the second heat dissipation The airbag channel width between the adjacent two second and third heat sinks 42 and 52 is set to be between the two groups of the second and third heat sinks 40, and the air flow passages 44, 54 are arranged to reduce the airflow to an ugly The airflow can directly enter the resistance of the first heat film group 30 without preheating, and the second heat pipe 24 is buried in the substrate 1〇 and the =j, and 30, in addition, the heat sink group 4G is connected by heat conduction, the first-ruling The heat pack 30 and the second heat sink set 50 are respectively thermally connected to the first and second heat pipes 26, thereby eliminating heat dissipation groups 30 and 4 = two CPUs for heat dissipation. . According to the above, the present invention conforms to the requirements of the hair supply. 4: The above is only a preferred embodiment of the present invention, and: *哎1=Technology Equivalent modifications or interlaces of persons in the spirit of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a preferred embodiment of a heat sink of the present invention. 2 is an exploded perspective view of the heat sink of FIG. 1. Figure 3 is a plan view of the heat sink of Figure i. [Main component symbol description] substrate 10 first accommodating groove 12 first parallel segment 120 first vertical segment 122 ~~' accommodating groove 14 second parallel segment 140 second vertical segment 142 third accommodating groove 16 third parallel Section 160 third vertical section 162 heat pipe group 20 first heat pipe 22 12 200848994 first parallel portion 220 first vertical portion 222 second heat pipe 24 second parallel portion 240 second vertical portion 242 third heat pipe 26 third parallel portion 260 Three vertical portions 262 First heat sink group 30 First heat sink 32 Folds 320, 420 Second heat sink group 40 Second heat sink 42 Air flow passages 44, 54 Third heat sink group 50 Third heat sink 52 Perforation 520 13