1301398 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱器，特別係一種用於發熱電子元 件散熱之散熱器。 【先前技術】 隨著中央處理器（CPU)等電子元件功率之不斷提高， 散熱問題越來越受到人們之重視，在電腦中更是如此。為 了在有限之空間内高效地帶走系統產生之熱量，目前業界 主要採用由散熱鰭片、熱管及散熱風扇組合之方式進行散 熱。風扇主要是提供流動之空氣，熱管主要為了遠距離之 傳遞熱里’散熱鰭片之任務則是將熱官帶來之熱量通過風 扇驅動所產生之流動空氣傳遞到外界環境中去。由此可 見，在一定之體積空間内，能否及時疏導電子元件所產生 之熱里將取決於是否有南效之散熱鰭片。若採用平板結構 之散熱鰭片，當風扇氣流流經散熱鰭片時，由於黏性力之 影響，散熱鰭片表面與氣流之接觸部分形成層流底層，在 該層流底層内氣流之流速幾乎為零，熱交換效果大大降 低。因此若能提升散熱鰭片與風扇氣流之換熱效果，就可 大大提升散熱器之散熱效果。 【發明内容】 有鑒於此，有必要提供一種具有較高散熱效率之散教 器。 … 該散熱器用於對發熱電子元件散熱，包括複數平行設 置之鯖片’每一籍片包括一本體，相鄰鰭片之間形成供氣 6 1301398 流通過之流道，該本體上設有至少一凸出於本體之凸出 部，該凸出部之一側設有開口，該開口與相應鰭片兩側之 流道相連通。 與習知技術相比，該散熱器之鰭片上形成之凸出部， 可增大鰭片散熱面積，並可增加氣流之擾流效果，同時在 該凸出部之一側設有開口，可供氣流穿過到達相鄰鰭片， 加強鰭片間氣流之對流效果，提升散熱效率。 【實施方式】 下麵參照附圖，結合實施例作進一步說明。 圖1至圖6為本發明散熱器一較佳實施方式之附圖。 如圖1所示，該散熱器包括一散熱鰭片組10, 一吸熱塊100 及連接該散熱鰭片組10與吸熱塊100之一熱管50，該熱 管50將吸熱塊100從發熱電子元件（圖未示）所吸收之熱 量傳遞至散熱鰭片組10，一散熱風扇（圖未示）置於散熱 鰭片組10之側端用於提供強制氣流。風扇所產生之氣流 可沿圖中箭頭所示方向流入散熱鰭片組10内，從而與散熱 鰭片組10進行熱交換帶走熱量。 請同時參考圖2和圖3，該散熱鰭片組10包括複數相 互平行設置之鰭片20。每一鰭片20包括一方形本體22及 分別形成於本體22上下兩端之一上折邊24和一下折邊 25。各鰭片20之上、下折邊24、25分別與相鄰鰭片20 之上、下折邊24、25互相抵靠，從而兩相鄰鰭片20之間 形成供氣流通過之流道21。 每一鰭片20之本體22上形成三個凸出部，沿氣流行 7 1301398 進方向，分別為第一凸出部26、第二凸出部27及第三凸 出部28。該第一、二、三凸出部26、27、28由本體22之 • 正面222向相鄰鰭片20凸伸而成，鰭片20之背面220對 • 應每一凸出部26(27、28)之位置形成凹陷29。 如圖4、圖5及圖6所示，該第一、二、三凸出部26、 27、28均呈長條形狀，並相對上折邊24或下折邊25傾斜 設置。每一凸出部26(27、28)具有相似結構，以下以第一 凸出部26為例說明所述凸出部26、27、28之具體結構。 第一凸出部26包括〆凸出於本體22之頂面260。頂面260 呈平行四邊形結構，其通過上、下連接侧壁262、264及右 連接側壁266與本體22相連接，其上、下連接側壁262、 264與上折邊24或下折邊25相平行，右連接侧壁266則 與上折邊24或下折邊25呈傾斜狀設置。第一凸出部26 之右連接側壁266所在之一侧形成迎風面44,而與右連接 侧壁266相對應之另一側則形成背風面4〇，該迎風面44 和为風面40相對氣流行進方向呈傾斜狀設置，該迎風面 44和背風面40與鰭片20之下折邊25形成一夾角0。第 三凸出部28與第一、二凸出部26、27呈非平行設置，各 凸出部26、27、28與鰭片2〇之下折邊25形成之夾角0 大小不一致。在背風面40上設置有一開口 42，該開口 42 可使鰭片20之間之流道21相立連通，氣流行進時，可從 鰭片20之背面220 —侧之流道21通過該開口 42到達該 鰭片20之正面222 —側之流道21，增強各流道21間氣流 之對流，增強氣流與鰭片2〇之間之熱交換，同時能破壞 8 1301398 氣流在鰭片20表面形成之層流底層’加強擾流效果，從 而提升散熱效率。 第〆、二、三凸出部26、27、28大小不一致，設置在 氣流下游之第三凸出部28最大，設置在氣流上游之第一、 二凸出鄯26、27相對較小。第二凸出部27設在第一凸出 部26之上方’第二凸出部27之頂面270之下連接侧壁（未 標號）與第一凸出部26之頂面260之上連接側壁262之 間可形成一疋之間距，這樣可以讓部分氣流直接吹向第三 凸出部28。第三凸出部28之頂面280之上連接側壁（未 標號）比*第一凸出部27之頂面270之上連接侧壁（未標 號）位ί要高，第三凸出部28之頂面280之下連接側壁 (未標號）與第一凸出部26之頂面260之下連接側壁264 處在同〆水準線上。第三凸出部28之上連接側壁與鰭片 20之上折邊24之間形成一第一間距48，第三凸出部28 之下連接侧壁與鰭片20之下折邊25之間形成一第二間距 46，第>間距46在縱向上之寬度比第一間距48大。 熱管50包括用於與吸熱塊1〇〇接觸之一蒸發部及與 鰭片20之下折邊25熱連接之一冷凝部，利用熱管5〇快 速之導熱性能可將吸熱塊100從發熱電子元件吸收之熱量 快速均勻地傳遞至縛片20上。該散熱器工作時，熱管％ 之蒸發部吸收吸熱塊上之熱量，熱管50内之液綠工 作介質吸熱蒸發並向熱管50之冷凝部流動，然後於冷凝 部釋放自吸熱塊1〇〇所吸收之熱量並冷凝回流至蒸發;進 入下一次循環，如此反復地進行吸收、釋放大量潛熱，將 9 1301398 吸熱塊100所吸收之熱量快速地傳遞至鰭片20。 熱管50將熱量傳遞至鰭片20時，鰭片20靠近熱管 50之區域，即對應第二間距46之附近區域之熱量較為集 中，形成熱量密集區。當風扇產生之氣流流經流道21時， 由於第一、二、三凸出部26、27、28沿著氣流行進方向傾 斜設置，部分氣流將受到第一、二、三凸出部26、27、28 之迎風面44之導引而傾斜地流向鰭片20之下方’即流向 鰭片20上對應第二間距46之附近區域，從而鰭片20與 氣流在該熱量密集區之熱交換得到加強。另一方面，由於 黏性力之影響，氣流流經鰭片20表面時將形成層流底層， 而在第一、二、三凸出部26、27、28之背風面40上設置 之開口 42,能使氣流從鰭片20之背面220 —侧之流道21 通過該開口 42到達鰭片20之正面222 —側之流道21，能 夠加強氣流在相鄰鰭片20間之對流效果，並破壞形成在 鰭片20表面上之層流底層。另外第一、二、三凸出部26、 27、28之形成則相當於在鰭片2〇表面上設置一障礙物， 可進一步破壞該層流底層，增強氣流在鰭片2〇表面處之擾 流效果，加強鰭片20與氣流之間之熱交換，也同時增加 鰭片20之散熱面積，最終提升散熱器之整體散熱效果。 同時’在籍片20之背面220與第一、二、三凸出部26、 27、28對應之位置上形成之凹陷29,也使鰭片2〇之背面 220呈非平面狀，同樣能增強氣流之擾流效果，提升散熱 器之散熱效率。μ 該實施例中，鰭片20上包括沿氣流方向傾斜設置之第 1301398 —、一 — 一—、二凸出部26、27、28，凸出部26(27、28)大小不 ^且都呈長條形，並在凸出部26(27、28)之背風面40 ^叹^開口 42。實際上，凸出部之數量和形狀等可根據鰭 之、、構以及所需散發之熱量而改變。如凸出部可以是一 個或彡你| ’可以設置成互相平行並大小相同，它們的形狀1301398 IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink, and more particularly to a heat sink for heat dissipation of a heat generating electronic component. [Prior Art] With the continuous improvement of the power of electronic components such as a central processing unit (CPU), the problem of heat dissipation has been receiving more and more attention, especially in computers. In order to efficiently remove the heat generated by the system in a limited space, the industry currently uses heat sink fins, heat pipes and cooling fans to dissipate heat. The fan mainly provides the flowing air, and the heat pipe mainly transmits the heat in the long distance. The task of the heat sink fin is to transfer the heat generated by the heat officer to the outside environment through the flowing air generated by the fan drive. It can be seen that in a certain volume of space, whether the heat generated by the conductive sub-components in time will depend on whether there is a heat sink fin of the south effect. If the fins of the flat structure are used, when the fan airflow flows through the fins, the contact surface of the fins and the airflow form a laminar bottom layer due to the adhesive force, and the flow velocity of the airflow in the laminar bottom layer is almost At zero, the heat exchange effect is greatly reduced. Therefore, if the heat exchange effect between the heat sink fin and the fan airflow can be improved, the heat dissipation effect of the heat sink can be greatly improved. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a spar with high heat dissipation efficiency. The heat sink is used for dissipating heat from the heat-generating electronic component, and includes a plurality of parallel-arranged cymbals' each of the pieces includes a body, and a flow path through which the gas is supplied through the adjacent fins 6 131398 flows, and the body is provided with at least A protrusion protruding from the body, and one side of the protrusion is provided with an opening that communicates with the flow path on both sides of the corresponding fin. Compared with the prior art, the protruding portion formed on the fin of the heat sink can increase the heat dissipation area of the fin, and can increase the spoiler effect of the airflow, and at the same time, an opening is provided on one side of the protruding portion. The air supply passes through to the adjacent fins to enhance the convection effect of the airflow between the fins and improve the heat dissipation efficiency. [Embodiment] Hereinafter, the embodiments will be further described with reference to the accompanying drawings. 1 to 6 are drawings of a preferred embodiment of a heat sink of the present invention. As shown in FIG. 1 , the heat sink includes a heat dissipation fin set 10 , a heat absorption block 100 , and a heat pipe 50 connecting the heat dissipation fin set 10 and the heat absorption block 100 , and the heat pipe 50 heats the heat absorption block 100 from the heat generating electronic component ( The heat absorbed is transferred to the heat dissipation fin group 10, and a heat dissipation fan (not shown) is placed at the side end of the heat dissipation fin group 10 for providing a forced air flow. The airflow generated by the fan can flow into the heat radiating fin group 10 in the direction indicated by the arrow in the figure, thereby performing heat exchange with the heat radiating fin group 10 to remove heat. Referring to FIG. 2 and FIG. 3 simultaneously, the heat dissipation fin set 10 includes a plurality of fins 20 disposed in parallel with each other. Each fin 20 includes a square body 22 and a folded edge 24 and a lower flange 25 formed on one of the upper and lower ends of the body 22. The upper and lower flanges 24 and 25 of each of the fins 20 abut against the upper and lower flanges 24 and 25 of the adjacent fins 20, respectively, so that a flow passage 21 for airflow is formed between the two adjacent fins 20. . Three protrusions are formed on the body 22 of each of the fins 20, and the first protrusions 26, the second protrusions 27 and the third protrusions 28 are respectively in the direction of the airflow 71301398. The first, second, and third projections 26, 27, 28 are formed by the front surface 222 of the body 22 projecting toward the adjacent fins 20. The back surface 220 of the fins 20 are aligned with each of the projections 26 (27). The position of 28) forms a recess 29. As shown in Figs. 4, 5 and 6, the first, second and third projections 26, 27, 28 are each elongated and are inclined with respect to the upper flange 24 or the lower flange 25. Each of the projections 26 (27, 28) has a similar structure, and the specific structure of the projections 26, 27, 28 will be described below by taking the first projections 26 as an example. The first projection 26 includes a top surface 260 that protrudes from the body 22. The top surface 260 is in the form of a parallelogram which is connected to the body 22 through the upper and lower connecting side walls 262, 264 and the right connecting side wall 266, and the upper and lower connecting side walls 262, 264 are combined with the upper folded side 24 or the lower folded side 25. Parallel, the right connecting side wall 266 is disposed obliquely to the upper folded edge 24 or the lower folded edge 25. One side of the right connecting side wall 266 of the first protruding portion 26 forms a windward side 44, and the other side corresponding to the right connecting side wall 266 forms a leeward side 4, which is opposite to the wind surface 40. The airflow direction is inclined, and the windward surface 44 and the leeward surface 40 form an angle 0 with the lower flange 25 of the fin 20. The third projections 28 are disposed non-parallel to the first and second projections 26, 27, and the angles 0 formed by the projections 26, 27, 28 and the lower flange 25 of the fins 2 are not uniform. An opening 42 is disposed on the leeward surface 40. The opening 42 allows the flow passage 21 between the fins 20 to communicate with each other. When the airflow travels, the flow passage 21 from the back side 220 of the fin 20 passes through the opening 42. The flow path 21 on the side 222 of the front surface 222 of the fin 20 is enhanced to enhance the convection of the air flow between the flow channels 21, enhance the heat exchange between the air flow and the fins 2, and destroy the airflow of the 8 1301398 on the surface of the fin 20. The laminar bottom layer enhances the efficiency of heat dissipation by enhancing the spoiler effect. The second, second, and third projections 26, 27, and 28 are inconsistent in size, and the third projections 28 disposed downstream of the airflow are the largest, and the first and second projections 26, 27 disposed upstream of the airflow are relatively small. The second protruding portion 27 is disposed above the first protruding portion 26. The connecting sidewall (not labeled) below the top surface 270 of the second protruding portion 27 is connected to the top surface 260 of the first protruding portion 26. A spacing between the side walls 262 may be formed such that a portion of the airflow is directed toward the third projection 28. The connecting side wall (not labeled) on the top surface 280 of the third protruding portion 28 is higher than the connecting side wall (not labeled) position ί on the top surface 270 of the first protruding portion 27, and the third protruding portion 28 is higher. The lower side of the top surface 280 is connected to the side wall (not labeled) and the lower side of the top surface 260 of the first projection 26 is connected to the side wall 264 on the same level. A first spacing 48 is formed between the connecting sidewalls of the third projections 28 and the upper flanges 24 of the fins 20, and between the connecting sidewalls of the third projections 28 and the lower flanges 25 of the fins 20 A second spacing 46 is formed, the width of the > spacing 46 being greater in the longitudinal direction than the first spacing 48. The heat pipe 50 includes one of an evaporation portion for contacting the heat absorbing block 1 及 and a condensing portion thermally connected to the lower hem 25 of the fin 20, and the heat absorbing block 100 can be used to heat the heat absorbing block 100 from the heat generating electronic component. The absorbed heat is transferred to the tab 20 quickly and evenly. When the heat sink is in operation, the evaporation portion of the heat pipe absorbs the heat on the heat absorption block, and the liquid green working medium in the heat pipe 50 absorbs heat and evaporates and flows to the condensation portion of the heat pipe 50, and then is released from the heat absorption block 1 in the condensation portion. The heat is condensed and refluxed to evaporate; into the next cycle, the absorption is repeated repeatedly, and a large amount of latent heat is released, and the heat absorbed by the 9 1301398 heat absorbing block 100 is quickly transferred to the fins 20. When the heat pipe 50 transfers heat to the fins 20, the fins 20 are close to the area of the heat pipe 50, that is, the heat corresponding to the vicinity of the second pitch 46 is concentrated to form a heat-intensive area. When the airflow generated by the fan flows through the flow passage 21, since the first, second, and third projections 26, 27, 28 are inclined along the traveling direction of the airflow, part of the airflow will be subjected to the first, second, and third projections 26, The windward surface 44 of 27, 28 is guided obliquely to the lower side of the fin 20, that is, to the vicinity of the second spacing 46 on the fin 20, so that heat exchange between the fin 20 and the airflow in the heat-intensive region is strengthened. . On the other hand, due to the influence of the viscous force, the laminar flow bottom layer is formed when the airflow flows through the surface of the fin 20, and the opening 42 is provided on the leeward surface 40 of the first, second and third projections 26, 27, 28. The flow path 21 from the side 220 of the back surface 220 of the fin 20 can be passed through the opening 42 to the flow path 21 on the side of the front surface 222 of the fin 20, thereby enhancing the convection effect of the airflow between the adjacent fins 20, and The laminar underlayer formed on the surface of the fin 20 is destroyed. In addition, the formation of the first, second and third protrusions 26, 27, 28 is equivalent to providing an obstacle on the surface of the fin 2, which can further destroy the laminar bottom layer and enhance the airflow at the surface of the fin 2 The turbulence effect enhances the heat exchange between the fins 20 and the airflow, and also increases the heat dissipation area of the fins 20, ultimately improving the overall heat dissipation effect of the heat sink. At the same time, the recess 29 formed at the position corresponding to the first, second and third projections 26, 27, 28 of the back surface 220 of the tablet 20 also makes the back surface 220 of the fin 2 non-planar, which can also enhance the airflow. The turbulence effect enhances the heat dissipation efficiency of the heat sink. In this embodiment, the fin 20 includes a 1301398-, a-one, and two protrusions 26, 27, 28 which are inclined along the airflow direction, and the protrusions 26 (27, 28) are not large in size and both It has a long strip shape and sighs the opening 42 on the leeward side of the projections 26 (27, 28). In fact, the number and shape of the projections may vary depending on the fin, the configuration, and the amount of heat that needs to be dissipated. If the bulges can be one or 彡 you | ’ can be set to be parallel to each other and the same size, their shape
不限於長條形，也可以是圓弧形、圓柱形或其他類似形狀。 JpJ 才，θ B ’閉口 42也可設在凸出部26(27、28)之迎風面44上， 而月風面40形成封閉狀，如此，氣流經過流道21時可從 ·、、、曰 U之正面222 —侧之流道21通過開口 42到達鰭片 20之背面220 —侧之流道21，同樣能達到破壞鰭片2〇表 面上之層流底層、加強氣流在相鄰鰭片20間之對流效果。It is not limited to a long strip shape, but may be a circular arc shape, a cylindrical shape, or the like. JpJ, θ B 'close 42 may also be provided on the windward surface 44 of the projection 26 (27, 28), and the moon wind surface 40 is closed, so that the airflow through the flow passage 21 can be from ·,,, The flow path 21 of the front surface 222 of the 曰U reaches the flow channel 21 on the side of the back surface 220 of the fin 20 through the opening 42 to achieve the laminar bottom layer on the surface of the fin 2, and the airflow in the adjacent fin 20 convection effects.
如圖7和圖8所示，為本發明散熱器另一實施方式之 韓片20a之示意圖。鰭片2〇a同樣包括本體22、上折邊24 及下折邊25。在鰭片20a之本體22上形成兩個凸出部， 沿氣流行進方向，分別為第一凸出部26a及第二凸出部 28a。該第一凸出部26a及第二凸出部2如與上述實施例中 之凸出部26、27、28具有相同結構和形狀，不同之處在 於’該第一凸出部26a由本體22之背面220向相鄰鰭片 20a凸伸而成，而第二凸出部28a則由本體22之正面222 向相鄰鰭片20a凸伸而成，在本體22之相對面對應每一凸 出部26a、28a之位置各自形成一凹陷29a。該第一凸出部 26a及第一凸出部28a互相平行設置，且第一凸出部26a 較小，位於氣流之上游，第二凸出部28a相對較大，位於 氣流之下游。該第一凸出部26a及第二凸出部28a之迎風 11 1301398 面44 一側與本體22相連，形成封閉狀，而於背風面4〇 側a又置一開口 42，使鰭片2〇a之間之流道21相通。 ^該實施例中’散熱器之其他元件都與前述實施例中之 " 政熱器相同，在此不再資述。 • ^同樣在該實施例中’鰭片20a上凸出部之數量和形狀 等可根據鰭片之結構以及所需散發之熱量而改變。如凸出 部可以是-個或多個，可以設置成互不平行 ，其大小可以 • ㈣’它們的形狀不限於長條形，也可以是圓弧形、圓柱 形或其他類似形狀。開口 42也可設在凸出部2如、28a之 迎風面44上，而背風面4〇形成封閉狀，也能達到破壞鰭 片20a表面上之層流底層、加強氣流在相鄰鰭片間之 對流效果之功效。 知上⑽，本㈣符合發明專彳彳之料，絲法提出 料申請。惟以上所述者僅為本發明之較佳實施例，舉凡 u案技藝之人士’在爰依本發明精神所作之等效修飾 • 或變化，皆應涵蓋於以下之中請專利範圍内。 【圖式簡單說明】 圖1為本發明散熱器-較佳實施方式之組裝示意圖。 圖2為散熱鰭片組分解示意圖。 圖3為圖2所示散熱鰭片組之另—角度視圖。 圖4為其中一鰭片之放大圖。 圖5為圖4所示韓片之另—角度視圖。 圖6為圖4所示鰭片背面之正視圖。 ® 7為本發另—實施方式之—鰭片示意圖。 12 1301398 圖8為圖7所示鰭片之另一角度視圖。 【主要元件符號說明】 散熱鰭片組 10 吸熱塊 100 籍片 20、20a 流道 21 本體 22 背面 220 正面 222 上折邊 24 下折邊 25 第一凸出部 26 ^ 頂面 260、270、280 上連接侧壁 262 下連接侧壁 264 右連接側壁 266 第二凸出部 27、28a 第三凸出部 28 凹陷 29、29a 背風面 40 開口 42 迎風面 44 第二間距 46 第一間距 48 熱管 50 26aAs shown in Fig. 7 and Fig. 8, a schematic view of a Korean piece 20a according to another embodiment of the heat sink of the present invention is shown. The fin 2〇a also includes a body 22, an upper flange 24 and a lower flange 25. Two protrusions are formed on the body 22 of the fin 20a, and the first protrusion 26a and the second protrusion 28a are respectively in the airflow direction. The first protruding portion 26a and the second protruding portion 2 have the same structure and shape as the protruding portions 26, 27, 28 in the above embodiment, except that the first protruding portion 26a is composed of the body 22 The back surface 220 is protruded from the adjacent fins 20a, and the second protrusions 28a are formed by the front surface 222 of the body 22 protruding toward the adjacent fins 20a, and corresponding to each of the opposite sides of the body 22 The positions of the portions 26a, 28a each form a recess 29a. The first protruding portion 26a and the first protruding portion 28a are disposed in parallel with each other, and the first protruding portion 26a is small and located upstream of the airflow, and the second protruding portion 28a is relatively large and located downstream of the airflow. The first protruding portion 26a and the second protruding portion 28a are connected to the body 22 on the side of the windward 11 1301398 surface 44 to form a closed shape, and an opening 42 is formed on the side of the leeward side 4 to make the fin 2 The flow path 21 between a is in communication. The other components of the heat sink in this embodiment are the same as those of the "" heat exchanger in the foregoing embodiment, and will not be described here. • ^ Also in this embodiment, the number and shape of the projections on the fin 20a may vary depending on the structure of the fin and the amount of heat that needs to be dissipated. For example, the projections may be one or more, and may be arranged to be non-parallel to each other, and their size may be (4) 'The shapes thereof are not limited to the long strip shape, and may be a circular arc shape, a cylindrical shape or the like. The opening 42 can also be disposed on the windward surface 44 of the protrusions 2, such as 28a, and the leeward side 4〇 is closed, and the laminar bottom layer on the surface of the fin 20a can be broken, and the airflow can be enhanced between the adjacent fins. The effect of the convection effect. Knowing that (10), this (4) meets the requirements of the invention, and the silk method proposes the application. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be covered by the following patents. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the assembly of a heat sink according to a preferred embodiment of the present invention. 2 is a schematic exploded view of a heat sink fin group. 3 is another perspective view of the heat sink fin set of FIG. 2. Figure 4 is an enlarged view of one of the fins. Fig. 5 is another perspective view of the Korean piece shown in Fig. 4. Figure 6 is a front elevational view of the back of the fin of Figure 4. ® 7 is a schematic view of the fins of the other embodiment. 12 1301398 Figure 8 is another perspective view of the fin shown in Figure 7. [Description of main component symbols] Heat sink fin set 10 Heat sink block 100 Chip 20, 20a Flow path 21 Body 22 Back 220 Front side 222 Upper fold 24 Lower fold 25 First projection 26 ^ Top surface 260, 270, 280 Upper connecting side wall 262 lower connecting side wall 264 right connecting side wall 266 second protruding portion 27, 28a third protruding portion 28 recess 29, 29a leeward surface 40 opening 42 windward side 44 second spacing 46 first spacing 48 heat pipe 50 26a
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