TWI649024B - Electronic device - Google Patents

Abstract

An electronic device includes a housing, an electronic module, a heat dissipation air passage, and at least one inlet fan. The housing defines an accommodating space, and has a corresponding air inlet portion and an air outlet portion. The air inlet portion and the air outlet portion are respectively provided with a plurality of through holes communicating with the accommodating space. The electronic module is disposed in the accommodating space. The air distribution duct is located in the accommodating space and communicates with the air inlet portion and the air outlet portion, so that an airflow from the outside can enter the heat dissipation air passage through the air inlet portion and exchange heat with the accommodating space. The air flow then flows out of the air outlet. The inlet fan is disposed in the accommodating space for forming the airflow flowing from the through holes of the air inlet portion and flowing out of the through holes of the air outlet portion.

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an electronic device having good heat dissipation capability.

With the development of integrated circuit technology and the evolution of the process, in order to meet the wide application and use requirements of electronic devices, manufacturers have developed an integrated computer (All-in-one, AIO) formed by integrating the display and the host. ). However, while the performance and performance of the electronic device are gradually increased, the operating power is increased, but the heat generated by the electronic device in a unit time is also increased, thereby causing the electronic device to operate at a higher operating temperature. . On the other hand, under the continual pursuit of the tendency of the electronic device to become thinner and lighter, the ability of the electronic device to dissipate heat is further reduced, resulting in a large amount of thermal energy accumulated inside the electronic device, which not only increases the surface temperature of the casing, It causes discomfort to the user during operation, and also affects the normal operation of the electronic device, and reduces the periodicity of use of the product, which may even cause the failure of the electronic device to fail.

Accordingly, it is an object of the present invention to provide an electronic device that solves the aforementioned heat dissipation problem.

Therefore, in some implementations, the electronic device of the present invention includes a housing, an electronic module, a heat dissipation air passage, and at least one inlet fan. The housing defines an accommodating space, and has a corresponding air inlet portion and an air outlet portion. The air inlet portion and the air outlet portion are respectively provided with a plurality of through holes communicating with the accommodating space. The electronic module is disposed in the accommodating space. The air distribution duct is located in the accommodating space and communicates with the air inlet portion and the air outlet portion, so that an airflow from the outside can enter the heat dissipation air passage through the air inlet portion and exchange heat with the accommodating space. The air flow then flows out of the air outlet. The inlet fan is disposed in the accommodating space for forming the airflow flowing from the through holes of the air inlet portion and flowing out of the through holes of the air outlet portion.

In some embodiments, a plurality of inlet fans are included to accelerate the flow of the airflow, and the inlet fans are disposed in the heat dissipation air duct.

In some embodiments, the electronic module includes an electronic component, the electronic device further includes at least one heat dissipation module in contact with the electronic component, and an exhaust fan disposed adjacent to the heat dissipation module, the heat dissipation module includes a fixing base contacting the electronic component, a heat pipe connected to the fixing seat, and a fin group connected to one end of the heat pipe and adjacent to the air outlet portion, the fin group having a plurality of spaced apart from each other The heat dissipating fins are disposed, and each of the heat dissipating fins has a body and at least one protrusion protruding outward from the body to increase a heat dissipating area.

In some embodiments, an aperture ratio is defined as a ratio of an area occupied by all of the protrusions on the body of each heat dissipation fin to a total area of the body, and the protrusions are arranged in an array. The opening ratio ranges from 40% to 70%.

In some embodiments, an aperture ratio is defined as a ratio of an area occupied by all of the protrusions on the body of each heat dissipation fin to a total area of the body, and the protrusions are arranged in a single row. The opening ratio ranges from 30% to 50%.

In some implementations, the fin set further includes at least one stud disposed between the fins.

In some implementations, the heat dissipation module further includes a clip group for accommodating the fin group, the clip group having an upper clip covering the top end of the fin set, the upper clip having an upper portion The buckle body and the upper snap tabs formed on opposite sides of the upper buckle body and projecting downward.

In some embodiments, the buckle set further has a lower buckle corresponding to the upper buckle, the lower buckle has a lower buckle body and two lower card holes respectively formed on the lower buckle body. And a grid detachably disposed on one side of the lower buckle body and extending upward.

In some embodiments, at least one heat conducting member coupled to the heat dissipation module and configured to transfer thermal energy of the electronic component to the outside of the housing is further included.

In some embodiments, the exhaust fan includes a blade group having a rotating shaft, and a rubber ring disposed at a bottom end of the rotating shaft for reinforcing the stability of the blade group.

In some embodiments, the exhaust fan further includes a frame for accommodating the blade group, the frame having a bottom wall, two side walls extending upward from opposite sides of the bottom wall, and a bottom wall connected to the bottom wall a connecting wall with one end of the side walls, a plurality of sets of supporting ribs formed at the side walls and at different heights, and a top cover optionally supported by one of the supporting ribs opposite to the bottom wall, The top cover is supported by the different sets of the support ribs to adjust the distance between the distance between the top cover and the bottom wall.

In some embodiments, the exhaust fan further includes a baffle formed on the bottom wall and extending upward to guide the air flow.

In some implementations, the electronic module includes a plurality of electronic components, and the electronic device further includes a plurality of spaced apart heat dissipation modules, each of the heat dissipation modules including a fixed seat that contacts the corresponding electronic component. a heat pipe connected to the fixing base, and a fin group connected to one end of the heat pipe and adjacent to the air outlet portion, the fin groups respectively having a plurality of heat dissipating fins spaced apart from each other, and the like The fin sets are disposed adjacent to each other and the heat sink fins of the adjacent fin sets are aligned.

In some implementations, the electronic module includes a plurality of electronic components, and the electronic device further includes a plurality of heat dissipation modules respectively contacting the electronic components, each of the heat dissipation modules including a fin set, the fin The chip set has a plurality of heat dissipating fins spaced apart from each other, and the two adjacent fins together define a heat dissipating channel for the airflow to flow.

In some embodiments, the electronic module includes an electronic component, and the electronic device further includes a heat exchanger in contact with the electronic component for circulating a fluid.

In some embodiments, the housing further includes at least one baffle disposed on the heat dissipation air duct for guiding the air flow.

The present invention has at least the following effects: the electronic module is disposed in the accommodating space, and the heat dissipating air passage is located in the accommodating space and communicates with the design of the air inlet portion and the air outlet portion, so that the external airflow can be After the air inlet portion enters the heat dissipation air passage and exchanges heat with the accommodating space, the air flow again flows out from the air outlet portion. On the other hand, the inlet fans 3 are disposed in the accommodating space for forming the airflow flowing from the first through holes of the air inlet portion and flowing out of the second through holes of the air outlet portion. Thereby, the flow of the airflow inside the casing is increased, so that the thermal energy of the electronic components can be dissipated by the airflow to the outside of the casing. In addition, in the case where the heat dissipation module, the heat conduction members, the exhaust fan, and the heat radiator are alternately matched or used in any combination, the electronic components are generated and accumulated. Thermal energy can be quickly transferred out of the housing, thereby further improving the heat dissipation performance of the electronic components while reducing the temperature of the housing.

Referring to FIG. 1 , a first embodiment of an electronic device of the present invention comprises a housing 1 , an electronic module 2 , two inlet fans 3 , three heat dissipation modules 4 , three heat conduction members 5 , and a row of fans 6 . .

In detail, the housing 1 includes a bottom plate 11 and a louver 12 extending upward from the periphery of the bottom plate 11, and the bottom plate 11 and the yoke 12 cooperate to define an accommodating space 13. The air inlet portion 121 has a plurality of air inlet portions 121 and a wind outlet portion 122. The air inlet portion 121 is provided with a plurality of first through holes 123 respectively communicating with the receiving space 13 and the outer space. The air outlet portion 122 A plurality of second through holes 124 respectively communicating with the accommodating space 13 and the external space are provided, and the first through holes 123 and the second through holes 124 are both for a gas flow into and out of the accommodating space 13.

The electronic module 2 is disposed in the accommodating space 13 and is mounted on the bottom plate 11. The housing 1 further includes a heat dissipating air passage 14 disposed in the accommodating space 13 and adjacent to the inner periphery of the housing 1. The heat dissipation air duct 14 has a plurality of first openings 141 communicating with the air inlet portion 121, and a plurality of second openings 142 communicating with the air outlet portion 122, so that the airflow from the outside can pass through the air inlet portion in sequence. 121 and the first openings 141 enter the heat dissipation duct 14 . The electronic module 2 includes a plurality of electronic components 21, such as a processor (CPU), a hard disk drive, a burning machine, a memory module, and a display chip, but not Limited to the above disclosure. On the other hand, when the electronic components 21 are in an operational state, a large amount of thermal energy is easily generated, and at the same time, the temperature of the casing 1 rises.

The inlet fan 3 is disposed in the accommodating space 13 and is disposed in the heat dissipation air duct 14 for forming the first flow through the first through holes 123 of the air inlet portion 121 and the air venting portion 122 The air flow from the two through holes 124. When the airflow of the lower temperature flows into the accommodating space 13 from the first through holes 123 of the air inlet portion 121, the airflow can be accelerated to the shell under the cooperation of the auxiliary fans 3 The flow inside the body 1 while the air flow can also flow in a large amount along the heat dissipation air passage 14 and advance toward the air outlet portion 122. In other embodiments, the angle formed by the heat dissipating air passage 14 at the boundary between the shroud 12 and the bottom plate 11 can be formed into an arc-shaped corner or an obtuse angle to allow the airflow to flow through the angle. The flow can be smoothly and unimpeded along the angle of the curved arc, thereby avoiding reducing the flow rate and flow rate of the airflow in the heat dissipation duct 14. It should be noted that the design and the manufacturer can adjust and combine according to the actual use requirements, and the manner in which the heat dissipation air duct 14 is disposed is not limited to the disclosure of the embodiment. In this embodiment, the position of the heat dissipating air passage 14 is preferably, for example, a region in which the hot air in the casing 1 is less likely to be dissipated, or is not suitable for being disposed in the exhaust fan 6 for heat dissipation. The track 14 allows the area to dissipate heat by heat exchange.

In the present embodiment, the first through holes 123 of the housing 1 are simultaneously communicated with the first openings 141 of the heat dissipation air duct 14 and the accommodating space 13 so that the airflow can enter the heat dissipation air. Outside the track 14, another portion of the air stream can enter the accommodating space 13. In addition, the second through holes 124 of the housing 1 are also connected to the second openings 142 of the heat dissipation air duct 14 and the accommodating space 13 . Therefore, the first through holes 123 enter. The airflow to the accommodating space 13 can flow through the electronic components 21 to flow in the direction of the air outlet portion 122, whereby the thermal energy of the electronic components 21 can be taken away by the airflow, accompanied by The flow of the airflow is entrained by the second through holes 124 of the air outlet portion 122 to the outside of the casing 1 to reduce the accumulation of thermal energy of the electronic components 21 in the electronic device. The temperature of the housing 1 can be effectively reduced, so that the overall heat dissipation performance of the electronic device can be increased. It should be noted that the design and the manufacturer can be adjusted according to actual needs, and the arrangement of the heat dissipation air duct 14 and the inlet fan 3 is not limited to the disclosure of the embodiment.

Referring to FIG. 2 to FIG. 4 , the heat dissipation modules 4 are respectively in contact with the electronic components 21 , and each of the heat dissipation modules 4 includes a fixing base 41 that is in contact with the corresponding electronic component 21 , and is connected to the fixing base. a heat pipe 42 of 41, a mounting plate 43 disposed adjacent one end of the heat pipe 42, and a fin set disposed on the mounting plate 43 and connected to one end of the heat pipe 42 and adjacent to the air outlet portion 122 44. The fixing base 41 has a base body 411, four legs 412 extending from the four corners of the base body 411, and four legs respectively disposed on the legs 412 for mounting the fixing base 41 to the corresponding one. A connector on the electronic component 21. Each of the fin sets 44 has a plurality of heat dissipating fins 441 spaced apart from each other, and each of the heat dissipating fins 441 has a body 442 and a plurality of convex portions 440 protruding outward from the body 442 to increase a heat dissipating area. . In the present embodiment, the convex portions 440 are respectively ribs 443, and each of the ribs 443 defines a slot portion 443a for assisting heat dissipation of the corresponding electronic component 21. It should be noted that the geometric shapes of the protrusions 440 may be set to a rectangular shape, a circular shape, a long strip shape, a diamond shape, an elliptical shape, a hexagon shape, or the like according to actual needs.

Referring to FIG. 1 , the heat conducting members 5 are respectively connected to the fin sets 44 of the heat dissipation modules 4 and extend to the side edges of the housing 1 , thereby transferring thermal energy accumulated in the housing 1 to The side edges of the housing 1 are such that the thermal energy of the electronic components 21 is easily dissipated from the side edges of the housing 1 to the outside. In this embodiment, the heat dissipation fins 441 and the materials of the heat conduction members 5 are, for example, It is made of a material with high thermal conductivity and good thermal conductivity, such as copper or aluminum, but not limited to such materials.

Referring to FIG. 1 , FIG. 5 and FIG. 6 , the exhaust fan 6 is disposed adjacent to one of the heat dissipation modules 4 , and the exhaust fan 6 includes a blade group 61 having a rotating shaft 611 and a fan blade group 61 . A frame 62, and a rubber ring 63 disposed at a bottom end of the rotating shaft 611 for reinforcing the stability of the blade group 61. The frame 62 has a bottom wall 621, two side walls 622 extending upward from opposite sides of the bottom wall 621, and a connecting wall 623 connected to one end of the bottom wall 621 and the side walls 622. The side walls 622 are located at different heights of the support ribs 624, and a top cover 625 that is optionally supported by one of the support ribs 624 opposite the bottom wall 621. In addition, the exhaust fan 6 further includes a baffle 67 formed on the bottom wall 621 and extending upward for guiding the air flow. The distance between the top cover 625 and the bottom wall 621 can be adjusted by supporting the top cover 625 by different sets of the support ribs 624. Therefore, the support ribs 624 can provide the top cover 625 to be assembled to the frame. At 62 o'clock, there is a choice of different heights, and the amount of air blown by the exhaust fan 6 can be adjusted indirectly. It should be noted that the design and the manufacturer can adjust and combine according to the actual use requirements, and the manner of setting the support ribs 624 is not limited to the disclosure of the embodiment.

Referring to FIG. 5 and FIG. 6 , the top cover 625 and the bottom wall 621 respectively define a first air inlet hole 64 and a second air inlet hole 65. The bottom wall 621, the side walls 622 and the top cover 625 are three. An air outlet 66 is defined by mutual cooperation, and the opening of the air outlet 66 is disposed in the direction of the fin sets 44. Since the bottom end of the rotating shaft 611 has a distance difference from the frame 62, the rubber ring 63 is designed such that the bottom end of the rotating shaft 611 is closely fitted with the frame 62 to avoid the bottom end of the rotating shaft 611 and the frame. There is such a distance drop between 62, so that when the exhaust fan 6 rotates, the phenomenon of separation from the electronic module 2 is less likely to occur.

Referring to FIG. 1 , FIG. 4 and FIG. 5 , the fin sets 44 are adjacently disposed and the cooling fins 441 of the adjacent fin sets 44 are aligned, and the corresponding electronic components 21 are respectively respectively It is in close contact with the lower surface of the fixing base 41 and is in contact with the base body 411 , so that the corresponding thermal energy of the electronic component 21 can be sequentially transmitted to the fin set 44 via the fixing base 41 and the heat pipe 42 . When the blade group 61 rotates, the airflow of the lower temperature enters the exhaust fan 6 from the first air inlet hole 64 of the top cover 625 and the second air inlet hole 65 of the bottom wall 621, respectively. When a portion of the airflow enters through the second air inlet 65 of the bottom wall 621 and passes through the deflector 67, the deflector 67 blocks the airflow to divert the airflow and flow through the diversion flow. The flow velocity of the airflow of the sheet 67 is abruptly accelerated, so that the overall flow velocity of the airflow inside the exhaust fan 6 is increased, so that the airflow is accelerated by the air outlet 66 toward the fin sets 44, and at the same time The airflow also moves toward the fin group 44, and the airflow entrains the thermal energy of the corresponding electronic component 21 accumulated on the fin group 44, and flows toward the air outlet portion 122 through the heat dissipation fins 441. Thereby, the corresponding electronic component 21 is cooled and cooled.

On the other hand, since each of the ribs 443 and the corresponding body 442 of the heat dissipation fin 441 form a gap (that is, the slot portion 443a), the slots are assisted by the exhaust fan 6. The portion 443a can increase the convection of the corresponding thermal energy of the electronic component 21 to improve the heat dissipation capability of the fin set 44. In addition, when the thermal energy transfer of the corresponding electronic component 21 is transferred to the fin set 44, part of the thermal energy can also be transferred and conducted to the heat conducting member 5, thereby reducing the corresponding electronic component 21. At the same time, the thermal energy of the corresponding electronic component 21 accumulated on the heat conducting member 5 can be directly entrained by the airflow and dissipated to the outside of the casing 1 with the aid of the exhaust fan 6.

Referring to Figure 7, a second embodiment of the electronic device is shown. In the present embodiment, the overall structure and the manner of use of the electronic device are substantially the same as those of the first embodiment described above, and the main difference between the second embodiment and the first embodiment is the structure of the housing 1.

The housing 1 includes a plurality of baffles 15 disposed in the heat dissipation air duct 14 for guiding the air flow. The airflow enters the first through holes 123 of the air inlet portion 121, and is introduced into the heat dissipation air duct 14 by the fan 3, since the baffles 15 are respectively movable, therefore, when When the airflow passes, the baffles 15 oscillate with the flow of the airflow, thereby increasing the flow velocity of the airflow, so that the thermal energy of the electronic components 21 can be quickly directed toward the air outlet 66. The direction flows.

Referring to Figure 8, a third embodiment of the electronic device is shown. In the present embodiment, the overall structure and the manner of use of the electronic device are substantially the same as those of the first embodiment. The main difference between the third embodiment and the first embodiment is the structure of the heat dissipation fin 441.

The protrusions 440 are respectively a rib 446, and the ridges 446 can be used to increase the heat dissipation area of each of the heat dissipation fins 441. In this embodiment, the ridges 446 are respectively cylindrical. However, it is not limited to the content of the disclosure. A hole ratio is defined as the ratio of the area occupied by all of the ridges 446 on the body 442 of each heat sink fin 441 to the total area of the body 442. In this embodiment, when the ridges 446 are arranged in an array, the opening ratio ranges from 40% to 70%. On the other hand, when the ridges 446 are arranged in a single row and juxtaposed manner, the opening ratio ranges from 30% to 50%. In particular, the design and the manufacturer can adjust according to the actual use requirements. The shape of the ridges 446 and the manner of setting the ribs 446 are not limited to the disclosure of the embodiment, and the ridges 446 can also be achieved. The efficacy is considered as a routine change of the embodiment.

Referring to Figure 9, a fourth embodiment of the electronic device is shown. In the present embodiment, the overall structure and the manner of use of the electronic device are substantially the same as those of the first embodiment described above, and the fourth embodiment is mainly different from the foregoing first embodiment in the structure of the fin set 44.

In this embodiment, the fin set 44 includes two studs 447 each penetrating horizontally and spaced apart from each other between the fins 441. The protrusions 447 can increase the heat dissipation area of the entire fin set 44. When the corresponding thermal energy of the electronic component 21 is transmitted to the fin set 44 along the heat pipe 42, the corresponding thermal energy of the electronic component 21 portion. Heat exchange can be achieved by conduction through the studs 447. Further, the material of the studs 447 is made of a material having high thermal conductivity and good thermal conductivity, such as copper or aluminum sheets, but is not limited to such materials.

Referring to Figures 10 and 11, a fifth embodiment of the electronic device is shown. In the present embodiment, the overall structure and the manner of use of the electronic device are substantially the same as those of the first embodiment. The main difference between the fifth embodiment and the first embodiment is the structure of the heat dissipation module 4.

The heat dissipation module 4 includes a buckle assembly 45 for receiving the fin assembly 44. The fastener assembly 45 has an upper fastener 451 and a lower fastener 452 corresponding to the upper fastener 451. In detail, the upper buckle 451 has an upper buckle body 453, and two upper snap tabs 454 formed on opposite sides of the upper buckle body 453 and protruding downward and respectively having an opening. The lower buckle 452 has a lower buckle body 455 having a slightly inverted U-shaped side and opposite ends respectively formed with a wing portion, and two lower card holes 456 formed in the wing portions of the lower buckle body 455, and A grid 457 detachably disposed at an edge of one side of the lower buckle body 455 and extending upward.

The upper buckle body 453 of the upper buckle 451 covers the top end of the fin set 44 such that the upper snap tabs 454 of the upper fastener 451 respectively abut on opposite sides of the fin set 44 The outermost edge of the heat dissipation fins 441 and the lower buckle body 455 of the lower buckle 452 are wrapped around the bottom of the mounting plate 43. Then, the upper fastening tabs 454 of the upper fastening device 451 are respectively inserted into the lower fastening holes 456 of the lower fastening device 452, and the upper fastening tabs 454 of the upper fastening device 451 are further disposed. The lower fastening holes 456 of the lower fastening device 452 are respectively disposed, and the heat dissipation module 4 can be exchangeably received through the fastening device group 45 and can be installed in the housing in a solderless manner. 1.

On the other hand, since the grid plate 457 has a plurality of grid sheet structures spaced apart from each other, when the blade group 61 is operated, the airflow may be contaminated with suspended particles such as dust and deposited on the fin group 44. The fin group 44 is easily caused to generate dust and affects the heat dissipation capability of the entire heat dissipation module 4 . Therefore, the design of the grid sheets through the grid 457 can be used to block dust and suspended particles, and the dust and suspended particles can be pre-blocked and accumulated in the grid 457 to avoid the fin group 44. The problem of card dust has occurred.

Referring to Figures 12 and 13, a sixth embodiment of the electronic device is shown. In this embodiment, the overall structure and the manner of use of the electronic device are substantially the same as those of the foregoing fifth embodiment. The main difference between the sixth embodiment and the foregoing fifth embodiment lies in the structure of the heat dissipation module 4.

The heat dissipation module 4 includes a clip group 45 that houses the fin set 44. The clip set 45 has an upper clip 451. In detail, the upper buckle 451 has an upper buckle body 453, and two upper snap tabs 454 formed on opposite sides of the upper buckle body 453 and protruding downward and respectively having an opening. The upper buckle body 453 of the upper buckle 451 covers the top end of the fin set 44 such that the upper snap tabs 454 of the upper fastener 451 respectively abut on opposite sides of the fin set 44 The outermost edges of the heat dissipation fins 441 are on the outer side. Then, the upper snap tabs of the upper clip 451 are respectively inserted into the two preset engagement slots 16 of the housing 1 to fix the heat dissipation module 4 to the housing 1 .

Referring to Figure 14, a seventh embodiment of the electronic device is shown. In this embodiment, the overall structure and the manner of use of the electronic device are substantially the same as those of the first embodiment. The main difference between the seventh embodiment and the first embodiment is the structure of the heat dissipation modules 4 . .

The electronic device includes a plurality of heat dissipation modules 4, each of the heat dissipation modules 4 includes a fin group 44. The fin groups 44 each have a substrate 444, and a plurality of spacers are disposed on the substrate 444 and are interlaced with each other. The heat dissipation fins 441 of the matrix are defined, and the two adjacent heat dissipation fins 441 jointly define a heat dissipation channel 445 for the airflow to flow. Each of the heat dissipation modules 4 is disposed above the corresponding electronic component 21, and when the inlet fan 3 rotates, the airflow of the lower temperature flows from the first through holes 123 of the air inlet portion 121 to The accommodating space 13 flows along the heat dissipation passages 445 toward the air outlet portion 122. When the airflow flows through the heat dissipation passages 445, the heat energy of the electronic components 21 can be thereby The second through holes 124 of the air outlet portion 122 are entrained and escaped to the outside of the casing 1.

Referring to Figure 15, an eighth embodiment of the electronic device is shown. In this embodiment, the overall structure and the manner of use of the electronic device are substantially the same as the first embodiment. The eighth embodiment is mainly different from the first embodiment in that the electronic device further includes a heat exchange. The structure of the device 7.

The heat exchanger 7 is disposed above the electronic module 2 and is in contact with the corresponding electronic component 21 for circulating a fluid. In the embodiment, the fluid is, for example, a condensed liquid. . The heat exchanger 7 includes a contact portion 71 that is in contact with the corresponding electronic component 21, a reservoir 72 for storing the condensed liquid, and a communication port 72 and the reservoir 72, respectively. The water inlet pipe 73 and an outlet pipe 74 that communicate with the contact portion 71 and the liquid storage tank 72, respectively. Since the contact portion 71 is disposed above the corresponding electronic component 21, when the condensed liquid flows from the liquid storage tank 72 to the water inlet pipe 73, the condensed liquid flows to the contact portion 71, and then The water outlet pipe 74 is returned to the liquid storage tank 72, and the condensed liquid flows in the heat exchanger 7 in this direction. Therefore, the circulating flow of the condensed liquid in the heat exchanger 7 causes the corresponding electronic component to pass. The thermal energy of 21 is dissipated while also lowering the temperature of the corresponding electronic component 21.

In the embodiment of the present invention, the electronic module 2 is disposed in the accommodating space 13 , and the heat dissipating air duct 14 is located in the accommodating space 13 and communicates with the air inlet portion 121 and the The air outlet portion 122 is designed such that the airflow from the outside can enter the heat dissipation air passage 14 via the air inlet portion 121 and exchange heat with the accommodation space 13, and the air flow again flows out from the air outlet portion 122. On the other hand, the inlet fans 3 are disposed in the accommodating space 13 for forming the second through holes of the first through holes 123 of the air inlet portion 121 and the second through holes of the air outlet portion 122. The outflow of airflow 124 thereby increasing the flow of the airflow within the housing 1 such that the thermal energy of the electronic components 21 can be dissipated by the airflow to the outside of the housing 1. In addition, in the case of the thermal matching module 4, the heat conducting members 5, the exhaust fan 6, and the alternative arrangement of the heat exchanger 7, or any combination of arbitrary combinations, the electronic components 21 The generated and accumulated thermal energy can be quickly transferred out of the casing 1, whereby the heat dissipation performance of the electronic components 21 can be improved, and the temperature of the casing 1 can be lowered, so that the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the equivalent equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still The scope of the invention is covered.

1‧‧‧shell

11‧‧‧floor

12‧‧‧

121‧‧‧Intake Department

122‧‧‧Outlet Department

123‧‧‧First through hole

124‧‧‧Second through hole

13‧‧‧ accommodating space

14‧‧‧heating air duct

141‧‧‧ first opening

142‧‧‧ second opening

15‧‧‧Baffle

16‧‧‧Clock seat

2‧‧‧Electronic module

21‧‧‧Electronic components

3‧‧‧Into the fan

4‧‧‧ Thermal Module

41‧‧‧ Fixed seat

411‧‧‧ base

412‧‧‧ feet

413‧‧‧Connecting parts

42‧‧‧heat pipe

43‧‧‧Installation board

44‧‧‧Fin group

440‧‧‧ convex

441‧‧‧heat fins

442‧‧‧ body

443‧‧ ‧ ribs

443a‧‧‧Slots

444‧‧‧Substrate

445‧‧‧heating channel

446‧‧‧ embossing

447‧‧‧Bump

45‧‧‧ buckle group

451‧‧‧Upper buckle

452‧‧‧ Lower buckle

453‧‧‧Upper body

454‧‧‧Upper snaps

455‧‧‧Like body

456‧‧‧下卡孔

457‧‧‧ grid

5‧‧‧Heat conductive parts

6‧‧‧ exhaust fan

61‧‧‧Fan leaf group

611‧‧‧Rotary axis

62‧‧‧Frame

621‧‧‧ bottom wall

622‧‧‧ side wall

623‧‧‧Connecting wall

624‧‧‧Support ribs

625‧‧‧ top cover

63‧‧ ‧ rubber ring

64‧‧‧First air inlet

65‧‧‧Second inlet hole

66‧‧‧Air outlet

67‧‧‧Guide

7‧‧‧ heat exchanger

71‧‧‧Contacts

72‧‧‧ liquid storage tank

73‧‧‧ water inlet

74‧‧‧Outlet

BRIEF DESCRIPTION OF THE DRAWINGS Other features and advantages of the present invention will be apparent from the embodiments of the present invention, wherein: FIG. 1 is a schematic diagram illustrating a first embodiment of the electronic device of the present invention; FIG. 2 is an exploded perspective view. FIG. 3 is a perspective view showing the combination relationship between the heat dissipation module and the heat conduction member of the first embodiment; FIG. 4 is a perspective view illustrating the heat dissipation module and the heat conduction member of the first embodiment; FIG. 5 is a perspective view showing a detailed structure of a row of fans of the first embodiment; FIG. 6 is a side view showing the first FIG. 7 is a perspective view showing a second embodiment of the electronic device; FIG. 8 is a perspective view showing the heat dissipating fin of a third embodiment of the electronic device; 9 is a plan view illustrating a stud of a fourth embodiment of the electronic device; FIG. 10 is an exploded perspective view showing the fin set and a clip set of a fifth embodiment of the electronic device; 11 is FIG. 12 is an exploded perspective view showing the fin set of the sixth embodiment of the electronic device and the buckle; Figure 13 is a perspective view showing the combination relationship between the fin set and the clip set of the sixth embodiment; Figure 14 is a schematic view showing the seventh embodiment of the electronic device The heat dissipation module; and FIG. 15 is a schematic view showing a heat exchanger of an eighth embodiment of the electronic device.

Claims (13)

An electronic device includes: a casing defining an accommodating space, and having an opposite air inlet portion and an air outlet portion, wherein the air inlet portion and the air outlet portion are respectively provided with a plurality of communication spaces a through hole; an electronic module disposed in the accommodating space and including at least one electronic component; a heat dissipating air passage located in the accommodating space and communicating the air inlet portion and the air outlet portion to make an air flow of the outside The air inlet portion can enter the heat dissipation air passage and exchange heat with the accommodating space, and the air flow is further discharged from the air outlet portion; a plurality of inlet fans are disposed on the heat dissipation air passage to form the self The through holes of the air inlet portion flow into and flow from the through holes of the air outlet portion, and can be used to accelerate the flow of the air flow; at least one heat dissipation module includes a fixed contact with the electronic component a heat pipe connected to the fixing seat, and a fin group connected to one end of the heat pipe and adjacent to the air outlet portion, the fin group having a plurality of heat dissipating fins spaced apart from each other, and each The heat dissipation fin has a body, and at least one of the body protrudes outward The convex portion of the heat dissipating area is defined, and an opening ratio is defined as a ratio of an area occupied by all the convex portions on the main body of each heat dissipating fin to a total area of the main body, and the convex portions are arranged in an array manner. The opening ratio ranges from 40% to 70%; and a row of fans is disposed adjacent to the heat dissipation module. The electronic device of claim 1, wherein the convex portions are arranged in a single row In the case of the mode, the opening ratio ranges from 30% to 50%. The electronic device of claim 1, wherein the fin set further comprises at least one stud disposed between the heat dissipating fins. The electronic device of claim 1, wherein the heat dissipation module further comprises a clip group for accommodating the fin group, the clip group having an upper clip covering the top end of the fin set, the upper clip The buckle has an upper buckle body, and two upper snap tabs formed on opposite sides of the upper buckle body and protruding downward. The electronic device of claim 4, wherein the buckle set further has a lower buckle corresponding to the upper buckle, the lower buckle having a lower buckle body and two formed on the lower buckle body a lower card hole, and a grid detachably disposed on one side of the lower buckle body and extending upward. The electronic device of claim 1, further comprising at least one heat conducting member connected to the heat dissipation module and configured to transfer thermal energy of the electronic component to the outside of the housing. The electronic device of claim 1, wherein the exhaust fan comprises a blade group having a rotating shaft, and a rubber ring disposed at a bottom end of the rotating shaft for reinforcing the stability of the blade group. The electronic device of claim 7, wherein the exhaust fan further comprises a frame for accommodating the blade group, the frame having a bottom wall and two side walls extending upward from opposite sides of the bottom wall, a connecting wall connected to one end of the bottom wall and the side walls, a plurality of sets of supporting ribs formed at the side walls and at different heights, and optionally a pair of the supporting ribs supported by the one of the supporting ribs The top cover is adjusted to support the distance between the top cover and the bottom wall by supporting the top cover by different sets of the support ribs. The electronic device of claim 8, wherein the exhaust fan further comprises a baffle formed on the bottom wall and extending upward for guiding the airflow. The electronic device of claim 1, wherein the electronic module comprises a plurality of electronic components, the electronic device comprises a plurality of heat dissipating modules arranged at intervals, and the fin sets of the heat dissipating modules are adjacently arranged And aligning the fins of the adjacent fin groups. The electronic device of claim 1, wherein the electronic module comprises a plurality of electronic components, the electronic device comprising a plurality of heat dissipation modules respectively contacting the electronic components, and two adjacent heat dissipation fins A heat dissipation channel for the flow of the airflow is defined together. The electronic device of claim 1, wherein the electronic device further comprises a heat exchanger in contact with the electronic component for circulating a fluid. The electronic device of claim 1, the housing further comprising at least one baffle disposed on the heat dissipation air duct for guiding the airflow.