KR102012450B1 - Thermoelectric module using air cooling - Google Patents

Abstract

The present invention relates to a thermoelectric cooling device and, more specifically, to a thermoelectric cooling device using air-cooled cooling, which cools a cooling target by using a thermoelectric module. According to the present invention, the device comprises: a pair of thermoelectric module units each including a first heat exchange portion and a second heat exchange portion which are coupled to a thermoelectric module, and spaced from each other so that the first heat exchange portion is positioned at the center; a pair of cooling flow path forming units provided corresponding to each thermoelectric module unit, and forming a cooling flow path by connecting a cooling suction port for sucking air and a cooling discharge port for discharging, to the outside, air sucked from the cooling suction port to be cooled while passing through the second heat exchange portion of each thermoelectric module unit; a heat dissipation flow path forming unit forming a heat dissipation flow path by connecting a heat dissipation suction port for sucking outside air and a heat dissipation discharge port for discharging, to the outside, air sucked from the heat dissipation suction port to cool the first heat exchange portions while passing through the first heat exchange portions of the pair of thermoelectric module units; a housing coupled with a structure, having the pair of thermoelectric module units and the pair of heat dissipation flow path forming units provided therein, and having the pair of cooling flow path forming units provided therein so that the cooling suction port and the cooling discharge port of the cooling flow path forming unit communicate with the inside of the structure; a cooling air flow forming unit provided on the cooling flow path to form an air flow from the cooling suction port to the cooling discharge port; and a heat dissipation air flow forming unit provided on the heat dissipation flow path to form an air flow from the heat dissipation suction port to the heat dissipation discharge port. The present invention has a simple structure, can be miniaturized, and can also greatly reduce manufacturing costs.

Description

Thermoelectric module using air cooling {Thermoelectric module using air cooling}

The present invention relates to a thermoelectric cooling device, and more particularly, to a thermoelectric cooling device using air-cooled cooling to cool a cooling object using a thermoelectric module.

A thermoelectric module is a thermoelectric cooling device or heating device that uses endothermic or heat generation by connecting a plurality of thermoelectric elements having a Peltier effect in which one end generates heat and the other end absorbs when direct current is applied to both ends. Refers to the module used.

The thermoelectric module is composed of a heat absorbing end portion or a heat generating portion that generates heat, and a heat dissipation member such as a heat dissipation fin or a heat dissipation block is coupled to the heat absorbing portion or the heat generating portion to increase heat transfer efficiency when used as a thermoelectric cooling device or a heating device.

However, the conventional thermoelectric cooling device or heating device has a problem that the heat exchange efficiency transferred from the thermoelectric module to the heat dissipation member coupled to the heat transfer block is inferior.

Moreover, the thermoelectric module as described above has a problem in that the efficiency of the thermoelectric module decreases as the time for continuous endothermic and heat dissipation is increased.

Therefore, as disclosed in Korean Patent Laid-Open Publication No. 10-2013-0085633, a heat exchanger is installed for optimizing air flow in the cooling unit and the heating unit. However, the heating and cooling unit in which the heat is transferred from the thermoelectric module to the heating unit is not optimized. Low heat transfer efficiency has a problem of low cooling efficiency.

In particular, the thermoelectric cooling device disclosed in Korean Patent Laid-Open Publication No. 10-2013-0085633 has a relatively large size in the case of an air-cooled heat dissipation structure in order to realize the required cooling capacity, and thus is inferior in practicality. There is a problem that the manufacturing cost is expensive.

An object of the present invention, in order to solve the above problems, by having a structure in which the heat dissipation side is radiated by air cooling in a relatively high temperature environment, the structure is simple, miniaturization and air-cooled cooling that can significantly reduce the manufacturing cost It is to provide a thermoelectric cooling device using.

The present invention has been created to achieve the object of the present invention as described above, the present invention, one or more thermoelectric module 110, the heat dissipation portion 111 and the heat absorbing portion 112 of the thermoelectric module 110. A pair of thermoelectric module portions 100, each of which is spaced apart from each other such that each of the first heat exchangers 120 and the second heat exchangers 130 is disposed at a center thereof. ); It is installed corresponding to each of the thermoelectric module unit 100, the cooling suction unit 210 to suck the outside air, and the second heat exchange unit of each thermoelectric module unit 100 after being sucked from the cooling suction unit 210 A pair of cooling flow path forming units 200 which connect the cooling discharge ports 220 for discharging the cooled air to the outside while passing through the 130 to form a cooling flow path CF; The first heat exchange part while passing through the heat dissipation suction part 310 for sucking outside air and the first heat exchange part 120 of the pair of thermoelectric module parts 100 after being sucked from the heat dissipation suction part 310. A heat dissipation flow path forming unit 300 which connects the heat dissipation discharge ports 320 for discharging air cooled to the outside to form a heat dissipation flow path RF; It is coupled to the structure (1) and the pair of thermoelectric module unit 100 and the heat dissipation flow path forming unit 300 is installed, the cooling suction portion 210 and the cooling outlet 220 of the cooling flow path forming unit 200 A housing 400 in which the pair of cooling flow path forming units 200 are installed such that the pair communicates with the inside of the structure; At least one cooling air flow forming unit (250) installed in the cooling passage (CF) to form an air flow from the cooling suction unit (210) to the cooling discharge port (220); Air cooling is characterized in that it comprises one or more heat dissipation air flow forming unit 350 is installed in the heat dissipation passage (RF) to form an air flow from the heat dissipation suction unit 310 to the heat dissipation outlet (320). Disclosed is a thermoelectric cooling device used.

The housing 400 may include a cooling suction unit 210 and a cooling suction unit 210 of the cooling channel forming unit 200 such that the cooling suction unit 210 and the cooling discharge port 220 of the cooling channel forming unit 200 are exposed to the outside. A first housing 410 having a suction opening 411 and a discharge opening 412 formed at a position corresponding to the cooling discharge opening 220; A second housing forming an inner space together with the first housing 410 such that the pair of thermoelectric module units 100, the cooling flow path forming unit 200, and the heat dissipation flow path forming unit 300 are installed therein. 420 may be included.

In the thermoelectric module 110 of the pair of thermoelectric module units 100, the heat dissipation channel forming unit 300 is positioned at the center, and the pair of cooling channel forming units 200 are the thermoelectric module unit 100. The internal space of the housing 400 may be partitioned and installed so as to be positioned at a position opposite to the heat dissipation flow path forming unit 300 based on the thermoelectric module 110.

The first heat exchanger 120 includes a heat dissipation plate 121 coupled to the heat dissipation unit 111 of the thermoelectric module 110, and a plurality of heat pipes 122 coupled to the heat dissipation plate 121. It may include a heat radiation fin member 123 is inserted in the longitudinal direction of the heat pipe 122 to maximize the heat dissipation effect.

The cooling flow path forming unit 200 includes a main flow path part 231 extending along the arrangement direction of the second heat exchange part 130 of the thermoelectric module part 100, and an upstream side of the main flow path part 231. An upstream side flow path part 232 coupled to the upstream side flow path part 232 and a downstream side flow path part 233 coupled to a downstream side of the main flow path part 231 and having the cooling discharge port 220 formed therein; It may include.

The present invention is also one or more thermoelectric module 110, the first heat exchanger 120 and the second heat exchanger 130 coupled to the heat dissipation portion 111 and the heat absorbing portion 112 of the thermoelectric module 110, respectively. And a pair of thermoelectric module parts 100 disposed at intervals from each other such that each second heat exchange part 130 is positioned at the center thereof; Installed in correspondence with the second heat exchanger 130 of the pair of thermoelectric module unit 100 disposed in the center, and the cooling suction unit 210 for sucking the outside air, and from the cooling suction unit 210 After being sucked through the second heat exchange unit 130 of the pair of thermoelectric module unit 100 while connecting the cooling outlet 220 for discharging the cooled air to the outside to form a cooling flow path (CF) Forming unit 200; It is installed to correspond to the first heat exchange unit 120 of each of the thermoelectric module unit 100, the heat absorbing suction unit 310 to suck the outside air, and the suction after the heat absorbing suction unit 310 and each of the thermoelectric module A pair of heat dissipation outlets 320 for discharging air cooled through the first heat exchangers 120 to the outside while passing through the first heat exchangers 120 of the part 100 to form a heat dissipation flow path RF. A heat dissipation flow path forming unit 300; It is coupled to the structure (1) and the pair of thermoelectric module unit 100 and the heat dissipation flow path forming unit 300 is installed, the cooling suction portion 210 and the cooling outlet 220 of the cooling flow path forming unit 200 A housing 400 in which the cooling flow path forming unit 200 is installed to communicate with the inside of the structure; At least one cooling air flow forming unit (250) installed in the cooling passage (CF) to form an air flow from the cooling suction unit (210) to the cooling discharge port (220); Air cooling is characterized in that it comprises one or more heat dissipation air flow forming unit 350 is installed in the heat dissipation passage (RF) to form an air flow from the heat dissipation suction unit 310 to the heat dissipation outlet (320). Disclosed is a thermoelectric cooling device used.

The housing 400 may include a cooling suction unit 210 and a cooling suction unit 210 of the cooling channel forming unit 200 such that the cooling suction unit 210 and the cooling discharge port 220 of the cooling channel forming unit 200 are exposed to the outside. A first housing 410 having a suction opening 411 and a discharge opening 412 formed at a position corresponding to the cooling discharge opening 220; A second housing forming an inner space together with the first housing 410 such that the pair of thermoelectric module units 100, the cooling flow path forming unit 200, and the heat dissipation flow path forming unit 300 are installed therein. 420 may be included.

In the thermoelectric module 110 of the pair of thermoelectric module units 100, the cooling flow path forming unit 200 is positioned at the center, and the pair of heat dissipation flow path forming unit 300 is the thermoelectric module unit 100. The internal space of the housing 400 may be partitioned and installed so as to be positioned at a position opposite to the cooling flow path forming unit 200 based on the thermoelectric module 110.

The first heat exchanger 120 includes a heat dissipation plate 121 coupled to the heat dissipation unit 111 of the thermoelectric module 110, and a plurality of heat pipes 122 coupled to the heat dissipation plate 121. It may include a heat radiation fin member 123 is inserted in the longitudinal direction of the heat pipe 122 to maximize the heat dissipation effect.

The cooling flow path forming unit 200 includes a main flow path part 231 extending along the arrangement direction of the second heat exchange part 130 of the thermoelectric module part 100, and an upstream side of the main flow path part 231. An upstream side flow path part 232 coupled to the upstream side flow path part 232 and a downstream side flow path part 233 coupled to a downstream side of the main flow path part 231 and having the cooling discharge port 220 formed therein; It may include.

In the thermoelectric cooling apparatus using air-cooled cooling according to the present invention, by installing a pair of thermoelectric modules at intervals and placing the heat dissipation portion or the heat absorption portion between them, the size of the apparatus is minimized while the heat dissipation side is relatively high temperature environment. By having a structure that radiates heat by air-cooling, the structure is simple and can be miniaturized, there is an advantage that can significantly reduce the manufacturing cost.

The thermoelectric cooling apparatus using air-cooled cooling according to the present invention includes a flat portion having a flat surface on a heat pipe coupled to a heat radiating plate of the thermoelectric module, thereby making the thickness of the thermoelectric module remarkably thin by reducing the thickness of the heat radiating plate constituting the heat radiating portion. The advantage is that the module can be compactly constructed.

1 is a perspective view showing a thermoelectric cooling apparatus using air-cooled cooling according to a first embodiment of the present invention.
FIG. 2 is a perspective view of the rear side as the thermoelectric cooling device of FIG. 1.
3 is an exploded perspective view of the thermoelectric cooling device of FIG.
4 is an exploded perspective view of the rear side of the thermoelectric cooling device of FIG.
FIG. 5 is a rear view of the state in which the housing is removed from the thermoelectric cooling device of FIG. 1.
FIG. 6 is a rear view of the flow path forming plate in FIG. 5.
FIG. 7 is a front view of a state in which the housing of the thermoelectric cooling device of FIG. 1 is removed.
FIG. 8 is a front view of a state in which the flow path forming plate is removed in FIG. 7.
FIG. 9 is a sectional view taken along the line VII-VII in FIG. 6.
FIG. 10 is a perspective view illustrating an example of a thermoelectric module unit of the thermoelectric cooling device of FIG. 1.
FIG. 11 is a perspective view of the thermoelectric module of FIG. 10 seen from the rear side. FIG.
12 is a perspective view illustrating a flow path forming housing of the thermoelectric module unit of FIG. 10.
FIG. 13 is a perspective view illustrating a state in which the flow path forming housing of FIG. 12 is removed from the thermoelectric module unit of FIG. 10.
14 is a cross-sectional view taken along the line XIV-XIV in FIG. 6.
FIG. 15 is a perspective view illustrating a portion of the thermoelectric module unit of FIG. 10.
FIG. 16 is a cross-sectional view seen from the CC direction in FIG. 15.
FIG. 17 is a perspective view illustrating a heat exchange member constituting a second heat exchanger unit coupled to an endothermic unit of the thermoelectric module unit of FIG. 10.
18 is a conceptual diagram illustrating an installation example of a thermoelectric cooling device according to the present invention.
19 is a front view showing the arrangement of the first heat exchange part and the second heat exchange part of the thermoelectric cooling device according to the second embodiment of the present invention.
20 is a perspective view illustrating an arrangement of the first heat exchanger and the second heat exchanger illustrated in FIG. 19.
21A to 21D are side views illustrating arrangement examples of a first heat exchanger positioned between a pair of thermoelectric modules in the thermoelectric cooling apparatus illustrated in FIG. 19.
22A is a front view illustrating a configuration in which the condensate handling unit is added as the thermoelectric cooling device illustrated in FIGS. 1 to 18.
22B is a front view of the thermoelectric cooling apparatus illustrated in FIGS. 19 and 20, in which a condensate handling unit is added.
23A is a cross-sectional view showing an example of the condensate handling unit in FIGS. 22A and 22B.
FIG. 23B is a perspective view illustrating the condensate handling unit illustrated in FIG. 23A. FIG.
FIG. 23C is a cross-sectional view of the CC direction in FIG. 23A.

Hereinafter, a thermoelectric cooling apparatus using air-cooled cooling according to the present invention will be described with reference to the accompanying drawings.

In the thermoelectric cooling apparatus using air-cooled cooling according to the present invention, as shown in Figures 1 to 17, a pair of thermoelectric module unit 100, a pair of cooling flow path forming unit 200, and a heat radiation flow path A forming unit 300, a housing 400, and a cooling air flow forming unit 250; It includes a heat radiation air flow forming unit (350).

6, 8 and 9, the thermoelectric module unit 100 is installed in a pair, one or more thermoelectric module 110, the heat dissipation unit 111 and the thermoelectric module 110 and Various configurations are possible, including a first heat exchanger 120 and a second heat exchanger 130 respectively coupled to the heat absorbing part 112.

The thermoelectric module 110 is, for example, connected to a pair of substrates, a plurality of thermoelectric elements (not shown) installed between the pair of substrates, and a thermoelectric element (not shown) to supply power. It may include a power applying unit (not shown).

In this case, a variety of materials such as metal and ceramic may be used for the substrate, but a ceramic material is preferably used in consideration of thermal expansion.

Here, the pair of substrates function as a heat dissipation unit and one as a heat absorbing unit according to the arrangement of the thermoelectric elements.

In addition, the thermoelectric module 110 is preferably installed in plural in consideration of cooling or heating capacity, such as two or four for the convenience of manufacturing, in order to prevent the parts other than the power supply unit from being exposed to the outside, Each of the openings formed in the insulation member such as styrofoam may be inserted into and installed.

The first heat exchanger 120 and the second heat exchanger 130 are coupled to each of the heat dissipation unit 111 and the heat absorbing unit 112 of the thermoelectric module 110.

The first heat exchanger 120 and the second heat exchanger 130 are coupled to the heat dissipation unit 111 and the heat absorbing unit 112 of the thermoelectric module 110, respectively, so that the heat dissipation effect and heat absorption unit of the heat dissipation unit 111 are performed. Various configurations are possible according to the heat exchange method as a configuration for maximizing the endothermic effect of (112).

At this time, the first heat exchange unit 120, the heat exchange using the flow of air or heat exchange using the flow of a refrigerant such as water, the second heat exchange unit 130, heat exchange or water using the flow of air. Heat exchange using a flow of refrigerant, such as can be made.

In particular, the first heat exchanger 120 and the second heat exchanger 130 may have various structures according to a heat exchange method.

The first heat exchanger 120 may be coupled to the heat dissipation unit 111 of the thermoelectric module 110 to radiate heat from the heat dissipation unit 111.

Specifically, the first heat exchange unit 120 has a variety of configurations according to the heat exchange method, the structure shown in Figure 2 of Patent No. 10-1185567, preferably the view of Korea Patent Publication No. 10-2009-0120437 It may have a structure shown in 4.

In particular, the first heat exchange unit 120, as shown in Figures 6 and 8, 15 and 16, the heat dissipation plate 121 coupled to the heat dissipation unit 111 of the thermoelectric module 110, and heat dissipation A plurality of heat pipes 122 coupled to the plate 121, and the heat radiation fin member 123 is inserted in the longitudinal direction of the heat pipe 122 to maximize the heat dissipation effect.

The heat dissipation plate 121 may include a plurality of insertion grooves 121a in which each of the plurality of heat pipes 122 is inserted into one surface of the upper and lower surfaces in close contact with the thermoelectric module 110.

The insertion groove 121a is formed on one surface of the upper surface and the lower surface of the heat dissipation plate 121 to be in close contact with the thermoelectric module 110 so that each of the plurality of heat pipes 122 may be inserted by various methods. Can be.

In particular, the insertion groove 121a, the heat pipe 122 is in direct contact with the heat dissipating portion of the thermoelectric module 110, so as to efficiently perform heat exchange with the heat dissipating portion of the thermoelectric module 110, the thermoelectric module 110 It is preferably formed on the surface in close contact with the heat radiating portion of the.

As described above, the heat pipe 122 is coupled to one surface in close contact with the thermoelectric module 110 so that the heat pipe 122 is in direct contact with the heat dissipation part of the thermoelectric module 110 and the heat dissipation part of the thermoelectric module 110. By efficiently performing the heat exchange of the thermoelectric cooling apparatus according to the present invention can greatly improve the cooling efficiency.

The plurality of heat pipes 122 may be used as long as the heat pipes are connected to the heat dissipation plate 121 at one end thereof and disposed in parallel with each other.

Here, the heat pipe 122 may have a rod shape having a long length as a commodity, and may have various shapes such as a straight line, a curved line, preferably a '-' shape according to the structure of the first heat exchanger 120. .

On the other hand, the heat pipe 122, it is preferable that the flat portion 122b is formed to form one surface with one surface of the heat dissipation plate 121 in the inserted state (121a).

The planar portion 122b is formed as a part of the heat pipe 122 having a circular or polygonal cross section, so that one surface of the heat dissipation plate 121 is inserted in the state where the heat pipe 122 is inserted into the insertion groove 121a. As a result, the contact area of the heat dissipation plate 121 and the heat dissipation unit of the thermoelectric module 110 may be increased to greatly improve the cooling efficiency of the thermoelectric cooling apparatus according to the present invention.

In particular, the heat pipe 122 is effectively coupled to one surface of the heat pipe 122 that is in close contact with the thermoelectric module 110 by the planar portion 122b so that the heat pipe 122 is in direct contact with the heat dissipation part of the thermoelectric module 110 and the thermoelectric module 110. Efficient heat exchange with the heat dissipation portion of the) can greatly improve the cooling efficiency of the thermoelectric cooling device according to the present invention.

That is, when the heat pipe 122 is coupled to one surface of the heat dissipation plate 121 in close contact with the heat dissipation unit of the thermoelectric module 110, the heat dissipation plate 121 and the thermoelectric module 110 are formed by the cylindrical heat pipe 122. ), The contact area between the heat dissipating parts is reduced, and the heat pipe 122 is effectively coupled to one surface of the heat pipe 122 that is in close contact with the thermoelectric module 110 by the planar part 122b. In direct contact with the heat dissipation unit, heat exchange with the heat dissipation unit of the thermoelectric module 110 may be efficiently performed.

On the other hand, the planar portion 122b is formed by deforming to form one surface together with one surface of the heat dissipation plate 121 in a state where the heat pipe 122 is inserted into the insertion groove 121a, or the heat pipe 122 is It may be formed in a portion of the heat pipe 122 by various methods such as being formed in advance before being inserted into the insertion groove (121a).

In addition, by providing the heat pipe 122 with the flat portion 122b, the thickness of the heat dissipation plate 121 to which the heat pipe 122 is coupled is reduced to significantly reduce the thickness of the thermoelectric module 110, thereby making the module compact. can do.

The plurality of heat pipes 122 may further protrude outward from an edge of the heat dissipation plate 121 based on the length direction of the plurality of heat pipes 122.

At this time, the heat dissipation fin members 123 to be described later are preferably coupled at a portion further protruding outward from an edge of the heat dissipation plate 121 of the plurality of heat pipes 122.

In a more specific embodiment, the heat dissipation fin members 123 may be installed to protrude outward in pairs from side edges facing each other with respect to the heat dissipation plate 121 having a rectangular planar shape.

The lengthwise direction of the heat dissipation fin members 123 may be arranged in a direction parallel to the top and bottom surfaces of the heat dissipation plate 121.

The plurality of heat dissipation fin members 123 are sequentially inserted into the plurality of heat pipes 122 to perform heat exchange by air flow along the first air flow path P1 together with the plurality of heat pipes 122. Various configurations are possible.

For example, the plurality of heat dissipation fin members 123 may be stacked in parallel with each other by being perpendicular to the longitudinal direction of the heat pipe 122.

Meanwhile, as illustrated in FIGS. 6 and 8, the first heat exchanger 120 having the above configuration includes the heat pipe 122 of the first heat exchanger 120 of the thermoelectric module unit 100 facing each other. And the heat dissipation fin member 123 is preferably installed at intervals so that the heat dissipation assembly is alternately positioned as one heat dissipation assembly.

The second heat exchanger 130 may be coupled to the heat absorbing part 112 of the thermoelectric module 110 to absorb heat in the air by air flow and may have various configurations.

Specifically, the second heat exchanger 130 has a structure similar to that of the first heat exchanger according to a heat exchange method, and the structure shown in FIG. 2 of Korean Patent No. 10-1185567, preferably Korean Patent Publication No. 10-1185567. It may have a structure shown in Figure 4 of the 10-2009-0120437.

In particular, the second heat exchanger 130, as shown in Figures 6 and 9, 5 and 17, the heat dissipation plate 131 coupled to the heat absorbing portion 112 of the thermoelectric module 110, and the heat dissipation Coupled to the plate 131 may include a heat exchange member 133 to maximize the heat dissipation effect.

The heat exchange member 133 protrudes in one direction on the main plate 133b and the upper and lower ends of the main body plate 133b such that a cross section perpendicular to the upper surface of the heat radiating plate 131 forms a 'c' shape. The upper portion 133a and the lower portion 133c may be included.

On the other hand, at least one of the upper end portion 133a and the lower end portion 133c, it is preferable that the coupling portion 133d for coupling with the adjacent heat radiating fin member 133 is formed.

The coupling part 133d is formed on at least one of the upper end part 133a and the lower end part 133c and is configured to couple with the adjacent heat dissipation fin member 133. Various configurations are possible according to the coupling structure.

For example, the coupling part 133d may have an annular shape so as to be further protruded from at least one of the upper end 133a and the lower end 133c to be caught by the protrusion 133e formed in the adjacent heat dissipation fin member 133. .

The heat exchange member having a configuration as described above, that is, the heat radiation fin member 133 may be simply fitted by pressing against the adjacent heat exchange member 133 by the structure of the coupling portion 133 d after being formed by press working or the like.

By assembling a plurality of heat exchange members 133 sequentially by the simple assembly operation as described above, the assembly is easy, and heat exchange with air and coupling with the first heat exchange plate 311 are easy.

Meanwhile, the thermoelectric module unit 100 includes the thermoelectric module 110, the first heat exchanger 120, and the second heat exchanger 130 as one module so that each first heat exchanger 120 is positioned at the center. It is characterized by being spaced apart from each other.

In particular, the first heat exchanger 120 performing the heat dissipation function may overlap each other to minimize the thermoelectric cooling device.

Specifically, the thermoelectric module unit 100 is installed so that the first heat exchange unit 120 is located at the center in a pair, and as shown in FIGS. 6 and 8, the heat dissipation fin members 123 are coupled to each other. The heat pipes 122 of the thermoelectric module unit 100 facing the heat pipes 122 may be alternately arranged.

That is, the thermoelectric module unit 100 is installed so that the heat dissipation unit 111 of the pair of thermoelectric modules 110 face each other in parallel with each other, and the heat absorbing unit 112 is preferably located on a different surface.

More specifically, the thermoelectric module 110 of the pair of thermoelectric module unit 100, the heat dissipation flow path forming unit 300 to be described later is located in the center and the pair of cooling flow path forming unit 200 to be described later thermoelectric The internal space of the housing 400 may be partitioned so as to be positioned at a position opposite to the heat dissipation flow path forming unit 300 based on the thermoelectric module 110 of the module unit 100.

The heat dissipation flow path forming unit 300 includes a heat dissipation suction unit 310 for sucking outside air, and a first heat exchange unit 120 of the pair of thermoelectric module units 100 after being sucked from the heat dissipation suction unit 310. By connecting the heat dissipation outlet 320 for discharging the air cooled by the first heat exchanger 120 to the outside while forming a heat dissipation flow path (RF) is possible in various configurations.

In particular, the heat dissipation flow path forming unit 300 may have any structure as long as it forms a heat dissipation flow path RF passing through the first heat exchange parts 120 of the pair of thermoelectric module parts 100.

As shown in FIG. 18, the thermoelectric cooling apparatus according to the present invention is generally used to inhale internal air and inject after cooling by being coupled to an outer wall of the structure 1 having an internal space IS requiring cooling. to be.

The positions of the cooling suction unit 210 and the cooling discharge port 220 of the cooling flow path forming unit 200 to be described later are limited, but the heat dissipation suction unit 310 and the heat dissipation discharge port 320 that suck outside air are It may be formed in various structures and positions, such as formed in the housing 400.

However, the heat dissipation flow path forming unit 300 is preferably formed by the thermoelectric module parts 100 to form a flow path passing through the first heat exchange parts 120 of the pair of thermoelectric module parts 100. It is preferable to include the flow path forming plates (331, 332) installed on the upper and lower sides in the central space.

At this time, the heat dissipation fin members 123 are parallel to the air flow of the heat dissipation flow path RF so that air flows between the heat dissipation fin members 123 constituting the first heat exchangers 120 of the pair of thermoelectric module portions 100. It is preferred to be arranged and stacked.

On the other hand, the heat dissipation flow path forming unit 300, the heat dissipation suction unit 310 and the heat dissipation outlet 320 may be formed in various structures,

For example, the heat dissipation suction unit 310 and the heat dissipation discharge port 320 may be formed as a slot structure in the housing 400 or may be coupled to an opening formed in the housing 400, and a plurality of through holes may be formed to allow air flow. It may be formed by a variety of ways such as a cover member.

One or more heat dissipation air flow forming unit 350 is installed in the heat dissipation passage (RF) to form an air flow from the heat dissipation suction unit 310 to the heat dissipation outlet 320. Do.

For example, the heat dissipation air flow forming unit 350 may be installed at an upstream side of the heat dissipation flow path forming unit 300 and flow through the heat dissipation flow path RF in the housing 400. It can be configured to discharge through).

The heat dissipation air flow forming unit 350 may be configured as a centrifugal fan such as a turbo fan that sucks the axial direction based on the rotation axis of the fan and discharges it laterally. However, various fans may be used, such as centrifugal fans, quadruple fans, outlet fans, and crossflow fans, depending on the airflow structure.

The cooling flow path forming unit 200 is installed to correspond to each thermoelectric module unit 100, and the cooling suction unit 210 for sucking outside air and the thermoelectric module unit after being sucked from the cooling suction unit 210. Connecting to the cooling discharge port 220 for discharging the cooled air to the outside while passing through the second heat exchange unit 130 of 100 to form a cooling flow path (CF) can be various configurations.

That is, the cooling flow path forming unit 200, the air sucked from the cooling suction unit 210 passes through the second heat exchange unit 130 of the thermoelectric module unit 100 and discharged to the cooling discharge port 220. Any structure can be used as long as it is a structure to be formed.

On the other hand, the thermoelectric cooling device according to the present invention, as shown in Figure 18, is coupled to the outer wall of the structure (1) having an internal space (IS) that requires cooling is used to suck the internal air and inject again after cooling It is common.

The housing 400 to be described later, the suction opening 411 corresponding to the cooling suction unit 210 and the discharge opening corresponding to the cooling discharge port 220 on the coupling plate 413 coupled to the outer wall of the structure 1. 412 may be formed.

The cooling flow path forming unit 200 may be formed such that the cooling suction unit 210 and the cooling discharge port 220 correspond to the suction opening 411 and the discharge opening 412 of the housing 400.

Specifically, the cooling flow path forming unit 200, as shown in Figures 3 and 4, the main flow path of the square pillar formed along the direction of the arrangement of the second heat exchange unit 130 of the thermoelectric module unit 100 The upstream side passage portion 232 coupled to the upstream side of the main passage portion 231 and the cooling suction portion 210 and the downstream side of the main flow passage portion 231 and the cooling outlet ( 220 may include a downstream side flow path portion 233 is formed.

The main flow path part 231 is formed along the arrangement direction of the second heat exchange part 130 of the thermoelectric module part 100, has a rectangular pillar shape, and opens the upper and lower ends thereof and has a thermoelectric module part 100 therein. As the configuration in which the second heat exchanger 130 is located, various configurations are possible.

Here, at least one installation opening 231a for installation of the second heat exchanger 130 of the thermoelectric module 100 may be located at a side thereof so that the second heat exchanger 130 of the thermoelectric module 100 may be located inside. ) May be formed.

Meanwhile, the cooling flow path forming unit 200 may have an aerodynamic structure in consideration of a smooth air flow in forming the cooling flow path CF passing through the second heat exchange unit 130 of the thermoelectric module unit 100.

On the other hand, the thermoelectric cooling device according to the present invention, as shown in Figure 18, is coupled to the outer wall of the structure (1) having an internal space (IS) that requires cooling is used to suck the internal air and inject again after cooling In general, it can be combined in a variety of ways.

For example, the structure 1 is in communication with the internal space IS so as to suck the air in the internal space IS at a position corresponding to the cooling suction part 210 of the cooling flow path forming unit 200. The suction opening 1a is formed, and is sucked through the cooling suction unit 210 and then passed through the second heat exchange unit 130 to the cooling discharge port 220 so that the cooled air can be discharged to the internal space IS. The discharge opening 1b may be formed at a corresponding position.

In addition, the structure 1 may be formed with a through hole so that both the cooling suction part 210 and the cooling discharge port 220 may be exposed to the internal space IS.

In this case, the housing 400 has a structure such that the cooling suction part 210 and the cooling discharge port 220 may be partially inserted into the internal space IS of the structure 1 through the through hole. Can be coupled to the structure 1 in a manner.

The cooling air flow forming unit 250 is installed in one or more, is installed in the cooling flow path (CF) to form an air flow from the cooling suction portion 210 to the cooling outlet 220, various configurations are possible Do.

For example, the cooling air flow forming unit 250 may be configured as a centrifugal fan that discharges in a direction perpendicular to the suction direction installed in the cooling suction unit 210 such as a turbo fan. According to the airflow structure, a variety of fans, such as centrifugal fan, quadruple fan, outlet fan, and crossflow fan, may be used.

The housing 400 is coupled to the structure 1, a pair of thermoelectric module unit 100 and the heat dissipation flow path forming unit 300 is installed, the cooling suction unit 210 and the cooling flow path forming unit 200 and As a configuration in which a pair of cooling flow path forming units 200 are installed so that the cooling outlet 220 communicates with the inside of the structure, various configurations are possible.

For example, the housing 400, but preferably has a rectangular parallelepiped shape for the convenience of installation and loading, but is not necessarily limited thereto.

In addition, the housing 400 may be configured as a plate member having a plurality of openings, or a plate member forming a surface and a plurality of frame members coupled thereto.

On the other hand, the housing 400, as an example, the cooling suction portion 210 of the cooling flow path forming unit 200, so that the cooling suction portion 210 and the cooling outlet 220 of the cooling flow path forming unit 200 is exposed to the outside. And a first housing 410 having a suction opening 411 and a discharge opening 412 formed at a position corresponding to the cooling discharge opening 220; The second housing 420 forming an inner space together with the first housing 410 so that the pair of thermoelectric module unit 100, the cooling flow path forming unit 200, and the heat dissipation flow path forming unit 300 are installed therein. It may include.

The first housing 410, the cooling suction portion 210 of the cooling flow path forming unit 200 and the cooling suction portion 210 and the cooling discharge port 220 of the cooling flow path forming unit 200 is exposed to the outside. The inlet opening 411 and the outlet opening 412 is formed in a position corresponding to the cooling outlet 220, various configurations are possible.

For example, the first housing 410 may include a coupling plate 413 having the suction opening 411 and the discharge opening 412, and a second housing 420 protruding from the side of the coupling plate 413 to be described later. It may include a coupling frame 415 is coupled to.

The coupling plate 413 is a plate on which the suction opening 411 and the discharge opening 412 are formed and may have a flat structure for coupling with the structure 1 described above, and according to the coupling structure with the structure 1. Various configurations are possible.

The coupling frame 415 is protruded from the side of the coupling plate 413 is integrally formed by a sheet metal or the like coupled to the second housing 420 to be described later, or may be configured in various ways, such as a separate member is combined. Do.

The second housing 420 includes an inner space together with the first housing 410 such that the pair of thermoelectric module unit 100, the cooling flow path forming unit 200, and the heat dissipation flow path forming unit 300 are installed therein. Various configurations are possible as a structure to form.

For example, the second housing 420 may be coupled to the first housing 410 to install a pair of thermoelectric module unit 100, a cooling flow path forming unit 200, and a heat dissipation flow path forming unit 300. As a configuration for forming a space, it may be composed of plate members that form the front and side surfaces of the thermoelectric cooling apparatus according to the present invention.

On the other hand, the second housing 420, a suction through-hole 431 for suctioning the outside air through the heat dissipation suction unit 310 and the discharge pipe through which the air discharged from the heat dissipation discharge port 320 can be discharged to the outside A vent 432 may be formed.

The suction through hole 431 may be formed on at least one surface of the front side and the side surface of the thermoelectric cooling device as a through hole formed for suction of external air through the heat dissipation suction unit 310.

On the other hand, the thermoelectric cooling device according to the present invention, although not described, the sensor for powering and controlling the thermoelectric module 110, the driving and control of the heat dissipation flow forming unit 350 and the cooling air flow forming unit 250, etc. , Power supply devices, control devices, and the like.

The housing 400 may be installed to expose a control panel for the user's operation and control to the outside.

Meanwhile, the thermoelectric cooling apparatus according to the present invention minimizes the structure of the apparatus by optimizing the arrangement of the thermoelectric module unit 100 in the housing 400 and simplifies the structure of the outer structure to increase the cooling performance and increase the manufacturing cost. Significant savings are possible.

Accordingly, unlike the configuration of the first embodiment in which the heat dissipation portions 111 of the pair of thermoelectric modules 110 face each other, as a second embodiment of the present invention, as shown in FIG. 19, a pair of thermoelectric modules The heat absorbing portion 112 of the 110 may be installed to face each other.

That is, in the thermoelectric cooling apparatus according to the present invention, as shown in FIGS. 19 and 21A to 21D, one or more thermoelectric modules 110, the heat dissipating portion 111 and the heat absorbing portion 112 of the thermoelectric module 110 are provided. And a pair of thermoelectric module units each having a first heat exchanger 120 and a second heat exchanger 130 coupled to each other, and spaced apart from each other such that each second heat exchanger 130 is positioned at the center thereof. 100); Installed in correspondence with the second heat exchangers 130 of the pair of thermoelectric module units 100 disposed in the center, the cooling suction unit 210 for sucking the outside air, and the suction suction from the cooling suction unit 210 After passing through the second heat exchange unit 130 of the pair of thermoelectric module unit 100 is connected to the cooling discharge port 220 for discharging the cooled air to the outside to form a cooling flow path (CF) ( 200); It is installed to correspond to the first heat exchange unit 120 of each thermoelectric module unit 100, and the heat absorbing suction unit 310, which sucks outside air, and is sucked from the heat radiation suction unit 310, and then each thermoelectric module unit 100 A pair of heat dissipation flow paths forming a heat dissipation flow path (RF) by connecting a heat dissipation outlet 320 for discharging air cooled through the first heat exchange parts 120 to the outside while passing through the first heat exchange parts 120 of Section 300; Coupled with the structure (1) and a pair of thermoelectric module unit 100 and the heat dissipation flow path forming unit 300 is installed, the cooling suction portion 210 and the cooling outlet 220 of the cooling flow path forming unit 200 is a structure A housing 400 in which the cooling flow path forming unit 200 is installed to communicate with the inside; At least one cooling air flow forming unit 250 installed in the cooling passage CF to form an air flow from the cooling suction unit 210 to the cooling discharge port 220; One or more heat dissipation air flow forming units 350 may be installed in the heat dissipation passage RF to form an air flow from the heat dissipation suction unit 310 to the heat dissipation outlet 320.

The thermoelectric cooling device according to the second embodiment of the present invention as described above, in contrast to the configuration of the thermoelectric cooling device according to the first embodiment shown in Figures 1 to 18, the position of the first heat exchanger and the second heat exchanger Except for the positions and structures of the cooling flow path forming unit 200 and the heat dissipating flow path forming unit 300 forming the cooling flow path CF passing through the second heat exchange unit, the detailed description is omitted.

In detail, the housing 400 includes the cooling suction unit 210 of the cooling flow path forming unit 200 such that the cooling suction unit 210 and the cooling discharge port 220 of the cooling flow path forming unit 200 are exposed to the outside. And a first housing 410 having a suction opening 411 and a discharge opening 412 formed at a position corresponding to the cooling discharge opening 220; The second housing 420 forming an inner space together with the first housing 410 so that the pair of thermoelectric module unit 100, the cooling flow path forming unit 200, and the heat dissipation flow path forming unit 300 are installed therein. It may include.

In the thermoelectric module 110 of the pair of thermoelectric module units 100, the cooling flow path forming unit 200 is positioned at the center, and the pair of heat dissipation flow path forming units 300 are thermoelectrics of the thermoelectric module unit 100. The internal space of the housing 400 may be partitioned and installed so as to be positioned at a position opposite to the cooling flow path forming unit 200 based on the module 110.

The first heat exchange part 120 includes a heat dissipation plate 121 coupled to the heat dissipation unit 111 of the thermoelectric module 110, a plurality of heat pipes 122 coupled to the heat dissipation plate 121, and Inserted in the longitudinal direction of the heat pipe 122 may include a heat radiation fin member 123 to maximize the heat radiation effect.

The cooling flow path forming unit 200 is coupled to an upstream side of the main flow path part 231 and the main flow path part 231 which are formed long along the arrangement direction of the second heat exchange part 130 of the thermoelectric module part 100. And an upstream side flow path part 232 having a cooling suction part 210 and a downstream side flow path part 233 coupled to a downstream side of the main flow path part 231 and having a cooling outlet 220 formed therein.

Meanwhile, the second heat exchange part 130 may be configured in various ways according to the arrangement of the heat exchange members 133 as illustrated in FIGS. 21A to 21C.

For example, as illustrated in FIG. 21A, the second heat exchange part 130 may be configured such that the ends of the heat exchange members 133 face each other.

As another example, as illustrated in FIG. 21B, the second heat exchange part 130 may be coupled to the heat dissipation plate 131 of the second heat exchange part 130 opposite to both ends of the heat exchange members 133. have.

As another example, as illustrated in FIG. 21C, the second heat exchange part 130 may be disposed by alternately overlapping the heat exchange members 133 up and down.

As another example, as illustrated in FIG. 21C, the second heat exchange part 130 alternately moves up and down with the heat exchange member group in which the plurality of heat exchange members 133 are opposed to one heat exchange member group. It can be arranged as.

On the other hand, the present invention having the configuration as described above, the air intake and cooling has been described mainly with the same configuration, the operation of the thermoelectric module unit 100 can be reversed if necessary to perform a heating function rather than a cooling function. Of course.

On the other hand, during the heat exchange of the second heat exchange part of the thermoelectric cooling device according to the present invention having the above configuration, condensed water may be generated in the second heat exchange part, and the generated condensed water flows downward to damage electrical components. There is a problem that causes problems.

Accordingly, the thermoelectric cooling apparatus according to the present invention includes a condensate handling unit 900 having a configuration similar to the condensate storage unit and the condensate removing unit described in Korean Patent Application Publication No. 10-2016-0078824, which is one of the applicants' inventions. It may further comprise.

The condensate handling unit 900 stores condensate generated in the second heat exchange unit during heat exchange of the second heat exchange unit of the thermoelectric cooling device according to the present invention, and stores the condensate using ultrasonic waves to store the condensate. And various configurations are possible depending on the removal.

For example, the condensate handling unit 900 may include a condensate storage unit 910 for storing condensate generated in the second heat exchange unit during heat exchange of the second heat exchange unit, and ultrasonic condensate stored in the condensate storage unit 910. By the small water particles, that is, the mist forming unit for forming the mist and the air flow for discharging the mist formed by the ultrasonic unit 920 to the outside of the condensate storage unit 910 ( 930).

The condensate storage unit 910 is configured to store the condensate generated in the second heat exchange unit during heat exchange of the second heat exchange unit, and various configurations are possible.

For example, the condensate storage unit 910 is located in a lower position than the second heat exchanger in consideration of the flow of condensate from the second heat exchanger in place in the housing 400, and in an installation position in the housing 400. Thus, shapes and structures may have various shapes.

For example, the overall shape of the condensate storage unit 910, the overall shape is preferably having a shape by a combination of one or more rectangles, considering the condensate is stored in the storage housing having a bowl structure and the upper side is opened 911 And a cover member 912 for covering the opening of the storage housing 911.

Meanwhile, the condensate storage unit 910 has a structure for receiving condensate generated from the second heat exchanger, one or more discharge openings 913 and discharge openings through which mist generated in the storage housing 911 is discharged to the outside. Air for the discharge of the mist through the 913 is to be provided with a mist discharge structure including one or more inlet openings 914 introduced from the outside by the mist flow forming unit 930.

Thus, the storage housing 911, the air for mist discharge through the one or more discharge opening 913 and the discharge opening 913 through which the mist generated inside the storage housing 911 is discharged to form a mist flow One or more inlet openings 914 introduced from the outside by the unit 930 may be formed on the sidewalls.

The discharge opening 913 is formed at a side wall of the storage housing 911 and is an opening through which mist generated in the storage housing 911 is discharged to the outside, and is sufficiently higher than the level of condensate stored in the storage housing 911. It is preferably formed in position.

On the other hand, the outer surface of the side wall of the storage housing 911 in which the discharge opening 913 is formed, a flow guide portion 941 for guiding the flow of the mist may be installed.

The flow guide portion 941 is configured to be installed on the outer surface of the side wall of the storage housing 911 in which the discharge opening 913 is formed in order to guide the flow of the mist, and various configurations are possible.

As an example, the flow guide portion 941 may be configured as a guide member extending upward from the outer surface of the side wall of the storage housing 911 as the mist is preferably flowed to the upper side of the storage housing 911.

The inlet opening 914 is formed on the side wall of the storage housing 911, the air for the discharge of the mist through the discharge opening 913 is an opening that is introduced from the outside by the mist flow forming unit 930, the storage housing 911 is preferably formed at a position sufficiently higher than the water level of the condensate stored therein.

On the other hand, the air through the inlet opening 914 so as not to interfere with the operation of the ultrasonic unit 920, such as the water column 901 generated by the ultrasonic unit 920 to be described later when the air inlet through the inlet opening 914 to the upper side An air guide part 942 may be installed on the inner surface of the side wall of the storage housing 911.

The air guide portion 942 is installed on the inner surface of the side wall of the storage housing 911 and configured to guide the air through the inlet opening 914 to the upper side can be configured in various ways.

As an example, the air guide part 942 may include a guide member extending upward from an inner surface of the side wall of the storage housing 911.

The condensate storage unit 910 receives the condensate generated in the second heat exchanger by various structures and methods, and for example, a pipe 902 connected to the cooling flow path forming unit 200 constituting the second heat exchanger. ) May be connected to the cover member 912.

At this time, the cover member 912, a pipe connection structure for connecting the pipe 902 may be installed, the condensate inlet 903 through the pipe 902 so that the condensate can be stably introduced the condensate storage unit It is preferred to extend sufficiently to the bottom of 910.

On the other hand, the condensate storage unit 910, it is preferable that the water level sensor 943 for measuring the amount of stored condensate and the operation control of the ultrasonic unit 920 and the like.

The water level sensor 943 is a water level measurement sensor for measuring the amount of condensed water stored and controlling the operation of the ultrasonic unit 920.

The ultrasonic unit 920 is configured to form small water particles, that is, mist by condensate stored in the condensate storage unit 910 by ultrasonic waves, and installed in the condensate storage unit 910 and at least one vibrating unit generating ultrasonic waves. 921, and an operation unit 922 for operating and controlling the vibrator 921.

Here, in order to generate a sufficient amount of mist for improving the heat exchange efficiency of the first heat exchanger, which will be described later, the condensate stored in the condensate storage unit 910, rather than applying the same principle as a general humidifier, as shown in Figure 23c, condensate Preferably, the vibrator 921 is strongly driven to the extent that the water column 901 is generated in the storage 910.

Furthermore, when the water column 901 is generated in the condensate storage unit 910, the vibrator 921 may be damaged, so that the condensate may be vibrated only at a sufficient level from the vibrator 921 to prevent the vibrator 921 from being damaged. It is desirable to operate 921.

It is preferable that the level of condensate from the vibrator 921 is 10 mm or more, and more preferably 40 mm or less.

If the level of the condensate is less than 10mm, there is a risk that the vibrator 921 is broken, if the level of the condensate is greater than 40mm there is a problem that the amount of mist generated by the vibrator 921 may be rather reduced because too much condensate have.

Here, the level of the condensate in the condensate storage unit 910 may be maintained at 10 mm to 40 mm by controlling the operation of the vibrator 921.

The mist flow forming unit 930 may be configured to form an air flow for discharging the mist formed by the ultrasonic unit 920 to the outside of the condensate storage unit 910.

For example, the mist flow forming unit 930, as shown in FIGS. 22A to 23C, may be configured as a fan installed to correspond to the inlet opening 914 on the outside of the condensate storage unit 910.

Since the above has been described only with respect to some of the preferred embodiments that can be implemented by the present invention, the scope of the present invention, as is well known, should not be construed as limited to the above embodiments, the present invention described above It will be said that both the technical idea and the technical idea which together with the base are included in the scope of the present invention.

100: thermoelectric module unit 200: cooling flow path forming unit
300: heat dissipation path forming unit 400: housing
250: cooling air flow forming unit 350: heat radiation air flow forming unit

Claims (10)

At least one thermoelectric module 110 and the first heat exchanger 120 and the second heat exchanger 130 coupled to the heat dissipation unit 111 and the heat absorbing unit 112 of the thermoelectric module 110, respectively, A pair of thermoelectric module parts 100 disposed at intervals from each other such that each first heat exchange part 120 is positioned at the center;
It is installed corresponding to each of the thermoelectric module unit 100, the cooling suction unit 210 to suck the outside air, and the second heat exchange unit of each thermoelectric module unit 100 after being sucked from the cooling suction unit 210 A pair of cooling flow path forming units 200 which connect the cooling discharge ports 220 for discharging the cooled air to the outside while passing through the 130 to form a cooling flow path CF;
The first heat exchange part while passing through the heat dissipation suction part 310 for sucking outside air and the first heat exchange part 120 of the pair of thermoelectric module parts 100 after being sucked from the heat dissipation suction part 310. A heat dissipation flow path forming unit 300 connected to a heat dissipation discharge port 320 for discharging air cooled to the outside to form a heat dissipation flow path RF;
It is coupled to the structure (1) and the pair of thermoelectric module unit 100 and the heat dissipation flow path forming unit 300 is installed, the cooling suction portion 210 and the cooling outlet 220 of the cooling flow path forming unit 200 A housing 400 in which the pair of cooling flow path forming units 200 are installed such that the pair communicates with the inside of the structure;
At least one cooling air flow forming unit (250) installed in the cooling passage (CF) to form an air flow from the cooling suction unit (210) to the cooling discharge port (220);
Air cooling is characterized in that it comprises one or more heat dissipation air flow forming unit 350 is installed in the heat dissipation passage (RF) to form an air flow from the heat dissipation suction unit 310 to the heat dissipation outlet (320). Thermoelectric cooling device used. The method according to claim 1,
The housing 400,
The cooling suction part 210 and the cooling outlet 220 of the cooling flow path forming unit 200 are exposed to the outside, so as to correspond to the cooling suction part 210 and the cooling outlet 220 of the cooling flow path forming unit 200. A first housing 410 having a suction opening 411 and a discharge opening 412 formed therein;
A second housing forming an inner space together with the first housing 410 such that the pair of thermoelectric module units 100, the cooling flow path forming unit 200, and the heat dissipation flow path forming unit 300 are installed therein. Thermoelectric cooling apparatus using air-cooled cooling, characterized in that it comprises a (420). The method according to claim 1 or 2,
In the thermoelectric module 110 of the pair of thermoelectric module units 100, the heat dissipation channel forming unit 300 is positioned at the center, and the pair of cooling channel forming units 200 are the thermoelectric module unit 100. The thermoelectric cooling device using air-cooled cooling, characterized in that installed by partitioning the inner space of the housing 400 so as to be located in a position opposite to the heat dissipation flow path forming unit 300 on the basis of the thermoelectric module (110). The method according to claim 3,
The first heat exchange unit 120,
A heat dissipation plate 121 coupled to the heat dissipation unit 111 of the thermoelectric module 110, a plurality of heat pipes 122 coupled to the heat dissipation plate 121, and a longitudinal direction of the heat pipe 122. Is inserted into the thermoelectric cooling device using air-cooled cooling, characterized in that it comprises a heat radiation fin member 123 to maximize the heat dissipation effect. The method according to claim 3,
The cooling flow path forming unit 200,
A main flow path part 231 formed long along the arrangement direction of the second heat exchange part 130 of the thermoelectric module part 100;
An upstream side flow path part 232 coupled to an upstream side of the main flow path part 231 and having the cooling suction part 210 formed therein;
A thermoelectric cooling device using air-cooled cooling, which is coupled to a downstream side of the main flow path part 231 and comprises a downstream side flow path part 233 in which the cooling discharge port 220 is formed. At least one thermoelectric module 110 and the first heat exchanger 120 and the second heat exchanger 130 coupled to the heat dissipation unit 111 and the heat absorbing unit 112 of the thermoelectric module 110, respectively, A pair of thermoelectric module parts 100 disposed at intervals from each other such that each second heat exchange part 130 is positioned at the center;
Installed in correspondence with the second heat exchanger 130 of the pair of thermoelectric module unit 100 disposed in the center, and the cooling suction unit 210 for sucking the outside air, and from the cooling suction unit 210 After being sucked through the second heat exchange unit 130 of the pair of thermoelectric module unit 100 while connecting the cooling outlet 220 for discharging the cooled air to the outside to form a cooling flow path (CF) Forming unit 200;
It is installed to correspond to the first heat exchange unit 120 of each of the thermoelectric module unit 100, the heat absorbing suction unit 310 to suck the outside air, and the suction after the heat absorbing suction unit 310 and each of the thermoelectric module A pair of heat dissipation outlets 320 for discharging air cooled through the first heat exchangers 120 to the outside while passing through the first heat exchangers 120 of the part 100 to form a heat dissipation flow path RF. A heat dissipation flow path forming unit 300;
It is coupled to the structure (1) and the pair of thermoelectric module unit 100 and the heat dissipation flow path forming unit 300 is installed, the cooling suction portion 210 and the cooling outlet 220 of the cooling flow path forming unit 200 A housing 400 in which the cooling flow path forming unit 200 is installed to communicate with the inside of the structure;
At least one cooling air flow forming unit (250) installed in the cooling passage (CF) to form an air flow from the cooling suction unit (210) to the cooling discharge port (220);
Air cooling is characterized in that it comprises one or more heat dissipation air flow forming unit 350 is installed in the heat dissipation passage (RF) to form an air flow from the heat dissipation suction unit 310 to the heat dissipation outlet (320). Thermoelectric cooling device used. The method according to claim 6,
The housing 400,
The cooling suction part 210 and the cooling outlet 220 of the cooling flow path forming unit 200 are exposed to the outside, so as to correspond to the cooling suction part 210 and the cooling outlet 220 of the cooling flow path forming unit 200. A first housing 410 having a suction opening 411 and a discharge opening 412 formed therein;
A second housing forming an inner space together with the first housing 410 such that the pair of thermoelectric module units 100, the cooling flow path forming unit 200, and the heat dissipation flow path forming unit 300 are installed therein. Thermoelectric cooling apparatus using air-cooled cooling, characterized in that it comprises a (420). The method according to claim 6 or 7,
In the thermoelectric module 110 of the pair of thermoelectric module units 100, the cooling flow path forming unit 200 is positioned at the center, and the pair of heat dissipation flow path forming unit 300 is the thermoelectric module unit 100. The thermoelectric cooling device using air-cooled cooling, characterized in that installed by partitioning the inner space of the housing 400 to be located in a position opposite to the cooling flow path forming unit 200 on the basis of the thermoelectric module (110). The method according to claim 8,
The first heat exchange unit 120,
A heat dissipation plate 121 coupled to the heat dissipation unit 111 of the thermoelectric module 110, a plurality of heat pipes 122 coupled to the heat dissipation plate 121, and a longitudinal direction of the heat pipe 122. Is inserted into the thermoelectric cooling device using air-cooled cooling, characterized in that it comprises a heat radiation fin member 123 to maximize the heat dissipation effect. The method according to claim 8,
The cooling flow path forming unit 200,
A main flow path part 231 formed long along the arrangement direction of the second heat exchange part 130 of the thermoelectric module part 100;
An upstream side flow path part 232 coupled to an upstream side of the main flow path part 231 and having the cooling suction part 210 formed therein;
A thermoelectric cooling device using air-cooled cooling, which is coupled to a downstream side of the main flow path part 231 and comprises a downstream side flow path part 233 in which the cooling discharge port 220 is formed.

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