JP2018207074A - Device including heat generation device - Google Patents

Abstract

To provide a device including a heat generation device which inhibits occurrence of dew condensation and causes the heat generation device to radiate heat without needing to add a fan and a heat sink to the heat generation device to cool the heat generation device provided at a kind of device such as an air conditioning unit.SOLUTION: An air conditioning unit 1 includes: a device body; an electronic device 30 including an electronic device body 31 which generates heat; a drain pan 15 which faces a heat reservoir H2 where heat from the electronic device 30 accumulates; and a housing 20 which houses the device body and the electronic device 30. A heat sink 151 which contacts with air in a space (21) partitioned from the heat reservoir H2 by the drain pan 15 is provided at the drain pan 15.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an apparatus such as an air conditioner unit including a heat generating device including a heat generating portion such as an electronic component.

  In recent years, in business and home air conditioners, the heat generation density of electronic devices such as inverters has been increasing due to the demand for downsizing of outdoor unit, and heat dissipation inside the case of electronic devices including electronic components Has become an issue. In order to protect electronic components from moisture, dust, and the like, the case of the electronic device often has a sealed structure, and the inside of the case is difficult to dissipate heat.

  In order to dissipate heat inside the sealed case of the electronic device, typically, a fan is arranged inside the case (Patent Document 1), or a fin-like heat sink is provided on the surface of the case (Patent Document 2). The method is taken.

JP 2012-044038 A JP 2006-032684 A

While downsizing of air conditioner units is being promoted, it is not always possible to secure a space for disposing a fan inside a case of an electronic device. Further, it is not always possible to secure a space for providing the heat sink in the case outside the case.
Moreover, if a fan or a heat sink is added to the electronic device, the weight and manufacturing cost of the air conditioner unit will increase. When fans are added, power consumption is increased.

  Even if a fan is built in the case of an electronic device or a heatsink is provided in the case, the direct cooling method may cause condensation in the cooled part, and May invade.

  As described above, the present invention eliminates the need to add a fan or a heat sink to the heat generating device in order to cool the heat generating device provided in various devices such as an air conditioner unit, and also radiates heat from the heat generating device while suppressing the occurrence of condensation. The purpose is to let you.

  The apparatus of the present invention includes an apparatus main body, a heat generating device including a heat generating part that generates heat, a facing member that faces a heat reservoir in which heat from the heat generating apparatus is accumulated, and a housing that houses the apparatus main body and the heat generating device. The counter member is provided with a heat sink that contacts the air in the space separated from the heat reservoir by the counter member.

  In the apparatus of the present invention, it is preferable that the apparatus main body includes a fan disposed in a space as an air path inside the housing, and the heat sink contacts the air flowing through the air path.

  In the apparatus of the present invention, it is preferable that the apparatus main body includes a heat exchanger through which a fluid that exchanges heat with air sucked into the fan flows.

  In the apparatus of the present invention, the facing member is preferably a drain pan that receives drain generated in the heat exchanger.

  The apparatus of the present invention is an air conditioner unit, and the apparatus main body has a refrigerant that exchanges heat between a fan arranged in a space as an air passage inside the housing and air sucked into the fan. And a flowing heat exchanger.

  The apparatus of the present invention is an air conditioner unit, and the apparatus main body is a heat exchanger through which a refrigerant that exchanges heat between a fan disposed in an air passage inside the housing and air sucked into the fan flows. The heat sink is preferably provided in an opposing member that is a part of the housing and is in contact with air in a space outside the housing.

The device of the present invention preferably includes an electronic device that is a heat generating device and drives and controls the device main body, and includes an electronic device main body that is a heat generating portion and a case that houses the electronic device main body.
Further, it is preferable that a first heat pool in which heat from the heat generating portion is retained exists inside the case, and a second heat pool as the heat pool is present between the case and the opposing member.

The heat sink from the heat generating device is cooled by the heat sink that contacts the air in the space separated by the facing member, so the amount of heat released from the heat generating device to the heat reservoir increases, resulting in the temperature inside the heat generating device. Decreases.
According to the present invention, it is not necessary to install a fan inside the heat generating device or attach a heat sink to the heat generating device as long as the heat sink is provided on the member facing the heat reservoir from the heat generating device. Without hindering downsizing, it is possible to radiate heat from the heat generating device while suppressing the manufacturing cost and weight.
In addition, since the heat generating device is indirectly cooled through a heat reservoir, the method of directly cooling the heat generating device by installing a fan or a heat sink on the heat generating device suppresses the occurrence of condensation on the heat generating device, The heat generating device can dissipate heat.

It is a figure which shows the air conditioner unit which concerns on 1st Embodiment. (A) is a perspective view which shows the whole air conditioning machine unit, (b) is the Ib-Ib sectional view taken on the line of (a). It is a schematic diagram which shows the inner side of the housing | casing of the air conditioner unit shown in FIG. Black arrows indicate the direction of heat transfer. (A) And (b) is the elements on larger scale which show typically the heat sink with which the drain pan facing a heat reservoir is equipped. (A)-(c) is a schematic diagram which shows the example of orientation of the fin of a heat sink. It is a figure which shows the air conditioner unit which concerns on 2nd Embodiment. It is a figure which shows the air conditioning unit which concerns on the modification of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
[First Embodiment]
The air conditioner unit 1 shown in FIGS. 1 and 2 constitutes an air conditioner using a refrigeration cycle. The air conditioner unit 1 is an outdoor unit installed outdoors, and is connected to an indoor unit (not shown) by piping.

The air conditioner unit 1 includes a device main body 10, an electronic device 30 as a heat generating device that drives and controls the device main body 10, a drain pan 15 (FIG. 2), and a housing 20.
The apparatus main body 10 includes a fan 11, a heat exchanger 12, a compressor 13, a gas-liquid separator 14, and a decompression unit (not shown).

When the refrigerant circulating in the refrigerant circuit constituting the refrigeration cycle is compressed by the compressor 13 during the cooling operation of the air conditioner, heat is exchanged with outdoor air in the heat exchanger 12 blown by the fan 11. Then, it is condensed and further decompressed by a decompression section such as an expansion valve (not shown). Then, in a heat exchanger provided in an indoor unit (not shown), it is evaporated by exchanging heat with indoor air, and then sucked into the compressor 13 through the gas-liquid separator 14.
During the heating operation, the direction of the refrigerant flow in the refrigerant circuit is switched reversely by a four-way valve (not shown), so that the heat exchanger 12 functions as an evaporator and the heat exchanger of the indoor unit functions as a condenser.
Note that it is only necessary that at least one of the cooling operation and the heating operation can be performed by the air conditioner configured by the air conditioner unit 1.

The housing 20 (FIG. 1A and FIG. 2) accommodates the fan 11 and the heat exchanger 12, the compressor 13 and the gas-liquid separator 14, the drain pan 15, and the electronic device 30.
The housing 20 of the present embodiment is formed in a rectangular parallelepiped outer shape having dimensions that are larger than the left and right widths and the front and rear depths. As shown in FIG. 2, the inside of the housing 20 is divided into an air passage 21 above the drain pan 15 and an equipment chamber 22 below the drain pan 15.

  Two fans 11 are installed above the air passage 21. When these fans 11 are driven by the motor 11 </ b> M (FIG. 2), air introduced from the outside of the housing 20 into the air passage 21 flows through the air passage 21 and is sucked into the fan 11. Then, it is discharged toward the outside of the housing 20 upward. The outlet from the housing 20 is covered with a guard member 11G (FIG. 1A).

As shown in FIG. 1 (b), the heat exchanger 12 is disposed inside the air passage 21. The heat exchanger 12 includes a conduit through which a refrigerant (fluid) that exchanges heat with air sucked into the fan 11 flows. The heat exchanger 12 includes two heat exchange portions 121 and 122 formed in an L shape in plan view.
The heat exchanging part 121 is disposed toward the inlets 231 and 232 formed on the adjacent side walls of the housing 20, and the heat exchanging part 122 is directed toward the inlets 233, 234 and 235 formed on the remaining side walls. Arranged.
The rotating fan 11 blows air outside the housing 20 to the heat exchange units 121 and 122 through the inlets 231 to 235, thereby promoting heat exchange.

The drain pan 15 (opposing member) shown in FIG. 2 is installed in the housing 20 in order to receive the drain generated by the condensation on the heat exchange units 121 and 122. The drain pan 15 of the present embodiment is formed in a rectangular shape in plan view, and divides the interior of the housing 20 into an air passage 21 and an equipment room 22.
The drain dripped from the heat exchanging parts 121 and 122 to the peripheral edge 15 </ b> A of the drain pan 15 flows down to a predetermined location and accumulates due to the gradient of the drain pan 15. It is preferable that a suction part of a pump for sucking and discharging the drain is disposed in the drain part where the drain is accumulated in the drain pan 15.

In the present embodiment, the electronic device 30 is radiated to the air in the air passage 21 through the drain pan 15 as described later.
In order to quickly move heat from the electronic device 30 to the drain pan 15 and sufficiently dissipate heat from the heat sink 151 provided in the drain pan 15, the drain pan 15 is made of a material having high thermal conductivity, such as aluminum, iron, copper, or the like. It is preferable to be comprised from the used metal material. It is also preferable to subject the drain pan 15 to a surface treatment such as an anodizing treatment for improving the heat emissivity.

  The drain pan 15 does not necessarily have a rectangular shape. For example, the drain pan 15 can be configured in a form in which only the peripheral edge portion 15 </ b> A facing the lower ends of the heat exchange portions 121 and 122 and the vicinity thereof are left. In that case, in order to partition the air passage 21, it is preferable that another member that partitions the air passage 21 and the equipment room 22 is installed. It is preferable to provide the heat sink 151 also in such another partition member.

In the equipment chamber 22, components that form a refrigerant circuit with the heat exchanger 12, such as the compressor 13, the gas-liquid separator 14, and a decompression unit (not shown), and the electronic equipment 30 are arranged.
The compressor 13 is an electric compressor including a compression mechanism such as a scroll compression mechanism and a rotary compression mechanism, a motor that drives the compression mechanism, and a housing that houses the compression mechanism and the motor.

The electronic device 30 (FIGS. 1 and 2) supplies a drive current to the motor of the compressor 13 under predetermined control according to the operation mode of the air conditioner, the thermal load, and the like.
The electronic device 30 includes an electronic device main body 31 that is a heat generating unit that generates heat, and a case 32 that houses the electronic device main body 31. The electronic device body 31 includes a control board on which an IC (Integrated Circuit) or the like is mounted, a power board on which a switching element such as a power transistor is mounted, and a circuit element such as a capacitor or a coil connected to the board. It is configured.

In order to protect the electronic device main body 31 from moisture and dust contained in the outside air, the case 32 preferably accommodates the electronic device main body 31 in a sealed state. The case 32 is made of an appropriate material such as metal. In order to seal the inside of the case 32, it is preferable that the joint portion between the members constituting the case 32 is sealed with a seal member.
The upper wall 321 of the case 32 faces the back side of the drain pan 15.

During the operation of the air conditioner, the electronic device main body 31 generates heat by heat generation due to contact resistance or Joule heat. In particular, the power board on which the switching element is mounted generates significant heat. Due to the heat generated from the electronic device main body 31, the temperature inside the case 32 rises, and the temperature of the case 32 also rises.
Here, in order to protect the electronic device main body 31 from overheating, measures such as installation of an air cooling fan in the case 32 and installation of heat radiation fins in the case 32 are typically taken. In the present embodiment, the heat sink 151 is provided on the front side (upper side) of the drain pan 15 in order to release the heat of the electronic device main body 31 to the outside without adding such an air cooling fan or a heat radiating fin to the electronic device 30.

  In the present embodiment, the heat sink 151 (FIG. 2) is provided in the drain pan 15 which is a member facing the heat reservoir H2 in which heat from the electronic device 30 that is not directly provided with an air-cooling fan or a heat radiating fin is retained from above. The electronic device 30 is indirectly radiated by a heat sink 151 that is in contact with air in a space (the air passage 21) separated from H2. By cooling the heat reservoir H2 above the electronic device 30 with the heat sink 151, the amount of heat released from the heat reservoir H1 inside the case 32 to the heat reservoir H2 via the upper wall 321 increases, and the temperature inside the case 32 decreases. To do.

  The drain pan 15 is installed in the housing 20 with a gap from the upper wall 321 of the case 32. Since the air heated by the heat from the case 32 is prevented from floating by the drain pan 15, a heat pool H <b> 2 is formed in the gap between the upper wall 321 and the drain pan 15. A part of the drain pan 15 may be in contact with the upper wall 321.

  The heat sink 151 can be configured in an appropriate form capable of expanding the surface area of the drain pan 15 with respect to a typical flat drain pan. It is preferable that a heat sink 151 is provided over at least a region of the drain pan 15 facing the heat reservoir H2.

An example of the form of the heat sink 151 is shown in FIGS.
The heat sink 151 a shown in FIG. 3A includes a main body 150 of the drain pan 15 and a plurality of plate-like fins 16 protruding upward from the drain pan main body 150. A plurality of fins 16 arranged at a predetermined interval that can ensure convection between the fins 16 constitute a heat sink 151a. The plurality of fins 16 are joined to a flat region of the drain pan main body 150 by an appropriate method such as welding or adhesion.

The heat sink 151b shown in FIG. 3 (b) is formed integrally with the main body 150 of the drain pan 15. The heat sink 151b can be configured to have a wavy (in this case, rectangular wave) cross section by press working using a metal plate or the like. The heat sink 151b includes fins 151A and 151B that protrude alternately on the front side and the back side of the drain pan 15.
By forming the fins 151 </ b> A and 151 </ b> B integrally with the main body 150 of the drain pan 15 by press working, the drain pan 15 can be configured from a single member, and thus the manufacturing cost can be reduced. Moreover, since both the front surface area and the back surface area of the drain pan 15 can be enlarged by the fins 151A and 151B, heat absorption and heat dissipation can be improved.

The heat sink 151 provided in the drain pan 15 can be configured in an appropriate form as long as the function of the drain pan is maintained.
4A to 4C show examples of the orientation of the fins 16 of the heat sink 151 that can be employed in the drain pan 15, respectively.
The drain dropped on the peripheral portion 15A of the drain pan 15 flows down the peripheral portion 15A to reach the discharge portion 152 of the drain pan 15, and a part of the drain flows between the fins 16 depending on the dropped position. As shown in FIG. 4A, the fins 16 are oriented in parallel along the left-right direction, as shown in FIG. 4B, the fins 16 are oriented in parallel along the front-rear direction, and as shown in FIG. As shown in c), the fins 16 can be arranged radially such that the ends of the fins 16 are directed toward the discharge portion 152.
Considering the overall shape, dimensions, gradient, or position of the discharge portion 152 of the drain pan 15, so that the drain is discharged smoothly, and the heat sink 151 can easily hit the wind of the air passage 21. It is preferable to arrange the fins 16 appropriately.

The heat sink 151 is preferably provided over the entire region of the drain pan 15 facing the heat reservoir H2 in order to reduce the thermal resistance and ensure a sufficient amount of heat dissipation. However, in consideration of the cost and weight of the drain pan 15, it is also possible to provide the heat sink 151 only in at least a part of the region. When there is a thermal gradient in the heat reservoir H2 in the horizontal plane direction, it is preferable to dispose the heat sink 151 so as to include at least a location where the temperature is relatively high in the heat reservoir H2.
When the heat sink 151 is provided on a member positioned above the electronic device 30 instead of the drain pan 15, the heat sink 151 can be provided in a predetermined region in the same manner as described above.

The heat sink 151 is not limited to the one provided with plate-like fins, and one having a plurality of pin-like protrusions protruding from the main body 150 of the drain pan 15 can also be employed.
In addition, the material, height, planar size, fin shape, and the like of the heat sink 151 can be appropriately determined in consideration of the heat dissipation necessary for the heat sink 151 to dissipate the electronic device 30.

The heat sink 151 is provided at least on the front side of the drain pan 15 and faces the air passage 21. Therefore, the air flowing through the air path 21 toward the fan 11 contacts the fins of the heat sink 151. By releasing heat from the heat sink 151 to the air, heat dissipation from the electronic device 30 is promoted.
Here, in addition to the natural convection that occurs around the fins due to the movement of heat from the heat reservoir H2, the heat sink 151 is cooled by the air in the air passage 21 so that the heat sink 151 heats from the electronic device 30. The heat transmitted through the pools H1 and H2 is efficiently radiated to the air in the air passage 21. The air in the air passage 21 to which the heat from the heat sink 151 has been moved is quickly discharged to the outside of the housing 20 by the fan 11.

Since the case 32 of the electronic device 30 does not include a fan, the heat accumulation H1 is stably formed in the upper portion of the case 32 by natural convection due to the buoyancy of the air warmed by the heat generated by the electronic device body 31. . In addition, since the case 32 is disposed in the equipment room 22 that is partitioned from the air passage 21, natural convection is dominant as a flow state of air around the case 32.
By utilizing the flow state of the air inside and around the case 32 as described above, heat dissipation that moves heat from the electronic device 30 to the heat pools H1 and H2, the heat sink 151, the air path 21, and the housing 20 is performed. The system is configured.

  According to this heat dissipation system, the electronic device main body 31 can be suppressed to an allowable temperature or lower. Therefore, the reliability of the air conditioner unit 1 and the air conditioner can be ensured without using a typical cooling method such as incorporating a fan in the electronic device 30 or providing a radiating fin in the case 32.

  According to the present embodiment, the heat generated from the electronic device main body 31 that is a heat generating part is transferred from the heat reservoir H1 formed above to the case 32, and further, the drain pan 15 is connected via the heat reservoir H2 formed above the case 32. The heat transmitted to the heat sink 151 is dissipated from the heat sink 151 that contacts the air in the space separated from H2 by the drain pan 15. That is, instead of directly blowing air to the electronic device main body 31 to cool it, or directly radiating heat from the radiating fins provided on the case 32, the heat reservoir H2 above the electronic device 30 that is a heat source is used as a heat sink. 151 radiates heat. It can be said that this is an indirect cooling method.

  According to such a cooling method of the present embodiment, when the air conditioner unit 1 is required to be downsized, a space for installing a fan in the case 32 cannot be secured, or heat is radiated to the outer surface of the case 32. Even when it is not possible to secure a space for providing a heat sink such as a fin, the heat sink 151 is simply provided on the member (the drain pan 15 in this embodiment) facing the heat reservoir H2 in which the heat from the electronic device 30 has accumulated. Heat dissipation of the electronic device 30 can be achieved.

According to the cooling method of the present embodiment, since it is an indirect air cooling type as described above and the electronic device 30 is not directly cooled, a fan is built in the case 32 or a radiating fin is provided in the case 32. It is possible to dissipate heat from the electronic device main body 31 while suppressing the occurrence of condensation in a direct cooling method such as providing. According to the present embodiment, when the outside air temperature is low and the temperature of the upper space in the case 32 is high, a direct cooling method is adopted even if condensation occurs on the back side of the drain pan 15 located above the case 32. Unlike the case, the occurrence of dew condensation on the case 32 itself can be suppressed, so that the possibility of water entering from the gap between the members of the case 32 into the case 32 is low.
As described above, it is possible to prevent the dew condensation from occurring in the case 32 under the circumstance where the ambient temperature is low and the humidity is high, and the water can be prevented from entering the case 32.

  The drain pan 15 is an existing member except that the heat sink 151 is provided, and the fan 11 that contributes to heat dissipation of the heat sink 151 is also an existing member in the air conditioner unit 1. By using the components that the air conditioner unit 1 basically includes, such as the drain pan 15 and the fan 11, the number of parts is reduced, thereby reducing the manufacturing cost and the weight of the air conditioner unit 1. The electronic device 30 can be dissipated without increasing power consumption.

  The drain pan 15 is not only above the heat reservoir H2 in which the heat from the electronic device 30 has accumulated, but also on the front side of the drain pan 15 in a region corresponding to the heat reservoir H2 and is opened as an air passage 21 to the heat sink 151. There is sufficient space to provide Moreover, even if the front side of the drain pan 15 is condensed due to the installation of the heat sink 151, the condensed water is received by the drain pan 15 and collected by the pump at the discharge unit 152, unlike the case where the electronic device 30 is condensed. There is no influence such as water entering the inside of 32.

  Here, when there is drain dripped from the heat exchanger 12 or water condensed by cooling by the heat sink 151 in the drain pan 15, if they are evaporated by the heat transferred from the heat reservoir H2 to the drain pan 15, the evaporation The heat sink 151 is cooled by the latent heat (evaporation heat) accompanying this. That is, in addition to the convection around the fins and the air in the air passage 21 to the fins, cooling of the heat sink 151 is promoted by evaporation of drain and water, so that the heat can be sufficiently radiated from the electronic device 30.

As described above, when the heat sink 151 is provided in the drain pan 15, the effect of cooling the electronic device 30 is high.
However, in order to further enhance the cooling effect, in addition to installing the heat sink 151 on the drain pan 15, it is allowed to provide a heat sink on the upper wall 321, the side wall, and the like of the electronic device 30.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG.
In the following, the description will be focused on matters that differ from the first embodiment. The same code | symbol is attached | subjected to the structure similar to the structure of 1st Embodiment.
The air conditioner unit 4 of the second embodiment has a smaller outer shape than the air conditioner unit 1 (FIG. 1) of the first embodiment, and the compressor 13, the fan 11, the electronic device 30, etc. are placed inside the housing 40. The arrangement position is different from the air conditioner unit 1. The air conditioner unit 4 constitutes an air conditioner as an outdoor unit.

  The housing 40 is formed in a horizontal shape in which the left and right width dimensions are larger than the height and depth. The inside of the housing 40 is divided into an air passage 41 located on the left side of the partition plate 40A and an equipment room 42 located on the right side of the partition plate 40A. The air passage 41 and the equipment room 42 communicate with each other above the upper end of the partition plate 40A.

A fan 11 and a heat exchanger 12 are installed in the air passage 41.
When the air is sucked into the fan 11 from the suction port 48 on the rear wall and the suction port 48 on the side wall by driving the fan 11 by the motor, the heat exchanger arranged along the rear wall and the side wall The outside air passes through 12 and is discharged from an air outlet (not shown) on the front surface of the housing 40. The drain generated in the heat exchanger 12 is discharged from the bottom plate 43 to the outside of the housing 40.

In the equipment chamber 42, the compressor 13, the gas-liquid separator 14, and the electronic equipment 30 are installed. The electronic device 30 is installed above the compressor 13 and the gas-liquid separator 14 installed on the bottom plate 43 of the housing 40.
A part of the air sucked into the air passage 41 by the fan 11 flows into the space between the upper wall 321 of the electronic device 30 and the top plate 44 of the housing 40 to cool the electronic device 30, and It is discharged from a side exhaust port 46 formed in the side wall 45 of the body 40.

  In the second embodiment, a heat sink 441 is provided on the top plate 44 that is a part of the housing 40 located above the electronic device 30. When the upper wall 321 is heated by the heat reservoir H1 accumulated in the upper portion of the case 32 of the electronic device 30, heat accumulation H2 is also generated between the upper wall 321 and the top plate 44 due to the radiation of heat from the upper wall 321. . A heat sink 441 having a plurality of fins is provided on the front side (outside) of the top plate 44 facing the heat reservoir H2 from above. The heat sink 441 is open to the atmosphere outside the housing 40.

The heat sink 441 may be formed integrally with the top plate 44 by pressing or the like, or may be formed by joining a member other than the top plate 44 to the top plate 44. In addition, the heat sink 441 can be configured in an appropriate form such as a substrate that is laminated on the top plate 44 and a fin that protrudes from the substrate.
It is preferable that the heat sink 441 is provided over the entire region of the top plate 44 facing the heat reservoir H2.

Around the housing 40, there is an air flow accompanying the operation of the fan 11, and natural wind is also generated. Therefore, also in the second embodiment, as in the first embodiment, the heat sink 441 is in contact with the air flowing in the external space 47 (the space outside the housing 40) separated from the heat reservoir H2.
Therefore, while the heat sink 441 is cooled by natural wind hitting the fins, convection around the fins, or the like, the heat sink 441 can absorb heat from the H2 and dissipate it to the outside air.

  Also in the second embodiment, the heat sink 441 is provided in the casing 40 that is basically provided in the air conditioner unit 4, so that the fan is installed inside the case 32 and the heat is directly released to the case 32. Without requiring the installation of fins, the electronic device 30 can be dissipated while meeting the demand for miniaturization while reducing the manufacturing cost and weight. Even if the heat generation density in the case 32 increases with the performance and miniaturization of the air conditioner, the heat reservoir H1, the upper wall 321 and the ceiling formed in the space in the case 32 where no fan is provided. The inside of the electronic device 30 is indirectly radiated through the heat reservoir H2 between the plate 44 and the heat sink 441 of the top plate 44, thereby suppressing the occurrence of condensation on the electronic device 30 and the electronic device main body 31. The temperature can be kept below the allowable temperature.

In order to further enhance the cooling effect, in addition to the installation of the heat sink 151 on the top plate 44, a heat sink can be provided on the upper wall 321 or the side wall of the electronic device 30.
For example, the heat sink 33 along the air flow from the air passage 41 to the side exhaust port 46 can be installed on the upper wall 321 as indicated by a two-dot chain line.

  FIG. 6 shows an air conditioner unit 5 according to a modification of the present invention. The air passage 41 and the equipment room 42 are partitioned from the bottom plate 43 to the top plate 44 by a partition plate 40A. Therefore, unlike the second embodiment (FIG. 5), the air in the air passage 41 does not flow between the upper wall 321 of the case 32 and the top plate 44, and the side exhaust 45 is provided in the side wall 45 of the housing 40. 46 is not provided.

In the example shown in FIG. 6, the heat sink 441 is not provided on the top plate 44, but the heat sink 451 is disposed outside the side wall 45, which is a member facing the heat reservoir H <b> 2 where heat from the electronic device 30 has accumulated from the side. Is provided.
Also in this case, since the heat reservoir H2 is cooled by the heat sink 451, the amount of heat released from the heat reservoir H1 inside the case 32 to the heat reservoir H2 via the upper wall 321 increases, and the temperature inside the case 32 can be lowered. it can.

In addition to the above, as long as the gist of the present invention is not deviated, the configuration described in the above embodiment can be selected or changed to another configuration as appropriate.
In each of the above embodiments, an example of applying the present invention to an air conditioner unit as an outdoor unit has been described. However, the present invention can also be applied to an air conditioner unit as an indoor unit as long as a heating device is provided. . The positions of the inlet and outlet of the housing, the position of the air passage, the equipment room, and the like are not limited to the above embodiments, and can be determined as appropriate. Moreover, the case of the heat generating device does not necessarily have to be sealed.

  The present invention can be applied to various apparatuses other than the air conditioner unit as long as the heat sink is provided in the facing member that faces the heat reservoir in which the heat from the heat generating device is accumulated.

1, 4, 5 Air conditioner unit (device)
DESCRIPTION OF SYMBOLS 10 Apparatus main body 11 Fan 11G Guard member 11M Motor 12 Heat exchanger 13 Compressor 14 Gas-liquid separator 15 Drain pan (opposing member)
15A Peripheral part 16 Fin 20 Case 21 Air path (space)
22 Equipment room 24 Bottom plate 30 Electronic equipment (heat generating equipment)
31 Electronic equipment (heat generating part)
32 Case 40 Case 40A Partition plate 41 Air path (space)
42 Equipment room 43 Bottom plate 44 Top plate (opposing member)
45 Side wall 46 Side exhaust port 47 External space (space)
121, 122 Heat exchange part 150 Main body 151 Heat sink 151A, 151B Fin 152 Discharge part 231-235 Inlet 321 Upper wall 441, 451 Heat sink H1 Heat accumulation (first heat accumulation)
H2 heat pool (second heat pool)

Claims (8)

The device body;
A heat generating device including a heat generating part for generating heat;
A counter member facing the heat reservoir in which heat from the heat generating device is accumulated;
A housing for housing the apparatus main body and the heat generating device,
A heat sink that contacts the air in the space separated from the heat reservoir by the facing member is provided in the facing member.
A device characterized by that. The apparatus main body includes a fan disposed in the space as an air path inside the housing,
The heat sink is in contact with air flowing through the air path;
The apparatus of claim 1. The apparatus main body is
Including a heat exchanger through which a fluid exchanged with the air sucked into the fan flows.
The apparatus of claim 2. The opposing member is
A drain pan that receives the drain generated in the heat exchanger.
The apparatus of claim 3. An air conditioner unit,
The apparatus main body is
A fan disposed in the space as an air path inside the housing;
A heat exchanger through which a refrigerant that exchanges heat with air sucked into the fan flows.
Apparatus according to any one of claims 1 to 4. An air conditioner unit,
The apparatus main body is
A fan disposed in an air path inside the housing;
A heat exchanger through which a refrigerant that exchanges heat with air sucked into the fan flows,
The heat sink is
Provided in the facing member that is a part of the housing, and contacts the air in the space outside the housing,
Apparatus according to any one of claims 1 to 5. An electronic device that drives and controls the apparatus main body, the heating device;
An electronic device main body which is the heat generating part;
A case for housing the electronic device main body,
The device according to claim 1. Inside the case, there is a first heat pool in which heat from the heat generating portion is accumulated,
Between the case and the facing member, there is a second heat reservoir as the heat reservoir,
The apparatus according to claim 7.

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