TW200708229A - Computer system and heat dissipation module thereof - Google Patents

Computer system and heat dissipation module thereof

Info

Publication number
TW200708229A
TW200708229A TW094124090A TW94124090A TW200708229A TW 200708229 A TW200708229 A TW 200708229A TW 094124090 A TW094124090 A TW 094124090A TW 94124090 A TW94124090 A TW 94124090A TW 200708229 A TW200708229 A TW 200708229A
Authority
TW
Taiwan
Prior art keywords
circuit board
air channel
fan duct
heat exchange
exchange device
Prior art date
Application number
TW094124090A
Other languages
Chinese (zh)
Other versions
TWI266594B (en
Inventor
Tay-Jian Liu
Chih-Feng Fan
Chih-Peng Lee
Chao-Nien Tung
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94124090A priority Critical patent/TWI266594B/en
Application granted granted Critical
Publication of TWI266594B publication Critical patent/TWI266594B/en
Publication of TW200708229A publication Critical patent/TW200708229A/en

Links

Abstract

A thermal module adapted to be mounted on a circuit board, includes a loop-type heat exchange device, a fan duct and a fan located at one end of the fan duct. A first air channel and a second air channel are formed between the fan duct and the circuit board. The heat exchange device is received in the first air channel for contacting with an electronic component mounted on the circuit board. A plate is secured to the fan duct and separate the first and second air channels. An adjustable structure is formed between the plate and the fan duct to ensure an evaporator of the heat exchange device to firmly and thermally contact with the electronic component when the thermal module is mounted to the circuit board. One portion of airflow generated by the fan is blown to the heat exchange device via the first air channel and the other portion of the airflow is blown to other electronic components via the second air channel. In assembly, the thermal module can be conveniently secured to the circuit board via securing the fan duct with the circuit board.
TW94124090A 2005-08-08 2005-08-08 Computer system and heat dissipation module thereof TWI266594B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94124090A TWI266594B (en) 2005-08-08 2005-08-08 Computer system and heat dissipation module thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94124090A TWI266594B (en) 2005-08-08 2005-08-08 Computer system and heat dissipation module thereof

Publications (2)

Publication Number Publication Date
TWI266594B TWI266594B (en) 2006-11-11
TW200708229A true TW200708229A (en) 2007-02-16

Family

ID=38191617

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94124090A TWI266594B (en) 2005-08-08 2005-08-08 Computer system and heat dissipation module thereof

Country Status (1)

Country Link
TW (1) TWI266594B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI649024B (en) * 2018-04-16 2019-01-21 陳柏安 Electronic device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9207729B2 (en) 2013-06-07 2015-12-08 Apple Inc. Computer Architecture
US11899509B2 (en) 2013-06-07 2024-02-13 Apple Inc. Computer housing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI649024B (en) * 2018-04-16 2019-01-21 陳柏安 Electronic device

Also Published As

Publication number Publication date
TWI266594B (en) 2006-11-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees