TW200708229A - Computer system and heat dissipation module thereof - Google Patents
Computer system and heat dissipation module thereofInfo
- Publication number
- TW200708229A TW200708229A TW094124090A TW94124090A TW200708229A TW 200708229 A TW200708229 A TW 200708229A TW 094124090 A TW094124090 A TW 094124090A TW 94124090 A TW94124090 A TW 94124090A TW 200708229 A TW200708229 A TW 200708229A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- air channel
- fan duct
- heat exchange
- exchange device
- Prior art date
Links
Abstract
A thermal module adapted to be mounted on a circuit board, includes a loop-type heat exchange device, a fan duct and a fan located at one end of the fan duct. A first air channel and a second air channel are formed between the fan duct and the circuit board. The heat exchange device is received in the first air channel for contacting with an electronic component mounted on the circuit board. A plate is secured to the fan duct and separate the first and second air channels. An adjustable structure is formed between the plate and the fan duct to ensure an evaporator of the heat exchange device to firmly and thermally contact with the electronic component when the thermal module is mounted to the circuit board. One portion of airflow generated by the fan is blown to the heat exchange device via the first air channel and the other portion of the airflow is blown to other electronic components via the second air channel. In assembly, the thermal module can be conveniently secured to the circuit board via securing the fan duct with the circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94124090A TWI266594B (en) | 2005-08-08 | 2005-08-08 | Computer system and heat dissipation module thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94124090A TWI266594B (en) | 2005-08-08 | 2005-08-08 | Computer system and heat dissipation module thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI266594B TWI266594B (en) | 2006-11-11 |
TW200708229A true TW200708229A (en) | 2007-02-16 |
Family
ID=38191617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94124090A TWI266594B (en) | 2005-08-08 | 2005-08-08 | Computer system and heat dissipation module thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI266594B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI649024B (en) * | 2018-04-16 | 2019-01-21 | 陳柏安 | Electronic device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9207729B2 (en) | 2013-06-07 | 2015-12-08 | Apple Inc. | Computer Architecture |
US11899509B2 (en) | 2013-06-07 | 2024-02-13 | Apple Inc. | Computer housing |
-
2005
- 2005-08-08 TW TW94124090A patent/TWI266594B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI649024B (en) * | 2018-04-16 | 2019-01-21 | 陳柏安 | Electronic device |
Also Published As
Publication number | Publication date |
---|---|
TWI266594B (en) | 2006-11-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |