TWI811064B - Laptop computer - Google Patents

Abstract

This disclosure provides an electronic device including a host and a display. The host includes a casing and a fin assembly. The casing has first air outlets formed by ribs and second air outlets. The first and the second air outlets are respectively located on two different sides of the casing. The fin assembly includes first fins and second fins. First fin air outlets are respectively connected to the first air outlets. Second fin air outlets are respectively connected to the second air outlets.

Description

electronic device

The present invention relates to an electronic device, in particular to an electronic device with an air outlet.

Generally speaking, in order to prevent the notebook computer from falling to the ground and causing the risk of notebook computer failure, such as component falling off, the notebook computer will need to pass the drop test before leaving the factory to ensure that the notebook computer can withstand a certain degree of damage. shock. In addition, in order to dissipate the accumulated heat inside the notebook computer, air outlets are usually provided on the casing of the notebook computer, so that the hot air guided by the fan assembly of the notebook computer is drawn from the notebook computer through the cooling fins exposed to the air outlet. The air outlet is discharged to the outside world. Although opening air outlets on the casing can meet the heat dissipation requirements of the notebook computer, it will reduce the structural strength of the casing. Therefore, in order to increase the structural strength of the casing so that the notebook computer can pass the drop test, the air outlet on the casing is usually formed by a plurality of structural ribs.

However, the structural ribs forming the air outlet will block the hot air flowing from the cooling fins to the air outlet. Therefore, the hot air blocked by the structural ribs may accumulate on the heat dissipation fins and be difficult to discharge from the air outlet, and may even flow back into the interior of the notebook computer. In this way, the airflow rate of the cooling fins will be reduced and it will be difficult for the notebook computer to be effectively cooled. To sum up, it is difficult for traditional notebook computers to provide structural ribs to improve the structural strength while maintaining the airflow rate of the cooling fins.

The present invention provides an electronic device for maintaining the air outlet rate of the cooling fins while providing structural ribs to enhance the structural strength.

An electronic device disclosed in an embodiment of the present invention includes a main body and a display body. The host body includes a casing and a cooling fin set. The casing has a plurality of first air outlets and a plurality of second air outlets separated by a plurality of structural ribs. The first air outlet and the second air outlet are respectively located on different two sides of the casing. The heat dissipation fin group is disposed in the housing and includes a plurality of first heat dissipation fins and a plurality of second heat dissipation fins. The second heat dissipation fins are interposed between the first heat dissipation fins. Each first cooling fin has a first fin air inlet and a first fin air outlet communicating with each other. The air outlets of the first fins are respectively communicated with the first air outlets. Each second cooling fin has a second fin air inlet and a second fin air outlet communicating with each other. The air outlets of the second fins are respectively communicated with the second air outlets. The display body is pivotally connected to the casing.

According to the electronic device disclosed in the above-mentioned embodiments, since the second fin air outlet of the second heat dissipation fin is connected to the second air outlet, the air entering the second heat dissipation fin from the second fin air inlet of the second heat dissipation fin The hot air will not be blocked by the structural ribs, but will be guided by the second fins and discharged from the second air outlets to the outside through the second fin air outlets. In this way, the air outlet rate of the cooling fins can be maintained while the structural ribs are provided to improve the structural strength.

10,10a: Electronic devices

100, 100a: host body

110,110a: Chassis

111,111a: the first plate body

112,112a: the second plate body

113,113a: the third plate body

114,114a: the fourth plate body

115,115a: fifth plate

116,116a: the sixth board

117, 117a: Structural ribs

1171, 1172, 1171a, 1172a: inner surface

P1, P2, P1a, P2a: extended plane

118,118a:Accommodating space

1100, 1100a: the first air outlet

1101, 1101a: the second air outlet

120,120a: Motherboard

130, 131, 130a, 131a: heat source

140, 141, 140a, 141a: fan assembly

145,146,147,148,145a,146a,147a,148a: heat pipe

150, 160, 150a, 160a: cooling fin group

151, 151a: first cooling fin

1510,1510a: first fin air inlet

1511, 1511a: first fin outlet

152, 152a: second cooling fins

1520,1520a: second fin air inlet

1521, 1521a: second fin outlet

153,153a: Ontology

154, 154a: first convex plate

1541, 1541a: first extension

1542, 1542a: Second extension

1543a: first taper

1544a: Parallel segment

155, 155a: second convex plate

1551a: Parallel segment

1552a: Second taper

200,200a: display body

P, Pa: Pivot axis

FIG. 1 is a perspective view of an electronic device according to a first embodiment of the present invention.

FIG. 2 is a partial enlarged view of the perspective view of the electronic device in FIG. 1 .

FIG. 3 is a partial enlarged view of the rear view of the electronic device in FIG. 1 .

FIG. 4 is a schematic cross-sectional view of the electronic device along the section line 4 - 4 in FIG. 2 .

FIG. 5 is a schematic cross-sectional view of the electronic device along the section line 5 - 5 in FIG. 2 .

FIG. 6 is a schematic cross-sectional view of the electronic device along the section line 6 - 6 in FIG. 2 .

FIG. 7 is a perspective view of a second heat dissipation fin of the electronic device in FIG. 1 .

FIG. 8 is a perspective view of an electronic device according to a second embodiment of the present invention.

FIG. 9 is a partial enlarged view of the perspective view of the electronic device in FIG. 8 .

FIG. 10 is a partial enlarged view of the rear view of the electronic device in FIG. 8 .

FIG. 11 is a schematic cross-sectional view of the electronic device along the section line 11 - 11 in FIG. 9 .

FIG. 12 is a schematic cross-sectional view of the electronic device along the section line 12 - 12 in FIG. 9 .

FIG. 13 is a schematic cross-sectional view of the electronic device along the section line 13 - 13 in FIG. 9 .

FIG. 14 is a perspective view of the second heat dissipation fin of the electronic device in FIG. 8 .

The detailed features and advantages of the embodiments of the present invention are described in detail below in the implementation modes, the content is enough for anyone with ordinary knowledge in the field to understand the technical content of the embodiments of the present invention and implement them accordingly, and according to the disclosure of this specification Anyone with ordinary knowledge in the art can easily understand the related objectives and advantages of the present invention. The following embodiments are described in further detail The viewpoints of the present invention are illustrated, but the scope of the present invention is not limited by any viewpoint.

Please refer to FIGS. 1 to 4 . FIG. 1 is a perspective view of an electronic device according to a first embodiment of the present invention. FIG. 2 is a partial enlarged view of the perspective view of the electronic device in FIG. 1 . FIG. 3 is a partial enlarged view of the rear view of the electronic device in FIG. 1 . FIG. 4 is a schematic cross-sectional view of the electronic device along the section line 4 - 4 in FIG. 2 .

In this embodiment, the electronic device 10 is, for example, a notebook computer and includes a main body 100 and a display body 200 . In this embodiment, the main frame body 100 includes a case 110, a main board 120, two heat sources 130, 131, two fan assemblies 140, 141, four heat pipes 145, 146, 147, 148 and two cooling fin groups 150 , 160. The display body 200 is pivotally connected to the casing 110 along a pivot axis P. It should be noted that the electronic device 10 according to the present invention is not limited to a notebook computer. In other embodiments, the electronic device can also be an electronic device that has an air outlet for heat dissipation, such as a robot, a mobile phone, a vehicle device, and a tablet computer.

In this embodiment, the casing 110 includes a first board 111, a second board 112, a third board 113, a fourth board 114, a fifth board 115, a sixth board 116 and a plurality of structural ribs 117 , and the casing 110 has a plurality of first air outlets 1100 and a plurality of second air outlets 1101 . The first plate body 111 and the second plate body 112 are opposite to each other. The second board 112 is closer to the pivot axis P than the first board 111 . The third board 113 and the second board 112 are connected to each other through the first board 111 and the second board 112 and interposed between the first board 111 and the second board 112 . The third board 113 is closer to the display body 200 than the fourth board 114 . The fifth plate body 115 and the sixth plate body 116 pass through the first plate body 111, the second plate body 112, the third plate body 113 and the The four plates 114 are connected to each other, and are interposed between the first plate 111 and the second plate 112 , and between the third plate 113 and the fourth plate 114 . The first plate body 111 , the second plate body 112 , the third plate body 113 , the fourth plate body 114 , the fifth plate body 115 and the sixth plate body 116 together form an accommodating space 118 . In this embodiment, the structural rib 117 is located on the second plate body 112 and separates the first air outlets 1100 . The first air outlet 1100 and the second air outlet 1101 are respectively located on two different sides of the casing 110 . For example, in this embodiment, the first air outlet 1100 is located on the second board 112 and the second air outlet 1101 is located on the fourth board 114 . It should be noted that, in this embodiment, the first air outlet 1100 is located on the second board 112 in order to guide the hot air discharged from the first air outlet 1100 away from the user, so as to improve the comfort of the user when using the electronic device 10 degree, but not limited to this. In other embodiments, the structural rib and the first air outlet separated by the structural rib can also be located on the fifth plate or the sixth plate.

It should be noted that, as shown in FIG. 3, for the structural rib 117 and the second air outlet 1101 adjacent to each other, the structural rib 117 has two inner surfaces 1171, 1172 respectively located at the two adjacent first air outlets 1100, And at least part of the second air outlet 1101 is located between an extension surface P1 of the inner surface 1171 and an extension surface P2 of the inner surface 1172 . It should be noted that in other embodiments, the entire second air outlet can also be located between the two extension surfaces of the two inner surfaces of the structural rib.

The motherboard 120 is disposed in the containing space 118 . The two heat sources 130 , 131 are disposed and electrically connected to the motherboard 120 . The two heat sources 130 and 131 are, for example, central processing units or graphics processing units, and are disposed in the casing 110 . The two fan assemblies 140 , 141 are disposed in the accommodating space 118 and electrically connected to the motherboard 120 . Heat pipe 145 heat It is in contact with the heat source 130 and the cooling fin set 150 . The heat pipe 146 is in thermal contact with the heat source 130 and the two fin sets 150 and 160 . The heat pipe 147 is in thermal contact with the heat source 131 and the fin sets 150 and 160 . The heat pipe 148 is in thermal contact with the heat source 131 . The two fan assemblies 140 , 141 are used to guide the airflow and discharge the heat generated by the heat sources 130 , 131 to the outside through the two cooling fin sets 150 , 160 respectively.

The two cooling fin sets 150 and 160 are disposed in the accommodating space 118 of the casing 110 and separated from each other. Since the two cooling fin sets 150 and 160 have similar structures, only the detailed structure and connection relationship of one cooling fin set 150 will be described in detail below. The cooling fin set 150 includes a plurality of first cooling fins 151 and a plurality of second cooling fins 152 . The second heat dissipation fins 152 are interposed between the first heat dissipation fins 151 . The first heat dissipation fins 151 and the second heat dissipation fins 152 are fixed to each other.

Please refer to FIG. 2 and FIG. 5 . FIG. 5 is a schematic cross-sectional view of the electronic device along the section line 5 - 5 in FIG. 2 . Each of the first heat dissipation fins 151 has a first fin air inlet 1510 and a first fin air outlet 1511 communicating with each other. The first heat dissipation fins 151 are respectively exposed to the outside through the first air outlets 1100 and the first fin air outlets 1511 are respectively communicated with the first air outlets 1100 .

Please refer to Figure 2, Figure 6 and Figure 7. FIG. 6 is a schematic cross-sectional view of the electronic device along the section line 6 - 6 in FIG. 2 . FIG. 7 is a perspective view of a second heat dissipation fin of the electronic device in FIG. 1 . Each second fin 152 has a second fin air inlet 1520 and a second fin air outlet 1521 communicating with each other. The second heat dissipation fins 152 are respectively shielded by the structural ribs 117 and are respectively exposed to the outside through the second air outlets 1101 . The second fin air outlets 1521 communicate with the second air outlets 1101 respectively.

In each second heat dissipation fin 152 , the second fin air inlet 1520 is located on a side of the second heat dissipation fin 152 away from the second board 112 of the casing 110 . The second fin air outlet 1521 is located on a side of the second heat dissipation fin 152 close to the fourth board 114 of the housing 110 and communicates with one of the second air outlets 1101 . The second heat dissipation fin 152 includes a body 153 , a first protruding plate 154 and a second protruding plate 155 . The first protruding plate 154 and the second protruding plate 155 stand on the same side of the body 153 and are separated from each other. The first convex plate 154 is farther away from the fourth plate body 114 of the casing 110 than the second convex plate 155 . The first convex plate 154 includes a first extension section 1541 and a second extension section 1542 connected to each other. The first extension section 1541 and the second convex plate 155 jointly form the second fin air inlet 1520 . The second extension section 1542 is connected to a side of the first extension section 1541 close to the second board 112 of the housing 110 . The second extension section 1542 extends from a side connected to the first extension section 1541 toward the second board body 112 of the casing 110 and is arc-shaped. A side of the second extension section 1542 away from the first extension section 1541 and the second convex plate 155 jointly form the second fin air outlet 1521 . It should be noted that, according to this embodiment, the second extension section 1542 of the first protruding plate 154 is arc-shaped to increase the second cooling fins 152 to guide the airflow generated by the guiding fan assembly 140 to the second air outlet. 1101 smoothness, but the present invention is not limited thereto. In other embodiments, the second extension section may also be in the shape of a slanted plate.

In addition, as shown in FIG. 6 , in this embodiment, in each of the second heat dissipation fins 152 , the second fin air outlet 1521 is from the second heat dissipation fin 152 close to the fourth board 114 of the casing 110 . The side extends to the side of the second heat dissipation fin 152 close to the second plate body 112 of the casing 110, so that the second heat dissipation fin 152 can more smoothly The airflow generated by the fan assembly 140 is guided to the second air outlet 1101 . However, the present invention is not limited thereto. In other embodiments, the air outlets of the second fins may also be located only on the side of the second heat dissipation fins close to the fourth board without extending to the side of the second heat dissipation fins close to the second board.

In addition, as shown in FIG. 6 , in this embodiment, the heat pipes 145 , 146 , and 147 are located on the side of the cooling fin set 150 away from the second air outlet 1101 , so as to improve the space utilization rate of the accommodation space 118 of the casing 110 .

It should be noted that the present invention is not limited to the position of the second air outlet. Please refer to FIG. 8 to FIG. 11 . FIG. 8 is a perspective view of an electronic device according to a second embodiment of the present invention. FIG. 9 is a partial enlarged view of the perspective view of the electronic device in FIG. 8 . FIG. 10 is a partial enlarged view of the rear view of the electronic device in FIG. 8 . FIG. 11 is a schematic cross-sectional view of the electronic device along the section line 11 - 11 in FIG. 9 .

In this embodiment, the electronic device 10a includes a main body 100a and a display body 200a. In this embodiment, the main base body 100a includes a case 110a, a main board 120a, two heat sources 130a, 131a, two fan assemblies 140a, 141a, four heat pipes 145a, 146a, 147a, 148a and two cooling fin groups 150a , 160a. The display body 200a is pivotally connected to the casing 110a along a pivot axis Pa.

In this embodiment, the casing 110a includes a first board 111a, a second board 112a, a third board 113a, a fourth board 114a, a fifth board 115a, and a sixth board 116a and a plurality of structural ribs 117a, and the casing 110a has a plurality of first air outlets 1100a and a plurality of second air outlets 1101a. The first plate body 111a and the second plate body 112a are opposite to each other. The second board 112a is closer to the first board 111a Pivot axis Pa. The third board 113a and the second board 112a are connected to each other through the first board 111a and the second board 112a and interposed between the first board 111a and the second board 112a. The third board 113a is closer to the display body 200a than the fourth board 114a. The fifth plate body 115a and the sixth plate body 116a are connected to each other through the first plate body 111a, the second plate body 112a, the third plate body 113a and the fourth plate body 114a, and are interposed between the first plate body 111a and the second plate body between the bodies 112a, and between the third plate body 113a and the fourth plate body 114a. The first plate body 111a, the second plate body 112a, the third plate body 113a, the fourth plate body 114a, the fifth plate body 115a and the sixth plate body 116a together form an accommodating space 118a. In this embodiment, the structural rib 117a is located on the second plate body 112a and separates the first air outlets 1100a. The first air outlet 1100a and the second air outlet 1101a are respectively located on two different sides of the casing 110a. For example, in this embodiment, the first air outlet 1100a is located on the second board 112a and the second air outlet 1101a is located on the third board 113a. Compared with the first embodiment, in this embodiment, the second air outlet 1101a is changed from being located on the fourth board 114a to being located on the third board 113a.

The motherboard 120a is disposed in the containing space 118a. The two heat sources 130a, 131a are disposed and electrically connected to the main board 120a. The two fan assemblies 140a, 141a are disposed in the accommodating space 118a and electrically connected to the main board 120a. The heat pipe 145a is in thermal contact with the heat source 130a. The heat pipe 146a is in thermal contact with the heat sources 130a, 131a and the fin sets 150a, 160a. The heat pipe 147a is in thermal contact with the heat sources 130a, 131a and the cooling fin sets 150a, 160a. The heat pipe 148a is in thermal contact with the heat source 131a.

It should be noted that, as shown in FIG. 10, for the adjacent structural ribs 117a and the second air outlet 1101a, the structural ribs 117a have The two inner surfaces 1171a, 1172a of the two first air outlets 1100a, and at least part of the second air outlet 1101a are between an extending surface P1a of the inner surface 1171a and an extending surface P2a of the inner surface 1172a.

The two heat dissipation fin sets 150a, 160a are disposed in the accommodating space 118a of the casing 110a and separated from each other. Since the two cooling fin groups 150a and 160a have similar structures, only the detailed structure and connection relationship of one cooling fin group 150a will be described in detail below. The cooling fin set 150a includes a plurality of first cooling fins 151a and a plurality of second cooling fins 152a. The second heat dissipation fins 152a are interposed between the first heat dissipation fins 151a. The first heat dissipation fins 151a and the second heat dissipation fins 152a are fixed to each other.

Please refer to FIG. 9 and FIG. 12 . FIG. 12 is a schematic cross-sectional view of the electronic device along the section line 12 - 12 in FIG. 9 . Each of the first heat dissipation fins 151a has a first fin air inlet 1510a and a first fin air outlet 1511a communicating with each other. The first heat dissipation fins 151a are respectively exposed to the outside through the first air outlets 1100a and the first fin air outlets 1511a are respectively communicated with the first air outlets 1100a.

Please refer to Figure 8, Figure 13 and Figure 14. FIG. 13 is a schematic cross-sectional view of the electronic device along the section line 13 - 13 in FIG. 9 . FIG. 14 is a perspective view of the second heat dissipation fin of the electronic device in FIG. 8 . Each second fin 152a has a second fin air inlet 1520a and a second fin air outlet 1521a communicating with each other. The second heat dissipation fins 152a are respectively shielded by the structural ribs 117a and are respectively exposed to the outside through the second air outlets 1101a. The second fin air outlets 1521a communicate with the second air outlets 1101a respectively.

In each second heat dissipation fin 152a, the second fin air inlet 1520a is located on a side of the second heat dissipation fin 152a away from the second plate body 112a of the casing 110a. The second fin air outlet 1521a is located on a side of the second heat dissipation fin 152a close to the third plate body 113a of the casing 110a and communicates with one of the second air outlets 1101a. The second heat dissipation fin 152a includes a body 153a, a first protruding plate 154a and a second protruding plate 155a. The first protruding plate 154a and the second protruding plate 155a stand on the same side of the main body 153a and are separated from each other. The first protruding plate 154a is farther away from the third plate body 113a of the casing 110a than the second protruding plate 155a. The first convex plate 154a includes a first extension section 1541a and a second extension section 1542a connected to each other. The first extension section 1541a and the second convex plate 155a jointly form the second fin air inlet 1520a. The second extension section 1542a is connected to a side of the first extension section 1541a close to the second board 112a of the casing 110a. The second extension section 1542a extends from a side connected to the first extension section 1541a toward the third board 113a of the casing 110a and is arc-shaped. A side of the second extension section 1542a away from the first extension section 1541a and the second convex plate 155a jointly form the second fin air outlet 1521a.

As shown in FIG. 14 , in this embodiment, in each of the second heat dissipation fins 152a , the first protruding plate 154a further includes a first tapered segment 1543a and a parallel segment 1544a. The first tapering section 1543a is connected to a side of the first extension section 1541a away from the second extension section 1542a and extends toward the second convex plate 155a. The parallel section 1544a is connected to a side of the first tapering section 1543a away from the first extending section 1541a and is parallel to the first extending section 1541a. The second convex plate 155a includes a parallel section 1551a and a second tapered section 1552a. The second tapering section 1552a is connected to a side of the parallel section 1551a away from the second fin air outlet 1521a and extends toward the parallel section 1544a. Second tapered section 1552a Together with the parallel section 1544a, the second fin air inlet 1520a is formed. The parallel section 1551a and the second extending section 1542a jointly form the second fin air outlet 1521a. It should be noted that, in other embodiments, the first protruding plate does not need to include the first tapered section 1543a and the parallel section 1544a, and the second protruding plate does not need to include the second tapered section 1552a.

In addition, as shown in FIG. 13 , in this embodiment, in each second heat dissipation fin 152a. The second fin air outlet 1521a extends from a side of the second heat dissipation fin 152a close to the third plate 113a of the casing 110a to a side of the second heat dissipation fin 152a close to the second plate 112a of the casing 110a. However, the present invention is not limited thereto. In other embodiments, the air outlets of the second fins may also be located only on the side of the second heat dissipation fins close to the third board without extending to the side of the second heat dissipation fins close to the second board.

In addition, as shown in FIG. 13 , in this embodiment, the heat pipes 146a, 147a are located on the side of the heat dissipation fin set 150a away from the second air outlet 1101a, so as to improve the space utilization of the accommodating space 118a of the casing 110a.

In addition, as shown in FIG. 12 and FIG. 13, the heat pipe 147a is in thermal contact with the connection between the first extension section 1541a and the second extension section 1542a of the first convex plate 154a of the first heat dissipation fin 151a and each second heat dissipation fin 152a. to increase the contact area between the heat pipe 147a and the second heat dissipation fin 152a. However, the present invention is not limited thereto. In other embodiments, the heat pipe can also be separated at the junction of the first extension section and the second extension section.

According to the electronic device disclosed in the above-mentioned embodiments, since the second fin air outlet of the second heat dissipation fin is connected to the second air outlet, the air entering the second heat dissipation fin from the second fin air inlet of the second heat dissipation fin The hot air will not be blocked by the structural ribs, And it will be discharged from the second air outlet to the outside through the air outlet of the second fin by the guidance of the second fin. In this way, the air outlet rate of the cooling fins can be maintained while the structural ribs are provided to improve the structural strength.

Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.

110: Chassis

112: the second plate body

113: The third plate body

114: The fourth board

115: the fifth board body

117: structural rib

1100: the first air outlet

1101: Second air outlet

150: cooling fin group

151: The first cooling fin

152: Second cooling fin

200: display body

P: pivot axis

Claims (10)

An electronic device, comprising: a main body, comprising: a case, having a plurality of first air outlets and a plurality of second air outlets separated by a plurality of structural ribs, the first air outlets and the first air outlets Two air outlets are respectively located on different sides of the casing; a heat source is arranged in the casing; and a cooling fin group is arranged in the casing and thermally coupled to the heat source, the cooling fin group It includes a plurality of first heat dissipation fins and a plurality of second heat dissipation fins, the second heat dissipation fins are interposed between the first heat dissipation fins, and each of the first heat dissipation fins has a first heat dissipation fin communicating with each other. Fin air inlets and a first fin air outlet, the first fin air outlets are respectively communicated with the first air outlets, each of the second heat dissipation fins has a second fin air inlet and a second fin air outlet communicated with each other A second fin air outlet, the second fin air outlets are respectively communicated with the second air outlets; and a display body, pivotally connected to the casing. The electronic device according to claim 1, wherein the casing includes a first board and a second board, the first board and the second board are opposite to each other, and the display body is pivoted along a pivot axis Connected to the case, the second board is closer to the pivot axis than the first board, and the first air outlets are located on the second board of the case. The electronic device according to claim 2, wherein the casing further includes a third board and a fourth board, the third board and the second board pass through the first board and the second board bodies are connected to each other and interposed between the first board body and the second board body Between the two boards, the third board is closer to the display body than the fourth board, and the second air outlets are located on the fourth board of the casing. The electronic device according to claim 3, wherein in each of the second heat dissipation fins, the air inlet of the second fin is located on the side of the second heat dissipation fin away from the second board of the casing, the The second fin air outlet is located on the side of the second heat dissipation fin close to the fourth board of the casing and communicates with one of the second air outlets. The second heat dissipation fin includes a body, a first A protruding plate and a second protruding plate, the first protruding plate and the second protruding plate stand on the same side of the body and are separated from each other, the first protruding plate is farther away from the fourth protruding plate of the casing than the second protruding plate The plate body, the first convex plate includes a first extension section and a second extension section connected to each other, the first extension section and the second convex plate jointly form the second fin air inlet, and the second extension section The second extension section is connected to one side of the second board body of the casing close to the first extension section, and the second extension section extends from the side connected to the first extension section toward the second board body of the casing body in the shape of arc-shaped, the side of the second extending section away from the first extending section and the second protruding plate jointly form the second fin air outlet. The electronic device as described in claim 4, wherein in each of the second heat dissipation fins, the second fin air outlet extends from the side of the second heat dissipation fin close to the fourth board of the casing to The second cooling fin is close to one side of the second board of the casing. The electronic device according to claim 2, wherein the casing further includes a third board and a fourth board, the third board and the second board pass through the first board and the second board bodies are connected to each other and interposed between the first board body and the second board body Between the two boards, the third board is closer to the display body than the fourth board, and the second air outlets are located on the third board of the casing. The electronic device according to claim 6, wherein in each of the second heat dissipation fins, the air inlet of the second fin is located on the side of the second heat dissipation fin away from the second board of the casing, the The second fin air outlet is located on the side of the second heat dissipation fin close to the third board of the casing and communicates with one of the second air outlets. The second heat dissipation fin includes a body, a first a protruding plate and a second protruding plate, the first protruding plate and the second protruding plate stand on the same side of the body and are separated from each other, the first protruding plate is farther away from the third protruding plate of the casing than the second protruding plate The plate body, the first convex plate includes a first extension section and a second extension section connected to each other, the first extension section and the second convex plate jointly form the second fin air inlet, and the second extension section The second extension section is connected to one side of the second board body of the casing close to the first extension section, and the second extension section extends from the side connected to the first extension section toward the third board body of the casing body in the form of arc-shaped, the side of the second extending section away from the first extending section and the second protruding plate jointly form the second fin air outlet. The electronic device as described in claim 7, wherein in each of the second heat dissipation fins, the air outlet of the second fin extends from the side of the second heat dissipation fin close to the third board of the casing to The second cooling fin is close to one side of the second board of the casing. As the electronic device described in claim 7, the main base body further includes a heat pipe, and the heat pipe is in thermal contact with the first heat dissipation fins and the first extension of the first raised plate of each of the second heat dissipation fins section and the junction of the second extension section. As the electronic device described in claim 3 or 7, the main body further includes a heat pipe, the heat pipe is in thermal contact with the heat dissipation fin set, and the heat pipe is located on the side of the heat dissipation fin set away from the second air outlets .

Images