M392995 五、新型說明： 【新型所屬之技術領域】 =作係有關於__種風扇模組結構，尤指—種設有斜 月，導&結構，根據熱源不同而具有分配散熱風量功能之 風扇模組結構。 【先前技術】 • 一般電子設備（例如為词服器）中通常設置有散孰用之 風f模組，以疏散其内部電路元件（例如為中央處理器晶片） 於貫際運作時所產生的熱量，藉此而保護電子設備内部電 路το件不致因過熱而受到損害。由於不同電路元件之發妖 =度不同’因此目前可見許多利料流結構改變散熱風之 技術。 就習知專利而言，例如中華民國發明專利公開 200912617「電腦」，其係利用導風罩將風量全部導引至令 央處理器’以提高t央處理器散熱效率；又如中華民國新 型專利公告524432「導流式散熱風扇模組」，其係於電子 裝置頂部設置多個風扇’於風扇機組盤設有進氣孔，於該 多個風扇頂部設置V型傾斜狀之導流板’風扇將電子裝置 的熱量向上抽後’熱風可藉由著該導流板之傾斜角度，反 射穿過該機組殼體兩側邊殼壁上之散熱孔，將 去；另如中華民國發明專利公告_617「飼服器改良結 構」’其係利射卜八狀結構縮減風道加速風流量，以提 卻效果。 M392995 惟上述習知技術均未涉及散熱風量分配的概念，以伺 服器而言，大約80%之發熱係來自控制器，而20%之發熱來 自硬碟或其他元件，若可將80%之散熱風量集中於控制器， 20%之散熱風量集中於控制器，方能發揮最佳散熱效果。 【新型内容】 有鑑於習知技術之缺失，本創作提出一種風扇模組結 構’利用斜背式導流結構根據熱源不同而提供分配散熱風 # 量功能。 為達到上述目的，本創作提出一種風扇模組結構，包 含： 至少一風扇，該風扇具有一出風面以及一入風面； 一框架，該框架具有一第一面以及一第二面，該第一 面之頂緣高度低於該第二面之頂緣高度，且該框架之底面 设有透空部，於該第一面及第二面之間具有至少一第二空 間’該第-空間係用以容置該至少一風扇，該風扇之入= 面係朝向該第-面’該風扇之出風面係朝向該第二面； -導流板’係設置於該框架H，料流板具有 一斜度，該斜度係由該框架之頂面向下且朝向該框架之外 部延伸。 為使貴審查委員對於本創作之結構目的和功效有更 進-步之了解與認同，兹配合圖示詳細說明如后。 【實施方式】 M392995 以下將參照隨附之®式來描述本創作為達成目的所使 用的技術手段與功效，而以下圖式所列舉之實施例僅為辅 助說明’以利㈣查委員瞭解’但本f之技術手段並不限 於所列舉圖式。 μ請參閱第-圖至第四圖所示’本創作所提出之一種風 扇模組結構，其包含—框架1G，該框架1()具有—第一面 Y1以及一第二面12 ’於第二面12設有複數第一孔洞121， 第面11係平行於第二面12,第一面π之頂緣1U之高 度低於第二面12之頂緣122之高度，於框架Μ之底面設 有透^ 13一，力第一自u與第二面12之間設有三個隔板 一，省二個隔板14相互平行，且該三個隔板Μ垂直於第 -面11及第二面12 ’於該三個隔板14設有複數第二孔洞 该三個隔板14與該第一面11及第二面12形成二第 一空間j5’每一第一空間15係用以提供設置風扇2〇(如第 四圖所不）’於本實施例中，每H間15可設置二具 羽20母框架可设置四具風扇，風扇具有一入 j面21以及一出風面22，入風面21係朝向框架1〇之第 面丨1 ’出風面22則朝向框架1〇之第二面12。 呈^框架10之第一面u設有一導流板3〇,該導流板加 度，該斜度係由框架10之頂面向下且朝向框架 。卩延伸，導流板30之底緣連接於一底座31，於底 =之兩側各設有一足部31卜該足部311係水平延伸1 ^又且^連接於框架10之底面（如第四圖所示），該兩足部 所座與框架1〇之間形成一第二空間33(如第三圖 不，垓第二空間33係與框架10之第一空間15連通， M392995 於導流板30之頂緣連接於一連接座32，連接座32係由一 第一連接板321與一第二連接板322構成，第一連接板321 之底緣係連接於導流板30頂緣，且第一連接板321垂直延 伸一高度，第二連接板322之一側緣連接於第一連接板321 頂緣’且弟二連接板322水平延伸一寬度，於第二連接板 322不連接第一連接板321之一側緣設有一凸緣323，凸緣 323係抵罪設置於框架1 〇之第一面11之頂緣111底部， 導流板30與框架10之間可以螺栓相互鎖合。M392995 V. New description: 【New technical field】=The system has __ type fan module structure, especially the kind of slanting moon, guide & structure, which has the function of distributing heat dissipation according to different heat sources. Fan module structure. [Prior Art] • A general electronic device (for example, a word processor) is usually provided with a wind-fuse module for evacuating its internal circuit components (for example, a central processing unit chip) for continuous operation. The heat, by which the internal circuit of the electronic device is protected from damage due to overheating. Since different circuit components have different degrees of demonization, it is now seen that many benefits of the flow structure change the heat dissipation wind. As far as the patents are concerned, for example, the Republic of China invention patent publication 200912617 "computer", which uses the air hood to guide all the air volume to the central processor's to improve the heat dissipation efficiency of the t-processor; and, for example, the new patent of the Republic of China Announcement 524432 "Conditional Cooling Fan Module", which is provided with a plurality of fans on the top of the electronic device. The fan unit disk is provided with an air inlet hole, and a V-shaped inclined baffle fan is disposed on the top of the plurality of fans. After the heat of the electronic device is drawn upwards, the hot air can be reflected through the cooling holes of the shell walls on both sides of the unit casing by the inclination angle of the deflector; and the Republic of China invention patent announcement _ 617 "Improved structure of the feeding device" 'There is a slashing and octagonal structure to reduce the wind tunnel to accelerate the wind flow to improve the effect. M392995 However, the above-mentioned conventional technologies do not involve the concept of heat dissipation and air distribution. In the case of the server, about 80% of the heat is from the controller, and 20% of the heat comes from the hard disk or other components, if 80% of the heat can be dissipated. The air volume is concentrated on the controller, and 20% of the heat dissipation is concentrated on the controller to achieve the best heat dissipation. [New content] In view of the lack of the prior art, the present invention proposes a fan module structure, which utilizes a hatched backflow structure to provide a distributed heat dissipation function according to different heat sources. In order to achieve the above object, the present invention provides a fan module structure, comprising: at least one fan having an air outlet surface and an air inlet surface; a frame having a first surface and a second surface, The top edge of the first surface is lower than the height of the top edge of the second surface, and the bottom surface of the frame is provided with a transparent portion, and at least a second space between the first surface and the second surface is The space is for accommodating the at least one fan, the inlet of the fan is facing the first surface, and the wind surface of the fan is facing the second surface; the baffle is disposed on the frame H, The flow plate has a slope that extends downward from the top of the frame and toward the exterior of the frame. In order to enable your review committee to have a better understanding and recognition of the structural purpose and efficacy of this creation, please refer to the detailed description of the illustration as follows. [Embodiment] M392995 The technical means and effects used in the present invention for the purpose of achieving the creation will be described below with reference to the accompanying ® formula, and the examples listed in the following figures are only for the aid of the description 'Eli (4) The technical means of this f is not limited to the illustrated figures. μ Please refer to the fan-module structure proposed in the present invention as shown in the first to fourth figures, which includes a frame 1G having a first surface Y1 and a second surface 12' The two sides 12 are provided with a plurality of first holes 121, and the first surface 11 is parallel to the second surface 12, and the height of the top edge 1U of the first surface π is lower than the height of the top edge 122 of the second surface 12 on the bottom surface of the frame There is a through hole 13 , a force first between the u and the second surface 12 is provided with three partitions 1 , the two partitions 14 are parallel to each other, and the three partitions are perpendicular to the first side 11 and the first The two sides 12' are provided with a plurality of second holes in the three partitions 14. The three partitions 14 form a first space j5' with each of the first surface 11 and the second surface 12. The fan 2 is provided (as shown in the fourth figure). In this embodiment, two feathers can be arranged for each of the 15 rooms. The female frame can be provided with four fans. The fan has an input surface j 21 and an air outlet surface. 22, the wind inlet surface 21 faces the first surface of the frame 1〇1' The wind surface 22 faces the second surface 12 of the frame 1〇. The first face u of the frame 10 is provided with a baffle 3, which is increased by the top of the frame 10 facing downwards and towards the frame. The bottom edge of the baffle 30 is connected to a base 31, and each of the two sides of the bottom plate is provided with a foot portion 31. The foot portion 311 is horizontally extended 1 ^ and is connected to the bottom surface of the frame 10 (such as As shown in FIG. 4, a second space 33 is formed between the seat of the two feet and the frame 1 (as shown in the third figure, the second space 33 is connected with the first space 15 of the frame 10, M392995 The top edge of the flow plate 30 is connected to a connecting base 32. The connecting base 32 is formed by a first connecting plate 321 and a second connecting plate 322. The bottom edge of the first connecting plate 321 is connected to the top edge of the deflector 30. The first connecting plate 321 extends vertically to a height, and one side edge of the second connecting plate 322 is connected to the top edge of the first connecting plate 321 and the second connecting plate 322 extends horizontally. The second connecting plate 322 is not connected to the second connecting plate 322. One side edge of the first connecting plate 321 is provided with a flange 323, and the flange 323 is disposed at the bottom of the top edge 111 of the first surface 11 of the frame 1 , and the bolts 30 and the frame 10 can be bolted to each other. .
請參閱第五圖所示，一電子設備4〇具有一機殼41， 本創作^又置於機叙41之上層411，該電子設備主要發 熱元件（例如控制益）设置於機殼41之下層412，該電子設 備40之種類不限，例如可為伺服器，當風扇2〇運轉時， 由於導流板3G之設置，使得散熱風之路徑改變，風扇20 大部分抽取之熱源來自於機殼41之下層412，下層熱源經 由框架10底部之透空部、仓λ前芦ΟΛ . ^ 3進入風扇20 ’較少部分的熱游 則來自於機殼41之上層41 ^ ’由於第一面11之頂緣111 之高度低於第二面12之丁頁绝199 ♦丄— ^ ^ ^ 貝緣122之向度，因此機殼41之 上層411所產生之熱量可由钕 ^ 由弟一面U之頂緣111之上方通 過進入風扇2G，所有熱源再由風扇 面 12送出框架1〇’亦即送出番工^“ ^ 出電子έ又備4〇之機殼41達到散熱 作用，依貫驗驗證’經由兮逡泣鉍 亥導流板30之作用，風扇20所 抽取之熱源大約有80%來白秘姐w nn/ °水自機殼41之下層412，大約20% 來自機殼41之上層411 μ 根據此一特點可知，本創作之斜 背式導流板30設計，尤谪 如 電子設備40為伺服器，p丨丨 」機设41之上層411通常設置硬 M392995 碟，機殼41之下層412通常設置控制器，而控制器發熱程 度通常會高於硬碟。 請參閱第六圖所示，其係於電子設備40上並排設有二 組本創作之風扇模組，於圖中將風扇省略，以利說明散熱 " 風之路徑，於正常情況下，二組風扇模組均可發揮散熱功 能，若是其中該框架10A内之風扇發生故障而無法作用 時，此時，可藉由框架10内之風扇發揮作用，由於框架 10、10A内之隔板14、14A均設有第二孔洞141、141A，因 φ 此，熱量可由隔板14A之第二孔洞141A被抽取通過隔板 14之第二孔洞141，進入正常運作之該風扇模組之框架10 内，再一併由該框架10之第二面12之第一孔洞121排出。 請參閱第七圖所示，其顯示將二組本創作設置於電子 設備40内，且於框架10、10A底部設有一底板50，於底 板50設有複數第三孔洞51，圖示框架10係被完全安裝於 機殼41内之狀態，另一框架10A則約有一半被抽出機殼 41，必須明的是，當框架10被完全安裝於機殼41内，底 'φ 板50之第三孔洞51係對應於框架10底面之透空部13(顯 - 示於第三圖），而被抽出約一半之框架10Α，底板50之第 三孔洞51則可對應於框架10Α底面之第二空間（可參考第 三圖所示第二空間33)，根據此一特點，當框架10Α被抽 出機殼41進行維修，例如更換風扇20Α時，機殼41下層 412所產生之熱量仍可透過底板50的第三孔洞51，再通過 框架10Α底面之第二空間被排出，不致產生散熱不良的狀 況，同理，若僅設置一組風扇模組時，也可搭配尺寸較小 之底板，或可每一組風扇模組搭配一底板。 M392995 ...，.示上所ι丄莰出之風扇模組結構，其斜背式 導流板結構設計，可根據埶馮 ^ , θ ^據熱源不同而具有分配散熱風量功 心本創作#具有結構新難及功效上之增進。 淮以上所述者，僅為本創每 之限定本創作所實施之範圍人 =之均等變化與修飾，皆應二=專利範 乾圍内’謹請貴審查委員明鑑，並祈惠：乍=㈣之 仃至禱。Referring to FIG. 5, an electronic device 4A has a casing 41, which is placed on the upper layer 411 of the machine 41. The main heating element of the electronic device (for example, control benefit) is disposed on the lower layer of the casing 41. 412, the type of the electronic device 40 is not limited, for example, it may be a server. When the fan 2 is running, the path of the heat dissipation wind is changed due to the setting of the baffle 3G, and the heat source of the fan 20 is mostly extracted from the casing. 41 lower layer 412, the lower layer heat source through the bottom of the frame 10 through the hollow portion, the warehouse λ front reed. ^ 3 into the fan 20 'the lower part of the hot swim from the upper layer 41 of the casing 41 ^ ' due to the first side 11 The height of the top edge 111 is lower than that of the second surface 12, and the heat generated by the upper layer 411 of the casing 41 can be generated by the top of the U side. Above the edge 111, by entering the fan 2G, all the heat sources are sent out of the frame 1 by the fan face 12, that is, the fan is sent out, and the case 41 of the electronic device is further cooled. The role of the weeping sea deflector 30, the heat source extracted by the fan 20 About 80% of the white secret sister w nn / ° water from the lower layer 412 of the casing 41, about 20% from the upper layer of the casing 41 411 μ According to this feature, the design of the oblique back deflector 30, The electronic device 40 is a server, and the upper layer 411 of the chassis 41 is usually provided with a hard M392995 disk. The lower layer 412 of the casing 41 is usually provided with a controller, and the controller usually generates a higher degree of heat than the hard disk. Please refer to the sixth figure, which is arranged on the electronic device 40 and has two sets of fan modules of the present invention. The fan is omitted in the figure to illustrate the heat dissipation path of the wind. Under normal circumstances, The fan module can function as a heat dissipation function. If the fan in the frame 10A fails and cannot function, at this time, the fan in the frame 10 can function, because the partition 14 in the frame 10, 10A, Each of the 14A is provided with a second hole 141, 141A. The heat can be extracted from the second hole 141 of the partition 14 through the second hole 141 of the partition 14A into the frame 10 of the normally operating fan module. Further, it is discharged from the first hole 121 of the second surface 12 of the frame 10. Please refer to the seventh figure, which shows that two sets of the original creations are disposed in the electronic device 40, and a bottom plate 50 is disposed at the bottom of the frame 10, 10A, and a plurality of third holes 51 are provided in the bottom plate 50, and the frame 10 is illustrated. In the state of being completely installed in the casing 41, about half of the other frame 10A is taken out of the casing 41. It must be understood that when the frame 10 is completely mounted in the casing 41, the bottom of the bottom plate φ plate 50 The hole 51 corresponds to the hollow portion 13 of the bottom surface of the frame 10 (shown in the third figure), and about half of the frame 10 is extracted, and the third hole 51 of the bottom plate 50 corresponds to the second space of the bottom surface of the frame 10. (Refer to the second space 33 shown in the third figure). According to this feature, when the frame 10 is pulled out of the casing 41 for maintenance, for example, when the fan 20 is replaced, the heat generated by the lower layer 412 of the casing 41 can still pass through the bottom plate 50. The third hole 51 is discharged through the second space of the bottom surface of the frame 10, so that the heat dissipation is not caused. Similarly, if only one set of fan modules is provided, the bottom plate can be matched with a smaller size, or each can be used. A set of fan modules is combined with a bottom plate. M392995 ...,. Shows the fan module structure of the 丄莰 所 , , , 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 风扇 风扇 风扇 风扇 风扇 风扇 风扇It has the new structure and the improvement of its efficacy. The above mentioned Huai above is only the scope of the implementation of this creation. The equal change and modification of the person = all should be two = patent Fan Qianwei 'please ask your review committee Ming Jian, and pray: 乍 = (4) After the prayer.
ESI 9 M392995 【圖式簡單說明】 第一圖係本創作之導流板搭配框架之立體結構示音圖 構示意圖。 結構立體示意 第二圖係本創作之導流板結合框架之立體乡士 第三圖係本創作之導流板結合框架之底部 圖。 第四圖係本創作之導流板結合框架 體結構示意圖。 且框架内設置風扇 之立ESI 9 M392995 [Simple description of the diagram] The first diagram is a schematic diagram of the three-dimensional structure of the deflector of the creation with the frame. Stereoscopic structure of the structure The second picture shows the three-dimensional homesmen of the deflector of the creation combined with the frame. The third picture shows the bottom of the frame with the guide plate of the creation. The fourth picture is a schematic diagram of the structure of the deflector combined with the frame of the present invention. And set the fan in the frame
第五圖係本創作之散熱風路徑之示意圖。 組失效時之散熱風路徑 第六圖係本創作設置二組且其中一 示意圖。 第七圖係H本創作設置於底板之立體結構示意圖。 【主要元件符號說明】 10、10A-框架 II -第一面 III -第一面之頂緣 12- 第二面 121- 第一孔洞 122- 第二面之頂緣 13- 透空部 14、14A-隔板 141、141A-第二孔洞 15-第一空間 M392995 20、20A_風扇 21_入風面 22_出風面 30- 導流板 31- 底座 311-足部 32- 連接座 321- 第一連接板 322- 第二連接板 3 2 3 _凸緣 33- 第二空間 40- 電子設備 41- 機殼 411- 機殼上層 412- 機殼下層 5 0 -底板 51 -第三孔洞 ί siThe fifth picture is a schematic diagram of the heat dissipation wind path of the present creation. The heat dissipation wind path when the group fails. The sixth figure is a set of two sets of this creation and one of them. The seventh figure is a schematic diagram of the three-dimensional structure of the creation of the bottom plate. [Description of main component symbols] 10, 10A-frame II - first face III - top edge 12 of the first face - second face 121 - first hole 122 - top edge 13 of the second face - through portion 14, 14A - partition 141, 141A - second hole 15 - first space M392995 20, 20A_fan 21_ wind inlet 22_ wind direction 30 - deflector 31 - base 311 - foot 32 - connection seat 321 - A connecting plate 322 - a second connecting plate 3 2 3 _ flange 33 - a second space 40 - an electronic device 41 - a casing 411 - a casing upper layer 412 - a lower casing 5 0 - a bottom plate 51 - a third hole ί si