TWM356102U - Heat dissipation fins - Google Patents

Heat dissipation fins Download PDF

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Publication number
TWM356102U
TWM356102U TW097222662U TW97222662U TWM356102U TW M356102 U TWM356102 U TW M356102U TW 097222662 U TW097222662 U TW 097222662U TW 97222662 U TW97222662 U TW 97222662U TW M356102 U TWM356102 U TW M356102U
Authority
TW
Taiwan
Prior art keywords
guide
fin
notch
heat sink
heat
Prior art date
Application number
TW097222662U
Other languages
Chinese (zh)
Inventor
Yue-Ping Dai
meng-hong Ke
Jun Chen
Original Assignee
Tai Sol Electronics Co Ltd
Suzhou Taisol Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tai Sol Electronics Co Ltd, Suzhou Taisol Electronics Co filed Critical Tai Sol Electronics Co Ltd
Priority to TW097222662U priority Critical patent/TWM356102U/en
Priority to US12/379,900 priority patent/US20100147493A1/en
Publication of TWM356102U publication Critical patent/TWM356102U/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

M356102 五、新型說明： 【新型所屬之技術領域】 #創作係與散熱裝置有關 果的一種散熱鰭片。 【先前技術】 按’習知之層疊型散熱器 特別是指具有較佳散熱敦 其是以多片散熱鰭片互相 取而该等散熱縛片並且有一以上的熱管穿過，除 此之外’各該散熱鰭片呈平板狀而沒有其他的流道設計， 亚且在該等散熱鰭片的一側設置一風扇，利用風扇使氣流 通過該等散熱鰭>{之間，藉以把該等散熱鰭片上的熱帶 走，達到散熱的效果。 上述的習知散熱器在使用時，各該散熱鰭月表面的溫 度分佈實際上並科勻，在靠近該熱管的位置溫度較高， 而愈遠離該熱管的位置則溫度就愈低。而上述沒有其他流 道設計的散熱鰭片，在氣流經過散熱鰭片之間的空隙時， 並無法將氣流有效的導引到溫度較高的地方，而是直接通 過’其散熱效率有向上提昇的空間。 美國公開第US 2008/0017350號專利，揭露了 一種在 每個鰭片上設置複數凸起，並且相疊置的一種散熱器，其 可對進入鰭片間的氣流造成擾流效果，進而提昇散熱效 率。然而，此種方式僅只於擾流，並非將氣流導向散熱鰭 片上的高溫位置。 M356102 【新型内容】 本創作之主要目的在於提供—種散熱鰭片，其可在氣 流進入時，將氣流導引至散熱鰭片上高溫的位置，達到更 好的散熱效果。 緣是，為了達成前述目的，依據本創作所提供之一種 散熱鰭片’包含Πϋ本體，呈片狀，於賴片本體 的兩側分別具有一高溫區域，且該鰭片本體於中間具有一M356102 V. New description: [New technology field] #Creation system is a type of heat sink fin. [Prior Art] According to the conventional laminated heat sink, in particular, it has a better heat dissipation, which is obtained by taking a plurality of heat radiating fins and the heat radiating fins and having more than one heat pipe passing through, The heat dissipating fins are flat and have no other flow channel design. A fan is disposed on one side of the heat dissipating fins, and a fan is used to pass airflow through the heat dissipating fins. The tropical fins on the fins achieve the effect of heat dissipation. In the above-mentioned conventional heat sink, the temperature distribution of each of the heat-dissipating fin surfaces is substantially uniform, the temperature is higher near the heat pipe, and the temperature is lower as the distance from the heat pipe is further. The above-mentioned heat-dissipating fins without other flow channel design can not effectively guide the airflow to a higher temperature place when the airflow passes through the gap between the heat-dissipating fins, but directly through the 'the heat-dissipating efficiency is improved upwards. Space. U.S. Patent No. US 2008/0017350 discloses a heat sink which is provided with a plurality of protrusions on each fin and which are stacked one on another, which can cause a turbulence effect on the airflow entering the fins, thereby improving heat dissipation efficiency. . However, this approach is only for turbulence, and does not direct the airflow to a high temperature location on the heat sink fins. M356102 [New Content] The main purpose of this creation is to provide a kind of heat dissipation fin, which can guide the airflow to the high temperature position on the heat dissipation fin when the airflow enters, so as to achieve better heat dissipation effect. In order to achieve the above object, a heat dissipating fin ′ according to the present invention comprises a cymbal body having a sheet shape, each having a high temperature region on both sides of the lamella body, and the fin body having a middle portion in the middle

氣流區域可供氣流通過；該鰭片本體於該氣流區域的位置 具有至少—導引壁’該導引壁具有财高度，且該導引壁 具有—前端朝向該鰭片本體的前方，以及由該前端向兩側 且向後延伸預定長度的二斜導部。藉此，可將由外部進入 的氣流導引至散熱鰭片上高溫的位置，進而轴更好的散 熱效果。 【實施方式】 為了詳細說明本創作之構造及特點所在，茲舉以下之 四較佳實施例並配合圖式說明如后，其中： 之一種 如第一圖所示，本創作第一較佳實施例所提供 散熱鰭片10，主要具有： 別呈有^本體11 ’呈片狀’於销片本體11的兩側分 另J具有一南溫區域12,各該高溫區域12設 121 ’各該穿孔用以供一熱管穿過，該鰭片 於中間具有-氣流區域18可供錢通過，該鰭片本體^ 沿各該穿孔m關緣係垂直向外延伸預定高度的;壁 M356102 13。 該鰭片本體11於該氣流區域18的位置具有一導引壁 14，該導引壁14具有預定高度，且該導引壁14具有一前 端141朝向該鰭片本體11的前方’該導引壁14並且具有 由該前端141向兩侧且向後延伸預定長度的二斜導部 142，各該斜導部142的末端與該鰭片本體Π的兩側邊緣 相隔預定距離，也與對應側的穿孔121相隔預定距離。且 該導引壁14於其前端141具有一缺口 143。 鲁 以下說明本創作第一實施例之使用狀態： 如第二圖所示，本創作（即散熱鰭片10)在使用時，係 先以多片散熱鰭片10彼此相疊置，且將複數熱管91穿過 該等穿孔121，並貼接於該等周壁13。該等熱管91實際上 係用來傳遞一發熱元件(圖中未示)所發出的熱能。 在實際使用時’藉由熱管91的高均溫性，該等熱管 91可將該發熱元件所發出的熱能快速的傳導至該等散熱 • 鰭片10上，因此該等散熱鰭片10上最高溫的位置即在即' 該鰭片本體11與該熱管91接觸的位置附近(即在該等高溫 區域12内）。如第三圖所示，氣流的路徑及流向係以弧狀 的箭頭表示之，在氣流由該鰭片本體u的前方吹入時，大 部份的氣流即會由該導引壁14的前端141分開，並且沿著 該=斜導部142向兩侧並且向後斜向移動，進而移動至該 等穿孔121附近(即熱管91附近），再向外流出。換言之， 進入的氣流會被導引至散熱鰭片1()上溫度較高的位°置，進 而達到更好的散熱效果。另外，還有少部份的氣流會由該 M356102 缺口 143通過而向後流出。 請再參閱第四圖至第六圖，本創作第二較佳實施例所 提供之一種散熱鰭片20,主要概同於前揭第—實施例，不 同之處在於： 該鰭片本體2i於該氣流部位28中央具有一凸起部位 26(本實施例中該凸起部位26係向下凸），該導引壁24形 成於該凸起部位26的前方，且該導引壁24於該二斜導部 242的末端再向後且相向延伸並且結合，而圍合於該凸起 鲁 部位26並呈水滴狀。 本第二實施例之使用方式亦概同於前揭第一實施例， 容不贅述。在功效上則因為導向兩側的氣流到該導引壁24 後方時又再度會合，因此可使得整體導流效果更佳，具有 減少嗓音的進一步功效’且亦有助於讓氣流由後方排出。 明再參閱第七圖，本創作第三較佳實施例所提供之一 種散熱鰭片30，主要概同於前揭第—實施例，不同之處在 於： 參 該鰭片本體31於該氣流區域38具有複數導引壁34， 該荨‘引壁34係前後排列，各該導引壁34的前端具有一 缺口 343，且位於前方的導引壁34的缺口 343係大於後方 的導引壁34的缺口 343。且該鰭片本體31在後方的位置 係設有至少—後穿孔321，該後穿孔321係位於最後方的 導引壁34的缺口 343後方。 本第三實施例的使用狀態大致概同於前揭第一實施 例，不同之處在於，進入的氣流遇到最前方的導引壁34 6 M356102 時，會有部份的氣流受到斜導部342的引導而向雨側真向 後斜向移動，且有部份的氣流會由最前方的該導弓丨璧34 的缺口 343通過。接著，會再遇到較後方的導引壁34 ’同 樣的會有部份的氣流受到斜導部342的引導而斜向移動， 且同樣的會有部份的氣流從較後方的該導引壁34的缺口 343通過，而吹向設於該後穿孔321附近(即熱管附近）。而 前方缺口 343較後方缺口 343較大的設計，可容許較多的 前方空氣吹到後方，有助於後方的散熱效果。 由此可知，本第三實施例同樣的可導引氣流至對應的 較咼溫的位置，可具有較佳的散熱效果。 請再參閱第八圖，本創作第四較佳實施例所提供之一 種散熱鰭片40，主要概同於前揭第三實施例，不同之處在 於： 該鰭片本體41於該氣流區域48具有複數導引壁44， 該等導引壁44係前後排列。其中除了位於最後方的導引壁 44不具有缺口外’其餘的各該導引壁44的前端具有一缺 口 443 ’且位於前方的導引壁44的缺口 443係大於後方的 導引壁44的缺口 443。 本第四實施例的使用狀態大致概同於前揭第三實施 例’不同之處在於，最後方的導引壁44是沒有缺口的，因 此氣流流至最後方的導引壁44前時，會直接被導引向兩側 向後斜向流出。 由此可知，本第四實施例同樣的可導引氣流至對應的 較高溫的位置，可具有較佳的散熱效果。 M356102 5月再參閱第九圖，本創作第五較佳實施例所提供之一 種散熱韓片50，主要概同於前揭第—實施例，不同之處在 於： δ亥鰭片本體51兩側係配合連接—導熱板57，該二導 熱板57係可用以連接發熱元件（圖中未示），且可以至少一 熱管91相連接。 藉此，該發熱元件所產生的熱能即透過該二導熱板57 源傳導到a亥鰭片本體的兩側，而使得該鰭片本體51上 最高溫的位置即在即該鰭片本體51與該二導熱板57接觸 的位置附近(即在該等高溫區域52内）。而透過該鰭片本體 51上的導引壁54的導引，可將進入的氣流導引至該鰭片 本體51兩側的高溫區域52，進而達到更好的散熱效果。 由此可知，本第五實施例同樣的可導引氣流至對應的 較高溫的位置，可具有較佳的散熱效果。 綜上可知’本創作可在氣流進入時，將氣流導引至散 熱鰭片上向溫的位置，使氣流能帶走更多的熱能，達到更 好的散熱效果。 8 M356102 【圖式簡單說明】 第一圖係本創作第一較佳實施例之立體圖。 第二圖係本創作第一較佳實施例之實施狀態圖。 第三圖係本創作第一較佳實施例之氣流路徑說明圖。 第四圖係本創作第二較佳實施例之立體圖。 第五圖係本創作第二較佳實施例之實施狀態圖。 第六圖係本創作第二較佳實施例之氣流路徑說明圖。 第七圖係本創作第三較佳實施例之俯視圖，同時顯示 氣流路徑。 第八圖係本創作第四較佳實施例之俯視圖，同時顯示 氣流路徑。 第九圖係本創作第五較佳實施例之實施狀態圖。 M356102 【主要元件符號說明】 10散熱鰭片 π鰭片本體 12高溫區域 121穿孔 13周壁 14導引壁 141前端 142斜導部 20散熱鰭片 143 缺口 18氣流區域 21鰭片本體 24導引壁 242斜導部 • 26凸起部位 30散熱鰭片 2 8氣流區域 31鰭片本體 321後穿孔 34導引壁 342斜導部 40散熱鰭片 343 缺口 38氣流區域 41鰭片本體 4 8氣流區域 50散熱鰭片 44導引壁 443 缺口 • 51鰭片本體 57導熱板 91熱管 52尚溫區域 54導引壁 10The airflow region is adapted to pass airflow; the fin body has at least a guide wall at a position of the airflow region, the guide wall has a wealth, and the guide wall has a front end facing the front of the fin body, and The front end extends to the two sides and extends rearwardly by a predetermined length of the two oblique guides. Thereby, the airflow entering from the outside can be guided to a high temperature position on the fins, thereby further better heat dissipation of the shaft. [Embodiment] For the detailed description of the structure and features of the present invention, the following four preferred embodiments are described with reference to the following description, wherein: one of the first preferred embodiments of the present invention is as shown in the first figure. The heat dissipating fins 10 are mainly provided with: the body 11' is in the form of a sheet, and the two sides of the pin body 11 have a south temperature region 12, and each of the high temperature regions 12 is 121' The perforation is for a heat pipe to pass through, and the fin has a gas flow region 18 in the middle for the passage of money, and the fin body extends vertically outward along the perforation m to a predetermined height; the wall M356102 13. The fin body 11 has a guiding wall 14 at a position of the air flow region 18, the guiding wall 14 has a predetermined height, and the guiding wall 14 has a front end 141 facing the front of the fin body 11 The wall 14 has two inclined guide portions 142 extending from the front end 141 to both sides and rearward by a predetermined length, and the ends of the inclined guide portions 142 are spaced apart from both side edges of the fin body 预定 by a predetermined distance, and also corresponding to the side The perforations 121 are separated by a predetermined distance. And the guide wall 14 has a notch 143 at its front end 141. The following describes the state of use of the first embodiment of the present invention: As shown in the second figure, the present invention (ie, the heat dissipation fins 10) is first stacked with a plurality of heat dissipation fins 10, and will be plural The heat pipe 91 passes through the perforations 121 and is attached to the peripheral walls 13. The heat pipes 91 are actually used to transfer heat energy from a heat generating component (not shown). In actual use, by the high temperature uniformity of the heat pipes 91, the heat pipes 91 can quickly transfer the heat energy generated by the heat generating components to the heat sink fins 10, so that the heat sink fins 10 are the highest. The warm position is in the vicinity of the position where the fin body 11 is in contact with the heat pipe 91 (i.e., in the high temperature region 12). As shown in the third figure, the path and flow direction of the airflow are indicated by arc-shaped arrows. When the airflow is blown in front of the fin body u, most of the airflow is from the front end of the guide wall 14. The 141 is separated and moved obliquely to both sides and backwards along the = oblique guide 142, and then moved to the vicinity of the perforations 121 (i.e., near the heat pipe 91), and then flows outward. In other words, the incoming airflow is directed to the higher temperature position on the heat sink fin 1() to achieve better heat dissipation. In addition, a small portion of the airflow will pass through the M356102 notch 143 and will flow backward. Referring to the fourth to sixth embodiments, a heat dissipation fin 20 according to the second preferred embodiment of the present invention is mainly similar to the foregoing first embodiment, except that: the fin body 2i is The central portion of the air flow portion 28 has a convex portion 26 (the convex portion 26 is downwardly convex in this embodiment), and the guiding wall 24 is formed in front of the convex portion 26, and the guiding wall 24 is The ends of the two oblique guides 242 are further rearward and opposite to each other and joined, and are enclosed in the convex portion 26 and have a drop shape. The manner of use of the second embodiment is also the same as that of the first embodiment, and will not be described again. In terms of efficacy, since the airflow on both sides of the guide reaches the rear of the guide wall 24 again, the overall flow guiding effect is better, and the further effect of reducing the noise is reduced, and the airflow is also allowed to be discharged from the rear. Referring to the seventh embodiment, a heat dissipation fin 30 according to the third preferred embodiment of the present invention is mainly similar to the foregoing first embodiment, except that: the fin body 31 is in the airflow region. 38 has a plurality of guiding walls 34, which are arranged one behind the other, each front end of the guiding wall 34 has a notch 343, and the notch 343 of the guiding wall 34 at the front is larger than the guiding wall 34 at the rear. The gap 343. The fin body 31 is provided with at least a rear through hole 321 at a rear position, and the rear through hole 321 is located behind the notch 343 of the last guide wall 34. The use state of the third embodiment is substantially the same as that of the first embodiment described above, except that when the incoming airflow encounters the foremost guide wall 34 6 M356102, part of the airflow is subjected to the oblique guide portion. The guide 342 is moved obliquely backward to the rain side, and a part of the airflow is passed by the notch 343 of the foremost guide bow 34. Then, the same part of the airflow is again encountered by the rear guide wall 34', and the airflow is obliquely guided by the inclined guide 342, and the same part of the airflow is guided from the rear. The notch 343 of the wall 34 passes, and the blowing direction is provided near the rear perforation 321 (i.e., near the heat pipe). The design of the front notch 343 larger than the rear notch 343 allows more front air to be blown to the rear, which contributes to the rear heat dissipation effect. Therefore, it can be seen that the same steerable airflow to the corresponding relatively warm position in the third embodiment can have a better heat dissipation effect. Referring to the eighth embodiment, a heat dissipation fin 40 according to the fourth preferred embodiment of the present invention is mainly similar to the third embodiment. The difference is that the fin body 41 is in the airflow region 48. There are a plurality of guide walls 44 which are arranged one behind the other. The front end of each of the guide walls 44 has a notch 443 ', and the notch 443 of the guide wall 44 at the front is larger than the guide wall 44 of the rear, except that the guide wall 44 at the rear end does not have a notch. Gap 443. The use state of the fourth embodiment is substantially the same as that of the third embodiment described above. The last guide wall 44 is not nicked, so that when the airflow flows to the front guide wall 44, Will be directly directed to the sides to the back obliquely out. Therefore, the fourth embodiment can guide the airflow to the corresponding higher temperature position, and has better heat dissipation effect. M356102 In May, referring to the ninth figure, a heat-dissipating Korean film 50 provided by the fifth preferred embodiment of the present invention is mainly similar to the foregoing first embodiment, except that: δ sea fin body 51 on both sides The heat-conducting plate 57 is used to connect the heat-dissipating plates 57 to connect the heat-generating components (not shown), and at least one heat pipe 91 can be connected. Thereby, the thermal energy generated by the heating element is transmitted to the two sides of the a-half fin body through the two heat conducting plates 57, so that the highest temperature position on the fin body 51 is the fin body 51 and the The position where the two heat conducting plates 57 are in contact (i.e., in the high temperature regions 52). Through the guiding of the guiding wall 54 on the fin body 51, the incoming airflow can be guided to the high temperature region 52 on both sides of the fin body 51, thereby achieving better heat dissipation. Therefore, it can be seen that the same steerable airflow to the corresponding higher temperature position in the fifth embodiment can have a better heat dissipation effect. In summary, this creation can guide the airflow to the warming position of the fins when the airflow enters, so that the airflow can take more heat energy and achieve better heat dissipation. 8 M356102 [Simple Description of the Drawings] The first drawing is a perspective view of the first preferred embodiment of the present creation. The second drawing is an implementation state diagram of the first preferred embodiment of the present creation. The third figure is an airflow path explanatory diagram of the first preferred embodiment of the present creation. The fourth drawing is a perspective view of a second preferred embodiment of the present creation. The fifth drawing is an implementation state diagram of the second preferred embodiment of the present creation. The sixth drawing is an airflow path explanatory diagram of the second preferred embodiment of the present invention. The seventh drawing is a plan view of the third preferred embodiment of the present creation, showing the air flow path. The eighth drawing is a plan view of the fourth preferred embodiment of the present creation, showing the air flow path at the same time. The ninth drawing is an implementation state diagram of the fifth preferred embodiment of the present creation. M356102 [Description of main component symbols] 10 heat sink fin π fin body 12 high temperature region 121 perforation 13 peripheral wall 14 guide wall 141 front end 142 oblique guide portion 20 heat sink fin 143 notch 18 air flow region 21 fin body 24 guide wall 242 Oblique guides • 26 raised parts 30 heat sink fins 2 8 airflow area 31 fin body 321 rear perforation 34 guide wall 342 oblique guide 40 heat sink fins 343 notch 38 airflow area 41 fin body 4 8 airflow area 50 heat dissipation Fin 44 guiding wall 443 notch • 51 fin body 57 heat conducting plate 91 heat pipe 52 temperature area 54 guiding wall 10

Claims (1)

M356102 /、、申5青專利範圍： l種散熱鰭片，包含有： 一籍片本，σ u & 一、 王片狀’於該鰭片本體的兩側分別具有 冋'皿區域’且朗片本體於中間具有-氣流區域可供氣 流通過； 乂鰭片本體於該氣流區域的位置具有至少一導引壁， 4導引壁2有預定高度’且該導引壁具有-前端朝向該韓 片本體的刚方，以及由該前端向兩側且向後延伸預定長度 的二斜導部。 2. 依據申請專利範圍第1項所述之散熱鰭片，其中： I嗜片本體中央具有—凸起部位，該導引㈣成於該凸起 部位前方。 3. 依據申請專利範圍第2項所述之散熱鰭片，其中： 该凸起部位呈水滴狀。 4. 依據申請專利範圍第1項所述之散熱鰭片，其中： 各該斜導部的末端與該鰭片本體的兩側邊緣相隔預定距 離。 5. 依據申請專利範圍第1項所述之散熱鰭片，其中： 該導引壁的前端係具有一缺口。 6·依據申請專利範圍第1項所述之散熱鰭片，其中： 该鰭片本體於該氣流區域具有複數導引壁，該等導引壁係 =後排列，各該導引壁的前端具有—缺口，且位於前方的 導3丨壁的缺口係大於後方的導引壁的缺口，且該韓片本體 在後方的位置係設有至少一後穿孔，該後穿孔係位於最後 M356102 方的導引壁的缺口後方。 7. 依據申請專利範圍第1項所述之散熱鰭片，其中： 該鰭片本體於該氣流區域具有複數導引壁，該等導引壁係 前後排列，其中除了位於最後方的導引壁之外，其餘的各 該導引壁的前端具有一缺口，且位於較前方的導引壁的缺 口係大於較後方的導引壁的缺口。 8. 依據申請專利範圍第1項所述之散熱鰭片，其中： 該二高溫區域係分別設有一以上的穿孔，各該穿孔用以供 一熱管穿過。 9. 依據申請專利範圍第8項所述之散熱鰭片，其中： 該鰭片本體沿各該穿孔的周緣係垂直向外延伸預定高度的 一周壁。 10. 依據申請專利範圍第1項所述之散熱鰭片，其中： 該鰭片本體兩側中的至少一側係配合連接一導熱板。 12M356102 /, Shen 5 Qing patent range: l kinds of heat sink fins, including: a piece of film, σ u & 1, king piece shape 'on both sides of the fin body has a ''zone area' and The slab body has a flow region in the middle for the airflow to pass through; the 乂 fin body has at least one guide wall at the position of the airflow region, 4 the guide wall 2 has a predetermined height 'and the guide wall has a front end facing the The rigid side of the Korean body and the two oblique guides extending from the front end to the both sides and rearward by a predetermined length. 2. The heat sink fin according to claim 1, wherein: the middle of the body of the tablet has a convex portion, and the guide (4) is formed in front of the convex portion. 3. The heat sink fin according to item 2 of the patent application scope, wherein: the convex portion has a drop shape. 4. The heat sink fin according to claim 1, wherein: the end of each of the oblique guide portions is spaced apart from a side edge of the fin body by a predetermined distance. 5. The heat sink fin according to claim 1, wherein: the front end of the guide wall has a notch. The heat dissipating fin according to claim 1, wherein: the fin body has a plurality of guiding walls in the airflow region, the guiding walls are rear arranged, and the front ends of the guiding walls have a notch, and the notch of the guide wall located at the front is larger than the notch of the rear guide wall, and the Korean body is provided with at least one rear perforation at the rear position, and the rear perforation is located at the last M356102 side guide Behind the gap of the wall. 7. The heat sink fin according to claim 1, wherein: the fin body has a plurality of guide walls in the air flow region, the guide walls are arranged in front and rear, wherein the guide wall is located at the last side. In addition, the front ends of the other guiding walls have a notch, and the notch of the guiding wall at the front side is larger than the notch of the rear guiding wall. 8. The heat dissipating fin according to claim 1, wherein: the two high temperature regions are respectively provided with one or more perforations, and each of the perforations is for a heat pipe to pass through. 9. The heat sink fin of claim 8, wherein: the fin body extends vertically outward along a circumference of each of the perforations to a peripheral wall of a predetermined height. 10. The heat sink fin according to claim 1, wherein: at least one of the two sides of the fin body is coupled to a heat conducting plate. 12
TW097222662U 2008-12-17 2008-12-17 Heat dissipation fins TWM356102U (en)

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TWI736460B (en) * 2020-10-30 2021-08-11 華擎科技股份有限公司 Heat dissipation fin and heat dissipation module
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Family Cites Families (4)

* Cited by examiner, † Cited by third party
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US20060207747A1 (en) * 2005-03-18 2006-09-21 Cpumate Inc. Isothermal plate heat-dissipating device
US20070187082A1 (en) * 2006-02-14 2007-08-16 Li-Wei Fan Chiang Structural enhanced heat dissipating device
US20080017350A1 (en) * 2006-07-21 2008-01-24 Foxconn Technology Co., Ltd. Heat sink

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CN106200226A (en) * 2014-12-22 2016-12-07 中强光电股份有限公司 Heat radiation module with turbulent flow structure
US10114274B2 (en) 2014-12-22 2018-10-30 Coretronic Corporation Heat dissipating module having turbulent structures
CN106200226B (en) * 2014-12-22 2018-11-02 中强光电股份有限公司 Heat radiation module with turbulent flow structure
US10281807B2 (en) 2017-01-12 2019-05-07 Coretronic Corporation Projector, heat dissipation module, and heat dissipation fin set

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