201016118 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別係指一種具有良好散 熱效果之散熱裝置。 【先前技術】 隨著電子產業不斷發展，電子元件（特別係中央處理 器）運行速度和整體性能於不斷提升，隨之其發熱量也於 ❹不斷增加。為使電子元件能正常工作，業界一般於電子元 件上设置散熱器對其進行散熱。通常，該散熱器包括一與 發熱電子元件貼設之實心之底座，由底座向上延伸出之複 數散熱片，為加強散熱還設有連接底座與散熱片之熱管， 以將發熱電子元件之熱量更快地傳至散熱片。然而，由於 散熱器之底座為一實心體，發熱電子元件產生之熱量易集 中於底座之中央處，不能快速均勻分佈於整個底座上 利於熱量均勻傳至每-散熱片。此外，於散熱器整體體積 ©不變之情況下，習知結構之散熱片所能提供之散熱面積受 到很大限制，從而散熱效率較低。因此，需要提供一種散 熱效率較高之散熱裝置。 【發明内容】 有蓉於此冑必要^:供一種散熱效率較高之散熱裝置。 -種散熱裝置，用以對二相鄰之發熱電子元件散熱， 包括汉置於其中一發熱電子元件上之第一散熱器、盥第 -散熱器並列設置於另—發熱電子元件上之第二散熱器及 201016118 連接第-、二散熱器之複數熱管，每一熱管包括穿入第一 散熱器之紐段、穿設於第二餘器之冷凝段及位於暮發 段與冷凝段之間之連接段，該第一散熱器包括一貼至於其 中一電子元件上之均熱板及緊密貼設於均熱板上之第一鰭 片組’該第-韓片組具有蜂窩狀結構，該熱管之蒸發段呈 爲平狀，收容於第-鰭片組内並夾緊於第一韓片組與均教 板之間。 ‘' ❺ 與習知技術相比，本發明中第一鰭片組具有蜂窩結 構，有效增加散熱面積；均熱板使該其中一發熱電子元^ 上之熱量均勻傳至第一鰭片組’充分利用第一鰭片組之每 一部分進行散熱，有效提高散熱裝置之散熱效率。 【實施方式】 請參閱圖1及圖2,本發明一優選實施例中之散熱裝 置，用來對一電路板50上之第一、二發熱元件52、54進 行散熱，該散熱裝置包括第一散熱器1〇、與第一散熱器 ❹並排设置之第二散熱器2〇及熱連接第一、二散熱器1〇、2〇 之一對熱管3〇。該第一、二散熱器1〇、2〇分別貼設於第一、 二發熱元件52、54對其散熱。 該第一散熱器10包括一支撐架12、固定於支樓架12 上之均熱板14及貼設於均熱板14上之第一鰭片組16。均 熱板14及第一鰭片組16係通過焊接或粘貼之方式固定。 支撐架12呈矩形，靠近四角處各設一固定孔12〇，固定孔 120與電路板50上設置之穿孔510對應，以便螺釘8〇穿過 支撐架12將支撐架12固定於電路板50上。支撐架12 一 201016118 ❹ ，邊中間位置設有-缺口 122。均熱& 14為—平板形熱 官’其内封裝有工作介質’故相對實體金屬板體來說具有 導熱性能好及品質小之優點。均熱板14呈矩形，其形狀大 小與支撐架相匹配’以便均熱板14正好貼設於支樓架 12上。均熱板14之一側邊向外凸伸一條形封口部140;當 均熱板14貼没於支撐架12時，封口部14〇穿過支撐架η 之缺口 122而凸伸於支樓架12之外，避免與支撑架^發 生干涉。該第-㈣組16呈矩形，其蜂窩結構係通過堆養 複數金屬薄成，其蜂窩結構可以由複數圓形、三邊形、 四邊形等？邊形組成，也可㈣由不規狀多邊形狀拼凑 於一起而成。於本實施例中，第—轉片組^ 構由複數個六邊形驗成，且每—六邊祕形成供氣^ k之軋流通道160’（參閱圖3)。第一鰭片組16之底部 :設-收容槽162 ’供熱管3〇收容其内，收容槽162之橫 截面為矩形。 Ο 帛二散熱器20包括-底板22及貼設於底板22之第二 鰭片組24。底板22由導熱性能良好之金屬製成，第二鱗片 組24具有與第一縛片組16相同之結構即也具有蜂寫社 構，第二鰭片組24之下表面通過焊接或枯貼之方式固定於 底，22之上表面。第二鯖片組24於其頂部間隔設有一對 收谷熱官30之孔洞240。 每一熱管30包括-扁平狀之蒸發段％、一冷凝段別 及位於蒸發段32與冷凝段34之間之連接段％。蒸發段％ 之上下表面均為平面，以便蒸發段32收容於第-鰭片組16 201016118 之收容槽162内，其下表面與第一鰭片組16之底面共面， 保證蒸發段32之下表面能直接貼設於均熱板14之上表面 以得到最大之接觸面積。連接段36包括連接蒸發段32之 水平部360及連接冷凝段34之傾斜部362，水平部360與 傾斜部362異面設置。水平部360相互平行且垂直於蒸發 段32設置，傾斜部362與蒸發段32異面設置，便於熱管 30之冷凝段34順利插入第二散熱器20之孔洞240内。 ^ 組裝時，螺釘80順次穿過支撐架12之固定孔120,固 〇 定於電路板50之穿孔510内，將第一散熱器10固定於電 路板50上並使均熱板14之底面緊貼第一發熱元件52 ;同 樣，螺釘80穿過第二散熱器20之底板22將第二散熱器20 固定於電路板50上，同時底板22之底面緊貼第二發熱元 件54。熱管30之蒸發段32收容於第一鰭片組16之收容槽 162内，其下表面與第一鰭片組16之底面共面並被夾緊於 均熱板14與第一鰭片組16之間，冷凝段34間隔穿設於第 ❹二散熱器20之孔洞240内，此時，連接段36之水平部360 平行設置於第一、二散熱器10、20之側邊。 工作時，第一散熱器10之均熱板14吸收第一發熱元 件52之熱量並快速均勻地分佈於均熱板14上，一部分熱 量直接通過第一鰭片組16散熱，另一部分通過熱管30傳 遞到第二散熱器20之第二鰭片組24，並由第二鰭片組24 頂部向其底部傳遞；同時，第二散熱器20之底板22吸收 第二發熱元件54之熱量並快速向上傳遞，即由第二鰭片組 24之底部快速向其頂部傳遞。至此，第一、二發熱元件52、 201016118 54之熱量均勻分佈於第二散熱器20之第二鰭片組24上， 提高第二鰭片組24中部之利用率，充分利用第二鰭片組24 之每一部分，提升散熱裝置之散熱效率。 本發明中第一、二鰭片組16、24均為蜂窩結構，具有 體積輕、散熱表面積大之優點。此外，第二散熱器20之底 板22也可做成一均熱板，以便快速均勻將熱量傳遞至第二 散熱器20之第二鰭片組24。 0 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1為本發明散熱裝置之立體組合圖。 圖2為圖1之立體分解圖。 圖3為圖1中第一鰭片組之側視圖。 ©【主要元件符號說明】 第一散熱器. 10 第二散熱器 20 熱管 30 第一、二發熱元件 52、 電路板 50 支撐架 12 均熱板 14 第一鰭片組 16 固定孔 120 穿孔 510 螺釘 80 缺口 122 封口部 140 氣流通道 160 11 201016118 收容槽 162 底板 22 第二鰭片組 24 孔洞 240 蒸發段 32 冷凝段 34 連接段 36 水平部 360 傾斜部 362 ❹ 12201016118 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device having a good heat dissipating effect. [Prior Art] With the continuous development of the electronics industry, the operating speed and overall performance of electronic components (especially central processors) are constantly increasing, and the heat generation thereof is also increasing. In order to make electronic components work properly, the industry generally uses a heat sink on the electronic components to dissipate heat. Generally, the heat sink includes a solid base attached to the heat-generating electronic component, and a plurality of heat-dissipating fins extending upward from the base, and a heat pipe connecting the base and the heat-dissipating fin for reinforcing heat dissipation to heat the heat-generating electronic component. Transfer to the heat sink quickly. However, since the base of the heat sink is a solid body, the heat generated by the heat-generating electronic components is easily concentrated in the center of the base, and cannot be quickly and evenly distributed over the entire base to facilitate uniform heat transfer to each of the heat sinks. In addition, in the case where the overall volume of the heat sink is constant, the heat dissipation area provided by the heat sink of the conventional structure is greatly limited, so that the heat dissipation efficiency is low. Therefore, it is desirable to provide a heat sink having a high heat dissipation efficiency. [Summary of the Invention] There is a need for Rong to be used here: for a heat dissipating device with high heat dissipation efficiency. a heat dissipating device for dissipating heat from two adjacent heat-generating electronic components, including a first heat sink disposed on one of the heat-generating electronic components, and a second heat sink disposed on the other heat-generating electronic component The heat sink and the 201016118 are connected to the plurality of heat pipes of the first and second radiators, and each heat pipe includes a new section penetrating the first radiator, a condensation section penetrating the second balancer, and a boundary between the burst section and the condensation section. The first heat sink includes a heat equalizing plate attached to one of the electronic components and a first fin set closely attached to the heat equalizing plate. The first-Korean group has a honeycomb structure, and the heat pipe has a honeycomb structure. The evaporation section is flat, and is housed in the first fin group and clamped between the first Korean group and the uniform teaching board. Compared with the prior art, the first fin set has a honeycomb structure in the present invention, which effectively increases the heat dissipation area; the soaking plate allows the heat on the one of the heat generating electron elements to be uniformly transmitted to the first fin set' Make full use of each part of the first fin set for heat dissipation, effectively improving the heat dissipation efficiency of the heat sink. [Embodiment] Referring to FIG. 1 and FIG. 2, a heat dissipating device in a preferred embodiment of the present invention is configured to dissipate heat from first and second heating elements 52 and 54 on a circuit board 50. The heat dissipating device includes a first The heat sink 1〇, the second heat sink 2〇 disposed alongside the first heat sink❹, and the heat pipe 3〇 of the first and second heat sinks 1〇 and 2〇 are thermally connected. The first and second heat sinks 1 and 2 are respectively attached to the first and second heat generating elements 52 and 54 to dissipate heat. The first heat sink 10 includes a support frame 12 , a heat equalizing plate 14 fixed to the branch frame 12 , and a first fin set 16 attached to the heat equalizing plate 14 . The heat equalizing plate 14 and the first fin group 16 are fixed by welding or pasting. The support frame 12 has a rectangular shape, and a fixing hole 12 各 is disposed adjacent to the four corners. The fixing hole 120 corresponds to the through hole 510 disposed on the circuit board 50, so that the screw 8 〇 passes through the support frame 12 to fix the support frame 12 to the circuit board 50. . The support frame 12 - 201016118 ❹ is provided with a gap 122 in the middle of the side. The soaking & 14 is a flat-plate heat officer which has a working medium enclosed therein, so it has the advantages of good thermal conductivity and small quality with respect to the solid metal plate body. The heat equalizing plate 14 has a rectangular shape and its shape is matched to the support frame so that the heat equalizing plate 14 is just attached to the branch frame 12. One side of the heat equalizing plate 14 protrudes outwardly from the strip sealing portion 140; when the heat equalizing plate 14 is attached to the supporting frame 12, the sealing portion 14 passes through the notch 122 of the supporting frame n and protrudes from the branch frame Outside of 12, avoid interference with the support frame ^. The group of (-) groups 16 has a rectangular shape, and the honeycomb structure is formed by stacking a plurality of metals, and the honeycomb structure can be composed of a plurality of circles, a triangle, a quadrangle, and the like. The composition of the sides can also be made up of (4) pieces of irregular polygons. In the present embodiment, the first-rotor assembly is formed by a plurality of hexagons, and each of the six sides forms a rolling passage 160' for supplying air to the k (see Fig. 3). The bottom of the first fin set 16 is provided with a receiving groove 162' for the heat pipe 3, and the receiving groove 162 has a rectangular cross section. The second heat sink 20 includes a bottom plate 22 and a second fin set 24 attached to the bottom plate 22. The bottom plate 22 is made of a metal having good thermal conductivity, and the second scale group 24 has the same structure as the first die set 16, that is, also has a bee writing mechanism, and the lower surface of the second fin set 24 is welded or pasted. The way is fixed to the bottom, 22 upper surface. The second crotch panel 24 is provided with a pair of holes 240 in the top of the valley. Each heat pipe 30 includes a flattened evaporation section %, a condensation section, and a connection section % between the evaporation section 32 and the condensation section 34. The lower surface of the evaporation section is flat, so that the evaporation section 32 is received in the receiving groove 162 of the first fin group 16 201016118, and the lower surface thereof is coplanar with the bottom surface of the first fin group 16 to ensure the evaporation section 32 The surface can be directly attached to the upper surface of the heat equalizing plate 14 to obtain the largest contact area. The connecting section 36 includes a horizontal portion 360 connecting the evaporation section 32 and an inclined portion 362 connecting the condensation section 34, and the horizontal portion 360 is disposed opposite to the inclined portion 362. The horizontal portions 360 are disposed parallel to each other and perpendicular to the evaporation section 32. The inclined portions 362 are disposed opposite to the evaporation section 32 to facilitate the smooth insertion of the condensation section 34 of the heat pipe 30 into the hole 240 of the second heat sink 20. When assembled, the screws 80 are sequentially passed through the fixing holes 120 of the support frame 12, fixed in the through holes 510 of the circuit board 50, and the first heat sink 10 is fixed on the circuit board 50 and the bottom surface of the heat equalizing plate 14 is tight. The first heat generating component 52 is attached. Similarly, the screw 80 passes through the bottom plate 22 of the second heat sink 20 to fix the second heat sink 20 to the circuit board 50 while the bottom surface of the bottom plate 22 abuts against the second heat generating component 54. The evaporation section 32 of the heat pipe 30 is received in the receiving groove 162 of the first fin set 16 , and the lower surface thereof is coplanar with the bottom surface of the first fin set 16 and is clamped to the heat equalizing plate 14 and the first fin set 16 . The condensing sections 34 are disposed in the holes 240 of the second heat sink 20 at intervals. At this time, the horizontal portions 360 of the connecting sections 36 are disposed in parallel on the sides of the first and second heat sinks 10, 20. In operation, the heat equalizing plate 14 of the first heat sink 10 absorbs the heat of the first heat generating component 52 and is rapidly and evenly distributed on the heat equalizing plate 14, a portion of the heat is directly radiated through the first fin group 16, and the other portion passes through the heat pipe 30. Passing to the second fin set 24 of the second heat sink 20 and passing it from the top of the second fin set 24 to the bottom thereof; meanwhile, the bottom plate 22 of the second heat sink 20 absorbs the heat of the second heat generating component 54 and rapidly upwards The transfer, that is, is rapidly transmitted from the bottom of the second fin set 24 to the top thereof. At this point, the heat of the first and second heating elements 52, 201016118 54 is evenly distributed on the second fin set 24 of the second heat sink 20, improving the utilization of the middle of the second fin set 24, and making full use of the second fin set. Each part of 24 enhances the heat dissipation efficiency of the heat sink. In the present invention, the first and second fin groups 16 and 24 are all honeycomb structures, and have the advantages of light volume and large heat dissipation surface area. In addition, the bottom plate 22 of the second heat sink 20 can also be formed as a soaking plate for quickly and evenly transferring heat to the second fin set 24 of the second heat sink 20. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a heat sink of the present invention. Figure 2 is an exploded perspective view of Figure 1. 3 is a side view of the first fin set of FIG. 1. ©【Main component symbol description】 First heat sink. 10 Second heat sink 20 Heat pipe 30 First and second heating elements 52, Circuit board 50 Support frame 12 Heat spreader 14 First fin set 16 Fixing hole 120 Perforated 510 Screw 80 notch 122 sealing part 140 air flow channel 160 11 201016118 receiving groove 162 bottom plate 22 second fin set 24 hole 240 evaporation section 32 condensation section 34 connecting section 36 horizontal portion 360 inclined portion 362 ❹ 12