200921339 九、發明說明： 【發明所屬之技術領域】 尤指—種用於電子 元件散 本發明涉及一種散熱裝置 熱之散熱裝置。 【先前技術】 諸如電腦中央處理器、北橋晶片、 元件在運行時會產生大量熱量，該等哉又问功率電子 f散去丄將直接導致溫度急劇上升，而嚴重影響;^效: =正常運行。為此’需要添加一散熱裝 進行散熱。 τ电千凡态件 習知散熱裝置包括一鰭片型散熱器 料製成，其包括-接觸發熱電子元件 運行速度之不斷提高，其發熱量亦不斷增大，該 已無法滿足散熱需求。由於熱管具有高效之熱傳== 乏地運用於散熱領域，因而為配合熱管傳熱，各 種形式之散熱器應運而生。 ，兮二：之熱官式散熱器包括—鰭片型散熱器和複數埶 官。該鰭片型散熱器包括一接觸發熱電子元件之底座及置 於底座之士之複數散熱鰭片。該等散熱藉月透過谭接或其 他方式固疋連接在一起。底座上設有複數凹槽敎續片、 二亦相應開設複數通孔。每-熱管包括-直線形之:發： 和一直線形之冷凝段，該蒸發段容置在底座上之凹槽内， 而冷凝段則穿設於散熱鰭片上之通孔内。發熱電子元件產 200921339 生之熱量由底座吸收，並經過熱管傳送至散熱鰭片，熱量 進而散發到周圍空氣中。然，該種_片型散熱器由於其散 熱韓片需要透料接等u μ連接，而且必需在散孰缺 片上開設通孔以連接熱管，使得其製程複雜，製造成本相曰 對較向。另外熱管呈單向傳熱亦使散熱裝置之散教 到限制。 ‘’、、丁又 【發明内容】 有馨於此，t必要提供-種製程簡單1又具較佳散執 性能之散熱裝置。 …、 一種散熱裝置，用於對電子元件散熱，包括一盘電子 ::接觸：底座’置於底座上之第一散熱器，置於第一散 熱器上之第二散熱器及連接底座與第一、二散熱器之至少 B °玄第一散熱器包括一基板及由基板延伸而出之複 數政熱鰭片，該第二散熱器包括一基板及由基板延伸而出 1複數政熱鰭片’該至少―熱管包括__蒸發段及與該蒸發 平行之第、第一冷凝段，該蒸發段與第一冷凝段置於 底座與第一散熱器之基板之間，該第二冷凝段置於第二散 熱器之基板上。 〇〇 一白知技術相比，本發明散熱裝置中之散熱器製程簡 單，且由第—散熱器和第二散熱器堆疊設置可增大散熱裝 置之散熱面積。另外’散熱裝置中之熱管之兩冷凝段分別 置於底座與第一散熱器之基板之間，和置於第二散熱器之 基板上’可達到快速傳熱及均熱之效果，從而提高散熱裝 置之散熱致率。 200921339 【實施方式】 圖1示出本發明散熱裝置之一 置包括-錢1Q，_w1G之該散熱裝 一罟於笛一斗备如 工 < 弟一散熱器30, 10第％埶：益3〇之上之第二散熱器40及連接底座 i〇1L 3〇與第二散熱器4〇 ™ 熱裝置裝設於一電路板f R A 根'、、、s 20。該散 私路板（圖未不）上用於對苴上 電子几件（圖未示），如cpu等，進行散熱。、匕 底座10由具有高導熱性能之材 等。底座10呈一矩形塊狀，1；田衣成如銅或者鋁 從而吸收發熱電子元用:接觸發熱電子元件， 位於底座K)之1 該發熱電子元件大致 於底座10之底面之中間位置。底座1〇之頂面 相平行之四個半1]形之凹槽12。其巾位 頂 中間位置之兩個凹槽12相隔另之頂面之200921339 IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a heat dissipating device for a heat dissipating device. [Prior Art] For example, the computer central processing unit, the north bridge chip, and the components generate a large amount of heat during operation, and the enthalpy asks that the power electrons f are scattered, which will directly cause a sharp rise in temperature, which is seriously affected; . To do this, you need to add a heat sink to dissipate heat. τ 电千凡凡件 The conventional heat sink consists of a fin-type heat sink material, which includes - the contact heat-generating electronic components continue to increase in speed, and its heat generation is also increasing, which can not meet the heat dissipation requirements. Due to the efficient heat transfer of the heat pipe == sufficiency in the field of heat dissipation, various forms of heat sinks have emerged to cope with the heat transfer of heat pipes. , 兮 2: The thermal official radiator includes a fin-type radiator and a plurality of squadrons. The fin-type heat sink includes a base that contacts the heat-generating electronic component and a plurality of heat-dissipating fins placed on the base. These heat sinks are connected by a tan or other means. A plurality of grooved continuation pieces are arranged on the base, and a plurality of through holes are correspondingly opened. Each of the heat pipes includes a linear shape: a hair and a linear condensation section, the evaporation section is accommodated in a recess in the base, and the condensation section is bored in the through hole in the heat dissipation fin. Heated electronic components 200921339 The heat generated is absorbed by the base and transmitted to the fins through the heat pipes, and the heat is released into the surrounding air. However, this type of sheet-type heat sink requires a u μ connection such as a through-material connection because of its heat-dissipating Korean film, and it is necessary to open a through hole in the loose-foiled sheet to connect the heat pipe, which makes the process complicated and the manufacturing cost relatively backward. In addition, the one-way heat transfer of the heat pipe also limits the teaching of the heat sink. ‘‘, 丁又 【Contents of the Invention】 There is a need for this, and it is necessary to provide a heat sink with a simple process and a better performance. ..., a heat sink for dissipating heat from electronic components, including a disk of electrons:: contact: a first heat sink placed on the base, a second heat sink placed on the first heat sink, and a connection base and The first heat sink of the first and second heat sinks includes a substrate and a plurality of political fins extending from the substrate, the second heat sink including a substrate and a plurality of political fins extending from the substrate The at least one heat pipe includes an __evaporation section and a first and first condensation section parallel to the evaporation, the evaporation section and the first condensation section being disposed between the base and the substrate of the first heat sink, the second condensation section being disposed On the substrate of the second heat sink. Compared with the first known technology, the heat sink process in the heat sink of the present invention is simple, and the heat sink area of the heat sink is increased by the stacking of the first heat sink and the second heat sink. In addition, the two condensation sections of the heat pipe in the heat sink are respectively placed between the base and the substrate of the first heat sink, and are placed on the substrate of the second heat sink to achieve rapid heat transfer and soaking effect, thereby improving heat dissipation. The heat dissipation rate of the device. 200921339 [Embodiment] FIG. 1 shows that one of the heat dissipating devices of the present invention includes - Qian 1Q, _w1G, the heat dissipating device is smashed in a flute and a bucket, and the other is a heat sink 30, 10% 埶: Yi 3 The second heat sink 40 and the connection base i〇1L 3〇 and the second heat sink 4〇TM thermal device are mounted on a circuit board f RA ', ', s 20 . The scatter circuit board (not shown) is used to dissipate heat from several pieces of electronic components (not shown), such as cpu.匕 The base 10 is made of a material having high thermal conductivity. The base 10 is in the form of a rectangular block, 1; the field is made of copper or aluminum to absorb the heat-generating electronic component: the contact heat-generating electronic component is located at the base K). The heat-generating electronic component is substantially at the middle of the bottom surface of the base 10. The top surface of the base 1 is parallel to the four halves 1] shaped groove 12. The two grooves 12 in the middle position of the top of the towel are separated from the other top surface
則分別置於該中間之兩個凹样玉^而另外兩個凹槽U ㈣與中間兩個凹槽12之==側’响外兩個凹 :根熱管20具有相同之結構與功能 括一平直之蒸發段21，與該蒸發段21平行之第二； i4 弟二冷凝段25，及分別對應連接蒸發段21 Γ ==::r—連接段22、第二連接段：。第 运按奴22由瘵發段21之—迚hi κ仏 段23由蒸發段21之另1傾^切^成，第二連接 段23之高度大致與第—散之 ^而成。第二連接 由第-連接段22之一端向第：二度相同。第-冷凝段24 而成，該第-冷凝段24 =方向水平延伸 ^ ί又21千仃。第一冷凝段24、 200921339 f —連接段22及蒸發段21 -起形成- u形結構，复 朝向-第-方向。第二冷凝段25由第二連接段# = 口山 向第一連接段22之方向水平延伸而成，該第二冷 端 也與蒗發段21平;T ^ r $减丰又25 發段；^ΓΓ弟 第二連接段23及蒸 起形成另—υ形結構，其開.口朝向—黛_ 該第二方向盥弟一方向， 万句/、第方向相反。該兩U形結構處於不同 列I:起該::二之間形成一銳角。兩根熱管2°對稱地排 置於丄::::段】1互相靠近’兩個第一冷凝段24 …士杈之兩側且與兩個蒸發段21 C位於兩個蒸發段21和兩個;：段 第一散熱器30由具有高導埶性能 ^ ^ - , 30 ^ 3! ^IS # 出之複數散埶鍵片33 土 b基板31延伸而 底座1〇之面呈一矩形平板^ A ^ ^ ，、底座10上之四個凹槽12相對库、， 3=板之ST形成四個半圓柱狀之凹槽精簿片 平行，土且各^ 上延伸而成，散熱鰭片33與凹槽32 33 m、…、韓片33亦互相平行’每兩相鄰之散執鰭片 33之間开^成一間距。執鍺 ，、’、 向上看呈描开… …、曰片33之整體外形從前後兩端方 位於美板31^陳於基板31中間部分之散熱韓片33比 於基板3!兩側端之散熱鰭片 段23鱼仿於1 。 , ”，、g ζυ (弟一運接 等。」基板31中間部分之散熱.鳍片33之高度大致相 第二散熱器40包括—基板41，由基板“之底面向下 200921339 延伸而成之複數裳— 、延伸而成之複數第片43及由基板竹之頂面向上 .30之散熱賴片33之-政=片体基板〇對應第-散熱器 …側端朝第一：::結？形成對應之形狀，即基板 板41之頂面上於°之^政熱鰭4 33向下彎折。基 以容置兩根熱管at言折處分別形成—個凹槽d :订且母兩相鄰第—散熱鰭片4 …曰43互 距與第-散熱器30上之兩相鄰散距，該間 等。第二散熱鰭“與第—散熱.鰭;二 第二散-片散熱器4〇之體積之限制， 第二㈡： 短。位於中間部分之 二::增加散熱鰭片之數量，從二it得 ”二f圖2和圖3 ’當該散熱裝置組裝時，兩根敎 :凹二 21和第一冷凝段2 4分別置於底座1 〇之四、 個凹槽工2内。兩個蒸發段21容置在中間之兩個凹槽 而兩個第-冷凝段24則分別容置在兩側之兩個凹槽 内。然後將第一散熱器30置於底座1〇之上。底座忉上 凹槽12和第—散熱器30之基板31上之凹槽32—起形^ 容置熱管20之蒸發段21和第-冷凝段24之圓形空間，於 此熱管20之蒸發段21和第—冷凝段％夾置於底座忉與 第一散熱器30之間。熱管20之第一連接段22和第二連接 段23分別位於第一散熱器30之前後兩端。熱管2〇之苐二 冷凝段25置於第一散熱器30之散熱鰭片33之上。最後將 200921339 第二散熱器4〇置於第一散熱器30之上’且第二散埶器4〇 之第-散熱鰭片43與第-散熱器3〇之散熱續片幻相互間 隔排列，即每相鄰兩第一散熱鰭片43之間有一第一散熱器 30之散熱鰭片33。第一散熱鰭片43之末端與第一散熱器 30之基板31之頂面相接觸，第一散熱器3〇之中間部分之 散熱鰭片33之末端與第二散熱器4()之基板41之底面相接 觸’如此可有利於勃*量之J皇彳庚 , . …、炙傅遞。由於製程之精准度問題， 第-散熱器30之兩側端之散熱.鰭片％會與第二散熱器4〇 ，基板4\之間有-定間隙。熱管2()之第二冷凝段25置於 第一散熱器40之基板41之凹槽42内。 當該散熱裝置工作時，由發熱電子元件產生之熱量經 底座10吸收後，其中—部分熱量直接由底座K)傳送至第 -散熱器30’然後散發到周圍空氣中。由底錢吸收之另 =分熱轉熱管2◦之蒸發段21吸收，再分別經第一連 I又22和第一連接段23傳遞到第一冷凝段μ和第二冷凝 段25。由於發熱電子元件置於底座iq之大致中間位置，因 此產生之熱量大多集中在底座1〇之中央。熱管20之第一 ^段24可將集中在底座1〇中央之熱量快速地轉移到底 厘10之兩側端，亦即第—埒刼 卜弟放熱益30之基板31之兩側端， =快^均熱以及充分利用底座1〇和第一散熱器3〇之基 之政熱面積之效果。而傳遞到第二冷凝段Μ之执量 則可經過第二散熱器4〇之第一、 速地散發到周圍環境中。 第一政熱鰭片33、34快Then, the two concaves are placed in the middle, and the other two grooves U (four) and the two grooves 12 in the middle == side of the two outer concaves: the root heat pipe 20 has the same structure and function. The straight evaporation section 21, the second parallel to the evaporation section 21; the i4 second condensation section 25, and the corresponding connection evaporation section 21 Γ ==::r - the connection section 22, the second connection section:. The first transport is made by the slave 22 from the burst section 21 - 迚hi κ 仏 section 23 is formed by the other one of the evaporation section 21, and the height of the second connecting section 23 is substantially the same as that of the first. The second connection is made from one end of the first connecting section 22 to the second: the second degree is the same. The first condensation section 24 is formed, and the first condensation section 24 = horizontally extends ^ ί and 21 thousand 仃. The first condensing section 24, 200921339 f - the connecting section 22 and the evaporating section 21 - form a - u-shaped structure, the complex orientation - the first direction. The second condensation section 25 is formed by a horizontal extension of the second connecting section #=mouth mountain to the direction of the first connecting section 22, and the second cold end is also flat with the bursting section 21; T ^ r $ reduced and 25 rounds ^^ The second connecting section 23 of the younger brother and the steaming to form another υ-shaped structure, the opening of the mouth is oriented - 黛 _ the second direction is the direction of the younger brother, the sentence /, the opposite direction. The two U-shaped structures are in different columns I: from the :: an acute angle is formed between the two. The two heat pipes are symmetrically arranged at 2° in the 丄:::: segment] 1 close to each other 'two first condensing segments 24 ... both sides of the gentry and two evaporating segments 21 C are located in two evaporating segments 21 and two ; the first heat sink 30 has a high conductivity ^ performance ^ ^ - , 30 ^ 3 ! ^IS # out of the plural 埶 key sheet 33 soil b substrate 31 extended and the base 1 〇 face is a rectangular plate ^ A ^ ^ , the four grooves 12 on the base 10 are opposite to the library, and the ST of the 3 = plate forms four semi-cylindrical grooved fine-grained sheets parallel to each other, and the heat sink fins 33 are formed. And the grooves 32 33 m, ..., the Korean sheets 33 are also parallel to each other 'every two adjacent floating fins 33 are opened to each other. Squeeze, ', look up and draw... The overall shape of the cymbal 33 is located at the front and rear ends of the heat sink Korean sheet 33 located in the middle portion of the substrate 31 compared to the substrate 3! The fin fins 23 fish are like 1 . , ",, g ζυ (different from the first one, etc.) heat dissipation in the middle portion of the substrate 31. The height of the fins 33 is substantially the same as the second heat sink 40 includes a substrate 41 extending from the bottom surface of the substrate downwards 200921339 The plurality of skirts - the extended plurality of the first piece 43 and the heat-dissipating sheet 33 from the top of the substrate bamboo top. - The government = the body substrate 〇 corresponds to the first heat sink... the side end faces the first::: knot Forming a corresponding shape, that is, the top surface of the substrate board 41 is bent downward at a temperature of the heat fin 4 33. The base is formed by accommodating two heat pipes at the folds to form a groove d: Two adjacent first-heat-dissipating fins 4 ... 曰 43 are spaced apart from each other by two adjacent gaps on the first heat sink 30, and the like. The second heat-dissipating fin "and the first heat-dissipating fin" and the second second-scattering piece The limit of the volume of the heat sink 4,, the second (2): short. Located in the middle part of the second:: increase the number of fins, from the second it "two f Figure 2 and Figure 3" when the heat sink is assembled, two The root enthalpy: the concave second 21 and the first condensing section 24 are respectively placed in the fourth base of the base 1 and the groove 2. The two evaporation sections 21 are accommodated in the middle two grooves and two first - The condensing sections 24 are respectively received in the two grooves on both sides. Then, the first heat sink 30 is placed on the base 1 。. The base 忉 upper groove 12 and the concave surface of the substrate 31 of the first heat sink 30 are recessed. The groove 32 is configured to receive the circular space of the evaporation section 21 and the first condensation section 24 of the heat pipe 20, and the evaporation section 21 and the first condensation section of the heat pipe 20 are sandwiched between the base and the first heat sink 30. The first connecting section 22 and the second connecting section 23 of the heat pipe 20 are respectively located at the front and rear ends of the first heat sink 30. The heat pipe 2 is disposed on the heat radiating fin 33 of the first heat sink 30. Finally, the 200921339 second heat sink 4〇 is placed on the first heat sink 30' and the second heat sink fins 4 and the heat sink fins 43 and the heat sink 3 The heat dissipation fins 33 of the first heat sink 30 are disposed between the two adjacent first heat dissipation fins 43. The ends of the first heat dissipation fins 43 are in contact with the top surface of the substrate 31 of the first heat sink 30, The end of the heat sink fin 33 in the middle portion of the first heat sink 3 is in contact with the bottom surface of the substrate 41 of the second heat sink 4 (). *The amount of J Huang Geng, . . . , Fu Fu. Due to the accuracy of the process, the heat dissipation on both sides of the first heat sink 30. The fin % will be the second heat sink 4, the substrate 4\ There is a constant gap. The second condensation section 25 of the heat pipe 2 () is placed in the recess 42 of the substrate 41 of the first heat sink 40. When the heat sink is in operation, the heat generated by the heat generating electronic components is absorbed by the base 10 After that, part of the heat is directly transmitted from the base K) to the first radiator 30' and then to the surrounding air. The absorption section 21 absorbed by the bottom money is absorbed by the evaporation section 21 of the heat transfer tube 2, and then passed through the first The I and 22 and the first connecting section 23 are transferred to the first condensation section μ and the second condensation section 25. Since the heat-generating electronic component is placed in the approximate middle position of the base iq, the heat generated is mostly concentrated in the center of the base 1〇. The first section 24 of the heat pipe 20 can quickly transfer the heat concentrated in the center of the base 1 to the two sides of the bottom 10, that is, the two sides of the substrate 31 of the first heat release 30, = fast ^Homogeneous heat and the effect of fully utilizing the thermal area of the base 1〇 and the base of the first radiator 3〇. The amount delivered to the second condensing section can be dissipated to the surrounding environment first through the second heat sink 4〇. The first political fins 33, 34 are fast
值得進-步指出，因第二散熱器4〇之第一散熱韓片U 200921339 :末：與弟一散熱器3〇之基极3ι相接觸 '熱态30上之埶量由此丌僅、路_ 、王J弟一散 '.，、里由此了傳遞到第二散熱器仙上 夕一個向上傳遞熱量之途徑， 口而立曰 另外，第-、第二4… 更快地散發出去。 々勒叫 一散'、、、态30、40之製程非常簡單， 編30之散编33與第二散熱器 ：It is worthwhile to step-by-step, because the second heat sink 4 〇 the first heat sink Korean film U 200921339 : the end: with the brother of a radiator 3 〇 base 3 ι contact 'hot state 30 埶 丌 丌 丌Road _, Wang J brother a scattered '., and then passed to the second radiator on the eve of a way to transfer heat upwards, mouth and squat, in addition, the first -, the second 4 ... more quickly. 々勒叫一散',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,
43呈間隔排列設置，可在 制 dMMM 键片夕玄疮丄 徒问衣4成本之前提下使散埶 ::片之被度增大’從而增大散熱面積。再者，將第二：： ㈣兩側之第-散熱鰭二傳=熱二冷凝段 達第二散熱器40位於其兩側部分之散H置更快地到 端，從而充分利用到每一處散埶 ……曰片43之末 裝置之散熱效率之效果。’、、、貝’達到提高整個散熱 綜上所述’本發明符合發明專利要件，麦依 J申凊。惟，以上所述者僅 熟悉本案技蓺之人士 r為本發月之較佳實施例，舉凡 或變化，明精神所作之等效修飾 【圖式簡單說;Γ 之申請專利範圍内。 ::本毛月政熱裝置-較佳實施例之立體分解圖。 為圖1中散熱裝置之部分組裝圖。 圖3為圖i中散熱裝置之立體組裝圖。 L主要元件符號說明】 Ϊ座 1〇 凹槽 12 32 42 熱管 12、32、42 20 蒸發段 21 11 41200921339 第一連接段 22 弟一連接段 23 第一冷凝段 24 第二冷凝段 25 第一散熱器 30 基板 31 散熱鰭片 33 第二散熱器 40 第一散熱鰭片 43 第二散熱鰭片 44 Λ 1243 is arranged at intervals, which can be used to increase the heat dissipation area before the cost of the dMMM key is removed. Furthermore, the second:: (four) the two sides of the first - heat sink fins = hot two condensation section up to the second heat sink 40 on the two sides of the scattered H set faster to the end, so as to make full use of each Diffusion... The effect of the heat dissipation efficiency of the device at the end of the film 43. ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, However, the above-mentioned persons who are only familiar with the technology of the present invention are the preferred embodiments of the present month, and the equivalent modifications of the spirit of the present invention are as follows: [The diagram is simple; :: The Maoyue political heating device - a perspective exploded view of the preferred embodiment. It is a partial assembly diagram of the heat sink in Fig. 1. 3 is an assembled, isometric view of the heat sink of FIG. L main component symbol description Ϊ seat 1 〇 groove 12 32 42 heat pipe 12, 32, 42 20 evaporation section 21 11 41200921339 first connection section 22 brother one connection section 23 first condensation section 24 second condensation section 25 first heat dissipation 30 substrate 31 heat sink fin 33 second heat sink 40 first heat sink fin 43 second heat sink fin 44 Λ 12