M249427 五、創作說明（1) · 【新型所屬之技術領域】 本創作係關於一種應用在資訊或通訊產品的散熱模組， 特別是可以提昇散熱片的散熱效率者。 【先前技術】 目前產業界針對電腦中央處理器（CPU )或高熱源產品所 採用之散熱裝置，大多是利用具有高傳熱效率的金屬製成的 散熱片的基座接觸於熱源，以將熱量吸收並傳遞到散熱片的 鰭片上，再利用風扇吹出冷空氣將散熱片上的熱量予以排 除。 實務上雖然可以藉由將複數組前述的傳統散熱片堆疊組 成散熱模組，並配合導熱管與散熱風扇來提昇其散熱效率； 但是並非每一組中央處理器都需要那麼複雜且價格較高的散 熱模組，而且有些電腦主機内部的空間較為狹小，無法容納 藉由兩組以上散熱片堆疊組合的體積，反而只要散熱效果更 好的單一散熱片即可，但傳統散熱片的結構卻無法進一步提 供更好的散熱效果；因而，藉由提昇單一散熱片的散熱效率 是必要的做法。 【新型内容】 《所欲解決之技術問題》 本創作主要在於解決具有鰭片的傳統散熱片無法進一步 提昇其散熱效率之遺憾。M249427 V. Creation Instructions (1) · [Technical Field of New Type] This creation is about a cooling module applied to information or communication products, especially one that can improve the heat dissipation efficiency of the heat sink. [Previous technology] At present, most of the heat dissipation devices used in the industry for computer central processing units (CPUs) or high-heat source products use the base of the heat sink made of metal with high heat transfer efficiency to contact the heat source to transfer heat. The heat is absorbed and transferred to the fins of the heat sink, and the cold air is blown out by the fan to remove the heat on the heat sink. In practice, although the traditional heat sinks can be stacked to form a heat sink module, and heat pipes and cooling fans can be used to improve the heat dissipation efficiency; not every group of central processing units needs to be so complicated and expensive. Cooling modules, and some computer hosts have a relatively small space inside, which can not accommodate the volume of two or more heat sinks stacked and combined. Instead, only a single heat sink with better heat dissipation effect can be used, but the structure of traditional heat sinks cannot be further Provide better heat dissipation effect; therefore, it is necessary to improve the heat dissipation efficiency of a single heat sink. [New content] "Technical problem to be solved" This creation is mainly to solve the regret that the traditional heat sink with fins cannot further improve its heat dissipation efficiency.
M249427 五、創作說明（2) - 《解決問題之技術手段》 本創作的主要特徵是將具有高傳熱效率的導熱管結合於 散熱片之基座内，得以藉由基座或另外結合的底座吸收熱量 後再同時將熱量傳導到導熱管與散熱片，導熱管則更進一步 地將熱量再分散地傳導到散熱片其它部位，亦可配合設在散 熱片之散熱風扇運轉時，得以更快速地將熱量排除。 《對於先前技術的效果》 和先前技術相較，本創作只要利用一組散熱模組便可以 達到快速傳熱與排除熱量的效果，進而在相同的傳熱效率下 能縮小散熱模組的體積。 【實施方式】 以下配合圖式對本創作做進一步的說明將更為明瞭，立 中： ’、 第一圖顯示了本創作的第一種實施方式包括有散熱片1、 導熱管2與底座3;其中的散熱片1與底座3係以具有優異導熱 性質的金屬材料製成而成，例如銅金屬、鋁金屬材料··等 等；散熱片1的結構進一步包括結合在基座11上呈平行排列的 複數鰭片1 2 ;所述基座1 1的底面可以被加工出一適當深度的 圓形凹陷空間1 3，於該凹陷空間1 3内塗佈導熱膠或焊錫^ 後，再將預先成型為渦捲形狀之導熱管2置入該凹陷空間胃i 3 中’利用導熱膠或焊錫膏使導熱管2結合固定於凹陷$ ^ i 3的 底面’最後將預先成型為對應該凹陷空間1 3形狀的底座3亦塗M249427 V. Creation Instructions (2)-"Technical Means for Solving Problems" The main feature of this creation is to combine a heat transfer tube with high heat transfer efficiency into the base of the heat sink, so that the base or other combined base can be used. After absorbing the heat, the heat is transmitted to the heat pipe and the heat sink at the same time. The heat pipe further dissipates the heat to the other parts of the heat sink. It can also cooperate with the cooling fan installed on the heat sink to run more quickly. Remove heat. "Effects on the previous technology" Compared with the previous technology, as long as a set of heat dissipation modules are used in this creation, the effect of rapid heat transfer and heat removal can be achieved, and the volume of the heat dissipation module can be reduced under the same heat transfer efficiency. [Embodiment] The following description of the creation will be made clearer with the help of drawings, and the middle: ', The first figure shows a first embodiment of the creation including a heat sink 1, a heat pipe 2 and a base 3; The heat sink 1 and the base 3 are made of a metal material with excellent thermal conductivity, such as copper metal, aluminum metal material, etc .; the structure of the heat sink 1 further includes a parallel arrangement combined with the base 11 A plurality of fins 1 2; the bottom surface of the base 11 can be processed into a circular recessed space 13 of an appropriate depth, and a thermally conductive glue or solder is applied in the recessed space 13 before forming The heat-conducting tube 2 in the shape of a scroll is placed in the hollow space i 3 'using the heat-conducting glue or solder paste to fix and fix the heat-conducting tube 2 to the bottom surface of the recess $ ^ i 3' Finally, it is preformed to correspond to the recessed space 1 3 Shaped base 3 is also painted
M249427 、創作說明（3) 佈導熱膠或焊錫膏後，將底座 熱管2被包圍在凹陷空間13内，以及凹陷工間13,進而使得導 如第二圖所示）。 位於基座11與底座3之間 所述的導熱管2可以是熱傳導超 折或變形之空心金屬管體，將具 a & 係採用可自由彎 填於金屬管體中，最後將金屬。體=f $傳導性能之材料充 有高速熱傳導性能之材料可以是以封所製成。所述具 1、 無機高溫超導化合物材料，例如·的成種選擇： )超導材料、鉈鋇鈣銅氧化合物（紀鋇銅氧化合物（YBC 鋇鈣銅氧化合物（HBCCO )超導材BCC〇 )超導材料、汞 BSCCO )超導材料、或其他無機超’導、從銷鈣銅氧化合物 2、 有機超導材料，例如：純水或其°它才料 3、 其它可達到高速熱傳導性材料；;匕有機超導材料。 所述無機高超導材料其所應用的 的分手受熱時產生之高速震盪與摩擦’，、理，係利用管、體内 速熱傳；有機高溫超導材料，其所^田讓熱能以波動方式快 管、體内液體的分子受熱時產生之相的原理，係利用金屬 輪速度非常快，故稱為「熱傳導超導总化而快速傳熱，因傳 超導管、體由熱端傳輸至冷端之傳體」，且因熱傳導 冷蠕之溫差很小，可達到最佳導埶效^ 9很短，因此熱端與 熱的速率約為銅的五倍以上，更。經實驗證實，其傳 十倍以上。 知雜金屬之傳熱速度快 本創作用於結合在基座1 1盥底庙q 2，π α星一的、、々r λ :、 之間的渦捲形導熱管 ^ 可以單 的/尚捲形式（如弟二圄辦- 示一 ®所不）置於所述凹陷空間M249427, Creative Instructions (3) After the thermal conductive adhesive or solder paste is distributed, the base heat pipe 2 is enclosed in the recessed space 13 and the recessed work chamber 13 so as to be guided as shown in the second figure). The heat transfer pipe 2 located between the base 11 and the base 3 may be a hollow metal pipe body which is thermally folded or deformed. A & system may be used to fill the metal pipe body freely and finally the metal. Body = f $ The material with high conductivity can be made by sealing. The selection of the materials with the 1. inorganic high-temperature superconducting compound, such as:) Superconducting materials, barium calcium copper oxide compounds (barium copper oxide compounds (YBC barium calcium copper oxide compounds (HBCCO)) BCC 〇) Superconducting materials, Mercury BSCCO) Superconducting materials, or other inorganic superconducting materials, calcium copper oxide compounds, organic superconducting materials, such as: pure water or other materials 3. Others can achieve high-speed heat conduction Material; Organic superconducting material. The high-speed vibration and friction generated by the inorganic high superconducting material when it is heated when the breakup is applied. The reason is that the tube and the body are used for rapid heat transfer. The organic high-temperature superconducting material is used to fluctuate thermal energy. The principle of the phase generated by the fast tube and the molecules of the liquid in the body when heated is based on the very fast speed of the metal wheel. Therefore, it is called "heat conduction superconducting and rapid heat transfer. Because the superconducting tube and the body are transmitted from the hot end to the "The cold end of the body", and because the temperature difference between heat conduction and cold creep is small, the best conduction efficiency can be achieved ^ 9 is very short, so the rate of hot end and heat is about five times more than copper, and more. It was confirmed by experiments that it was transmitted more than ten times. The heat transfer rate of the known miscellaneous metal is fast. This book is used to combine the scroll-shaped heat-conducting tube between the base 1 1 and the base temple q 2, π α, and 々r λ :, The roll form (such as Di Erji Office-Shiyi®) is placed in the recessed space
第7頁 M249427 五、創作說明（4) 丨德=& ^疋將兩個甚至更多的渦捲形狀導熱管2呈交錯地套置 圖ti所不）再放置於凹陷空間1 3内。所述渦捲形導 I用；，〃你脾、、、广1及底座3結合後的俯視圖係如第五圖所示。使 丨風I底户^座3接觸於Cpu等熱源，散熱片1亦可以組合散熱 I扇，底座3吸收了熱源所產生的埶一 由底座3傳導到導埶总9五士、旨”、、俊 邛伤·、、、里θ直接 ! 〇 , , ^ ^ 〇7 " 2再由導熱管2傳導到基座11與鰭片 ; &採用渦捲形狀的設計，因而旦有較大的面積 丨晰- 在基座11底面的凹陷空間13除了可以是第一圖 I二外，也可以利用工作母機力…第：圖所： ί 導貧二合二該矩形槽凹陷空間13中，然後 b开包陷/間内’而且位於基座11與底座3之間所= 導熱官2與散熱片i及底座3結合後的俯視圖係如第七二 本，作的第二種實施方式請參閱第八圖，係將散敎 1出較薄的基座11，而底座3的厚度則成型為較厚，於、底 U面成型出可以容納渦捲式導熱管2的凹陷空間3〇，於=二 I二間30内的底面塗佈導熱膠或膏後， 晋=陷 匕空尸。中，然後底座3上面與基座u下面之間二 |焊錫霄予以結合，藉以達到相同的傳熱與散熱效果。5 以上所述者僅為用以解釋本創作之較佳實施例， 圖據以對本創作作任何形式上之限制，是以，凡有在===Page 7 M249427 V. Creation Instructions (4) 丨 == amp two or more scroll-shaped heat-conducting tubes 2 are nested in a staggered arrangement (not shown in figure ti) and placed in the recessed space 1 3. The scroll-shaped guide is used; the top view of the combination of spleen, spleen, cane 1 and base 3 is shown in the fifth figure. The 丨 wind I bottom ^ seat 3 is in contact with the CPU and other heat sources. The heat sink 1 can also be combined with a heat sink I fan. The base 3 absorbs the heat generated by the heat source.邛, 邛, 里, 里, θ directly! 〇,, ^ ^ 〇7 " 2 is then conducted by the heat pipe 2 to the base 11 and the fins; & uses a scroll-shaped design, so there is a larger The area is clear-the recessed space 13 on the bottom surface of the base 11 can be used in addition to the first picture I and II, and can also use the power of the working mother ... No .: Figure: In the poor recessed two of the rectangular groove recessed space 13, Then b open the trap / inside 'and it is located between the base 11 and the base 3 = the top view of the combination of the heat conduction officer 2 with the heat sink i and the base 3 is like the seventy two, for the second embodiment, please Referring to the eighth figure, the thin base 11 is scattered, and the thickness of the base 3 is formed to be thicker. The bottom surface of the base and the U is formed into a recessed space 30 that can accommodate the scroll-type heat transfer tube 2. After applying thermal conductive glue or paste on the bottom surface of = 2I, 2,30, Jin = trap dagger empty corpse. Medium, then between the top of the base 3 and the bottom of the base u | solder Xiao is combined to achieve the same heat transfer and heat dissipation effect. 5 The above is only to explain the preferred embodiment of this creation, and the chart is based on any form of restriction on this creation, so, wherever there is ===
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M249427 圖式簡單說明 第一圖為顯示本創作第一種實施例之散熱片、導熱管與底座 組合關係之立體分解圖。 第二圖為顯示第一圖之元件組合後之前視平面剖視圖。 第三圖為顯示本創作之單一渦捲式導熱管結構之平面視圖。 第四圖為顯示本創作將兩個渦捲式導熱管交錯套置後之形態 之平面視圖。 第五圖為顯示第一圖所示之元件組合後之俯視平面視圖。 第六圖為顯示本創作在散熱片基座的底面設置矩形槽形狀的 凹陷空間，並且與導熱管及底座組合關係之立體分解圖。 第七圖為顯示第六圖所示之元件組合後之俯視平面視圖。 第八圖為顯示本創作第二種實施例結構之平面剖視圖。 【元件符號說明】 (1 )散熱片 (11 )基座 (1 2 )鰭片 (13)凹陷空間 (2 )導熱管 (3 )底座 (30)凹陷空間M249427 Brief description of the drawing The first picture is an exploded perspective view showing the combination of the heat sink, the heat pipe and the base of the first embodiment of this creation. The second figure is a front cross-sectional view showing the components of the first figure after assembly. The third figure is a plan view showing the structure of a single scroll type heat pipe in this creation. The fourth figure is a plan view showing the form in which two scroll-type heat-conducting pipes are staggered in this creation. The fifth figure is a top plan view showing the combination of the components shown in the first figure. The sixth figure is an exploded perspective view showing a rectangular groove-shaped recessed space provided on the bottom surface of the heat sink base, and a combination of the heat sink and the base. The seventh figure is a top plan view showing the combination of the components shown in the sixth figure. The eighth figure is a plan sectional view showing the structure of the second embodiment of the present invention. [Description of component symbols] (1) heat sink (11) base (1 2) fin (13) recessed space (2) heat pipe (3) base (30) recessed space
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