M337966 八、新型說明： 【新型所屬之技術領域】 種透過均溫板的 本創作係與一種散熱器有關，尤指一 延伸而構成平板式之散熱裝置。 【先前技術】 按，由於電腦適用範圍越來越廣泛，也日漸朝向攜帶 化的設計。因此，配合應用於電腦内部的散熱裳置，二 須針對電腦内部之中央處理器所適用的場合而改變型能 例如：應用於個人電腦内之散熱裝置，由於其内部空^ 廣，且具有足夠的空間安襄風扇，故仍可以透過基本的= 材或銅材所製成的散熱器及搭配的風扇來提供散敎；作在 應用於筆記型或攜帶型電腦内的散熱裝置，則往 =窄，不僅無法使用較為常見的銘擠型散熱器，連 風扇亦被限制離心式始可適用。 除此之外，如熱管（Heatpipe )或是 妬 chamber)等透過汽液相之循環 . &Ρ〇Γ 為-从，上丄 以徒供熱傳作用的導 熱几件’也W被應用於散熱領域中。尤其是 為 熱管在型體上較容易製造，又 、，:口為 个伯工間，亚可透過其營 度之延伸’將中央處理器所產 旦 、 、乂 $ & …、里朝橫向導引至散埶 ^後，再料W錢料散熱料 : 故熱管相當適用應用於如筆記 /、、:之目的 人L ^ 玉电^專空間受到限制的埸 均溫㈣往往被用來取代以往散㈣上的每心其 座部位，故僅管其原理與熱管相同田只。土 卻也正㈣二者在型體上 仁貝^破應用的情況 股上的差異’而有所不同。 M337966 惟’熱管雖較不佔空間曰其尸 下，仍未如均溫板1右节】一，、5徑兴均溫板厚度相較 ，又常受限於板面積較大，而容易在製造上 *，若直易具有平整的受熱面或散熱 果。 貼附熱源’亦無法達到良好的熱傳接觸效 【新型内容】 :創作之主要目的，在於可提供一種平板 ，其主要係利用均溫板厚度較薄之特性 j置 整體薄型化，埶傳路庐tT财人4二使侍该散熱裝置 散熱裝置之導熱基座與藉片組皆位於均溫板之=側= 大大減h亥散熱裝置在高度上所佔之空間，故古 度或厚度上受限的場合中。 Μ用於回 為了達成上述之目的，本創作係提供一種平板式散熱 ^ ，包括一導熱基座、一均溫板以及至少一鰭片組，^ 熱基座係具有-導熱面，以供均溫板熱傳連結於其上，而 =溫板則形成朝向導熱基座側向延伸之型態，且^溫板朝 導熱基座側向所延伸之部位上係供鰭片組配置，並使鰭片 、、且與V熱基座皆位於均溫板之同一側處；藉以獲得一平板 式散熱裝置，並透過鰭片組與導熱基座皆位於均溫板同侧 之結構設計，以達成上述之目的。 【實施方式】 為了使貴審查委員能更進一步暸解本創作之特徵及 技術内容’請參閱以下有關本創作之詳細說明與附圖，然 6 M337966 圖式僅提供參考與說明用，並非絲對本創作加以 圖及= = ’係分別為本創作之立體分解 本創作係提供一種平板式散熱裝置，包 中： 叼，皿扳2、以及至少一鰭片組3 ;其 δ亥導熱基座1概呈一平姑 質所制 干板狀，其係以導熱性良好之材 乃用:鱼二° ”呂、銅等。導熱基座1底面為一受熱面10 ’ 示）作目^人如中央處理器等電子發熱元件4 (如第五圖所 導孰面=導熱基座1頂面則為一導熱面11，透過該 Λ柄溫板2作熱傳連結，以便導熱基座1 將其所吸收的熱量導引 1近周邊該導熱基座 的…角處亦可進一步穿設有鎖孔12，可供相配合 中水(圖略）穿入後，即可將導熱基座1固定於如 、处理器所設置之電路板（如主機板）上。 内辟該均溫板（Vaporchamber ) 2内呈真空而密封，且其 壁上具有毛細組織、内部填充有工作㈣，料一種透 ^液相變化來提供熱傳作用之導熱元件。均溫板2呈長 :扁板狀體’其一部位係用以貼附於上述導熱基座1之導 :面11上，以作熱傳連結，其餘部位則朝向導熱基座！侧 ΐ 伸’在本創作所舉之實施例_，該均溫板2係利用 2 tϋ卩位與上述導熱基座1之導熱面11相貼附而固接， 了餘條狀之二端處則分別突出於導熱基座1外而延伸 ，俾供導熱基座丨將所吸收的熱量導引至該均溫板2之中 M337966 2立後’再透過均溫板2具有高熱傳導之特性，以將熱 買由均溫板2二端處分別傳導。 /曰片、、且3係由複數鰭片30以橫向間隔排列而成，且 各Μ30上弯折有一折邊3〇〇。請一併參閱第三圖及第四 圖所7Γ纟I曰片3〇之折邊3〇〇可作為該等稽片如在橫向間 排列上之間距’而各鰭片3G之折邊在-折後，即可 T該鰭片組3上方形成—凹人區31，以供上述均溫板2由 灸V”、、基座1延伸而出的部位’容置於該凹入區y内並盘各 鰭片3〇之折邊300相貼附，進而使該.鰭片組3位於均溫板 2的下方處’即與上述導熱基座i —同位於均溫板2之同 -側上、。如此，該散熱裝置即可在高度上減少其所佔空間 ，故可適用於高度或厚度上受限制的場合令。 ^而上述導熱基座1、均溫板2與鰭片組3間之接合， 係可透過如錫焊或導熱膠等具導熱性的黏著手段或方二進 行接合，以便各組件間之固接。 疋以，藉由上述之構造組成，即可得到本式 散熱裝置。 傲巧 據此，如第五圖所示’當該散熱裝置應用於一如 處理器等電子發熱元件4時，係透過其導熱基座】之受埶 面K)貼附於該電子發熱元件4之上表面處，且可透= 基座1上之鎖孔12作m外，，鰭片組3最外側之^M337966 VIII. New Description: [New Technology Field] This type of creation through the uniform temperature plate is related to a heat sink, especially a heat sink that extends to form a flat plate. [Prior Art] Press, as computers are becoming more widely used, they are increasingly moving towards portable designs. Therefore, in conjunction with the heat sink that is applied to the inside of the computer, the second type must be changed for the application of the central processing unit inside the computer. For example, the heat sink applied to the personal computer is wide and has sufficient internal space. The space is equipped with a fan, so it can still be provided by a basic radiator made of a material or copper and a matching fan. For heat sinks used in notebook or portable computers, go to = Narrow, not only can not use the more common type of extruded radiator, even the fan is limited to the centrifugal type can be applied. In addition, such as heat pipe (Heatpipe) or 妒chamber, etc. through the vapor-liquid phase of the cycle. & Ρ〇Γ is - from, the upper part of the heat transfer of the heat transfer function is also applied In the field of heat dissipation. In particular, it is easier to manufacture the heat pipe on the body, and, the port is a work room, and the extension of the camp can be achieved by the extension of the battalion 'the central processor's dan, 乂$ & After the guide to the divergence ^, the material of the W material is dissipated: Therefore, the heat pipe is quite suitable for use in the purpose of notes such as notes /, :: L ^ jade electric ^ space is limited by the average temperature (four) is often used to replace In the past, each part of the heart (4) was scattered, so the principle is the same as that of the heat pipe. However, the soil is also different. (4) The two are different in the form of the case. M337966 However, although the heat pipe does not occupy space, it is still not as the right section of the uniform temperature plate. The thickness of the plate is relatively limited, and it is often limited by the large plate area. Made of *, if it is easy to have a flat heating surface or heat-dissipating fruit. Attaching a heat source can't achieve good heat transfer effect [New content]: The main purpose of the creation is to provide a flat plate, which is mainly made of a thinner thickness of the uniform temperature plate, and is thinned overall.庐tT 财人4二 makes the heat-dissipating pedestal and the borrowing group of the heat-dissipating device of the heat-dissipating device are located at the side of the temperature-equalizing plate = greatly reducing the space occupied by the height-receiving device in the height, so the ancient or the thickness In limited circumstances. In order to achieve the above objectives, the present invention provides a flat-plate heat sink, comprising a heat-conducting base, a temperature-averaging plate and at least one fin set, and the heat base has a heat-conducting surface for both The heat plate is thermally coupled thereto, and the = warm plate is formed to extend laterally toward the heat conducting base, and the fin plate is disposed on the side of the heat conducting base laterally for the fin group, and The fins, and the V thermal base are located on the same side of the temperature equalizing plate; to obtain a flat heat sink, and through the structure design of the fin group and the heat conducting base on the same side of the temperature equalizing plate, The above purpose. [Embodiment] In order to enable your review committee to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings of this creation. However, the 6 M337966 schema is for reference and explanation only, not for the creation of this creation. The figure and the == 'system respectively provide a flat-type heat sink for the creation of the three-dimensional decomposition of the creation, in the package: 叼, 盘, 2, and at least one fin set 3; A flat plate made of a flat material, which is made of a material with good thermal conductivity: fish 2° ” Lu, copper, etc. The bottom surface of the heat-conducting base 1 is a heated surface 10′). The electronic heating element 4 (as shown in the fifth figure, the top surface of the heat conducting base 1 is a heat conducting surface 11 through which the heat transfer surface 2 is thermally coupled so that the heat conducting base 1 absorbs it. The heat guiding base 1 can be further provided with a locking hole 12 at a corner of the heat-conducting base near the periphery, so that the heat-conducting base 1 can be fixed and processed after being inserted into the water (not shown). On the circuit board (such as the motherboard) set up by the device. Vaporchamber 2 is vacuum-sealed and has a capillary structure on the wall and is internally filled with work (4). It is a heat-conducting element that provides a heat transfer function by changing the liquid phase. The temperature-average plate 2 is long: flat plate-like body 'The other part is attached to the guide of the above-mentioned heat-conducting base 1 : surface 11 for heat transfer connection, and the other part is oriented toward the heat-conductive base! Side extension' in the present embodiment _, The temperature equalizing plate 2 is attached to the heat conducting surface 11 of the heat conducting base 1 by means of a 2 t clamp, and the two ends of the strip are respectively protruded outside the heat conducting base 1 and extended. The heat conducting base 导引 guides the absorbed heat to the temperature equalizing plate 2 in the M337966 2 and then passes through the temperature equalizing plate 2 to have high heat conduction characteristics, so that the heat is separately transmitted from the two ends of the temperature equalizing plate 2 / 曰 、 , , and 3 series are arranged by the plurality of fins 30 at a lateral interval, and each of the cymbals 30 is bent with a hem 3 〇〇. Please refer to the third and fourth figures together. The 3 折 折 3 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 该 该 该 该 该 该 该 该 该 该That is, the concave portion 31 is formed above the fin group 3, so that the portion of the temperature equalizing plate 2 that is extended by the moxibustion V" and the base 1 is accommodated in the concave portion y and each of the disks The folded edge 300 of the fin 3 is attached, so that the fin set 3 is located below the temperature equalizing plate 2, that is, on the same side as the heat conducting base i. In this way, the heat dissipating device can reduce the space occupied by the height, so it can be applied to the case where the height or the thickness is limited. ^ The joint between the heat conducting base 1, the temperature equalizing plate 2 and the fin group 3 The heat-dissipating adhesive means such as soldering or thermal conductive adhesive or the bonding of the two components can be used for bonding between the components. Therefore, the heat dissipating device of the present type can be obtained by the above-mentioned structural composition. According to this, as shown in the fifth figure, when the heat dissipating device is applied to the electronic heating element 4 such as a processor, the receiving surface K) through the thermal conductive base thereof is attached to the electronic heating element 4 At the upper surface, and through the lock hole 12 on the base 1 for m, the outermost part of the fin set 3
30亦可形成向外f折之鎖固片32，以供螺检41等螺設乂 穿入後定位於電路板40上。該散熱裝置係透過均溫板 向延伸作為導熱路徑，尤其將導熱基座】配置於均溫板Z M337966 2部位下ΓΓ均溫板2二端皆可成為冷凝端並分別 連接所祕片組3，且利㈣散熱1置#際應用上 均溫板2與電路板4G間的間隙，以供所組3配^ 此，因而能使該散熱t置在整體的高度上貼近於電路板4〇 ，有效減少佔用空間。 綜上所述，本創作實為不可多得之新型創作產品，其 確可達到預期之使用目的，而解決習知之缺失，又因極具 籲新穎性及進步性，完全符合新型專利申請要件，麦依專利 法提Φ申請，敬請詳查並賜准本案專利，以保 權利。 η准以上所述僅為本創作之較佳可行實施例，非因此即 句=本創作之專利範圍，故舉凡運用本創作說明書及圖式 内奋所為之等效結構變化，均同理皆包含於本創作之範圍 内’合予陳明。 M33 7966 【圖式簡單說明】 f 一圖係、本創作之立體分解圖。 ，二圖係本創作之立體組合圖。 第三圖係本創作之剖面示意圖。 第四圖係第三圖之A部份放大詳圖 • 第五圖係本創作使用狀態之示意圖 <本創作> •【主要元件符號說明】 導熱基座 1 受熱面 10 導熱面 11 鎖孔 12 均溫板 2 鰭片組 3 鰭片 30 折邊 300 凹入區 31 鎖固片 32 電子發熱元件4 電路板 40 螺栓 41 1030 can also form an outwardly f-folded locking piece 32 for screwing 41 and the like to be placed on the circuit board 40 after being inserted. The heat dissipating device extends through the temperature equalizing plate as a heat conducting path, in particular, the heat conducting base is disposed on the temperature equalizing plate Z M337966 2, and the two sides of the temperature equalizing plate 2 can be the condensation end and respectively connected to the secret group 3 And (4) heat dissipation 1 set the gap between the temperature equalization plate 2 and the circuit board 4G for the group 3, so that the heat dissipation t can be placed on the overall height close to the circuit board 4〇 , effectively reducing the space occupied. In summary, this creation is a rare new creative product, which can achieve the intended purpose of use, and solve the lack of knowledge, but also because of the novelty and progress, fully comply with the new patent application requirements, Maiyi patent law Φ application, please check and grant the patent in this case to protect the rights. η准 The above is only a preferred and feasible embodiment of the present creation, and therefore is not a sentence = the patent scope of the creation, so the equivalent structural changes in the use of this creation specification and the schema are all included in the same reason. In the scope of this creation, 'combined with Chen Ming. M33 7966 [Simple description of the diagram] f A diagram, a three-dimensional exploded view of the creation. The second picture is a three-dimensional combination of the creation. The third picture is a schematic cross-section of the creation. The fourth picture is a partial enlarged view of the third part of the third figure. • The fifth picture is a schematic diagram of the state of use of this creation. <This creation> • [Description of the main components] Thermal base 1 Heated surface 10 Thermally conductive surface 11 Keyhole 12 Mean temperature plate 2 Fin set 3 Fin 30 Fold 300 Recessed area 31 Locking piece 32 Electronic heating element 4 Circuit board 40 Bolt 41 10