JPH09326459A - Heat radiator of ic board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiator of an IC board improving the heat radiating efficiency. SOLUTION: Respective through parts of corrugated boards 60 made of flexible thermal conductive material are fixed on the surface of a thermal conductive substrate 50 to be decoratively and close by provided on the IC board surface of CPU so as to form multiple vent cavities 63 between the thermal conductive substrate 50 and the corrugated boards 60 also multiple vent holes 62 are board in the corrugated boards 60 so that air may be freely ventilated in the multiple vent cavities 63 through these vent holes 62, thereby enabling the radiating efficiency of the heat from the thermal conductive substrate 50 to the corrugated board 60 to be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device for an integrated circuit board (hereinafter referred to as IC board) in a central processing unit (hereinafter referred to as CPU) of a computer.

[0002]

2. Description of the Related Art As the functions of CPUs for computers have been improved more and more, their power consumption has been increased more and more, so that the generated heat often causes the temperature to reach 100 ° C. or more. On the other hand, the operating temperature allowed for the CPU is usually 60 ° C or less, so
A heat dissipation device is required to dissipate the heat from the heat dissipation device, such as the heat dissipation fin device or heat dissipation grid body disclosed in U.S. Pat. No. 5,299,632 shown in FIGS. As shown in the figure, the heat radiation fin device 11 has a CPU 20 on the bottom surface thereof.
The fan means 12 is mounted on the upper end surface, and the fan means 12 is placed on the upper end surface. As shown in FIG. 2, the radiating fin device 11 is fixed to the bottom plate portion 13 and the upper surface of the bottom plate portion 13. Although a large number of upright heat dissipation pieces 14 are provided to dissipate and dissipate heat from the CPU, the bottom plate portion 13 and the heat dissipation pieces 14 are disposed.
Is relatively thick, its surface area is small relative to its heat capacity, and it is difficult to expect a rapid heat dissipation effect, so the heat dissipation efficiency is extremely low.

[0003]

SUMMARY OF THE INVENTION In view of the problems in the conventional heat dissipation device for an IC plate, an object of the present invention is to provide a heat dissipation device for an IC plate with improved heat dissipation efficiency.

[0004]

In order to achieve the above-mentioned object, the present invention is provided on the upper surface of a heat conducting substrate which is closely adhered to the surface of an IC board of a CPU and serves to conduct heat. The wave-shaped heat dissipation plate made of a flexible heat conduction material for dissipating the heat of is laminated and fixed to form a large number of ventilation cavities between the heat conduction substrate and the heat dissipation plate, and A large number of ventilation holes are bored to allow ventilation of the large number of ventilation cavities to flow freely through these ventilation holes, and heat is radiated from both upper and lower surfaces of the heat dissipation plate so that the overall heat dissipation effect is improved. Composed.

Then, the heat conducting substrate is formed of an electrically insulating material so as to prevent the leakage of the IC plate of the CPU, or a fan means is attached above the heat sink so that the fan means is used. The airflow flowing between the upper surface of the heat dissipation plate and the ventilation cavity via the air holes is enhanced, or a part of the heat dissipation plate is extended to the outside of the heat conductive substrate to dissipate the heat dissipation plate. It is even more preferable to spread and expand the heat dissipation area of.

According to the present invention having the above-described configuration, the CPU
The heat-dissipating plate made of a flexible heat-conducting material for heat dissipation is fixed on the upper surface of the heat-conducting substrate that closely adheres to the surface of the IC plate to perform heat conduction, Forming a large number of ventilation cavities between the heat conductive substrate and the heat dissipation plate,
Since a large number of ventilation holes are formed in the heat dissipation plate, when the fan means mounted above the heat dissipation plate is activated, air freely flows through the ventilation holes to the plurality of ventilation cavities, and the heat The heat transmitted from the conductive substrate to the heat dissipation plate can be dissipated from both upper and lower surfaces of the heat dissipation plate, and the overall heat dissipation efficiency can be improved.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be specifically described based on embodiments, but the present invention is not limited to these embodiments. As shown in FIGS. 3 and 4, the heat dissipation device for an IC plate of the present invention includes an inverted U-shaped holding body 30 as a holding means, and fan means 40, C provided on the upper surface of the U-shaped holding body 30.
The PU 20 is provided with a heat conducting substrate 50 made of a heat conducting material which is closely adhered to the upper surface of the IC plate, and a wave-shaped heat radiating plate 60 made of a flexible heat conducting material fixedly mounted on the upper surface of the heat conducting substrate 50. . Among them, the U-shaped holder 30 is the horizontal ceiling wall 3
1 and both upright side walls 32, and horizontal grooves 34 of lateral opening are provided along the lower edges of the inner side surfaces of both upright side walls 32, and both horizontal grooves 34 hold and hold both side edges of the heat conductive substrate 50. Then, the fan means 40 is fixed above the heat conductive substrate 50 with the corrugated heat dissipation plate 60 interposed therebetween.

The heat sink 60 is corrugated with aluminum foil pieces to form a number of V-shaped sections 61 with an outer surface 611 and an inner surface 612, and these V-shaped sections 61.
The bottoms of the letter-shaped sections 61 are fixed to the surface on the heat conducting substrate 50, thereby partitioning a plurality of ventilation cavities 63 between the upper surface of the heat conducting substrate 50 and the heat radiating plate 60. A plurality of ventilation holes 62 are formed at appropriate intervals, and cool air from the fan means 40 is passed through the ventilation holes 62 to a ventilation cavity 63 formed between the heat conduction substrate 50 and the heat dissipation plate 60. The hot air in the ventilation cavity 63 is made to flow in through the ventilation hole 62 or the heat radiation plate 60.
It is made to flow out to the upper surface, and the heat dissipation board 6 is released from the heat conduction substrate 50.
The heat transmitted to 0 can be dissipated from the upper and lower surfaces of the heat dissipation plate 60.

It should be noted that the heat conducting substrate 50 is formed of an electrically insulating material, so that electricity does not conduct from the IC plate of the CPU 20 to the heat conducting substrate 50, and therefore the CPU 20 of the CPU 20 is not electrically conducted. There is no risk of damaging the insulating layer of the IC board. As can be seen from the above, the thickness of the heat conducting substrate 50 and the heat radiating plate 60 of the present invention is much thinner than the thickness of the horizontal bottom surface portion 13 and the upright heat radiating piece 14 of the heat radiating fin device 11 in the prior art shown in FIG. Therefore, the heat dissipation device of the present invention can dissipate the heat in the IC plate of the CPU 20 effectively and quickly.

The U-shaped holder 30 may be replaced by a holding unit 70 shown in FIG. 5, and the holding unit 70 has a third side wall 71 at the right end in the figure in addition to the side walls.
Is formed, whereby the right end of the horizontal groove 72 in the drawing can be closed. FIG. 6 shows an embodiment in which the present invention is applied to a notebook computer. In this embodiment, a part 81 of the heat sink 80 is extended to the outside of the heat conductive substrate 50 ', and the part 81 is Computer 1
00 'extends into the large ventilation space 200 in the housing, thereby expanding the heat dissipation area of the heat dissipation plate 80. A portion 81 of the heat sink 80 may extend outside the housing of the computer 100 'if desired, and as will be understood from the above, the heat sink of the present invention may be used in other technical fields such as a microprocessor or an electronic device. It can also be applied to a computer.

[0011]

The present invention constructed as described above has the following effects. 1. Whereas the conventional upright heat dissipating member has a simple surface heat dissipation, the heat dissipating surface of the present invention includes the outer surface and the inner surface of each V-shaped section of the heat dissipating plate, so that the area in contact with air is considerably wide. , Heat dissipation is fast.

2. Since a large number of vent holes are formed in each V-shaped section of the heat sink, when the fan means is activated, air rapidly flows through the vent holes above and below each V-shaped section to exchange heat. And improve the overall heat dissipation effect. 3. Since the heat dissipation plate is formed of a highly flexible aluminum foil piece, it is possible to directly extend a part from the heat dissipation plate according to the place of use and connect it to a relatively easy heat dissipation part of the computer main unit. As a result, CP is transferred through the heat conductive substrate.
The heat generated by the IC plate of U can be dissipated more quickly to improve the overall heat dissipation efficiency.

[Brief description of drawings]

FIG. 1 is a perspective view of a conventional heat dissipation device for an IC plate.

FIG. 2 is a perspective view of a heat dissipation fin device in a conventional IC plate heat dissipation device.

FIG. 3 is a three-dimensional exploded view of a first preferred embodiment of the present invention.

FIG. 4 is a sectional side view of the first embodiment combined with an IC plate.

FIG. 5 is a stereoscopic exploded view of a second preferred embodiment of the present invention.

FIG. 6 is a sectional side view of a third preferred embodiment of the present invention.

[Explanation of symbols]

 20 CPU 40 Fan Means 50 Heat Conduction Substrate 60 Radiator 62 Vent Hole 63 Vent Cavity 80 Part of Radiator

Claims (4)

[Claims] 1. A flexible heat-conducting material for dissipating heat from the heat-conducting board on the upper surface of the heat-conducting board that is closely adhered to the surface of the IC board of the CPU and acts as a heat conductor. The corrugated heat dissipation plates are stacked and fixed to form a large number of ventilation cavities between the heat conductive substrate and the heat dissipation plate, and a large number of ventilation holes are formed in the heat dissipation plate, and the ventilation holes are formed through these ventilation holes. Ventilation of a large number of ventilation cavities is made to flow freely, and heat is radiated from both upper and lower surfaces of the heat dissipation plate to improve the overall heat dissipation effect.
C plate heat dissipation device. 2. The heat dissipation device for an IC plate according to claim 1, wherein the heat conducting substrate is formed of an electrically insulating material to prevent leakage of the IC plate of the CPU. 3. A fan means is attached above the heat dissipation plate, and the fan means enhances an air flow flowing between the upper surface of the heat dissipation plate and the ventilation cavity through the ventilation hole. The heat dissipation device for an IC plate according to claim 1. 4. The heat dissipation device for an IC board according to claim 1, wherein a part of the heat dissipation plate is extended to the outside of the heat conductive substrate to expand and expand a heat dissipation area of the heat dissipation plate.