JPH07176653A - Cooler and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide a cooler, and manufacturing method thereof, exhibiting excellent cooling effect and cooling performance through a simple structure which can be manufactured at low cost and the design thereof can be modified easily according to the performance thereof. CONSTITUTION:Fin members 2 and board members 3 are laminated alternately and bonded through a brazing material. In this regard, both members 2, 3 are abutted on the end faces thereof to form a plane for mounting heating components, i.e., power semiconductors 5a, 5b, 5c, and the part of fin member 2 not bonded to the board member 3 serves as a cooling fin. The power semiconductors 5a, 5b, 5c are cooled, as required, by means of the cooling fins using cooling air fed from a cooling fan 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for mounting heat generating electric parts such as an inverter and a power module to promote dissipation of generated heat, and a manufacturing method thereof.

[0002]

2. Description of the Related Art FIG. 13 is a perspective view showing a conventional cooling device for heat generating electric parts. In the figure, reference numeral 1 denotes a cooling body, which has a plurality of cooling fins 1b formed integrally with the cooling body 1 and having a function as a heat radiating plate together with an installation portion 1a of a heat-generating electric component which is a cooled body. ing. Further, since the cooling body 1 is an extruded aluminum material, it is warped, and the installation portion 1a of the heat-generating electric component is surface-cut to improve the flatness. Reference numeral 4 denotes a cooling fan that blows cooling air between the plurality of cooling fins 1b of the cooling body 1 and is installed so as to have a vertical positional relationship with the cooling fins 1b. Reference numerals 5a, 5b and 5c are heat-generating electric components, for example, a power semiconductor 3 and a power semiconductor 5a,
The screws 5b and 5c are detachably attached to the installation portion 1a of the cooling body 1. As shown, the cooling fin 1b has a large surface area.

The cooling operation of the conventional cooling device for heat-generating electric parts configured as described above will be described. Since the temperature rises due to the use of the power semiconductors 5a, 5b, 5c, it is necessary to suppress this temperature rise within the allowable operating temperature. Therefore, the heat generated by the power semiconductors 5a, 5b, 5c is transferred to the cooling body 1 and radiated by the cooling fin 1b. The cooling fin 1b has a large surface area and can also naturally radiate heat. However, in order to promote heat radiation and increase the cooling capacity, the cooling fan 4 is used to force the cooling air to flow between the cooling fins 1b. . As described above, the heat is removed from the cooling body 1 in which the power semiconductors 5a, 5b, and 5c are installed to indirectly bring the power semiconductors 5a, 5b, and 5c into appropriate temperature conditions within the allowable operating temperature.

FIG. 14 shows a cooling device for heat-generating electric parts described in Japanese Utility Model Laid-Open No. 4-77292. The cooling device shown in the figure is formed by stacking and fixing a plurality of fin materials formed with a fin pitch thickness, and each fin material has a thin shape except for the parts fixed to each other. . In the figure,
Reference numerals 1, 4 to 6 are the same as those in FIG. Three
Reference numeral 0 denotes a cooling fin material that constitutes a cooling body, which is obtained by cutting an aluminum extruded product, and 30a is a connecting surface for connecting and fixing the fin materials, and a triangular convex shape 30b is formed on one surface. The opposite surface is provided with a groove 30c having a concave shape that matches the triangular shape at the same position. Reference numeral 30d is a fin portion to which cooling air from the cooling fan 4 is blown, and reference numeral 30e is an installation surface on which the heat-generating electric component is installed. The width of the installation surface 30e corresponds to a desired fin pitch, and the fin portion 30d is formed thinner than the width of the installation surface 30e. 30f is a bolt hole through which a bolt formed in the connection surface 30a of the fin material 30 is inserted. Reference numeral 31 denotes a cooling body assembly formed by stacking a plurality of cooling fins 30. The cooling fins 30 are tightly fixed by the nuts 14 through the bolts 13 shown in the drawings through the bolt holes 30f. Installation surface 3
0e are connected to form a plane on which the power semiconductors 5a, 5b, 5c are installed.

The cooling operation by this cooling device is similar to that of FIG. 13, and the heat generated by the power semiconductors 5a, 5b, 5c is transferred to the cooling body assembly 31 and radiated by the fin portion 30d. The cooling fan 4 sends cooling air between the fins 30d to exchange heat with the surfaces of the fins 30d.

Since the cooling body assembly 31 of the cooling device shown in FIG. 14 is formed by stacking the cooling fin materials 30 which are extruded products, the fin pitch can be reduced. Further, in order to facilitate the stacking of the fins, the triangular projection and the groove are provided on both sides, so that the positioning is easy.

Further, FIG. 15 is a diagram of Japanese Patent Laid-Open No. 63-81838.
The cooling device using the brazing described in the official gazette is shown. In the figure, reference numeral 32 denotes a base material, which has side walls 32a at both ends.
Reference numeral 33 is a thin plate-shaped solder, and 34 is a heat dissipation fin formed in a corrugated shape.

A method of constructing the cooling device shown in FIG. 15 will be described.
The solder 33 is placed on the base material 32 and brazed.
Then, if necessary, a frit (not shown) is provided, and when the corrugated heat dissipation fins 34 are elastically narrowed and inserted into the base material 32, the heat dissipation fins 34 spring back and both sides of the fins 34 spring back. It is positioned by being locked at the base of the side wall 32a. When this is put in a heating furnace to melt the solder 33 and the radiation fins 34 are soldered to the base material 32 and then taken out from the heating furnace and cooled, FIG.
A cooling device such as

The cooling operation of this cooling device is also shown in FIGS.
The cooling device is the same as this cooling device.
Cooling air from a cooling fan (not shown in FIG. 15) is sent between 4 to exchange heat with the surface of the radiating fins 34. With the cooling device having the above structure, heat dissipation characteristics are improved, mechanical strength is increased, and productivity is increased.

[0010]

In the conventional cooling device for heat generating electric parts shown in FIG. 13, a power semiconductor 5a,
Since the cooling body 1 on which 5b and 5c are installed is an extruded aluminum product, the spacing between the fins is limited with respect to the vertical length of the cooling fin 1b in the figure, and the spacing cannot be narrowed. However, there is a problem that the outer diameter of the device becomes large.

Further, in the cooling device shown in FIG. 14, since the cooling fin materials 30 are simply stacked and pressed, air intervenes in the contact portions of the cooling fin materials 30 and the thermal conductivity decreases. Therefore, the heat-generating electric components 5a, 5b, 5
The heat generated by c is not efficiently transmitted to the fin portion 30b,
Although the fin pitch can be narrowed, there is a problem that the cooling device has low heat dissipation characteristics.

Further, in the cooling device shown in FIG. 15, since the thin plate is formed into a corrugated shape, it is difficult to form the fins to a large height from the beginning. Was required, and a step of elastically narrowing it when brazing it to the base material 32 was required. In addition, the heat dissipation fin 3 formed in a corrugated shape
The side walls 32a are provided on both sides of the base member 32 in order to lock 4
Therefore, there is a problem that the shape of the base material is complicated.

The present invention has been made to solve the above problems, and has a small outer dimension, excellent cooling efficiency and cooling performance, does not require a complicated base material, and is inexpensive and has excellent performance. It is an object of the present invention to obtain a cooling device which can be easily changed in design, and to provide a method of manufacturing such a cooling device.

[0014]

According to the cooling device of the present invention, the first metal material and the second metal material are alternately laminated and joined while leaving a part of the first metal material. The respective end surfaces of the first and second metal materials form a flat surface on which the heat-generating component is mounted, and further, the cooling fins are formed by the unbonded portions of the first and second metal materials.

In the method for manufacturing a cooling device according to the present invention, the first metal material and the first metal material are arranged so that the second metal material is arranged so as to leave a predetermined region from opposite ends of one surface of the first metal material. A step of alternately stacking two metal materials, a step of joining and integrating the first and second metal materials, and a step of cutting a joint portion between the first metal material and the second metal material Is included.

Further, in the method for manufacturing a cooling device according to the present invention, a space is formed between the second and third metal materials in a predetermined region from opposite ends of one surface of the first metal material. A step of arranging the second and third metal materials on the first metal material and alternately stacking the first metal material and the second and third metal materials, and the first metal material and the second and third metal materials. It includes a step of joining and integrating metal materials and a step of cutting the above-mentioned space portion.

Further, in the method for manufacturing a cooling device according to the present invention, the second metal material is arranged while leaving a predetermined region from opposite ends of one surface of the first metal material, and the first and second metal materials are arranged. A step of alternately stacking the first metal material and the second metal material so that the holes previously provided in the metal material overlap, and a step of joining and integrating the first and second metal materials The process includes cutting so as to pass through the hole.

Further, in the method for manufacturing a cooling device according to the present invention, a space is formed between the second and third metal materials in a predetermined area from opposite ends of one surface of the first metal material. The second metal material and the second metal material are arranged so that the holes previously formed in the first metal material are lined up at the same position in the space. Are alternately laminated, the first metal material and the second and third metal materials are joined and integrated, and the cutting is performed so as to pass through the hole.

Further, in the cooling device according to the present invention, the first metal material and the second metal material are alternately laminated and joined while leaving a part of the first metal material. Each end surface of the second metal material is joined to the base material on which the heat-generating component is mounted, and the cooling fin is formed by the unjoined portion of the first and second metal materials.

Further, in the cooling device according to the present invention, the first metal material and the second metal material are alternately laminated and joined while leaving a part of the first metal material. Each end surface of the second metal material is joined to a substrate having a wiring pattern connected to the heat generating component, and the cooling fin is formed by a portion where the first and second metal materials are not joined.

In the cooling device according to the present invention, a heat-generating component is mounted on one surface, a flow path for liquid flow is formed inside, and a base material provided with inlets and outlets of the flow path on the surface, A first metal material and a part of the first metal material are left, and a first metal material and a second metal material that are alternately laminated and bonded to each other are provided. The cooling fin is formed by the portion which is not joined to the second metal material.

The above cooling device according to the present invention,
An uneven shape is formed on the surface portion of the first metal material that is not joined to the second metal material.

[0023]

In the cooling device described above, the first metal material and the second metal material are alternately laminated and joined while leaving a part of the first metal material. The outer diameter of the cooling device is arbitrarily set according to the plate thickness, and the end faces of the first and second metal materials form a flat surface on which the heat-generating component is mounted, and the first and second metal materials are joined together. Since the cooling fin is formed by the non-heated portion, the heat conductivity from the heat-generating component to the fin is good, and the cooling performance is improved.

Further, in the above-described method for manufacturing the cooling device, the first metal material and the first metal material are arranged so that the second metal material is arranged so as to leave a predetermined region from opposite ends of one surface of the first metal material. Since the two metal materials are alternately laminated and bonded, and further, the step of cutting the bonding portion between the first metal material and the second metal material is included,
Two cooling devices are manufactured at the same time.

Further, in the above-described method for manufacturing a cooling device, a space is formed between the second and third metal materials in a predetermined region from opposite end sides of one surface of the first metal material. As well as arranging the second and third metal materials, the steps of laminating and joining the first metal material and the second and third metal materials alternately, and further cutting the space portion are included. Two cooling devices are manufactured.

In the method for manufacturing the cooling device, the first metal material and the second metal material are alternately laminated and joined so that the holes provided in advance in the first and second metal materials overlap. Further, since the cutting is performed so as to pass through the above holes, the time required for cutting is shortened when two cooling devices are manufactured at the same time, and the jig for fixing the metal material at the time of stacking and joining is It is attached using the holes.

Further, in the above-described method for manufacturing the cooling device, a space is formed between the second and third metal materials arranged on one surface of the first metal material, and the space is provided in advance in the first metal material. Since the first metal material and the second and third metal materials are alternately laminated and joined so that the holes are aligned at the same position in the space portion, and further cut so as to pass through the holes, similarly, When manufacturing two cooling devices at the same time, the time required for cutting is shortened, and a jig for fixing a metal material at the time of stacking and joining can be attached using this hole.

In the above cooling device, the end surfaces of the first and second metal materials are joined to the base material on which the heat-generating component is mounted, and the first and second metal materials are not joined. Since the cooling fin is formed by this, surface processing for mounting the heat generating component on the cooling device is not required.

Further, in the above cooling device, the respective end faces of the first and second metal materials are joined to a substrate having a wiring pattern to be connected to the heat generating component, and further, the first and second metal materials are connected. Since the cooling fins are formed by the parts that are not joined together, even if a heating element such as a power semiconductor is mounted, screwing is not required and the generated heat is efficiently transmitted to the cooling fins, and the cooling device body Is also miniaturized.

Further, the above cooling device is provided with a base material having a heat-generating component mounted on one surface and having a flow passage for liquid flowing therein, and each end surface of the first and second metal materials. Is joined to the base material, and the cooling fins are formed by the portions where the first and second metal materials are not joined, so that even if the cooling fins and the heat-generating components are separated from each other, they are generated by the heat-generating components. The heat is efficiently transferred to the cooling fins by the liquid.

Further, in the above cooling device, since the uneven shape is formed on the surface portion of the first metal material which is not joined to the second metal material, the surface area is increased and the heat dissipation effect is enhanced, and the force is forced by the fan. Air-cooled with, the boundary layer of air flowing between the fins is more easily destroyed.

[0032]

【Example】

Example 1. An embodiment of the present invention is shown below in FIG. Figure 1
1 is a perspective view showing a cooling device obtained according to the present invention, 1 is a cooling body which is a main body of the cooling device, and 2 is a rectangular fin member which is a heat radiating body. For example, an aluminum plate (JIS standard A110
0, the standard numbers shown below are all JIS standards). 3 is a rectangular (hereinafter referred to as a strip) plate having a side that is the same length as the fin material 2 in the lateral direction and a side that is shorter than the fin material 2 in the vertical direction, and the core material (for example, A3003) is an aluminum material. A brazing sheet in which a brazing material (for example, BA4343) is clad on both sides by about 10% of the plate thickness is used. The fin material 2 and the brazing sheet 3 have substantially the same plate thickness. Reference numeral 4 denotes a cooling fan that blows cooling air between the plurality of fin members 2 of the cooling body 1, and is installed so as to have a frontal positional relationship with the fin members 2. 5a, 5b, 5c
Are semiconductors for electric power, each of which is a heat-generating electric component similar to the conventional example, and are detachably attached to the installation portion 1a of the cooling body 1 with screws 6. In the above description, an example in which an aluminum plate is used as the fin material 2 and a brazing sheet is used for the strip plate 3 is used. However, a copper plate is used for the fin material 2 and solder plating is performed on the strip plate 3 (melting temperature 220 to 300).
℃) or nickel plating (brazing temperature 1000-)
1100 ° C.) may be used. Furthermore, the fin material and strip-shaped plate material are not limited to aluminum and copper,
Any material with high thermal conductivity may be used.

In the cooling body 1 which is the main body of the cooling device, the fin material 2 and the brazing sheet 3 are alternately stacked so that the sides of the fin material 2 and the brazing sheet 3 are aligned with each other so that the entire surface of the brazing sheet 3 is aligned with the surface of the fin material 2. Three
It is formed by brazing with the above brazing material and integrating them. By connecting the sides of the fin material 2 and the brazing sheet 3 to form the installation portion 1a on which the power semiconductors 5a, 5b, 5c are mounted, the brazing material of the brazing sheet 3 protrudes during the above brazing, Since no flat surface is formed, surface cutting is performed. On the other hand, the brazing sheet 3 and the portion of the fin material 2 which is not brazed form the cooling fin 1b, and the fin pitch of the cooling fin 1b has substantially the same size as the plate thickness of the brazing sheet 3. The cooling fan 4 blows air to the cooling fins 1b to exchange heat. Further, unlike the prior art shown in FIG. 15, it has a structure having no base material.

Since the fin pitch can be arbitrarily determined by the plate thickness of the brazing sheet by the cooling device having the above structure, a very small fin pitch is possible, and the cooling device can be easily miniaturized. Further, since the respective members are integrally joined with the brazing material, the thermal conductivity of the entire device is improved. In addition, component processing does not require a complicated shape, the manufacturing process of the cooling device is simple, the manufacturing cost is low, and the cooling device can be easily designed or modified for various purposes.

Next, a method of manufacturing the cooling device will be described with reference to FIG. A copper plate is used for the fin member 2 as a heat dissipation plate, and a copper plate plated with solder or nickel is used for the strip-shaped plate member 3. These are formed by pressing using a simple mold or the like. Oxygen-free copper is desirable for the material of the copper plate, and Sn-Pb type or Sn-Ag is used for solder plating.
When nickel plating is performed using the system, electroless nickel plating (Ni-P or Ni-B) is used. These are stacked alternately with the fin material 2 and the plate material 3. At this time, as shown in FIG. 2A, the lower surface of the fin 2 and the lower surface of the plate member 3 are aligned so that they are aligned. Then, the soldering or brazing jig 7 applies a pressure (a surface pressure of about 0.5 kgf / cm ² ) to bring the respective plate materials into close contact with each other. The jig 7 is
A material obtained by pre-oxidizing a stainless steel material (austenitic type, so as not to be diffusion-bonded during soldering or brazing)
For example, it is made of SUS304). For example, FIG. 2 (b)
FIG. 4 is a view showing a state in which the jig is attached to the jig (a view of FIG. 2A viewed from below). In the jig 7 of this embodiment, surface pressure is applied by a screw force of a bolt and a nut. . Further, when heating for brazing the fin material 2 and the plate material 3,
With this jig still attached, turn it over from the state of (a) (with the surface on which the jig 7 is attached facing up), put it in a soldering furnace or a brazing furnace, and set the soldering temperature of each solder material ( 22
0 to 300 ° C.) or the melting temperature of each nickel plated material (brazing temperature 1000 to 1100 ° C.). By performing the joining upside down, the joining material flows below the surface of the fin material 2 and conversely the amount of overflowing to the installation surface 1a of the cooling body is reduced. Heat for a fixed time (2-5 minutes), then cool and fuse together. After brazing, the jig 7 is removed, and the surface of the joined cooling body 1 which becomes the installation portion 1a is subjected to surface cutting to obtain flatness.

The fin material 2 is an aluminum plate, and the strip-shaped plate material 3 is a strip-shaped plate material 3. The strip-shaped plate material 3 is a core material (for example, A3003).
A method for manufacturing a cooling device main body will be described in which a brazing sheet in which aluminum is an aluminum material and a brazing material (for example, BA4343) is clad on both sides by about 10% of the plate thickness is used. Aluminum plate material is pure aluminum material A1 that is easy to braze
100 or A1050 or Al-Mn based material A3003 is preferable. The brazing material used for the brazing sheet is preferably BA4343, where the liquidus and solidus temperatures are as far apart as possible. The aluminum plate and the brazing sheet are formed by pressing using a simple mold or the like as in the above.

The method of forming the cooling body of the cooling device by these steps is the same as that described above. However, when brazing the aluminum material, it is placed in an aluminum brazing furnace and heated to a temperature (approximately 600 to 605 ° C) between the solidus line (577 ° C) and the liquidus line (615 ° C) of the aluminum brazing material. . This temperature causes the brazing material to braze the aluminum material properly.

Example 2. 3A and 3B show a method of manufacturing a cooling device according to the present invention, where FIG. 3A is a front view and FIG. 3B is a side view thereof. The fin material 2 serving as a radiator is an aluminum plate, and the side edge of the fin material 2 as viewed from the cross-sectional view of FIG. 3 has, for example, twice the length of the fin material side edge of the first embodiment (FIG. 1).
Similarly, the side edge of the strip-shaped plate member 3 as seen from the cross-sectional view is also the first embodiment.
The brazing sheet having a length twice as long as the side edge of the plate material is used as the material, and both the fin material 2 and the plate material 3 are formed by pressing using a simple mold or the like. Also, the aluminum plate material is pure aluminum-based material A1100, which is easy to braze.
Or A1050 or Al-Mn-based material A3003 is preferable, and the brazing material used for the brazing sheet is preferably BA4343 in which the liquidus and solidus temperatures are different from each other.

A method of forming the cooling body of the cooling device by the fin material 2 and the plate material 3 will be described. Like the first embodiment, the fin material 2 and the plate material 3 are alternately stacked. This time,
The fin material 2 shown in FIG. 3 is positioned and stacked so that the center of the plate material 3 is aligned with the center of the fin material 2 while leaving the portions serving as the cooling fins from the upper end side and the lower end side.
At this time, as shown in the figure, the fin material 2 is tightened by the jig 7.
The bolt holes 8 formed in the plate member 3 in advance may be used for positioning. Then, a pressure (a surface pressure of about 0.5 kgf / cm ² ) is applied by the brazing jig 7 so that the respective plate materials come into close contact with each other. The jig 7 is made of a material obtained by previously oxidizing a stainless material (austenite type, for example, SUS304) so as not to be diffusion-bonded during aluminum brazing. Next, with this jig attached, it was put in an aluminum brazing furnace to a temperature (600 to 605 ° C) between the solidus line (577 ° C) and the liquidus line (615 ° C) of the aluminum brazing material. To heat. After brazing, the jig 7 is removed and the aluminum material 2 and the plate material 3 are removed.
Cut the center of the overlapped part (section A-A in the figure). The cut surface is a surface to be the installation portion of the joined cooling body 1, and after cutting, chamfering is performed. You get two products in one braze. This can significantly reduce the production cost and production time per piece.

Example 3. Similar to the second embodiment, FIG. 4 shows another embodiment in which two products are efficiently produced by one brazing. For example, the fin material 2 serving as a radiator is an aluminum material having a length twice the side of the fin material of the first embodiment, and the strip-shaped plate material 3 has the same size and shape as the plate material of the first embodiment. Is.

A method of forming the cooling body of the cooling device by the fin material 2 and the plate material 3 will be described. As shown in FIG. 4, one fin member 2 is positioned and stacked alternately so that the upper and lower end faces of the fin member 2 are aligned with the side surfaces of the two plate members 3, respectively. Then, a pressure (a surface pressure of about 0.5 kgf / cm ² ) is applied by the brazing jig 7 so that the respective plate materials come into close contact with each other. The jig 7 has a shape in which pressure is applied evenly to the fin material 2, and is made of a material such as a material obtained by pre-oxidizing a stainless material (austenite system, for example, SUS304) so as not to be diffusion bonded during aluminum brazing. Next, with this jig attached, it was put in an aluminum brazing furnace to a temperature (600 to 605 ° C) between the solidus line (577 ° C) and the liquidus line (615 ° C) of the aluminum brazing material. To heat. After brazing, the jig 7 is removed, and the plate material 3 is not brazed on the fin material 2, that is, the fin material 2 in FIG.
The center is cut (cross section AA in the figure). As described above, the surface formed by aligning the surfaces of the fin material 2 and the plate material 3 and alternately joining them becomes the installation portion 1a. At this time, face cutting is performed to improve the flatness of the surface. In this way, since two products are obtained by brazing once, the production cost and production time per piece can be reduced.

Example 4. FIG. 5 shows another manufacturing method of the cooling device according to the present invention. The fin material 2 serving as a radiator is an aluminum plate, and FIG. 5A is a fin material, and its side has a length twice that of the side of the fin material of Example 1 (FIG. 1), for example. FIG. 5 (b) shows a strip-shaped plate material 3, which is made of a brazing sheet whose side edges are twice as long as the side edges of the plate material of the first embodiment. Fin material 2 and plate material 3
In the same manner as in Example 2, the layers are alternately laminated and cut after brazing, but before brazing, a rectangular hole 9 is formed in advance in both parts to be cut. In FIG. 5, the fin material 2 and the plate material 3 are provided with a hole 9 that is laterally longer than the central portion, and have the same size and shape. The outer shape and the central portion of the hole are pressed by using a simple mold or the like. Is molded by. Aluminum plate material is A1100 / A1050 or
A3003 or the like is desirable, and BA4343 is desirable as the brazing material used for the brazing sheet.

A method of forming the cooling body of the cooling device by the fin material 2 and the plate material 3 will be described. As shown in FIG. 5C, as in the second embodiment, the fin material 2 and the plate material 3 are alternately stacked, but the holes 9 provided in both are positioned so as to be aligned with each other. For example, each member may be positioned through the holes by the bolts of the jig 7 as shown in the figure. Since the jig 7 is attached using the holes, a jig having a simple shape can be used. Then, a pressure (a surface pressure of about 0.5 kgf / cm ² ) is applied by the brazing jig 7 so that the respective plate materials come into close contact with each other. The jig 7 is made of a material obtained by previously oxidizing a stainless material (austenite type, for example, SUS304) so as not to be diffusion-bonded during aluminum brazing. Next, with this jig attached, it was put in an aluminum brazing furnace to a temperature (600 to 605 ° C) between the solidus line (577 ° C) and the liquidus line (615 ° C) of the aluminum brazing material. To heat. After brazing, the jig 7 is removed in the same manner as in FIG. 3, and the central portions other than the rectangular holes 9 of the fins 2 and the plate material 3 of the two joined cooling bodies 1 are cut, and two products are brazed once. To get As a result, not only the manufacturing cost per piece can be reduced, but also the machining time required for cutting can be reduced.

Example 5. Similar to the fourth embodiment, FIG. 6 shows another embodiment in which two products are efficiently produced by one brazing and the time required for cutting is reduced. Figure 6
(A) is a fin material 2 serving as a radiator, an aluminum plate having the same size and shape as in Example 4, and (b) is a strip-shaped plate material 3 having the same size and shape as the plate material in Example 3 A sheet is used as a material. Further, in the same manner as in Example 3, the fin material 2 and the two plate materials 3 are alternately stacked and brazed, and then the fin material 2 is cut. However, in the present embodiment, a rectangular hole 9 is provided in advance in a portion where the fin material 2 is cut and a portion of the fin material 2 where the two plate materials 3 are not brazed (the central portion of the fin material in the figure). The outer shape and the center hole of 2 and the plate material 3 are formed by pressing using a simple mold or the like. Aluminum plate material is A1100 / A
1050 or A3003 is desirable, and BA4343 is desirable as the brazing material used for the brazing sheet.

A method of forming the cooling body of the cooling device by the fin material 2 and the plate material 3 will be described with reference to FIG. As shown in FIG. 4 of the third embodiment, one fin material 2 is positioned and stacked alternately so that the upper and lower end surfaces of the fin material 2 are aligned with the side surfaces of the two plate materials 3, respectively. Then, a pressure (a surface pressure of about 0.5 kgf / cm ² ) is applied by the brazing jig 7 so that the respective plate materials come into close contact with each other. The jig 7 has a shape in which pressure is evenly applied to the fin material 2, so that diffusion bonding is not performed during aluminum brazing.
It is made of a material obtained by previously oxidizing a stainless steel material (austenite type, for example, SUS304). Next, with this jig attached, it was put in an aluminum brazing furnace to a temperature (600 to 605 ° C) between the solidus line (577 ° C) and the liquidus line (615 ° C) of the aluminum brazing material. To heat. After brazing, the jig 7 is removed in the same manner as in FIG. 4, the central portion other than the rectangular hole 9 provided in the fin 2 portion where the two plate materials 3 are not joined is cut, and two pieces are obtained by brazing once. Get the product. As a result, not only the manufacturing cost per piece can be reduced, but also the machining time required for cutting can be reduced.

Example 6. FIG. 7 shows another embodiment of the cooling device according to the present invention. In the figure, the fin material 2 serving as a heat radiator of the present invention is an aluminum plate, and the strip-shaped plate material 3 has an aluminum material as a core material (for example, A3003) and a brazing material (for example, BA4343) on both sides thereof with a thickness of 10 The brazing sheet is clad by about%, which is the same as that in Example 1, and these are formed by pressing using a simple mold or the like. 7 is a jig, 10 is a base material of an aluminum flat plate, and a screw hole 11 for attaching a heat-generating electric component is formed on the bottom surface. The base material 10 is made by extruding aluminum by machining or pressing. As the material of the aluminum plate of the base material 10, it is desirable to use pure aluminum materials A1100 and A1050, which are easy to braze, or Al-Mn material A3003. The brazing material used for the brazing sheet is BA43, where the liquidus and solidus temperatures are as far apart as possible.
43 is preferred. FIG. 7A is a view seen from one direction in a state where the fin material 2 and the plate material 3 are placed on the base material 10 and further fixed by the jig 7, and FIG. 7B is a sectional view taken along line AA of FIG. .

In this embodiment, the fin material 2 and the plate material 3 are alternately stacked, and these are placed on the base material 10.
By joining and integrating these members, a cooling body which is a cooling device main body is configured. Further, the heat generating electric component is screwed by the screw hole 11 formed on the surface of the base material 10.

A method of forming this cooling body will be described. Similar to the first embodiment, the fin material 2 and the plate material 3 are alternately stacked so that their sides are aligned with each other. Further, the fin member 2 and the plate member 3 are positioned so that the side surfaces of the fin member 2 and the plate member 3 are in contact with the upper surface of the base member 10. A brazing jig (for example, SUS304) 7 fixes a large number of positioned fin members 2, and presses the fins 2 and the plate member 3 against the base member 10 from above. A pressure (a surface pressure of about 0.5 kgf / cm ² ) is applied to the base material 10. On the other hand, at the time of heating, the fin 2 (A110
0) ・ The plate material 3 (A1100) has a large linear expansion coefficient, and a pressure in the lateral direction is generated due to the difference in the linear expansion coefficient. Therefore, this pressure acts as a pressure for fixing the fin material 2 and the plate material 3 together. Become.
The jig 7 should not be diffusion-bonded during aluminum brazing.
It is made of a material obtained by previously oxidizing a stainless steel material (austenite type, for example, SUS304).

Next, with this jig attached (see FIG.
(See (b)), put in an aluminum brazing furnace, and heat to a temperature (600 to 605 ° C) between the solidus line (577 ° C) and the liquidus line (615 ° C) of the aluminum brazing material. By joining with the base material 10 facing down, the aluminum brazing material of the plate material 3 protrudes during brazing, reaches the base material 10, and integrally joins the fin material 2, the plate material 3 and the base material 10. Further, in order to bond the fin material 2, the plate material 3 and the base material 10 more firmly, the base material 10 is previously displaced so that the plate material 3 slightly projects from the end surface of the fin material 2.
Place on the surface of. The brazing material of the projected plate material portion is bonded more firmly. After brazing, the jig 7 is removed.
The surface to be the installation portion 1a of the joined cooling body 1 has a flatness without surface cutting, and the heat generating electric component can be directly attached to the screw hole 11 (see FIG. 7).
(C)).

Example 7. FIG. 8 shows another embodiment of the cooling device of the present invention. In FIG. 1A, reference numeral 12 is a portion 19 on the surface of which a wiring pattern is drawn in advance by masking or the like and a heat-generating semiconductor is soldered.
Is a substrate made of copper or the like, and 13 is an insulating layer made of an adhesive or a ceramic plate. For example, an insulating material that does not melt even at a brazing temperature (about 620 ° C.) of an aluminum brazing material is preferable. Reference numeral 14 is a substrate made of a copper material, an aluminum material or the like, and the insulating layer 13 is sandwiched between the upper surface and the lower surface of the surface having the wiring pattern of the substrate 12, and the lower surface is bonded to the substrate 14. And insulating layer 1
The bottom surface of the substrate 14 on the lower surface of No. 3 is coated with nickel plating 15 which makes it easy for the aluminum brazing material to wet. The substrate 12,
A mounting substrate 16 for the heat-generating semiconductor component is formed by 14 and the insulating layer 13. For example, the mounting substrate 1 for heat-generating semiconductor parts now
If the insulating layer 13 of 6 is made of a ceramic plate, the substrate 12 on the upper surface and the substrate 13 on the lower surface are integrated by diffusion bonding in a separate process. After that, nickel plating 15 is applied to the lower surface of the substrate 14 on the lower surface. Furthermore, as in the above-mentioned embodiment,
The fin material 2 serving as a heat radiator is an aluminum plate (for example, A1100), and the strip-shaped plate material 3 has an aluminum material for the core material (for example, A3003) and a brazing material (for example, BA4343) on both sides of the aluminum material for 1 plate thickness
It is a brazing sheet clad by about 0%, and these are formed by pressing using a simple mold or the like.

The cooling device for the heat-generating semiconductor component shown in the figure is the one in which the fin material 2 and the plate material 3 are alternately stacked and integrated as in the above-mentioned embodiment, and the substrate on which the semiconductor component is wired is directly placed on the integrated body. A method for forming the cooling device of this embodiment will be described. As shown in FIG. 8B, the mounting substrate 1
6 are alternately stacked so that the end face of the fin 2 and the lower end face of the plate member 3 are in contact with the substrate 14 of the heat-generating semiconductor component with the substrate 14 side facing upward, and the brazing jig 7 applies pressure (at surface pressure). , About 0.5 kgf / cm ² ) and the plate materials are brought into close contact with each other, and the fin materials 2 and the plate material 3 are fixed on the substrate 14 by pressing them by weight in the vertical direction. The jig 7 is made of a material obtained by pre-oxidizing a stainless steel material (austenite type, for example, SUS304) so as not to be diffusion-bonded during aluminum brazing.

Next, with this jig attached (see FIG. 8).
(See (b)), put in an aluminum brazing furnace, and heat to a temperature (600 to 605 ° C) between the solidus line (577 ° C) and the liquidus line (615 ° C) of the aluminum brazing material. By joining the mounting substrate 16 of the heat-generating semiconductor component downward, the aluminum brazing material of the plate material 3 protrudes during brazing and reaches the mounting substrate 16, and the fin material 2, the mounting substrate 16 and the plate material 3 are integrated. To join. Further, as in the sixth embodiment, in order to join the fin material 2, the plate material 3 and the mounting board 16 more firmly, the mounting material is preliminarily shifted so that the plate material 3 slightly protrudes from the end surface of the fin material 2. Placed on the surface of 16.
The brazing material of the projected plate material portion is bonded more firmly. After brazing, the jig 7 is removed. After brazing, the insulating resist 17 is applied to the portion other than the wiring pattern on the upper surface of the substrate 12 to manufacture a circuit to which the heat-generating semiconductor 5 is attached. Then, the substrate 15 has the heat-generating semiconductor component 5
Are soldered, and then, if necessary, other wiring 18 is made with a wire bonder (FIG. 8C).

As a result, the mounting substrate 1 for the exothermic semiconductor 5 is formed.
Since the fins 2 for heat dissipation are directly brazed to 6, the heat conduction between the fin part 2 and the mounting substrate 16 is better than that of the system in which the packaged heat-generating semiconductor 5 is fixed with screws, and the heat dissipation is significantly improved. To do. Therefore, since the fin area can be reduced, the number of fins can be reduced, the fin height can be reduced, and the entire system can be downsized.

Further, FIG. 9 shows another embodiment of the cooling device formed by brazing the fin material 2 to the mounting substrate having the wiring pattern. Similarly to the above, the mounting substrate 16 for the heat-generating semiconductor component has the insulating layer 13 made of an adhesive or a ceramics plate in the center, and the wiring pattern is drawn on the surface with a copper material or the like, and the heat-generating semiconductor is soldered. The substrate 12 is made of copper or the like and has a lower portion and the lower surface is a substrate 14 of copper or aluminum. Further, the bottom surface of the substrate 14 on the lower surface is provided with nickel plating 15 which allows the aluminum brazing material to easily wet. And, the fin material 2 which becomes the heat radiator is an aluminum plate (for example, A1100),
It is formed by pressing using a simple mold. 16a is a flat plate base material having one surface joined to the substrate 14 and a large number of fin materials 2 arranged on the back surface. The core material (for example, A3003) is an aluminum material and the brazing material (for example, BA4343) is on both surfaces thereof. It is a brazing sheet clad with about 5% of the plate thickness.

A method of forming the cooling device having the above structure will be described. A jig 7 fixes a large number of fin members 2 so that the pitch between the fin members can be controlled. The jig 7 is made of a material obtained by pre-oxidizing a stainless steel material (austenite type, for example, SUS304) so as not to be diffusion-bonded during aluminum brazing. Then, the fin material 2 is attached by forming a predetermined pitch with the jig 7, and the fin material 2 is further attached.
The base material 16a is further stacked above the base material 16a, and the mounting substrate 16 is further stacked in this order with the substrate 14 side as the lower surface, and pressed by weight (not shown) (FIG. 9A).

Next, the jig is put in an aluminum brazing furnace and the temperature (615 to 605 ° C.) between the solidus line (577 ° C.) and the liquidus line (615 ° C.) of the aluminum brazing material. ). By setting the fin material 2 on the lower side, the brazing material of the base material 16a flows out along the surface of the fin material 2 and a large fillet is formed, so that brazing is firmly performed and the base material 16a and the fin material 2 are Has a high thermal conductivity.

After brazing, the jig 7 is removed (see FIG. 9).
(B)). A circuit to which the heat-generating semiconductor component 5 is attached is formed on the upper substrate 12 by masking only the wiring pattern portion and applying the insulating resist 17 to the other portions. Then, the heat-generating semiconductor component 5 is soldered to the substrate 12 on the upper surface, and then, if necessary, the other wiring 18 is made with a wire bonder. As a result, the fins 2 for heat radiation are directly brazed to the mounting substrate 16 of the heat-generating semiconductor 5, so that the fin portion 2 and the mounting substrate 16 are
The heat conduction is better than that of the system in which the packaged heat-generating semiconductor 5 is fixed with screws, and the heat dissipation is remarkably improved. Therefore, since the fin area can be reduced, the number of fins can be reduced, the fin height can be reduced, and the entire system can be downsized.

Example 8. FIG. 10 shows another embodiment of the cooling device of the present invention. In Figure (a),
2 and 3 are the same fin materials and strip-shaped plate materials as in Example 1, 20 is an end plate made of, for example, aluminum (for example, A1100), 21 is a core material (for example, A3003) made of aluminum material, and brazing material ( For example, BA4343) is a heat exchange plate consisting of a brazing sheet clad with about 10% of the plate thickness, and the part that becomes the flow path is punched, and these are processed by pressing using a simple mold or the like. Molded. 22 is an end plate made of the same material as the end plate 20, and the inlet pipe 2
3 and a hole to which the outlet pipe 24 is attached is drilled. The heat exchange plate 21 forms a flow path by arranging the plate members 20 and 22 on both surfaces thereof. Reference numeral 23 is an inlet pipe of an aluminum pipe through which a fluid such as a refrigerant flows into the flow path, and 24 is an outlet pipe of an aluminum pipe through which the fluid flows.

A method of forming the cooling device having the above structure will be described. Similar to the first embodiment, the fins 2 and the plate member 3 are alternately stacked so that the lower end faces of the fins 3 and the plate member 3 are in contact with the end plate 20, and a pressure (contact pressure is applied by a brazing jig (not shown)). 0.5kgf / cm ² ) and each plate material is in close contact with each other, and is pressed vertically by a weight, etc., and the fin material 2 and the plate material 3
Is fixed to the end plate 20, and the heat exchange plate 21 and the end plate 22 are further stacked below the end plate 20 in this order and pressed by a weight or the like. Then, the inlet pipe 23 and the outlet pipe 24 are inserted, and flux is applied and fixed to the aluminum ring solder.

Next, with the jig attached, it was placed in an aluminum brazing furnace and the temperature (600-605 ° C.) between the solidus line (577 ° C.) and the liquidus line (615 ° C.) of the aluminum brazing material. ). The plate member 3 is formed by joining the end plate 20 downward.
The aluminum brazing material of (3) protrudes during brazing, reaches the end plate 20, and is joined. Therefore, the fin material 2, the plate material 3, the end material 2
0, 22 and heat exchange plate 21, and inlet pipe 23 and outlet pipe 24
Are joined together. After brazing, the heat-generating semiconductor component 5 is fixed to the end plate 20 with screws or aluminum solder (see FIG. 1).
0 (b)). Further, it may be fixed to the end plate 22 side depending on the use of the device.

By allowing a heat exchange fluid such as a refrigerant to flow from the inlet pipe 23, the exothermic semiconductor 5 transmits heat to the heat exchange fluid, and the heat exchange fluid transfers this heat to the fin 2 portion, where the fin 2 portion. By exchanging heat with the atmosphere, the temperature of the heat exchange fluid is lowered and the heat exchange fluid is caused to flow out from the outlet pipe 24. According to this embodiment, even if there is no space on the back surface of the heat-generating semiconductor 5 and the fin 2 cannot be directly attached, the heat generated by the heat-generating semiconductor 5 can be generated with a small heat loss in a space provided. It is possible to dissipate heat by transmitting it to 2 parts. For example, as shown in FIG. 11, it is possible to provide a plurality of (two examples are shown in this figure) heat-dissipating semiconductors 5 arranged in a distributed manner with one fin 2 part.

Example 9. FIG. 12 shows still another embodiment of the cooling device of the present invention. In FIG. 12 (a), 25 is a fin member made of an aluminum plate (for example, A1100), the fin surface of which is ventilated by the cooling fan 4 has irregularities, and the surface 26 to which the strip-shaped plate member 3 made of a brazing sheet is attached is It has a flat surface without irregularities. Other symbols are the same as those in the first embodiment.

As in the first embodiment, these are used as fin material 25.
And the plate material 3 arranged on the flat surface are alternately stacked, and pressed and adhered by the jig 7, and placed in an aluminum brazing furnace, and the solid line (577 ° C.) of the aluminum brazing material and the liquidus line It heats and joins to the temperature (600-605 degreeC) between (615 degreeC). After brazing, the jig 7 is removed, and the surface of the joined cooling body 1 which becomes the installation portion 1a is flattened by surface cutting. In addition, power semiconductor parts 5 such as screws
a, 5b, 5c are mounted on the installation unit 1a (see FIG. 12).
(B)). Since the cooling body 1 of this embodiment uses a plate having irregularities in the fin portions 25, it is forcibly air-cooled by the fan 4 shown in (b) to destroy the boundary layer of the air flowing between the fins 25, and Since the surface area is increased, the heat radiation efficiency is improved.

In addition to the first embodiment, the second to second embodiments
Even if the fin portion of the fin material 2 described in 8 is similarly provided with unevenness, the heat dissipation effect is improved.

Example 10. In Examples 1 to 9 described above, the strip-shaped plate material 3 was an aluminum brazing sheet, and the fin material 2 or the uneven fin material 25 was an aluminum plate. However, the strip-shaped plate material 3 was an aluminum plate. Even if an aluminum brazing sheet is used as the material of the fin material 2, the material cost is high, but the same effect can be obtained. Other than this, the same effect can be obtained by using Ni particles.

Further, in Examples 1 to 9 described above, as the aluminum plate material, pure aluminum materials A1100 and A1050, which are easy to braze, or Al-Mn material A3003, etc. were used, and the brazing material used for the brazing sheet was used. We used BA4343, whose liquidus and solidus temperatures are as far apart as possible, but if the aluminum plate is made of an aluminum alloy other than the heat treatment strengthened type (A2024, A7075, etc.), the brazing property will deteriorate. The brazing material used for the brazing sheet can also be used with other brazing materials (BA4045
Etc.) can also be used.

[0067]

As described above, according to the present invention, the first metal material and the second metal material are alternately laminated and joined while leaving a part of the first metal material, The one end surface of the first metal material and the one end surface of the second metal material form a flat surface on which the heat-generating component is mounted, and the cooling fins are formed by the unbonded portion of the first metal material and the second metal material. Since it is formed, a cooling device with a simple structure and good cooling efficiency can be obtained, and since complicated processing is not required, the manufacturing cost is low and it is easy to design according to the performance of the cooling device. Produce an effect.

Further, in the method for manufacturing a cooling device according to the present invention, the first metal material is arranged so that the second metal material is arranged so as to leave a predetermined region from opposite ends of one surface of the first metal material. The step of alternately stacking the second metal material, the step of joining and integrating the first and second metal materials, and the step of cutting the joint portion between the first metal material and the second metal material Since the process is included, a plurality of cooling devices are manufactured at the same time, the processing time can be shortened, and the processing time per one cooling device and the manufacturing cost can be reduced.

Further, the above-described method for manufacturing a cooling device includes a step of alternately laminating the first metal material and the second metal material so that holes provided in advance in the first and second metal materials overlap with each other. Since it includes a step of joining and integrating the first and second metal materials and a step of cutting so as to pass through the above holes, the time required for cutting can be reduced when manufacturing a plurality of cooling devices at the same time. It is possible to reduce the processing time and the manufacturing cost.

Since the end surfaces of the first and second metal materials are joined to the base material on which the heat-generating component is mounted, and the cooling fins are formed by the portions where the first and second metal materials are not joined, The surface processing for mounting the heat generating component on the cooling device is not required, and the processing time can be reduced.

Further, the end faces of the first and second metal materials are joined to a substrate having a wiring pattern connected to the heat-generating component,
Further, since the cooling fin is formed by the portion where the first and second metal materials are not joined, the heat generated is efficiently cooled by the cooling fin without adhering the heat-generating electric component to the cooling device with another jig such as a screw. In addition, the cooling device body can be downsized.

Further, a heat-generating component is mounted on one surface, a flow path for liquid flow is formed inside, and a base material having inlets and outlets of the flow path on the surface is provided. The end surface of the material is joined to this base material, and the cooling fins are formed by the part where the first and second metal materials are not joined, so the heat generated from the heat-generating components is efficiently transmitted to the cooling fins by the liquid, and the cooling fins are cooled. The effect of increasing the degree of freedom in designing depending on the application, such as dispersing the fins and heat-generating components.

Further, since the surface portion of the first metal material which is not joined to the second metal material has an uneven shape, there is an effect that the surface area is increased and the heat dissipation is improved.

[Brief description of drawings]

FIG. 1 is an external perspective view of a cooling device according to an embodiment of the present invention.

FIG. 2 is a process drawing showing the manufacturing method of the cooling device in FIG.

FIG. 3 is a process drawing showing the method for manufacturing the cooling device showing the second embodiment of the present invention.

FIG. 4 is a process drawing showing a method of manufacturing a cooling device according to a third embodiment of the present invention.

FIG. 5 is a process drawing showing a method of manufacturing a cooling device according to a fourth embodiment of the present invention.

FIG. 6 is a process chart showing a method of manufacturing a cooling device according to a fifth embodiment of the present invention.

FIG. 7 is a process diagram showing a cooling device and a manufacturing method thereof according to a sixth embodiment of the present invention.

FIG. 8 is a process diagram showing a cooling device and a manufacturing method thereof according to a seventh embodiment of the present invention.

FIG. 9 is a sectional view of a cooling device showing another embodiment of the seventh embodiment of the present invention and process drawings showing the manufacturing method thereof.

FIG. 10 is a perspective view showing a cooling device and a method for manufacturing the same according to an eighth embodiment of the present invention.

FIG. 11 is a perspective view showing a cooling device according to another embodiment of the eighth embodiment of the present invention.

FIG. 12 is an external perspective view of a cooling device showing Embodiment 9 of the present invention.

FIG. 13 is an external perspective view showing a cooling device according to a conventional technique.

FIG. 14 is an external perspective view showing another cooling device according to the related art.

FIG. 15 is a cross-sectional view showing another cooling device according to the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cooling body 1a Electric component installation surface 2 Fin material 3 Plate material 5a Electric power semiconductor 5b Electric power semiconductor 5c Electric power semiconductor 6 Electric component retaining screw 7 Jig 8 Bolt hole 9 Rectangular hole 10 Base material 11 Screw hole 12 Substrate 13 Insulation Layer 14 Substrate 15 Nickel plating 16 Mounting substrate 17 Insulation resist 18 Wiring 20 End material 21 Heat exchange material 22 End material 23 Inlet tube 24 Outlet tube 25 Uneven fin material

Claims (11)

[Claims] 1. A first metal material and a second metal material are alternately laminated and joined while leaving a part of the first metal material, and one end surface of the first metal material is joined. A cooling characterized in that a flat surface on which a heat-generating component is mounted is formed by one end surface of a second metal material, and a cooling fin is formed by a portion where the first metal material and the second metal material are not joined. apparatus. 2. The first metal material and the second metal material are alternately arranged so that the second metal material is arranged except for a predetermined region from opposite edges of one surface of the first metal material. And a step of joining the first metal material and the second metal material so as to be integrated, and a step of cutting a portion where the first metal material and the second metal material are joined. A method of manufacturing a cooling device, comprising: 3. The second metal material such that a space is formed between the second metal material and the third metal material in a predetermined region from opposite edges of one surface of the first metal material. And arranging a third metal material, a step of alternately stacking the first metal material and the second and third metal materials, and the first metal material and the second and third metal materials The process of joining and integrating
A method of manufacturing a cooling device, comprising a step of cutting a space portion between the second and third metal materials. 4. A second metal material is arranged except for a predetermined region from opposite edges of one surface of the first metal material, and a hole previously provided at a predetermined position of the first metal material. And a step of alternately stacking the first metal material and the second metal material so that the holes provided in advance at predetermined positions of the second metal material overlap, and the first metal material and A method of manufacturing a cooling device, comprising: a step of joining and integrating a second metal material; and a step of cutting the first and second metal materials so as to pass through the overlapped holes. . 5. The second metal material such that a space is formed between the second metal material and the third metal material in a predetermined region from opposite edges of one surface of the first metal material. And the third metal material are arranged, and the first metal material and the second and third metal materials are arranged so that the holes previously provided in the first metal material are lined up at the same position in the space portion. Are alternately laminated, a step of joining the first metal material and the second and third metal materials to be integrated, and a step of cutting the metal material through the holes. Cooling device manufacturing method. 6. A first metal material and a second metal material are alternately laminated and joined while leaving a part of the first metal material, and one end surface of the first metal material and One end surface of the second metal material is joined to a base material on which the heat-generating component is mounted, and a cooling fin is formed by the unjoined portion of the first metal material and the second metal material. Cooling system. 7. A first metal material and a second metal material are alternately laminated and joined while leaving a part of the first metal material, and one end surface of the first metal material and One end surface of the second metal material is bonded to the substrate on which the wiring pattern to which the heat-generating component is connected is formed, and the cooling fin is formed by the unbonded portion of the first metal material and the second metal material. A cooling device characterized by the above. 8. A base material having a heat-generating component mounted on one surface thereof, a flow path for passing a liquid formed therein, and an inlet / outlet of the flow path provided on the surface; a first metal material; A second metal material that is alternately laminated and joined with the first metal material, leaving a part of the first metal material, wherein one end face of the first metal material and the second metal material are provided. A cooling device, wherein one end face of the first metal material is joined to the base material, and a cooling fin is formed by a portion where the first metal material and the second metal material are not joined. 9. The base material is provided with a heat exchange material from which a flow path portion is removed and an end plate sandwiching the heat exchange material from both sides, and an inlet / outlet of the flow path is formed on a surface of the end plate. The cooling device according to claim 8, wherein: 10. The cooling according to claim 1, wherein the surface portion of the first metal material that is not joined to the second metal material has an uneven shape. apparatus. 11. A solder plating on both sides of the second metal material,
11. A nickel-plated material or a sheet brazing material laminated together is heated to bond it to the first metal material, any of claims 1 to 6 to 10. A cooling device as described in 1 above.