JP3010080U - Electronic component cooler - Google Patents

Abstract

(57) [Summary] [Objective] To provide an electronic component cooler that is easy to manufacture, has high mass productivity, and has high strength and reliability. [Structure] Metal-made first plate 5 formed in a dish shape
And a second plate 7 made of a thick metal, which is integrally brazed or soldered and fixed to the peripheral portion of the first plate 5, and an inner fin 8 interposed therebetween. Then, the electronic component 10 is connected to the bolt mounting hole 6 on the surface of the second plate 7 via the bolt 9.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a water-cooled refrigerator that cools power semiconductors and other electronic components such as thyristors.

[0002]

[Prior art]

 An electronic component cooler for cooling a power semiconductor such as a thyristor uses, as an example, a pair of thick aluminum metal plates 5a and 7a as shown in FIG. 3, in which a large number of fins 8a and water channels are engraved. At the same time, the cooling water inlet / outlet pipes 3 and 4 are projectingly provided at the ends. Then, the peripheral portions of the pair of aluminum metal plates 5a and 7a are integrally brazed and joined, and a plurality of bolt mounting holes 6 for mounting electronic components are formed on the outer surface of one aluminum metal plate 5a. It was drilled. Then, an electronic component to be cooled is mounted in the bolt mounting hole 6 via a bolt.

[0003]

[Problems to be solved by the device]

 Such a conventional electronic component cooler is tedious to manufacture, lacks mass productivity, and requires a large amount of aluminum material, which inevitably increases the price of the cooler. Along with that, the weight became large. Also, the surface area of the cooling water flow passage could not be made too large, and the cooling capacity was relatively low compared to the size of the cooler. Therefore, the present invention aims to provide an electronic component cooler having high mass productivity, high reliability, and good heat dissipation performance, and has the following configuration to achieve the purpose.

[0004]

[Means for Solving the Problems]

 In the electronic component cooler of the present invention, a small flange portion 1 for joining is formed on the periphery, the bottom surface 2 is pressed into a flat plate shape, and a pair of cooling water inlets and outlets are provided at positions separated from each other. The first plate 5 is made of metal and has a thin plate thickness, to which the cooling water flow pipes 3 and 4 are connected in a liquid-tight manner at its inlet and outlet, and a plate thickness significantly thicker than that of the first plate 5. A plurality of bolt mounting holes 6 that do not penetrate through the front surface, and the back side peripheral edge is liquid-tightly brazed or soldered to the small flange portion 1 of the first plate 5; An inner fin 8 interposed between the plates 5 and 7, and a structure in which the electronic component 10 to be cooled is joined via a bolt 9 screwed into the bolt mounting hole 6. Is.

[0005]

【Example】

 Next, an embodiment of the electronic component cooler of the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view of an electronic component cooler of the present invention, and FIG. 2 is a partially cutaway side view showing a usage state of the cooler. The electronic component cooler of this embodiment includes a flat plate-shaped second plate 7 having a large plate thickness, a thin plate-shaped first plate 5, and an inner fin 8 interposed therebetween. Have. Each of these parts is made of a metal plate having good heat conductivity such as an aluminum plate or a copper plate. As an example, the first plate 5 has a plate thickness of about 0.15 mm to 2 mm, and is formed in a rectangular dish shape as a whole, and a small flange portion 1 is provided on the edge thereof. A pair of holes are formed at two corners on a diagonal line, and the ends of the pipes 3 and 4 are fitted in the holes.

Next, the second plate 7 has a shape slightly larger than the outer shape of the first plate 5, and is made of a metal plate having a plate thickness of about 2 mm to 10 mm, for example, and has a large number of bolts on its surface. A mounting hole 6 is bored, and an inner screw is threaded on the inner surface thereof. The plate thickness of the second plate 7 may be such that the bolt 9 is securely screwed into the bolt mounting hole 6. That is, as shown in FIG. 2, when the electronic component 10 is screwed into the bolt mounting hole 6 through the bolt 9 on its surface, sufficient strength and fastening force are sufficient. Next, the inner fins 8 interposed between the second plate 7 and the first plate 5 are of a corrugated shape in this embodiment. The plate thickness is about 0.05 mm to 0.3 mm, and the amplitude of the wave is matched with the depth of the first plate 5 or slightly larger. Then, the respective parts are in contact with each other on the inner surface side thereof, and the contact parts are integrally brazed or soldered and fixed. As the joining method, a conventionally known method may be used. For example, a brazing foil or the like is interposed between at least the contact parts of each component, or the surface of each component is coated with a brazing material or a soldering material in advance, and they are integrally brazed or soldered in a high-temperature furnace. Just fix it.

A large number of electronic components 10 are fixed to the outer surface of the second plate 7 of the electronic component cooler thus configured via bolts 9. The lower surface of the electronic component 10 and the outer surface of the second plate 7 are fixed. The surface and the surface are fastened and fastened so that they can conduct heat. Then, cooling water flows in from one pipe 3, flows through the inner surface of the first plate 5, and flows out from the other pipe 4. At this time, the cooling water is heat-exchanged while passing the respective surfaces of the inner fins 8 integrally joined to the second plate 7.

[0008]

[Operation and effect of the device]

 In the electronic component cooler of the present invention, a thin metal first plate 5 is pressed into a plate shape, a pair of pipes 3 and 4 are provided, and a small flange portion 1 is formed on the periphery thereof. It was done. Since the second plate 7 made of a metal having a large plate thickness is liquid-tightly joined to the small flange portion 1, the manufacturing is extremely easy and the productivity is good. Moreover, the electronic component 10 is configured to be joined to the bolt mounting hole 6 of the thick second plate 7 through the bolt 9, so that the electronic component 10 can be securely mounted and the necessary minimum It is possible to provide a high-strength electronic component cooler in terms of the number of parts. Further, since the small flange portion 1 of the first plate 5 made of a thin metal is brazed and joined to the peripheral edge of the second plate 7 having a significantly higher rigidity than that, deformation of the brazing portion is prevented and liquid It is possible to provide a highly reliable electronic component cooler.

[Brief description of drawings]

FIG. 1 is an exploded view of an electronic component cooler of the present invention.

FIG. 2 is a partially cutaway side view showing the same usage state.

FIG. 3 is a partially cutaway perspective view showing an example of a conventional electronic component cooler.

[Explanation of symbols]

 1 Small Flange 2 Bottom 3,4 Pipe 5 First Plate 5a Aluminum Metal Plate 6 Bolt Mounting Hole 7 Second Plate 7a Aluminum Metal Plate 8 Inner Fin 8a Fin 9 Bolt 10 Electronic Parts

Claims (1)

[Scope of utility model registration request] 1. A small flange portion 1 for joining is formed on a peripheral edge, a bottom surface 2 is pressed into a flat plate shape, and a pair of inlets and outlets of cooling water are formed at positions separated from each other. A thin metal first plate 5 to which pipes 3 and 4 for circulating cooling water are connected in a liquid-tight manner, and a plurality of bolts that are significantly thicker than the thickness of the first plate 5 and do not penetrate. A second plate 7 in which a mounting hole 6 is formed on the front surface, and the peripheral edge on the back surface side is liquid-tightly brazed or soldered to the small flange portion 1 of the first plate 5.
And an inner fin 8 interposed between the plates 5 and 7.
And an electronic component cooler configured such that an electronic component to be cooled 10 is joined via a bolt 9 screwed into the bolt mounting hole 6.