WO2024002324A1

WO2024002324A1 - Heat sink, circuit board module and electronic device

Info

Publication number: WO2024002324A1
Application number: PCT/CN2023/104491
Authority: WO
Inventors: 李洋
Original assignee: 北京比特大陆科技有限公司
Priority date: 2022-07-01
Filing date: 2023-06-30
Publication date: 2024-01-04
Also published as: CN217985815U

Abstract

The present application relates to a heat sink, a circuit board module and an electronic device. The heat sink is configured for the heat dissipation of an electronic component. The heat sink comprises a base, a plurality of fins, and a positioning column, wherein the plurality of fins are all connected to the base, and the positioning column is connected to the base; a heat conduction face, which is configured to be fitted to an electronic component, is formed on the base; and the positioning column is located on the same side of the base as the heat conduction face, and is configured to connect to a circuit board. The function of fixing a heat sink is achieved by providing the positioning column in the heat sink and connecting same to the circuit board, thereby making the connection between the heat sink and the electronic component firmer.

Description

Radiators, circuit board modules and electronic equipment

Technical field

The present application relates to the technical field of heat dissipation of electronic components, and relates to a radiator, a circuit board module and electronic equipment having a radiator.

Background technique

Electronic components that generate large amounts of heat are widely used in electronic equipment, such as chips, MOS tubes, etc. These electronic components emit heat during operation. If the heat cannot be dissipated in a timely and effective manner, it may easily lead to damage to the components, or The service life is shortened, so in some electronic equipment, the heat is dissipated through the use of mounting heat dissipation, active heat dissipation or passive heat dissipation through the radiator, so as to achieve the purpose of controlling the temperature of the components.

The Chinese utility model with publication number CN207602553U proposes a heat sink, chip and circuit board. The heat sink is welded to the chip to conduct heat to the heat sink to achieve the purpose of heat dissipation. Since the welding area between the heat sink and the chip is relatively small, the welding force of the heat sink is small, resulting in a low natural frequency of the product. When subjected to vibration during transportation or operation, the welding surface of the heat sink is highly likely to be damaged by fatigue. This may cause the heat sink to fall off and the product to fail.

Utility model content

In order to overcome the problems existing in related technologies, this application aims to provide a radiator that can firmly connect the radiator to electronic components and prevent the radiator from falling off, so as to achieve a good heat dissipation effect.

This application is implemented through the following technical solutions.

In one aspect, the technical solution is to provide a heat sink for heat dissipation of electronic components, including a base, a plurality of toothed plates and a positioning post, and the plurality of toothed plates are connected to the base. The positioning post is connected to the base, and the base is formed with a heat-conducting surface for fitting with electronic components. The positioning post and the heat-conducting surface are located on the same side of the base. Posts are used to connect to the circuit board.

The radiator of this technical solution is provided with positioning posts and is connected to the circuit board by using the positioning posts, thereby fixing the radiator and making the connection between the radiator and the electronic components more firm.

As an implementation manner of this technical solution, there are multiple positioning posts, and the plurality of positioning posts are centrally symmetrically arranged with respect to the center of the heat conduction surface.

As an implementation manner of this technical solution, the positioning post is provided on the heat conductive surface or the positioning post is provided on the side of the heat conductive surface.

As an implementation manner of this technical solution, the positioning column is a circular column, a regular polygonal column or a square column.

As an embodiment of this technical solution, the positioning post and the base are an integrated structure; or, the positioning post is connected to the base by threading, riveting, or welding.

As an embodiment of this technical solution, at least one of the tooth plates is provided with a gripping portion at its top end.

On the other hand, another technical solution of the present application is to provide a circuit board module, including a circuit board, electronic components provided on the circuit board, and the heat sink as described above;

The positioning post of the radiator is connected to the circuit board, and the thermal conductive surface of the radiator is in contact with the electronic component.

In the circuit board module of this technical solution, the radiator is connected to the circuit board by setting positioning posts, which plays a role in fixing the radiator and makes the connection of the radiator stronger; it increases the natural frequency of the circuit board and increases the Improves the earthquake resistance and reliability of the circuit board.

As an embodiment of this technical solution, the positioning post is welded to the surface of the circuit board; or the circuit board is provided with a fixing hole, and the positioning post is inserted into and welded into the fixing hole or the positioning post. The post passes through the fixing hole and is fixed with a nut.

As an embodiment of this technical solution, the thermally conductive surface is bonded and connected to the electronic component through soldering, or the thermally conductive surface is bonded and connected to the electronic component through thermally conductive glue.

In addition, this application also provides an electronic device, including the heat sink as mentioned above; or the circuit board module as mentioned above.

It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and do not limit the present application.

Description of drawings

The above and other objects, features and advantages of the present application will become more apparent through a more detailed description of the exemplary embodiments of the present application in conjunction with the accompanying drawings, in which the same reference numerals generally represent Same parts.

Figure 1 is one of the structural schematic diagrams of a radiator shown in an embodiment of the present application.

FIG. 2 is the second structural schematic diagram of the heat sink shown in an embodiment of the present application.

FIG. 3 is the third structural schematic diagram of the heat sink shown in an embodiment of the present application.

FIG. 4 is the fourth structural schematic diagram of the radiator shown in an embodiment of the present application.

FIG. 5 is a schematic side structural view of a circuit board module shown in an embodiment of the present application.

FIG. 6 is a schematic cross-sectional structural diagram of a circuit board module shown in an embodiment of the present application.

FIG. 7 is an enlarged view of part A of the circuit board module shown in FIG. 6 .

FIG. 8 is the second enlarged view of part A of the circuit board module shown in FIG. 6 .

The reference signs indicate:
100-radiator; 110-base; 111-heat-conducting surface; 120-tooth plate; 121-grabbing part; 130-positioning post; 200-circuit board; 201-fixing hole; 202-soldering pad; 300-electronic component device.

Detailed ways

The following will describe the techniques in some embodiments of the present application with reference to the accompanying drawings in some embodiments of the present application. The technical solution is clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

Since the welding area of the existing heat sink and the chip is relatively small, the welding force of the heat sink is small, resulting in a low natural frequency of the product. When subjected to vibration during transportation or operation, the welding surface of the heat sink is extremely likely to Fatigue damage may result in heat sink falling and product failure.

In response to the above problems, the first embodiment of the present application provides a heat sink 100 for heat dissipation of electronic components 300. The heat sink 100 can be firmly connected to the electronic components 300, and the heat sink 100 is not easy to fall, so as to realize the use of the heat sink 100. Good heat dissipation effect.

The technical solution of the first embodiment of the present application will be described in detail below with reference to the accompanying drawings.

As shown in Figure 1, this embodiment provides a heat sink 100 for heat dissipation of electronic components 300, including a base 110, a plurality of toothed plates 120 and a positioning post 130. The plurality of toothed plates 120 are all connected to the base. 110 is connected to each other, and the positioning post 130 is connected to the base 110; the base 110 is formed with a heat-conducting surface 111 for fitting with the electronic component 300, and the positioning post 130 and the heat-conducting surface 111 are located on the same side of the base 110. The positioning post 130 Used to connect with the circuit board 200.

In this way, the heat sink 100 is provided with positioning posts 130 and is connected to the circuit board 200 using the positioning posts 130, thereby fixing the heat sink 100, making the connection between the heat sink 100 and the electronic component 300 more firm, and achieving a heat dissipation effect.

As shown in FIGS. 1 to 4 , in this embodiment, there are multiple positioning posts 130 , and the multiple positioning posts 130 are centrally symmetrically arranged with respect to the center of the heat conduction surface 111 . By connecting multiple positioning posts 130 to the circuit board 200, the heat sink 100 can be firmly connected. The symmetrically arranged multiple positioning posts 130 can ensure that the connections are evenly distributed and improve the stability of the connection of the heat sink 100. Preferably, The number of positioning posts 130 is two, three or four.

In this embodiment, the positioning post 130 is provided on the heat conduction surface 111 or the positioning post 130 is provided on the side of the heat conduction surface 111 . When the thermal conductive surface 111 is much larger than the heating surface of the electronic component 300, the positioning post 130 The thermal conductive surface 111 can be further connected to the electronic component 300, which can make the connection between the heat sink 100 and the electronic component 300 more stable, and can also make the size of the heat sink 100 smaller. The position of the positioning post 130 can be determined by the size of the electronic component 300 and the actual application situation.

As shown in FIGS. 1 to 4 , in this embodiment, the positioning column 130 is a circular column, a regular polygonal column or a square column. It can be understood that the positioning post 130 being a circular post, a regular polygon post or a square post means that the cross section of the positioning post 130 is a circle, a regular polygon or a square, where the square can be a square or a rectangle.

As shown in FIGS. 1 to 4 , in this embodiment, the positioning post 130 and the base 110 have an integrated structure; alternatively, the positioning post 130 is connected to the base 110 by threading, riveting, or welding.

Understandably, the base 110 and the teeth 120 of the radiator 100 are made by direct extrusion through an extrusion module. At the same time, when the base 110 is extruded, a part for processing the positioning post 130 can be left, and then processed through CNC or the like. The positioning post 130 is formed on the base 110 by machining. In this way, the positioning post 130 and the base 110 can be integrated into an integrated structure, and the connection between the fixing post and the base 110 is more secure.

In addition, the base 110 and the teeth 120 of the radiator 100 are made by directly extruding through the extrusion module, making screw holes on the base 110, and screwing the processed positioning posts 130 to the base 110. , it is also possible to make rivet holes on the base 110, and the positioning posts 130 are connected to the base 110 by pressure riveting, or it is also possible to directly weld the positioning posts 130 on the base 110.

As shown in FIGS. 1 to 4 , in this embodiment, the number of tooth plates 120 is two or more, and the plurality of tooth plates 120 are connected to the side of the base 110 away from the heat conductive surface 111 . The specific arrangement method of the tooth plate 120 can be determined according to the actual situation, and this embodiment does not impose any limitation on it. The plurality of tooth plates 120 can be arranged in parallel or at equal intervals. Preferably, the number of tooth plates 120 is eight, and all the tooth plates 120 are arranged in parallel with equal intervals.

In this embodiment, in order to facilitate the grasping of the radiator 100 by a machine or manually, a grasping portion 121 may be provided on the top of one of the toothed plates 120 . The grabbing part 121 may be a sheet-shaped or annular body connected to the top end of the tooth plate 120 . Preferably, the gripping part 121 has a sheet-like structure. In this way, the gripping part 121 has a suction surface parallel to the heat conduction surface 111, and the suction surface is used for the machine. The suction cup is used to realize automated assembly of the radiator 100, and at the same time, the surface of the gripping part can also dissipate heat.

In this embodiment, the body of the radiator 100 is made of metal materials with good thermal conductivity such as aluminum, iron or copper. A coating is electroplated on the outer surface of the body of the radiator 100. The coating should also have good thermal conductivity and Chemical stability, preferably, the coating can be nickel or the like. In this way, the main body can be protected from oxidation and corrosion damage through the coating, and it is more beautiful.

As an application environment example of the heat sink 100 in this embodiment, the electronic component 300 is a chip. When the heat sink 100 is installed on the circuit board 200 to dissipate heat for the chip, the heat conductive surface 111 of the base 110 is attached to the chip. , the heat generated during the operation of the chip is transferred to the base 110 and the tooth plate 120 through the thermal conductive surface 111, thereby dissipating heat to the chip. The positioning post 130 is connected to the circuit board 200 by welding to further strengthen the heat sink 100 .

In addition, the heat sink 100 can dissipate heat from a single chip. When in use, one heat sink 100 in this embodiment can be attached to each chip of the circuit board 200, unlike the prior art where the heat sink 100 is attached to the entire circuit board 200. Compared with the method of attaching an entire radiator 100, each chip on the circuit board 200 can be dissipated independently, and each chip can be fully attached to the radiator 100, further improving the heat dissipation effect; in addition, since each chip The heat sink 100 is only attached to one chip, so it solves the problem in the prior art that the whole heat sink 100 squeezes some chips and damages the chips in order to fit all the chips.

The heat sink 100 of this embodiment realizes heat conduction and heat dissipation functions by being attached to the electronic component 300 through the thermal conductive surface 111. It is connected to the circuit board 200 through the positioning post 130, which plays a fixing role and makes the connection of the heat sink 100 more stable. Improved heat dissipation effect and heat dissipation reliability.

As shown in Figures 5 to 8, the second embodiment of the present application provides a circuit board module, including a circuit board 200, an electronic component 300 provided on the circuit board 200, and a heat sink as in any of the above embodiments. 100; The positioning post 130 of the heat sink 100 is connected to the circuit board 200, and the thermal conductive surface 111 of the heat sink 100 is attached to the electronic component 300. Specifically, the circuit board 200 of the circuit board module Multiple electronic components 300 may be provided, and each electronic component 300 is provided with a heat sink 100 correspondingly.

In addition, the heat sink 100 can dissipate heat from a single electronic component 300. When in use, one heat sink 100 in this embodiment can be attached to each electronic component 300 on the circuit board 200, which is different from the existing technology. Compared with the method of attaching an entire radiator 100 to the entire circuit board 200, each electronic component 300 on the circuit board 200 can be dissipated separately, and each electronic component 300 can be fully attached to the radiator 100. , further improving the heat dissipation effect; in addition, since each radiator 100 is only attached to one electronic component 300, the problem caused by the existing technology that a whole radiator 100 is attached to all the electronic components 300 is solved. The problem of squeezing some electronic components 300 and thereby damaging the electronic components 300.

As shown in Figures 7 and 8, in this embodiment, the positioning post 130 is welded to the surface of the circuit board 200; alternatively, the circuit board 200 is provided with a fixing hole 201, and the positioning post 130 is inserted into and welded into the fixing hole 201 or the positioning post. 130 passes through the fixing hole 201 and is fixed by a nut.

It can be understood that in order to realize the connection between the positioning post 130 and the circuit board 200, the positioning post 130 can be welded to the surface of the circuit board 200. The circuit board 200 is provided with a soldering pad 202, and the end of the positioning post 130 is connected to the soldering pad 202. Solder using solder. It is also possible that the circuit board 200 is provided with a fixing hole 201, and the positioning post 130 is inserted into the fixing hole 201 and soldered in the fixing hole 201. It is also possible that the end of the positioning post 130 has a thread, and the positioning post 130 passes through the fixing hole 201. The hole 201 is screwed with the nut so that the positioning post 130 is fixed on the circuit board 200 .

As shown in FIGS. 7 and 8 , in this embodiment, the thermal conductive surface 111 is bonded and connected to the electronic component 300 through soldering, or the thermal conductive surface 111 is bonded and connected to the electronic component 300 through thermally conductive glue. The thermal conductive surface 111 of the base 110 is welded to the electronic component 300 through solder paste, or the thermal conductive surface 111 is pasted to the electronic component 300 through thermal conductive glue. The heat of the electronic component 300 is transferred to the base of the heat sink 100 through the solder paste. The base 110 is then transferred to the gear plate 120 to achieve the heat dissipation effect.

In this embodiment, the electronic component 300 is a chip, a MOS tube, an inductor, etc.

In the circuit board module of this embodiment, while the base 110 of the heat sink 100 is welded or bonded to the electronic component 300 through solder paste and thermally conductive glue, the positioning post 130 of the heat sink 100 is also connected to the circuit board 200 . The fixing hole 201 or surface serves to fix the heat sink 100, increases the natural frequency of the circuit board 200, and increases the earthquake resistance and reliability of the circuit board 200.

The embodiments of the present application have been described above. The above description is illustrative, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

A radiator used for heat dissipation of electronic components, characterized in that it includes a base, a plurality of toothed plates and a positioning post, the plurality of toothed plates are connected to the base, and the positioning post is connected to the base. The base is connected;

The base is formed with a heat-conducting surface for bonding with electronic components. The positioning post and the heat-conducting surface are located on the same side of the base. The positioning post is used for connecting to the circuit board.
The heat sink according to claim 1, wherein the number of the positioning posts is multiple, and the plurality of positioning posts are centrally symmetrically arranged with respect to the center of the heat conduction surface.
The heat sink according to claim 2, wherein the positioning post is provided on the heat conductive surface or the positioning post is provided on a side of the heat conductive surface.
The radiator according to claim 1, wherein the positioning column is a circular column, a regular polygonal column or a square column.
The radiator according to claim 1, wherein the positioning post and the base have an integrated structure; or, the positioning post is connected to the base by threading, riveting, or welding. connected.
The heat sink according to claim 1, wherein at least one of the teeth is provided with a gripping portion at its top end.
A circuit board module, characterized by comprising a circuit board, electronic components provided on the circuit board, and the heat sink according to any one of claims 1 to 6;

The positioning post of the radiator is connected to the circuit board, and the thermal conductive surface of the radiator is in contact with the electronic component.
The circuit board module according to claim 7, wherein the positioning post is welded to the surface of the circuit board; or,

The circuit board is provided with a fixing hole, and the positioning post is inserted and welded into the fixing hole or the positioning post passes through the fixing hole and is fixed with a nut.
The circuit board module according to claim 7, wherein the thermally conductive surface is connected to the electronic component through soldering, or the thermally conductive surface is connected through thermally conductive glue. Paste and connect with the electronic components.
An electronic device, characterized in that it includes the heat sink according to any one of claims 1 to 6; or the circuit board module according to any one of claims 7 to 9.