CN217985815U

CN217985815U - Radiator, circuit board module and electronic equipment

Info

Publication number: CN217985815U
Application number: CN202221695678.2U
Authority: CN
Inventors: 李洋
Original assignee: Bitmain Technologies Inc
Current assignee: Bitmain Technologies Inc
Priority date: 2022-07-01
Filing date: 2022-07-01
Publication date: 2022-12-06
Anticipated expiration: 2032-07-01
Also published as: WO2024002324A1

Abstract

The application relates to a radiator, a circuit board module and electronic equipment, wherein the radiator is used for radiating electronic components and comprises a base, a plurality of tooth sheets and a positioning column, the tooth sheets are connected with the base, and the positioning column is connected with the base; the base is formed with the heat conduction face that is used for with electronic components laminating, and the reference column is located the same one side of base with the heat conduction face, and the reference column is used for being connected with the circuit board. The radiator is connected with the circuit board through the positioning columns, so that the fixing effect of the radiator is achieved, and the radiator is connected with the electronic components more firmly.

Description

Radiator, circuit board module and electronic equipment

Technical Field

The application relates to the technical field of heat dissipation of electronic components, in particular to a heat radiator, a circuit board module with the heat radiator and electronic equipment with the heat radiator.

Background

Electronic components with large heat productivity, such as chips, MOS tubes and the like, are widely applied to electronic equipment, and emit heat in the operation process, if the heat cannot be timely and effectively dissipated, the components are easily damaged, or the service life is shortened, so that in some electronic equipment, the heat is dissipated by adopting a surface-mounted heat dissipation mode and through active heat dissipation or passive heat dissipation of a radiator, and the aim of controlling the temperature of the components is fulfilled.

Chinese utility model with publication number CN207602553U proposes a heat sink, a chip and a circuit board, which are welded to each other to conduct heat to the heat sink for heat dissipation. Because the welding area of the radiating fin and the chip is smaller, the welding force of the radiating fin is smaller, the natural frequency of a product is lower, and when the product is subjected to vibration in the transportation process or the operation process, the welding surface of the radiating fin is greatly possibly damaged by fatigue, so that the radiating fin falls off and the product fails.

SUMMERY OF THE UTILITY MODEL

For overcoming the problem that exists among the correlation technique, this application aims at providing a radiator, can make the radiator firmly be connected with electronic components, and the radiator is difficult for dropping to realize making good radiating effect.

The application is realized through the following technical scheme.

In one aspect, the technical scheme provides a heat radiator for heat dissipation of electronic components, which includes a base, a plurality of fins and a positioning column, wherein the plurality of fins are connected with the base, the positioning column is connected with the base, the base is formed with a heat conduction surface for being attached to the electronic components, the positioning column and the heat conduction surface are located on the same side of the base, and the positioning column is used for being connected with a circuit board.

According to the radiator in the technical scheme, the positioning columns are arranged and are connected with the circuit board, so that the fixing effect of the radiator is achieved, and the radiator is more firmly connected with electronic components.

As an embodiment of the technical solution, the number of the positioning columns is multiple, and the plurality of positioning columns are arranged and distributed in a central symmetry manner with the center of the heat conducting surface.

As an embodiment of the technical solution, the positioning column is disposed on the heat conducting surface or the positioning column is disposed at a side of the heat conducting surface.

As an embodiment of the technical solution, the positioning column is a circular column, a regular polygon column or a square column.

As an embodiment of the technical solution, the positioning column and the base are of an integrated structure; or the positioning column is connected with the base in a threaded mode, a press riveting mode or a welding mode.

In one embodiment of this aspect, a tip of at least one of the teeth is provided with a grasping portion.

On the other hand, another technical solution of the present application is to provide a circuit board module, which includes a circuit board, an electronic component disposed on the circuit board, and the heat sink as described above;

the positioning column of the radiator is connected with the circuit board, and the heat conducting surface of the radiator is attached to the electronic component.

According to the circuit board module in the technical scheme, the radiator is connected with the circuit board through the positioning columns, so that the fixing effect of the radiator is achieved, and the connection of the radiator is firmer; the natural frequency of the circuit board is increased, and the shock resistance and the reliability of the circuit board are improved.

As an embodiment of the technical solution, the positioning column is welded on the surface of the circuit board; or the circuit board is provided with a fixing hole, and the positioning column is inserted into and welded in the fixing hole or penetrates through the fixing hole and is fixed through a nut.

As an embodiment of the technical scheme, the heat conducting surface is attached to the electronic component by a welding method through a welding flux, or the heat conducting surface is attached to the electronic component by a heat conducting adhesive.

In addition, the application also provides an electronic device, which comprises the radiator; or a circuit board module as described above.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application, as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.

Fig. 1 is one of the schematic structural diagrams of a heat sink shown in an embodiment of the present application.

Fig. 2 is a second schematic structural diagram of the heat sink shown in the first embodiment of the present application.

Fig. 3 is a third schematic structural diagram of a heat sink shown in an embodiment of the present application.

Fig. 4 is a fourth schematic structural diagram of a heat sink shown in an embodiment of the present application.

Fig. 5 is a schematic side view of a circuit board module shown in an embodiment of the present application.

Fig. 6 is a schematic cross-sectional structure diagram of a circuit board module shown in an embodiment of the present application.

Fig. 7 is one of enlarged views of a portion a of the circuit board module shown in fig. 6.

Fig. 8 is a second enlarged view of a portion a of the circuit board module shown in fig. 6.

The attached drawings indicate:

100-a heat sink; 110-a base; 111-a thermally conductive surface; 120-tooth sheet; 121-a grasping portion; 130-a locating post; 200-a circuit board; 201-fixing holes; 202-a pad; 300-electronic components.

Detailed Description

Technical solutions in some embodiments of the present application will be clearly and completely described below with reference to the drawings in some embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

Because the welding area of the existing radiating fin and the chip is smaller, the welding force of the radiating fin is smaller, the natural frequency of a product is lower, and when the product is subjected to vibration in the transportation process or the operation process, the welding surface of the radiating fin is greatly possibly damaged by fatigue, so that the radiating fin falls off and the product fails.

In view of the above problems, the first embodiment of the present application provides a heat sink 100, which is used for heat dissipation of an electronic component 300, and can make the heat sink 100 firmly connected with the electronic component 300, and make the heat sink 100 not easily fall off, so as to achieve a good heat dissipation effect.

The technical solution of the first embodiment of the present application is described in detail below with reference to the accompanying drawings.

As shown in fig. 1, the present embodiment provides a heat sink 100 for dissipating heat of an electronic component 300, including a base 110, a plurality of fins 120 and positioning pillars 130, wherein the plurality of fins 120 are connected to the base 110, and the positioning pillars 130 are connected to the base 110; the base 110 has a heat-conducting surface 111 for adhering to the electronic component 300, the positioning posts 130 and the heat-conducting surface 111 are located on the same side of the base 110, and the positioning posts 130 are used for connecting to the circuit board 200.

Thus, the positioning column 130 is arranged on the radiator 100, and the positioning column 130 is connected with the circuit board 200, so that the fixing effect of the radiator 100 is achieved, the connection between the radiator 100 and the electronic component 300 is firmer, and the radiating effect is achieved.

As shown in fig. 1 to 4, in the present embodiment, the number of the positioning columns 130 is multiple, and the plurality of positioning columns 130 are arranged and distributed in a central symmetry manner with the center of the heat conducting surface 111. Through a plurality of reference columns 130 are connected with circuit board 200, can make radiator 100's firm in connection, and a plurality of reference columns 130 that the symmetry set up can prove to connect evenly distributed, improve the stability that radiator 100 connects, and preferably, the quantity of reference column 130 is two, three or four.

In this embodiment, the positioning column 130 is disposed on the heat conducting surface 111 or the positioning column 130 is disposed on a side of the heat conducting surface 111. When the heat-conducting surface 111 is much larger than the heat-generating surface of the electronic component 300, the positioning post 130 is disposed on the heat-conducting surface 111 and can be further connected to the electronic component 300, so that the connection between the heat sink 100 and the electronic component 300 is more stable, and the volume of the heat sink 100 can be made smaller. The positioning position of the positioning post 130 can be determined by combining the size of the electronic component 300 with the practical application.

As shown in fig. 1 to 4, in the present embodiment, the positioning column 130 is a circular column, a regular polygon column, or a square column. Understandably, the positioning pillar 130 is a circular pillar, a regular polygon pillar or a square pillar, which means that the cross section of the positioning pillar 130 is circular, a regular polygon or square, wherein the square can be a square or a rectangle.

As shown in fig. 1 to 4, in the present embodiment, the positioning posts 130 and the base 110 are integrated; alternatively, the positioning posts 130 are connected to the base 110 by a screw, a press-rivet, or a welding method.

Understandably, the base 110 and the fins 120 of the heat sink 100 are fabricated by direct extrusion through an extrusion module, and meanwhile, a portion for processing the positioning posts 130 is left when the base 110 is extruded, and then is machined by CNC or the like, so as to form the positioning posts 130 on the base 110, so that the positioning posts 130 and the base 110 are integrated, and the connection between the positioning posts and the base 110 is firmer.

The base 110 and the fins 120 of the heat sink 100 may be directly extruded through an extrusion die, screw holes may be formed in the base 110, and the positioning posts 130 may be screwed to the base 110, rivet holes may be formed in the base 110, and the positioning posts 130 may be connected to the base 110 by press-riveting, or the positioning posts 130 may be directly welded to the base 110.

As shown in fig. 1 to 4, in the present embodiment, the number of the teeth 120 is two or more, and the plurality of teeth 120 are connected to a side of the base 110 away from the heat conducting surface 111. The specific arrangement of the tooth plate 120 can be determined according to actual conditions, and the embodiment does not limit the specific arrangement. The plurality of teeth 120 may be disposed in parallel or at equal intervals. Preferably, the number of the teeth 120 is eight, and all the teeth 120 are arranged in parallel at equal intervals.

In this embodiment, in order to facilitate the mechanical or manual grasping of the heat sink 100, a grasping portion 121 may be further provided at the top end of one of the fins 120. The grasping portion 121 may be a plate-like or ring-like body connected to the tip of the tooth piece 120. Preferably, the grasping portion 121 is a sheet structure, so that the grasping portion 121 has a suction surface parallel to the heat conduction surface 111, and the suction surface is used for a machine to suck through a suction cup, so as to realize an automatic assembly operation of the heat sink 100, and at the same time, the surface of the grasping portion can also dissipate heat.

In this embodiment, the body of the heat sink 100 is made of a metal material with good thermal conductivity, such as aluminum, iron, or copper, and a plating layer is electroplated on the outer layer of the body of the heat sink 100, where the plating layer also has good thermal conductivity and chemical stability, and preferably, the plating layer may be nickel or the like. Therefore, the body can be protected from being damaged by oxidation and corrosion through the plating layer, and the body is more attractive.

As an example of an application environment of the heat sink 100 of the present embodiment, the electronic component 300 is a chip, and when the heat sink 100 is mounted on the circuit board 200 to dissipate heat of the chip, the heat-conducting surface 111 of the base 110 is attached to the chip, and heat generated during the operation of the chip is transferred to the base 110 and the tooth piece 120 through the heat-conducting surface 111 to further dissipate heat of the chip. The positioning posts 130 are connected to the circuit board 200 by soldering, so as to further reinforce the heat sink 100.

In addition, the heat sink 100 can dissipate heat of a single chip, and when in use, one heat sink 100 in the embodiment can be respectively attached to each chip of the circuit board 200, and compared with the mode that the whole heat sink 100 is attached to the whole circuit board 200 in the prior art, the heat sink 100 can dissipate heat of each chip on the circuit board 200 independently, and each chip can be fully attached to the heat sink 100, so that the heat dissipation effect is further improved; in addition, since each heat sink 100 is attached to only one chip, the problem that a whole heat sink 100 may damage a chip due to the extrusion of a part of the chip caused by the attachment of the whole heat sink 100 to all chips in the prior art is solved.

The heat sink 100 of the embodiment is attached to the electronic component 300 through the heat conducting surface 111 to realize heat conducting and heat dissipating functions, and is connected to the circuit board 200 through the positioning column 130 to play a role in fixing, so that the heat sink 100 is more stably connected, and the heat dissipating effect and the heat dissipating reliability are improved.

As shown in fig. 5 to 8, a second embodiment of the present application provides a circuit board module, which includes a circuit board 200, an electronic component 300 disposed on the circuit board 200, and the heat sink 100 according to any one of the above embodiments; the positioning posts 130 of the heat sink 100 are connected to the circuit board 200, and the heat-conducting surface 111 of the heat sink 100 is attached to the electronic component 300. Specifically, the circuit board 200 of the circuit board module may be provided with a plurality of electronic components 300, and each electronic component 300 is provided with one heat sink 100.

In addition, the heat sink 100 can dissipate heat of a single electronic component 300, when in use, one heat sink 100 in the embodiment can be respectively attached to each electronic component 300 of the circuit board 200, and compared with the mode that the whole heat sink 100 is attached to the whole circuit board 200 in the prior art, the heat sink 100 can dissipate heat of each electronic component 300 on the circuit board 200 independently, and each electronic component 300 can be fully attached to the heat sink 100, so that the heat dissipation effect is further improved; in addition, because each heat sink 100 is only attached to one electronic component 300, the problem that in the prior art, the electronic component 300 is damaged due to extrusion of a part of the electronic component 300 caused by the fact that one whole heat sink 100 is attached to all the electronic components 300 is solved.

As shown in fig. 7 and 8, in the present embodiment, the positioning posts 130 are soldered on the surface of the circuit board 200; alternatively, the circuit board 200 is provided with a fixing hole 201, the positioning column 130 is inserted into and welded to the fixing hole 201, or the positioning column 130 passes through the fixing hole 201 and is fixed by a nut.

Understandably, in order to realize the connection between the positioning column 130 and the circuit board 200, the positioning column 130 may be soldered on the surface of the circuit board 200, a pad 202 is disposed on the circuit board 200, and an end portion of the positioning column 130 and the pad 202 are soldered by using solder. The circuit board 200 may be provided with a fixing hole 201, the positioning post 130 may be inserted into the fixing hole 201 and soldered into the fixing hole 201, an end portion of the positioning post 130 may have a screw, and the positioning post 130 may be screwed with a nut through the fixing hole 201 to fix the positioning post 130 to the circuit board 200.

As shown in fig. 7 and 8, in the present embodiment, the heat conducting surface 111 is attached to the electronic component 300 by soldering or the heat conducting surface 111 is attached to the electronic component 300 by heat conducting adhesive. The heat conducting surface 111 of the base 110 is welded with the electronic component 300 through solder paste or the heat conducting surface 111 is adhered with the electronic component 300 through heat conducting glue, and heat of the electronic component 300 is transferred to the base 110 of the heat sink 100 through solder paste and then transferred to the tooth piece 120, so that the heat dissipation effect is realized.

In this embodiment, the electronic component 300 is a chip, a MOS transistor, an inductor, or the like.

In the circuit board module of this embodiment, the base 110 of the heat sink 100 is welded or bonded to the electronic component 300 through solder paste and thermal conductive adhesive, and the positioning column 130 of the heat sink 100 is also connected to the fixing hole 201 or the surface of the circuit board 200, so as to fix the heat sink 100, increase the natural frequency of the circuit board 200, and increase the shock resistance and reliability of the circuit board 200.

The foregoing description of the embodiments of the present application has been presented for purposes of illustration and description and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A radiator is used for radiating electronic components and is characterized by comprising a base, a plurality of tooth sheets and a positioning column, wherein the tooth sheets are connected with the base;

the base is provided with a heat conduction surface for being attached to an electronic component, the positioning column and the heat conduction surface are located on the same side of the base, and the positioning column is used for being connected with a circuit board.

2. The heat sink as claimed in claim 1, wherein the number of the positioning pillars is plural, and the plural positioning pillars are arranged and distributed in a central symmetry manner with respect to the center of the heat-conducting surface.

3. The heat sink as claimed in claim 2, wherein the positioning posts are disposed on the heat conducting surface or the positioning posts are disposed at the side of the heat conducting surface.

4. The heat sink as claimed in claim 1, wherein the positioning posts are circular posts, regular polygonal posts or square posts.

5. The heat sink as claimed in claim 1, wherein the positioning posts are integrated with the base; or the positioning column is connected with the base in a threaded mode, a press riveting mode or a welding mode.

6. The heat sink as claimed in claim 1, wherein a top end of at least one of said fins is provided with a catching portion.

7. A circuit board module comprising a circuit board, electronic components provided on the circuit board, and the heat sink according to any one of claims 1 to 6;

the positioning column of the radiator is connected with the circuit board, and the heat-conducting surface of the radiator is attached to the electronic component.

8. The circuit board module according to claim 7, wherein the positioning posts are soldered to the surface of the circuit board; alternatively, the first and second electrodes may be,

the circuit board is provided with a fixing hole, and the positioning column is inserted into and welded in the fixing hole or penetrates through the fixing hole and is fixed through a nut.

9. The circuit board module according to claim 7, wherein the heat conducting surface is attached to the electronic component by soldering or by adhering to the electronic component by a heat conducting adhesive.

10. An electronic device, comprising the heat sink according to any one of claims 1 to 6; or a circuit board module according to any of claims 7 to 9.