JP2001326307A - Heat sink for electronic component and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact, high-performance heat sink for electronic components that can efficiently radiate heat from a semiconductor device that operates at a high frequency and secure the operation stability of the semiconductor device, and the manufacturing method of the heat sink. SOLUTION: In a heat sink 101 that has a heat reception surface that opposingly comes into contact with an electrical heating element 3 and a post 2 projecting at a side being opposite to the heat reception surface while the post 2 has longitudinal and lateral directions on a surface that is in parallel with the heat reception surface, and a pin-like fin 1 is formed on the side surface of the post 2, the shape of a vertical section to the heat reception surface of the post 2 is in the same shape in all sections in the longitudinal direction of the post 2, thus obtaining the heat sink for electronic components having high radiation characteristics regardless of compactness and light weight.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink for an electronic component used for cooling an electronic component having a heating element such as a semiconductor, which is abbreviated as an IC, a CPU, an MPU, etc. It is about the method.

[0002]

2. Description of the Related Art In recent years, in electronic equipment, in order to increase the amount of heat generated due to higher integration of electronic parts such as semiconductors and higher frequency of operation clock, etc. How to keep the contact temperature of components within the operating temperature range has become a major problem. In particular, the integration and frequency of microprocessing units (hereinafter abbreviated as MPUs) have been remarkably increased, and heat dissipation measures have become an important issue from the viewpoint of ensuring operational stability and operating life.

In general, heat radiation from an electronic device is provided with a heat sink for expanding a heat radiation area and efficiently exchanging heat with a refrigerant such as air, and a motor with a motor for forcibly sending a refrigerant such as air to the heat sink. This is performed by a cooling device combined with a fan.

Here, a conventional example will be described with reference to FIGS. 13, 14 and 15. FIG.

FIG. 13 is a perspective view of a conventional heat sink, FIG. 14 is a top view and a side view of a conventional cooling device, and FIG. 15 is a perspective view and a side view of another conventional heat sink.

These heat sinks are of a plate type in which a number of thin plate-like fins 31c are arranged on a base plate 32b as a heat transfer portion as shown in FIG. 13 (a), and a base plate as shown in FIG. 13 (b). FIG. 15 shows a pin type in which a large number of pin fins 31 are arranged on
As shown in (a), it is classified into a tower type in which a large number of plate-like fins 31c formed of thin plates are arranged in the direction perpendicular to the axis of the column 32. These heat sinks are mainly composed of high thermal conductivity materials such as aluminum and copper, and are manufactured by methods such as extrusion (or called drawing), cold forging, die casting, and lamination of thin sheets. Have been.

When such a heat sink is attached to a heating element, a pin type heat sink is directly mounted on the heating element 33 as shown in FIG. 14A, or as shown in FIG. 14B. A heat conductive plate 3 for transmitting heat from the heat generating element 33 to the heat sink between the heat generating element 33 and the heat sink and dispersing and protecting the heat.
2c may be provided. The cooling principle of the actual cooling device is that the heat generated by the heating element is transmitted to the pin-shaped fins 31 through the heat-conductive base plate 32b having high heat conductivity such as aluminum, and the heat is cooled on the surface of the pin-shaped fins 31. The heat is transferred to the air sent from the fan 34, and is radiated into the air and cooled.

Here, in order to enhance the performance of the cooling device, it is most desirable that the heat is uniformly distributed over the entire heat transfer portion and that the heat can be radiated from all the formed radiating fins. However, in the plate-type or pin-type heat sink, the heat from the heating element 33 is very small compared to the heat transfer section, and the contact area is small.
Heat is easily transmitted to the radiating fins near directly above,
There is a tendency that heat is relatively difficult to be transmitted to the radiation fins in the peripheral portion. As a result, the entire radiation fin often does not function effectively. Also, if the air volume around the radiating fins is the same, increasing the number of fins and increasing the surface area will increase the radiating capacity, but in actuality when considered per unit area,
When the cross-sectional area of the radiating fins increases, the area of the air inflow surface 35 of a portion through which air can flow, for example, a portion other than the pin-shaped fin 31 shown in FIG. Therefore,
Since the total inflow air volume itself also decreases, as a result, the heat radiation capability may be reduced. In other words, simply increasing the number of radiation fins has no effect.

The most important factor here is whether the heat from the heating element 33 can be efficiently transmitted to the radiation fins as wide as possible as described above. As an example in consideration of this point, in a tower-type heat sink or the like as shown in FIG. 15, heat generated from a heating element 33 is directly transmitted to an upper portion of the heat sink by a central support column 32, and furthermore, in a direction perpendicular to the axis of the support column 32. The sheet is spread in a plane by the plate-like fins 31c formed in the above. Heat from both sides of the plate-shaped fin 31c spread in a plane is generally radiated into the air by natural air cooling. In this tower type heat sink, an improvement has been devised in order to improve the heat radiation performance. For example, Japanese Utility Model Publication No. 62-182
No. 600 discloses that a thin plate at a position corresponding to each thin plate is cut and raised, and plate-type fins are formed on the thin plate to form ventilation holes penetrating both sides of the thin plate. A structure has been proposed in which air is easily convected.

[0010]

However, in electronic parts such as semiconductors, the heat generation tends to increase more and more due to the progress of higher speeds and the like. Etc. cannot be performed. In particular, with high heat-generating electronic components such as MPU, the performance cannot be fully exhibited,
Alternatively, there is a problem that thermal runaway or the like occurs, and an abnormality occurs in the electronic device. In addition, it is conceivable to increase the heat generation by increasing the cooling device itself to increase the cooling capacity.However, the size of the electronic device itself is naturally limited by the size and weight of the cooling device. There is also. In contrast, tower-type heat sinks are generally
As shown in FIG. 15, the heat from the heating element 33 is dissipated to each plate-like fin 31 as compared with the pin type or plate type heat sink.
The structure has the column 32 that efficiently conducts heat, and the heat conduction is structurally efficient. However, the plate-like fin 31c
Because of the structure, air stagnation is likely to occur due to the structure, and considering the air flow, it is difficult to mount a cooling fan on top of the tower-type heat sink. Will be installed. Even in such a case, the height of the heat sink standing upright in the width direction of the cooling fan is required, and not only the shape of the entire cooling device becomes extremely large,
Although it is the plate-like fin 31c for its size, it is difficult to obtain a sufficient surface area on its surface, and it is not expected to improve the heat radiation efficiency as a whole.

[0011] The present invention provides a heat sink which is improved in heat radiation performance of heat generated from a heating element to achieve high performance, and which is small in size and light in weight. It is an object of the present invention to provide a method for manufacturing a heat sink that can be used.

[0012]

A heat sink for an electronic component according to the present invention has a heat receiving surface in contact with a heating element, and has a column protruding on a side opposite to the heat receiving surface, and the column is parallel to the heat receiving surface. A heat sink having a pin-shaped fin on the side surface of the support, wherein the shape of the cross section perpendicular to the heat receiving surface of the support is in each of the cross sections of the support in the longitudinal direction. It is characterized by having the same shape.

According to the present invention, heat from a heating element such as a semiconductor device or an electronic component can be efficiently guided to the entire heat sink while being small and lightweight, and a heat sink having high heat radiation characteristics can be obtained.

[0014] Here, if the strut is made of at least two or more kinds of high thermal conductors, the effect of efficiently guiding the heat from the heating element to the entire heat sink is further enhanced.

Further, the method of manufacturing a heat sink for electronic parts according to the present invention comprises a first step of forming a metal on a heat sink member having a base portion and a fin portion having a plurality of fins on the base portion; A second heat sink is joined by joining a heat sink such that a single high heat conductor is sandwiched between the base portions, and a plurality of heat sinks are integrally joined to form a support by the base portion and the high heat conductor.
And a step of:

According to the manufacturing method of the present invention, it is small and lightweight,
A heat sink having high heat radiation characteristics can be efficiently produced by a simple method such as joining a plurality of heat sinks or laminating metal plates.

[0017]

According to the first aspect of the present invention, there is provided a heat receiving surface which is in contact with a heating element, and a supporting column is provided which protrudes in a direction opposite to the heat receiving surface. A heat sink having pin-shaped fins on the side surfaces of the columns, wherein the shape of the cross section perpendicular to the heat receiving surface of the columns is the same in each cross section in the longitudinal direction of the columns. A heat sink for components that can diffuse heat from the heating element to almost the entire column of the heat sink, and can efficiently transmit the heat of the column to the fins, thus improving the heat radiation efficiency. Have.

According to a second aspect of the present invention, there is provided the heat sink for an electronic component according to the first aspect, wherein the support is formed of at least two or more kinds of high thermal conductors. In addition to being able to diffuse more efficiently to almost the entire support of the heat sink, the heat transfer efficiency of the support is high, so that even if the heat sink is downsized, high heat radiation characteristics can be obtained.

According to a third aspect of the present invention, there is provided a heat sink for electronic parts according to the second aspect, wherein the thermal conductivity of the high thermal conductor disposed on the support is at least 1.2 times higher than that of another metal portion. Since the thermal conductivity of the high thermal conductor disposed on the support is 1.2 times or more higher than that of other metal parts, the heat from the heat generator can be efficiently diffused to almost the entire support of the heat sink. At the same time, since the heat transfer efficiency of the columns is high, there is an effect that high heat radiation characteristics can be obtained even if the heat sink is downsized.

According to a fourth aspect of the present invention, there is provided the heat sink for electronic parts according to the second or third aspect, wherein the high thermal conductor disposed on the support is copper, and a portion other than the high thermal conductor is mainly composed of aluminum. Yes, since the high thermal conductor arranged on the support is copper and the other parts are mainly aluminum, the heat from the heat generator can be efficiently diffused to almost the entire support of the heat sink. In addition, since the heat transfer efficiency of the pillars is high, there is an effect that high heat radiation characteristics can be obtained even if the heat sink is downsized.

According to a fifth aspect of the present invention, there is provided the heat sink for electronic parts according to the second or third aspect, wherein the high thermal conductor disposed on the support is a heat pipe, and a portion other than the high thermal conductor is mainly composed of aluminum. Since the high heat conductor disposed on the support is a heat pipe and mainly composed of aluminum other than the high heat conductor, heat from the heat generator is efficiently diffused to almost the entire support of the heat sink. In addition, since the heat transfer efficiency of the support pillar is high, even if the heat sink is downsized, high heat radiation characteristics can be obtained.

According to a sixth aspect of the present invention, there is provided a heat-receiving surface which is in contact with the heating element, and a column is provided which protrudes in a direction opposite to the heat-receiving surface. A heat sink having pin-shaped fins on the side surfaces of the support, wherein a predetermined number of at least two types of metal plates, a fin plate having the support and the fin, and a spacer plate including only the support, are provided. It is stacked every time, a high thermal conductor is arranged so as to cross a plurality of metal plates, and the shape of the vertical cross section with respect to the heat receiving surface of the column is configured to be the same in each cross section in the longitudinal direction of the column. A heat sink for electronic components characterized by a high thermal conductor arrangement that allows the heat generated by the semiconductor device to be diffused to almost the entire post of the heat sink, and efficiently transfers the heat of the post to the fins. It is possible, such an action can improve the heat dissipation efficiency. Further, by providing a high thermal conductor even if the thickness of the heat sink is reduced for the purpose of downsizing the device, heat from the semiconductor device can be surely radiated. Furthermore, since the high thermal conductor is disposed so as to penetrate and traverse the components, there is an effect that the coupling between the components is reinforced.

According to a seventh aspect of the present invention, there is provided the heat sink for electronic parts according to the sixth aspect, wherein the thermal conductivity of the high thermal conductor is 1.2 times or more higher than that of the metal plate. By arranging the high thermal conductor having a high efficiency, the heat generated in the semiconductor device can be diffused to almost the entire pillar portion of the heat sink, and the heat of the pillar portion can be efficiently transmitted to the fin portion, thereby improving the heat radiation efficiency. It has the effect of being able to do things.

According to an eighth aspect of the present invention, there is provided the heat sink for an electronic component according to the sixth or seventh aspect, wherein the high thermal conductor has a substantially prismatic shape, and the high thermal conductor can be easily formed to improve productivity. It has the effect of being able to.

According to a ninth aspect of the present invention, there is provided a heat sink for an electronic component according to any one of the sixth to eighth aspects, wherein the metal plate is mainly composed of aluminum and the high thermal conductor is mainly composed of copper. In addition, the heat generated by the semiconductor device can be easily diffused to almost the entire base portion of the heat sink, and the heat of the base portion can be efficiently transmitted to the fin portion, so that the heat radiation efficiency can be improved. .

According to a tenth aspect of the present invention, there is provided the heat sink for electronic parts according to any one of the sixth to eighth aspects, wherein the metal plate is mainly composed of aluminum and the high thermal conductor is a heat pipe. In addition, since the heat generated in the semiconductor device can be diffused to almost the entire base portion of the heat sink, and the heat of the base portion can be efficiently transmitted to the fin portion, the heat radiation efficiency can be improved.

According to an eleventh aspect of the present invention, a first step of forming a metal on a heat sink member having a base portion and a fin portion having a plurality of fins on the base portion, and joining the plurality of heat sinks at the base portion. And a second step of forming a pillar by the base portion as a single unit.
By using a simple process of joining a plurality of heat sinks, it is possible to obtain a manufacturing method capable of efficiently manufacturing a high-performance heat sink capable of efficiently dissipating heat generated from semiconductor devices, electronic components, and the like. Has an action.

According to a twelfth aspect of the present invention, there is provided a first step of forming a metal on a heat sink member provided with a base portion and a fin portion having a plurality of fins on the base portion, and a plurality of heat sinks formed by a single base portion. A second step of joining a plurality of heat sinks by sandwiching the one high heat conductor so as to integrally form a support by the base portion and the high heat conductor. By using a process of joining a plurality of heat sinks so as to sandwich a single high thermal conductor at the base portion, it is possible to efficiently radiate heat generated from semiconductor devices and electronic components, etc.
This has the effect that a manufacturing method capable of accurately manufacturing a high-performance heat sink having high mechanical strength can be obtained.

According to a thirteenth aspect of the present invention, there is provided a first step of forming a metal on a heat sink member having a base and a fin having a plurality of fins on the base, and applying a plurality of heat sinks to the base. A second step of joining a plurality of heat sinks by mating and joining to a single high thermal conductor at the recessed portion and integrally forming a support with the base portion and the high thermal conductor. Is a method of manufacturing, which uses a simple positioning process in which a plurality of heat sinks are joined and joined to a single high thermal conductor at the recesses formed in the base, thereby efficiently reducing the heat generated from semiconductor devices and electronic components. The effect of being able to obtain a manufacturing method capable of accurately manufacturing a high-performance heat sink that can radiate heat well and has high mechanical strength. A.

According to a fourteenth aspect of the present invention, there is provided a first step of forming at least two types of metal plates including a fin plate having a support portion and a fin portion, and a spacer plate having only a support portion, A second step of laminating a predetermined number of the metal plates in the thickness direction, and joining a high heat conductor as a coupling member to the heat receiving surface of the bottom surface of the support portion so as to cross the metal plate in which the plurality of the metal plates are laminated. A method of manufacturing a heat sink for electronic parts, comprising a third step of combining and integrating, and using a simple step of joining a metal plate and a coupling member, the method generates a heat sink from a semiconductor device or an electronic part. This has the effect of being able to efficiently dissipate the generated heat and to obtain a manufacturing method capable of efficiently manufacturing a high-performance heat sink having high mechanical strength.

According to a fifteenth aspect of the present invention, there is provided a first step of forming at least two types of metal plates including a fin plate having a support portion and a fin portion, and a spacer plate including only the support portion, A second step of laminating a predetermined number of the metal plates in the thickness direction, and a high heat conductor as a coupling member is provided on the heat receiving surface of the bottom surface of the column portion so as to cross the laminated metal plates. A third step of embedding and joining the concave portion to join and integrate the concave portion, wherein the method comprises the steps of:
By using a simple positioning process of embedding and joining the coupling member in the recess, heat generated from semiconductor devices and electronic components can be efficiently dissipated, and a high-performance heat sink with high mechanical strength is produced. It has the effect that a manufacturing method that can be manufactured well can be obtained.

According to a sixteenth aspect of the present invention, there is provided a first step of forming at least two types of metal plates including a fin plate having a support portion and a fin portion, and a spacer plate having only a support portion. A second step of laminating a predetermined number of metal plates in the thickness direction, and a third step of penetrating a high thermal conductor as a coupling member so as to cross the metal plate in which a plurality of the metal plates are laminated and to combine and integrate them. A method for manufacturing a heat sink for electronic components, characterized by comprising the steps of: (1) using a simple process of penetrating a coupling member to efficiently radiate heat generated from a semiconductor device or an electronic component; Further, it has an effect that a manufacturing method capable of manufacturing a high-performance heat sink having high mechanical strength with high production efficiency can be obtained.

According to the seventeenth aspect of the present invention, a high heat conductor is penetrated as a connecting member so as to cross a metal plate in which a plurality of metal plates are stacked, and a gap between the metal plate and the high heat conductor is filled with a low melting point metal. 13. The method for manufacturing a heat sink for electronic parts according to claim 12, further comprising a third step of combining and integrating the metal plate by using a simple step of filling a low melting point metal. The high thermal conductor can be firmly adhered. This has the effect of being able to efficiently radiate heat generated from semiconductor devices, electronic components, and the like, and to obtain a manufacturing method capable of efficiently manufacturing a high-performance heat sink having high mechanical strength.

According to the present invention, a high thermal conductor is penetrated as a connecting member so as to cross a metal plate in which a plurality of metal plates are laminated, and a gap between the metal plate and the high thermal conductor has a high thermal conductivity. 13. The method for manufacturing a heat sink for an electronic component according to claim 12, further comprising a third step of filling and curing the resin containing the particles to bond and integrate the resin, and has a high thermal conductivity. By using a simple process of filling a resin containing particles, the metal plate and the high thermal conductor can be firmly adhered. This has the effect of being able to efficiently radiate heat generated from semiconductor devices, electronic components, and the like, and to obtain a manufacturing method capable of efficiently manufacturing a high-performance heat sink having high mechanical strength.

(Embodiment 1) Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

FIG. 1A is a perspective view of a main part of the heat sink according to the first embodiment of the present invention, FIG. 1B is a top view of the heat sink according to the first embodiment of the present invention, and FIG.
1 shows a front view of a heat sink according to Embodiment 1 of the present invention. FIG. 2A is a top view of a different shape heat sink according to the first embodiment of the present invention, and FIG. 2B is a front view of another shape heat sink according to the first embodiment of the present invention.

1 (a) to 1 (c), a plurality of pin-shaped fins 1 are integrally formed on a column 2 constituting a heat transfer section, and a heating element 3 is provided below the column 2 to form a pin-shaped fin. The fin 1 and the support 2 constitute a heat sink 101. The heating element 3 is an electronic component that generates heat, such as a semiconductor such as an IC, an LSI, or an MPU, or a transistor.

The heat sink configured as described above will be described in detail.

In FIG. 1, the shape of the column 2 is
If the shape of the prism is such that the heat receiving surface in contact with is wide and the cross-sectional area decreases as the distance from the heating element 3 increases, the heat transfer efficiency is improved and the weight is also effectively reduced. The support 2 is provided with a pin-shaped fin 1, and the pin-shaped fin 1 in FIG.
Indicates a case where the support column 2 is provided so as to protrude horizontally in two directions on both side surfaces in the longitudinal direction. However, the protruding directions are not limited to these two directions, and may protrude in any direction as shown in FIG. Also,
Although the angle is not limited to the horizontal direction, here, a description will be given of a representative one having a protruding direction and an angle as shown in FIG.

In general, in a heat radiating device in contact with a small heating element, when heat flows into the isotropic material from the heat receiving surface, the heat tends to diffuse with a hemispherical temperature distribution. Regarding the shape, it is considered that the highest heat radiation characteristic is obtained by forming a large number of heat radiation fins radially starting from a heat transfer portion having a hemispherical shape and a heat source at the center of the heat transfer portion. However, in such a configuration, various problems other than the performance appear, such as a shape or size in which the actual shape cannot be used, or an extremely high manufacturing cost. Further, in the conventional plate-type or pin-type heat sink as shown in FIG.
Due to the fact that the contact area is very small compared to the heat transfer area, heat is easily transmitted intensively to the radiation fins just above the heating element, and the heat is relatively transmitted to the radiation fins in the surrounding area. This tends to be difficult, and as a result, the entire radiation fin often does not function effectively. Further, the tower-type heat sink of FIG. 15 also has a structure in which the plate-like fins 31c are stacked as described above, so that air stagnation is likely to occur, and when a cooling fan is mounted thereon, it is difficult to mount the cooling fan on the heat sink. However, there are problems such as an increase in the overall size when a fan is mounted on the side surface of the heat sink, or an increase in the overall heat radiation efficiency due to the plate-shaped fins making it difficult to obtain a sufficient surface area for the size.

On the other hand, by adopting the structure of the heat sink according to the present invention, it is possible to realize a small-sized cooling device having excellent heat transfer and heat radiation characteristics.

In the heat sink 101 according to the first embodiment shown in FIG. 1, the heat of the heating element 3 is received by the bottom surface of the column 2 (that is, the heat receiving surface) in contact with the heating surface, and is directly above the bottom surface of the column 2. It will be three-dimensionally diffused in all directions, such as the direction, the longitudinal direction, and the lateral direction. In this case, since the column 2 has a prismatic shape, a stable hemispherical temperature distribution is realized in the column 2 in a much larger range than the conventional plate-type or pin-type heat sink. be able to. Heating element 3
Is dissipated from the hemispherical temperature distribution and spreads over the area of the pin-shaped fins 1 functioning as heat-dissipating fins. Will be done. Further, when the heat sink is not symmetrical with respect to the axis perpendicular to the heat receiving surface, the heat sink 101 receives heat from the support 2 even in the vicinity of both ends of the heat sink where such a spherical temperature distribution is difficult to obtain, such as in the longitudinal direction of the heat sink. Since the shape of the cross section perpendicular to the surface is the same in any cross section in the longitudinal direction, the cross sectional area can be kept the same, and the thermal resistance in the heat transfer in the longitudinal direction of the column 2 can be suppressed. it can. Therefore, the pin-shaped fins 1 in the peripheral portion can also function sufficiently for heat radiation.

FIGS. 3A to 3C are perspective views showing an embodiment in which the support 2 of the heat sink 101 according to the first embodiment of the present invention is composed of at least two or more types of high thermal conductors. . Here, 2a is a first high heat conductor, and 2b is a second high heat conductor. FIG.
As shown in (c), the second high heat conductor 2
By arranging b, the thermal resistance in the heat transfer in the longitudinal direction of the column 2 can be further reduced. Also,
By expanding the second high thermal conductor 2b in the direction directly above the heat receiving surface, the thermal resistance in the direction directly above as well as in the longitudinal direction can be reduced.

The heat sink 101 shown in FIGS.
Then, the support 2 is composed of a first high thermal conductor 2 a serving as a base of the pin-shaped fin 1 and a second
Of the second high heat conductor 2b with respect to this heat receiving surface. FIG. 3A shows a state of the column 2 when the vertical cross-sectional shape of the second high thermal conductor 2b arranged on the column 2 in FIG. 1 is quadrangular. Similarly, FIG. 3B shows a case where the second high heat conductor 2b is trapezoidal, and FIG. 3C shows a case where the second high heat conductor 2b is triangular. These cross-sectional shapes and cross-sectional areas are preferably determined in consideration of the size and weight of the heat sink.

In these heat sinks, it is preferable to chamfer the end faces of the pin-shaped fins 1 and the lower corners of the columns 2, and the chamfering of the corners can prevent the generation of chips due to chipping or the like. If you have sharp corners,
When the heat sink is mounted on the electronic component, there is a possibility that the other component or the like may be broken by contacting the other component. Further, if debris is generated by the corners, it may fall on wiring or the like, causing a short circuit or the like, which may cause malfunction of the electronic device.

A method for manufacturing these heat sinks will be described.

The column 2 and the pin-shaped fin 1 are integrally formed, or the pin-shaped fin 1 is bonded to the column 2 as a separate component with an adhesive or the like. The fins 1 may be press-fitted and fixed. Further, the pin-shaped fin 1 is integrally formed by a plurality of grooves arranged directly above the bottom surface of the column 2 and a plurality of two-way grooves arranged in the longitudinal direction parallel to the bottom surface of the column 2. May be formed. At this time, the depth of the groove in each direction is arbitrary, and either one may be deep or almost the same depth. Further, the grooves may be different. FIG. 1 and the like show an example in which the depth of each groove is substantially the same, but the present invention is not limited to this example.
When the support 2 and the pin-shaped fin 1 are integrally formed, the productivity is improved, and since there is no heat resistance between the support 2 and the pin-shaped fin 1, the heat transfer efficiency is improved.
Further, when the pin-shaped fins 1 are fixed to the columns 2 by bonding or press-fitting, materials suitable for the columns 2 and the pin-shaped fins 1 can be used, and the design of the heat sink is facilitated.

As shown in FIG. 1 and the like, the pin-shaped fin 1 has a quadrangular prism shape, a cylindrical shape,
Alternatively, a polygonal columnar shape, an elliptical shape, or the like can be used. In particular, by forming the pin-shaped fins 1 in a quadrangular prism shape, the mounting density of the pin-shaped fins 1 can be increased, and the heat dissipation can be improved.

In this embodiment, the pin-shaped fin 1
The thickness of the pin-shaped fin 1 is substantially constant. For example, a shape in which the thickness of the pin-shaped fin 1 becomes larger as approaching the column 2 from the tip, or a shape in which the thickness of the pin-shaped fin 1 becomes smaller as approaching the column 2 from the tip. Alternatively, the intermediate portion of the pin-shaped fin 1 may be thicker or thinner than other portions. In addition, by chamfering the corners formed on the pin-shaped fins 1, it is possible to prevent the generation of debris caused by chipping or the like as described above. Further, it is preferable that the pin-shaped fins 1 are periodically arranged as shown in FIG. 1 and the like in terms of heat dissipation and productivity.

The material of the first high thermal conductor 2a has a thermal conductivity at 100 ° C. of 100 W / (m · K).
It is preferable to use the above materials. Specific materials include a single material selected from zinc, aluminum, brass, gold, silver, tungsten, copper, beryllium, magnesium, and molybdenum (hereinafter abbreviated as a material group), or a plurality of materials selected from the above material groups Alloys,
Further, an alloy of at least one material selected from the material group and at least one material other than the material group can be used. In the present embodiment, in consideration of workability and cost, it is made of aluminum alone or an alloy of aluminum and at least one selected from the other material groups.

Next, the case where the second high heat conductive material 2b is arranged on the support column 2 to manufacture a heat sink will be described.

FIG. 4A is a front view of a heat sink according to the first embodiment of the present invention, and FIG. 4B is a front view of components of the heat sink according to the first embodiment of the present invention. In FIG. 4B, reference numeral 4 denotes a heat sink member including a base and a fin having a plurality of fins on the base. The shape of the heat sink member 4 in the heat sink in FIG. 4 is such that a plurality of pin-shaped fins 1 are arranged on a base plate which is a heat transfer portion. The heat sink according to the prior art, that is, the pin-shaped fin type heat sink shown in FIG. Therefore, the heat sink member 4 can be manufactured by the same manufacturing method as in the related art such as die casting or cold forging, or by the method of attaching the above-mentioned pin-shaped fin to the base plate by bonding or press fitting.

Next, it is preferable that the heat sink member 4 sandwiches the second high thermal conductor 2b and joins them to form an integrated heat sink. As a joining method, welding, brazing, adhesion, and the like are preferable as long as they can be attached in close contact. Note that, in the case of performing resin bonding, it is preferable to use a resin containing particles having as high a thermal conductivity as possible. Further, it is more preferable that the joining surface is machined in advance to improve the surface properties in order to join with good adhesion.

3 (a) to 3 (c) show a heat sink having a structure in which the heat sink member 4 and the second high thermal conductor 2b are joined to each other on a plane, but FIG. 5 (a) shows an embodiment of the present invention. FIG. 5B is an exploded perspective view of the heat sink according to the first embodiment, and FIG. 5B is a perspective view when the second high heat conductor is integrated with the heat sink according to the first embodiment of the present invention, as shown in FIG. Alternatively, a concave portion may be provided in the heat sink 101, and the second high thermal conductor 2b may be buried and joined therein. FIG. 6A is an exploded perspective view of a heat sink according to the first embodiment of the present invention, and FIG. 6B is a diagram illustrating a heat sink according to the first embodiment of the present invention in which a second high thermal conductor is integrated. As shown in FIG. 6, a hole may be formed in the heat sink 101 and the second high thermal conductor 2b may be inserted into the hole and joined.

Next, as a constituent material of the second high thermal conductor 2b, the thermal conductivity at 100 ° C. is 120 W / (m ·
K) It is preferable to use a material that is at least 1.2 times as high as the thermal conductivity at 100 ° C. of the first high thermal conductor 2a. Specific materials include zinc, aluminum,
A single material selected from brass, gold, silver, tungsten, copper, beryllium, magnesium, molybdenum (hereinafter abbreviated as a material group), or an alloy of a plurality of materials selected from the material group, or from the material group An alloy of at least one selected material and at least one material other than the material group can be used. In the present embodiment, in consideration of workability and cost, it is composed of copper alone, an alloy of copper and at least one selected from the other material groups, or the like.

(Embodiment 2) Hereinafter, Embodiment 2 of the present invention will be described with reference to FIGS.

FIG. 7 is a perspective view showing a heat sink according to Embodiment 2 of the present invention, FIG. 8 is an exploded perspective view of components of the heat sink, and FIG. 9A is a configuration of a heat sink according to Embodiment 2 of the present invention. FIG. 9B is a front view of a spacer of a component of the heat sink according to the second embodiment of the present invention.

7 to 9, reference numeral 111 denotes a heat sink, 11a denotes a support of the heat sink 111, 11b denotes a fin of the heat sink 111, 12 denotes a fin plate, 1
3 is a high thermal conductor, 14 is a column part in the fin plate 12, 15 is a fin part in the fin plate 12, 1
Reference numeral 6 denotes a spacer plate, and reference numeral 17 denotes a column in the spacer plate 16.

The heat sink configured as described above will be described in detail.

The heat sink 111 is basically composed of a strut 11 a, a fin 11 b, and a high thermal conductor 13, which are composed of a laminated structure of a fin plate 12, a spacer plate 16, formed by stamping or pressing or wire cutting by press working. It is configured.

As shown in FIG. 9A, the fin plate 12 is composed of a stepped rectangular support 14 and this support 1.
It is preferable to have a double-comb shape with a plurality of fin portions 15 extending at a predetermined interval from the four. FIG.
As shown in (b), it is preferable that the spacer plate 16 has a plate-like shape composed of the pillar portions 17 of the stepped rectangular spacer plate.

As shown in FIG. 7 and FIG.
The shape of 3 is preferably a polygonal plate shape such as a square plate shape or a disk shape. In particular, by forming the high thermal conductor 13 in the shape of a square plate, alignment and the like can be easily performed, and waste of materials and the like can be prevented. In addition, it is preferable that the high thermal conductor 13 has a rectangular plate shape in terms of mountability and heat dissipation, and it is preferable that the corner of the high thermal conductor 13 be chamfered. This is because if the high thermal conductor 13 has a sharp corner, there is a high probability that when the heat sink 111 is mounted, the high heat conductor 13 contacts another component or the like and breaks the other component. Furthermore, if chips are generated due to chipping of corners or the like, the chips may fall on wiring or the like, causing a short circuit or the like, which may cause malfunction of electronic devices or the like. Therefore, the high thermal conductor 13
By performing chamfering, the probability of contact with another component or the like to destroy the other component or the like can be reduced, and generation of chips due to chipping or the like can be prevented.

Next, the high thermal conductor 13, the fin plate 1
2 and the material of the spacer plate 16 are 100 ° C.
Is preferably made of a material having a thermal conductivity of 80 W / (m · K) or more. Specific materials include a single material selected from zinc, aluminum, brass, gold, silver, tungsten, copper, beryllium, magnesium, and molybdenum (hereinafter abbreviated as a material group), or a plurality of materials selected from the above material groups Or an alloy of at least one material selected from the material group and at least one material other than the material group. In the present embodiment, in consideration of workability and cost, aluminum alone, an alloy of aluminum and at least one selected from the other material groups, an aluminum and at least one alloy selected from the material group, or the like It consisted of. However, the thermal conductivity of the material of the high thermal conductor 13 is preferably higher than the thermal conductivity of the fin plate 12 and the spacer plate 16.

Next, a method of forming the heat sink 111 by laminating the fin plate 12 and the spacer plate 16 and then joining the high thermal conductor 13 as shown in FIGS. 7 and 8 will be described.

As shown in FIG. 8, the two comb-tooth-shaped fin plates 12 and the plate-shaped spacer plates 16 are laminated and joined together by caulking or the like, so that the productivity is very good, and Heat sink 111 with good heat dissipation
Can be produced. Furthermore, a predetermined number of fin plates 1
2. A target heat source to dissipate the thickness in the width direction of the heat sink 111 by periodically laminating the spacer plates 16;
For example, since the size can be freely set in consideration of the size of a semiconductor device or the like, the production process is greatly simplified, heat sinks 111 having various sizes can be easily manufactured, and productivity is improved. Here, the protruding portion of the fin plate 12 is a portion to be the fin portion 15. Moreover, the fin plate 12 and the spacer plate 16 are all provided with holes 18 for caulking. For example, as shown in FIG. 8, by alternately stacking the spacer plates 16 and the fin plates 12, the heat sink 111 having a predetermined size can be easily manufactured. The heat sink 111 shown in FIG. 7 is configured by laminating the fin plates 12 one by one, but may be configured by laminating two or more fin plates 12.

Although one spacer plate 16 is provided between the fin plates 12 in the embodiment shown in FIG. 7, a plurality of spacer plates 16 may be provided depending on the cooling efficiency, heat sink, and other specifications. Spacer plate 1
6 may be provided. Alternatively, two spacer plates 1 are provided between the fin plates 12.
6 and other fin plates 12 and fin plates 1
The number of the spacer plates 16 provided between the fin plates 12 may be different from each other, such as providing three spacer plates 16 between the two.

The heat sink 111 shown in FIG.
The fin plate 12 and the spacer plate 16 are joined to each other by caulking in order to improve the productivity and the degree of adhesion between the plates, but this may be done by using an adhesive. , A plurality of plates may be fixed by screwing or the like.

Next, the joining of the high thermal conductor 13 will be described.

As shown in FIG. 7, the heat sink 111 laminated by the high thermal conductor 13, the fin plate 12, and the spacer plate 16
It is preferable that a high thermal conductor 13 is buried in the concave portion and bonded. In order to provide a concave portion in the heat sink 111, a notch serving as a concave portion when forming the shapes of the fin plate 12 and the spacer plate 16 may be formed in each plate. In the present embodiment, an example in which the high thermal conductor 13 is a prism is shown. However, when the high thermal conductor 13 has another shape, a notch having a concave shape corresponding to the other shape is formed on the fin plate 12 and the spacer plate. 16 may be formed. Next, as a joining method, welding, brazing, adhesion, and the like are preferable as long as they can be attached in close contact. When bonding with a resin, a resin containing particles having as high a thermal conductivity as possible (for example, a product name of “ThreeBond 227” manufactured by ThreeBond Co., Ltd.)
0 "). Further, it is more preferable that the joining surface is machined in advance to improve the surface properties in order to join with good adhesion. Next, as shown in FIG. 8, the high thermal conductor 13 is preferably arranged so as to cross the fin plate 12 and the spacer plate 16. With such an arrangement, the heat of the heat source can be efficiently diffused and transmitted to the heat sink 111, and the cooling capability of the heat sink 111 is increased. Further, the bonding strength between the fin plate 12 and the spacer plate 16 can be increased, and the mechanical strength of the heat sink 111 can be increased.

(Embodiment 3) Hereinafter, a third embodiment of the present invention will be described with reference to FIGS. 10, 11 and 12. FIG.

FIG. 10 is a perspective view showing a heat sink according to the third embodiment of the present invention. FIG. 11 is an exploded perspective view of components of the heat sink according to the third embodiment of the present invention.
FIG. 2A is a front view of a fin plate of a component of the heat sink according to the third embodiment of the present invention, and FIG. 12B is a front view of a spacer of a component of the heat sink according to the third embodiment of the present invention.

As shown in FIGS. 10, 11 and 12, the heat sink 121 of the third embodiment
3 is a fin plate 22 constituting the heat sink 121
The configuration is the same as that of the heat sink 111 according to the second embodiment.

The shape of the high thermal conductor 23 is preferably a columnar shape such as a round bar. In particular, by making the high thermal conductor 23 a cylindrical shape, alignment and the like can be easily performed, processing can be easily performed, and waste of materials and the like can be prevented, which is good in terms of mountability and heat dissipation. Also, its length is
It is preferable that the length is equal to or longer than the thickness according to the number of the fin plates 22 and the spacer plates 26 of the heat sink 121. FIG.
In the figure, reference numeral 24 denotes a column, and 25 denotes a fin.

Next, it is preferable that the high thermal conductor 23 be made of a material having a thermal conductivity of 80 W / (m · K) or more at 100 ° C. Specific materials include a single material selected from zinc, aluminum, brass, gold, silver, tungsten, copper, beryllium, magnesium, and molybdenum (hereinafter abbreviated as a material group), or a plurality of materials selected from the above material groups Alloys,
Further, an alloy of at least one material selected from the material group and at least one material other than the material group can be used. However, the thermal conductivity of the material of the high thermal conductor 23 is preferably at least 1.2 times higher than the thermal conductivity of the fin plate 22 and the spacer plate 26, and more preferably at least 1.5 times.
In the present embodiment, in consideration of workability and cost, copper alone, an alloy of copper and at least one selected from the other material groups, or at least one selected from copper and the material group It was composed of an alloy or the like. Also,
The high thermal conductor 23 may use a heat pipe other than a single or alloy material such as a metal. The heat pipe has more heat transport ability than a metal material, and is more preferable. As the cross-sectional shape, a columnar shape or a flat shape is preferable, but in consideration of miniaturization of the heat sink, a flat shape capable of reducing the thickness is more preferable.

Next, a method of forming the heat sink 121 by laminating the fin plate 22 and the spacer plate 26 and arranging the high thermal conductor 23 therethrough will be described.

As shown in FIG. 12, the fin plate 22
And the plate-like spacer plate 26 are formed by punching or pressing or wire cutting. At this time, the through hole 29 in which the high thermal conductor 23 is arranged is simultaneously formed. It is preferable that the high thermal conductor 23 be disposed at least near the heat receiving surface 30. Therefore, it is preferable that the through hole 29 is also arranged at least near the heat receiving surface 30 as shown in the drawing. Further, it is more preferable that the high thermal conductors 23 are intensively arranged near the heat receiving surface 30.

The fin plate 22 in the form of both comb teeth and the spacer plate 26 in the form of a plate are laminated, and
They are joined together by caulking or the like. Here, the through-holes 29 formed in the respective plates are continuous holes formed by lamination, and the high thermal conductor 23 formed in a cylindrical shape by machining such as turning is disposed in the through-holes 29. Note that the relationship between the hole size of the through hole 29 and the size of the high thermal conductor 23 is formed so as to have an interference fit in each direction when the high thermal conductor 23 is inserted into the through hole 29. By inserting the high thermal conductor 23 into the through-hole 29 of the laminate of the fin plate 22 and the spacer plate 26 while pressing it with a press or the like, that is, by press-fitting, the laminate and the high thermal conductor 23 are firmly joined. With such a configuration, the heat sink 121 having very good productivity and good heat dissipation can be manufactured. Further, in the present embodiment, the method of press-fitting and arranging the high thermal conductor 23 after forming the laminate has been described. However, the high thermal conductor 23 is fixed in advance, and the fin plate 22 and the spacer plate 26 are press-fitted therein and laminated. The structure of the body and the joining of the high thermal conductor 23 may be performed simultaneously. Further, in addition to the method of fitting and fixing the bonding between the laminated body and the high thermal conductor 23 so as to have a tight fit, the relationship between the hole size of the through hole 29 and the dimension of the high thermal conductor 23 is defined as a clearance fit. May be formed by filling the space with a metal or resin of a high thermal conductor and curing the mixture. This eliminates the need for a pressing device such as a press for press-fitting the high thermal conductor 23.

Further, in addition to the contents described above, the high heat conductor 2
3 is the length of the fin plate 22 of the heat sink 121.
When the thickness is longer than the thickness of the stacked layers of the heat sink 121 and the spacers 26, the high heat conductors 23 are arranged so as to protrude at both ends of the thickness of the heat sink 121, and the outer dimensions of the protruding portions are larger than the inner dimensions of the through holes 29. By performing caulking by pressing with a press or the like, the laminate and the high thermal conductor 23 can be more reliably, stably and firmly contacted.

[0079]

According to the present invention, heat from a heating element such as a semiconductor device or an electronic component can be efficiently guided to the entire heat sink while being small and lightweight, and a heat sink having high heat radiation characteristics can be obtained.

According to the method of manufacturing a heat sink of the present invention, a high-performance heat sink can be manufactured with good productivity and at low cost by using a simple method such as joining a plurality of heat sinks or laminating metal plates.

[Brief description of the drawings]

FIG. 1A is a perspective view of a main part of a heat sink according to a first embodiment of the present invention. FIG. 1B is a top view of the heat sink according to the first embodiment of the present invention. Figure

2A is a top view of a different shape heat sink according to the first embodiment of the present invention. FIG. 2B is a front view of another shape heat sink according to the first embodiment of the present invention.

FIG. 3 is a perspective view showing an embodiment in which the support of the heat sink according to the first embodiment of the present invention is configured by at least two or more types of high thermal conductors.

4A is a front view of a heat sink according to the first embodiment of the present invention. FIG. 4B is a front view of components of the heat sink according to the first embodiment of the present invention.

5A is an exploded perspective view of a heat sink according to the first embodiment of the present invention. FIG. 5B is a perspective view of the heat sink according to the first embodiment of the present invention when a second high thermal conductor is integrated.

FIG. 6A is an exploded perspective view of a heat sink according to the first embodiment of the present invention. FIG. 6B is a perspective view of the heat sink according to the first embodiment of the present invention when a second high thermal conductor is integrated.

FIG. 7 is a perspective view showing a heat sink according to a second embodiment of the present invention.

FIG. 8 is an exploded perspective view of components of a heat sink according to a second embodiment of the present invention.

FIG. 9A is a front view of a fin plate of a heat sink component according to the second embodiment of the present invention. FIG. 9B is a front view of a spacer of a heat sink component according to the second embodiment of the present invention.

FIG. 10 is a perspective view showing a heat sink according to a third embodiment of the present invention.

FIG. 11 is an exploded perspective view of components of a heat sink according to a third embodiment of the present invention.

FIG. 12A is a front view of a fin plate of a heat sink component according to the third embodiment of the present invention. FIG. 12B is a front view of a spacer of a heat sink component according to the third embodiment of the present invention.

FIG. 13 is a perspective view of a conventional heat sink.

FIG. 14 is a top view and a side view of a conventional cooling device.

FIG. 15 is a perspective view and a side view of another conventional heat sink.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Pin-shaped fin 2 Post 2a First high heat conductor 2b Second high heat conductor 3 Heating element 4 Heat sink member 11a Post 11b Fin 12 Fin plate 13 High heat conductor 14 Post 15 Fin portion 16 Spacer plate 17 Post 18 Hole for swaging 22 Fin plate 23 High heat conductor 24 Support part 25 Fin part 26 Spacer plate 27 Support part 28 Hole for swaging 29 Through hole 30 Heat receiving surface 31 Pin fin 31c Plate fin 32 Support 32b Base plate 32c Heat conductive plate 33 Heating Element 34 Cooling Fan 35 Air Inflow Surface 101 Heat Sink 111 Heat Sink 121 Heat Sink

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Seiji Manabe 1006 Kadoma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. F-term (reference) 5F036 AA01 BB05 BB60 BD01 BD03

Claims (18)

[Claims] 1. A strut having a heat receiving surface in contact with a heating element and protruding on a side opposite to the heat receiving surface, wherein the strut has a longitudinal direction and a lateral direction in a plane parallel to the heat receiving surface, A heat sink having pin-shaped fins on a side surface of the support, wherein a shape of a cross section perpendicular to the heat receiving surface of the support is the same in each cross section of the support in the longitudinal direction. . 2. The heat sink for electronic parts according to claim 1, wherein said support pillar is made of at least two or more kinds of high thermal conductors. 3. The heat sink for electronic parts according to claim 2, wherein the thermal conductivity of the high thermal conductor disposed on the column is at least 1.2 times higher than that of the other metal part. 4. The heat sink for an electronic component according to claim 2, wherein the high thermal conductor disposed on the support is made of copper, and a portion other than the high thermal conductor is mainly composed of aluminum. 5. The heat sink for an electronic component according to claim 2, wherein the high thermal conductor disposed on the column is a heat pipe, and a portion other than the high thermal conductor is mainly composed of aluminum. 6. A heat-receiving element has a heat-receiving surface in contact with the heat-generating body, and a column protruding on a side opposite to the heat-receiving surface is provided. The column has a longitudinal direction and a short-side direction in a plane parallel to the heat-receiving surface. A heat sink having a pin-shaped fin on a side surface of the support, wherein at least two of a fin plate including a support and a fin, and a spacer plate including only the support are provided.
A plurality of types of metal plates are stacked for a predetermined number of sheets, a high thermal conductor is arranged so as to cross a plurality of the metal plates, and a shape of a cross section perpendicular to the heat receiving surface of the column is the longitudinal direction of the column. Characterized in that the heat sinks for electronic parts are configured to have the same shape in each of the cross sections. 7. The heat sink for electronic parts according to claim 6, wherein the thermal conductivity of the high thermal conductor is 1.2 times or more higher than that of the metal plate. 8. The heat sink for an electronic component according to claim 6, wherein said high thermal conductor has a substantially prismatic shape. 9. The metal plate contains aluminum as a main component,
9. The heat sink for an electronic component according to claim 6, wherein the high thermal conductor contains copper as a main component. 10. The heat sink for electronic parts according to claim 6, wherein said metal plate is mainly composed of aluminum, and said high thermal conductor is a heat pipe. 11. A first step of forming a metal on a heat sink member having a base portion and a fin portion having a plurality of fins on the base portion, and a plurality of heat sinks joined by the base portion to form an integral body. A method of manufacturing a heat sink for an electronic component, comprising: a second step of forming a support by a base portion. 12. A first step of forming a metal on a heat sink member having a base portion and a fin portion having a plurality of fins on the base portion, and forming a plurality of heat sinks on the base portion with a single high thermal conductor. A method of manufacturing a heat sink for an electronic component, comprising: a second step of forming a support by the base portion and the high thermal conductor so as to integrally join a plurality of heat sinks by sandwiching them. 13. A first step of forming a metal on a heat sink member having a base portion and a fin portion having a plurality of fins on the base portion, and a single step of forming a plurality of heat sinks in the concave portion provided on the base portion. A second step of joining a plurality of heat sinks by mating and joining the high heat conductor to form a support column integrally with the base portion and the high heat conductor. . 14. A first step of forming at least two types of metal plates including a fin plate having a support portion and a fin portion, and a spacer plate including only support portions, and forming a plurality of said metal plates in a thickness direction. A second step of laminating every predetermined number of sheets, and a step of joining a high thermal conductor as a coupling member to the heat receiving surface of the bottom surface of the support portion so as to traverse the plurality of laminated metal plates and combine them together. 3. A method for manufacturing a heat sink for electronic parts, comprising: 15. A first step of forming at least two types of metal plates including a fin plate having a support portion and a fin portion, and a spacer plate including only a support portion, and forming a plurality of said metal plates in a thickness direction. A second step of laminating every predetermined number of sheets, and embedding and joining a high thermal conductor as a coupling member into a concave portion provided on a heat receiving surface on the bottom surface of the pillar portion so as to cross the metal plate on which a plurality of sheets are laminated. And a third step of combining and integrating the heat sinks for electronic components. 16. A first step of forming at least two types of metal plates, including a fin plate having a support portion and a fin portion, and a spacer plate including only the support portion, and forming a plurality of metal plates with a thickness. A second step of laminating every predetermined number of sheets in the direction, and a third step of penetrating a high thermal conductor as a coupling member so as to traverse the metal plate in which a plurality of the laminated sheets are traversed and to combine and combine them. A method for manufacturing a heat sink for an electronic component, comprising: 17. A joining member formed by penetrating a high thermal conductor as a connecting member so as to traverse the plurality of laminated metal plates and filling a gap between the metal plate and the high thermal conductor with a low melting point metal. 13. The method for manufacturing a heat sink for an electronic component according to claim 12, comprising a third step of forming a heat sink. 18. A high thermal conductor as a connecting member is pierced so as to cross the plurality of laminated metal plates, and a gap between the metal plate and the high thermal conductor contains particles having high thermal conductivity. 3. The method according to claim 1, further comprising a third step of combining and integrating the resin by filling and curing the resin.
3. The method for manufacturing a heat sink for an electronic component according to item 2.