CN101150101B - Integrated heat radiation method, system and corresponding heat radiation device - Google Patents
Integrated heat radiation method, system and corresponding heat radiation device Download PDFInfo
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- CN101150101B CN101150101B CN200710124126XA CN200710124126A CN101150101B CN 101150101 B CN101150101 B CN 101150101B CN 200710124126X A CN200710124126X A CN 200710124126XA CN 200710124126 A CN200710124126 A CN 200710124126A CN 101150101 B CN101150101 B CN 101150101B
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000005855 radiation Effects 0.000 title abstract description 11
- 238000001816 cooling Methods 0.000 claims description 63
- 239000000463 material Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 238000013461 design Methods 0.000 description 16
- 239000006185 dispersion Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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Abstract
This invention relates to an integrated radiation method, a system and a corresponding radiation device, which installs a radiator on each chip mounted on a CB and sets a connecting unit between two adjacent radiators to form a cascade chain to radiate for the covered chips, in which, chips at high temperature trabsmit heat to radiators with low temperature via the chain so as to provide a fine radiation performance for chips on a CB.
Description
Technical field
The present invention relates to the heat dissipation technology field of electronic device, particularly a kind of integrated heat dissipating method of a plurality of electronic chips that are applied to install on the printed circuit board (PCB), system and corresponding heat abstractor.
Background technology
Along with the raising of electronics working frequency of chip and integrated level on the circuit board, the power of electronic chip is increasing, and caloric value also constantly increases.The generation of a large amount of heats will make the electronic chip temperature constantly raise, too high temperature will badly influence the performance of electronic chip, and then have influence on the performance of the circuit board and the machine system of carries chips, so the heat dissipation problem of chip, circuit board and machine system becomes more and more outstanding along with the development of chip technology.The bad meeting of dispelling the heat causes the electrical property of chip, reliability to reduce, even disabler or damage.The heat dissipating method commonly used of electronic chip is that a radiator is installed on chip, and according to the material of the power selection radiator of chip and the size of radiator, the diffusion of hot-air for the benefit of and flow and generally also can increase fan and strengthen radiating effect.A plurality of electronic chips are installed on the circuit board usually, so the heat dissipating state of circuit board is by the power of device on the circuit board, printed circuit board layout, radiating mode, environment for use decision.
Under the fixing condition of the conductive coefficient of the power of device on the circuit board, radiator and radiating mode, to the influence of heat dispersion arranging and structure of radiator most importantly.How not blocking the air channel, not reducing the heat dispersion that improves electronic chip on the circuit board under the condition of wind speed is problem demanding prompt solution.
Following dual mode is mainly adopted in the heat radiation of a plurality of electronic chips on the circuit board at present:
As shown in Figures 1 and 2, wherein a kind of radiating mode is on each chip 20 of installing on the circuit board 10 radiator 30 to be set independently, described radiator 30 can adopt heat-conducting glue to stick on the corresponding chip 20, also can utilize screw or fastener to be fixed on the circuit board 10.For carrying out air operated compulsory type wind-cooling heat dissipating system with fan, this mode generally requires on the air channel layout of chip 20 that corresponding radiator 30 can be staggered to arrange, so that allow wind cross each radiator 30 and take away heat.Yet, the shortcoming of this radiating mode is that the heat that the chip on the entire circuit plate produces can't evenly distribute, easily produce thermal stress, therefore the layout of device must be considered the requirement of heat radiation on the circuit board, for example temperature-sensitive device need and place upstream, air channel of focus or the like away from focus, not only limited the structural design of circuit board, influenced the layout of device on the circuit board, the physical dimension of radiator also is restricted.In addition, radiator staggers to arrange and can cause the obstruction in air channel, thereby reduces wind speed, has reduced heat dispersion.Particularly be placed on the chip of leeward, wind is heated by chip from weather gage, causes the heat dispersion rapid deterioration of lee gauge.
Another kind of radiating mode is to cover all chips for big radiator of chip design that a plurality of height are identical on the circuit board, this mode can increase area of dissipation, but, generally can on chip, cover flexible heat conductive pad and guarantee that radiator well contacts with each chip because still there is error in chip height.Yet the major defect of this mode is must be that highly identical device just can use, and the general heat conductivility of flexible heat conductive pad is bad, has increased thermal resistance.The number of devices that covers simultaneously along with radiator increases, and effective contact area of radiator and chip can be owing to the height error between device reduces, and heat dispersion worsens rapidly with radiator covering device quantity increase simultaneously.
Summary of the invention
For solving above-mentioned problems of the prior art, the embodiment of the invention provides a kind of integrated heat dissipating method, system and corresponding heat abstractor, for the chip of installing on the circuit board provides preferable heat dispersion, do not influence the structural design and the device layout of circuit board simultaneously.
The integrated heat dissipating method that the embodiment of the invention provided is used to a plurality of chips of installing on the circuit board to dispel the heat, and this method may further comprise the steps:
On each chip, install a radiator respectively;
Bindiny mechanism is set respectively between per two adjacent radiators to be located by connecting described two adjacent radiators together and to form radiator cascade chain, the chip that is covered is dispelled the heat, and wherein the chip that caloric value is big will conduct to heat on the radiator that temperature is lower in the chain by this radiator cascade chain; Described bindiny mechanism is specially and is shaped in two adjacent radiator opposite sides, is used for the contact surface of location cooperation mutually, the described step that described two adjacent radiators are located by connecting together is specially: the corresponding location of fitting mutually of contact surface with described two adjacent radiator opposite sides makes two adjacent radiators fully contact connection.
The integrated cooling system that the embodiment of the invention provided, be used to a plurality of chips of installing on the circuit board to dispel the heat, described integrated cooling system comprises at least one radiator cascade chain, described radiator cascade chain comprises a plurality of radiators and a plurality of bindiny mechanism, described each radiator correspondence respectively is installed on the chip, described each bindiny mechanism is arranged at respectively between the per two adjacent radiators, is used for correspondence two adjacent radiators are located by connecting together; Described bindiny mechanism is specially and is shaped in two adjacent radiator opposite sides, is used for the contact surface of location cooperation mutually.
The heat abstractor that the embodiment of the invention provided is for the chip of installing on the circuit board dispels the heat.Described heat abstractor comprises a radiator and the connecting portion that is arranged at least one side of described radiator, described radiator comprises a cooling base and a plurality of radiating fin that stretches out from described cooling base upper surface, and described connecting portion is formed in one in described cooling base side, is used for locating so that two heat abstractors fully contact the contact surface of connection with corresponding the applying mutually of connecting portion of adjacent heat abstractor.
From the technical scheme of the above embodiment of the invention as can be seen:
The embodiment of the invention adopts the mode that bindiny mechanism is set between radiator that a plurality of chips that a plurality of radiators combine to correspondence are dispelled the heat, not only improved the integral heat sink effect of a plurality of chips that have height error or differing heights, guarantee that each single radiator closely contacts with corresponding chip, and the bigger chip of caloric value is transmitted to heat on the lower radiator of temperature fast, heat on the circuit board can evenly be distributed, thereby provide preferable heat dispersion for the chip on the circuit board.In addition, the embodiment of the invention can reduce the influence that board structure of circuit designs and device layout is dispelled the heat, particularly for the circuit board in the forced air cooling formula cooling system, not only can make the layout neat appearance of device on the circuit board, do not block the air channel, improve the diffusion of heat in the unit interval, utilize the stronger capacity of heat transmission of metal can make that heat as much as possible evenly distributes on the circuit board simultaneously, reduce the thermal stress generation.
Fig. 1 is the end view of existing chip cooling structure.
Fig. 2 is the gas channel schematic diagram of existing chip cooling structure.
Fig. 3 is the integrated heat dissipating method flow chart of the embodiment of the invention.
Fig. 4 is two structural representations that the radiator contact connects of the integrated cooling system of the embodiment of the invention.
Fig. 5 is the radiator cascade chain structure schematic diagram of the integrated cooling system of the embodiment of the invention.
Fig. 6 is the gas channel schematic diagram of the integrated cooling system of the embodiment of the invention.
Fig. 7 is two structural representations that the radiator contact connects of the integrated cooling system of another embodiment of the present invention.
The invention will be further described below in conjunction with the drawings and specific embodiments, but the present invention is not limited to the following examples.
As shown in Figure 3, the embodiment of the invention provides a kind of integrated heat dissipating method, is applied to the diverse network communication apparatus, for a plurality of chips of installing on the set circuit board of device interior dispel the heat.The integrated heat dissipating method of the embodiment of the invention can be applicable under the natural heat dissipation condition, also can be applicable to carry out under the air operated compulsory type wind-cooling heat dissipating condition with fan, as as described in circuit board one side install fan or compulsory type wind-cooling heat dissipating system etc. additional, on described circuit board, to form the heat transmission gas channel.This integrated heat dissipating method mainly may further comprise the steps:
Step 101 is installed a radiator respectively on each chip of installing on the circuit board.
Wherein, described radiator adopts thermal conductivity preferred materials such as metal to make usually, and each radiator comprises a cooling base and a plurality of radiating fin that stretches out from described cooling base upper surface.When adopting compulsory type wind-cooling heat dissipating mode, described radiator can be arranged in rows along described gas channel direction.When radiator is installed, the bearing of trend of described radiating fin and described gas channel direction being consistent, can obtaining preferable radiating effect, is comparatively preferred mounting means.Described radiator can adopt heat-conducting glue directly to stick on the corresponding chip, also can utilize screw or fastener to be fixed on the circuit board.
Step 102, bindiny mechanism is set respectively between per two adjacent radiators to be located by connecting described two adjacent radiators together and to form radiator cascade chain, the chip that is covered is dispelled the heat, and wherein the chip that caloric value is big will conduct to heat on the radiator that temperature is lower in the chain by this radiator cascade chain.
Particularly, no matter be under the natural heat dissipation condition or under compulsory type wind-cooling heat dissipating condition, described radiator all can be arranged according to the structural design of described circuit board and the requirement of device layout, and the quantity of radiator can be adjusted according to the actual requirements flexibly in the described radiator cascade chain.When adopting compulsory type wind-cooling heat dissipating mode, described the step that forms radiator cascade chain is specially being provided with respectively between the per two adjacent radiators that bindiny mechanism is located by connecting described two adjacent radiators together: between the per two adjacent radiators in each the row radiator group that is being arranged in rows along described gas channel direction bindiny mechanism being set respectively is located by connecting described two adjacent radiators together, and make described each row radiator group form a radiator cascade chain, the chip that is covered is dispelled the heat, and wherein the chip that caloric value is big will conduct to heat on the radiator that temperature is lower in the chain by this radiator cascade chain.
Described bindiny mechanism is specially the cooling base opposite side that is shaped in two adjacent radiators, the contact surface that is used for locating mutually cooperation, and described contact surface is a hackly surface.The detailed process of described formation radiator cascade chain is, the hackly surface that per two adjacent heat sink side faces the are formed location of fitting mutually makes two adjacent radiators fully contact connection, carries out heat conduction.For strengthening the heat conductivility between two radiators, also can be at contact-making surface place coated with thermally conductive material, as heat conductive silica gel etc.
In addition, for guaranteeing effectively contact connection between the radiator, when radiator adopts screw, fixing screw hole on the radiator can be designed to ellipse, shape such as oval, fix a radiator during installation earlier, promote another radiator again and draw close, after the close contact matching of the hackly surface of two radiators, with screw radiator is fixed on the circuit board again; When radiator adopted the heat-conducting glue technique for sticking to be fixed on the chip, processing mode was roughly the same fixed a radiator earlier, push again another radiator make on it hackly surface be bonded on the chip again after the radiator hackly surface that is fixed contacts closely.A plurality of radiators can be installed on the circuit board one by one according to above-mentioned any mode when connecting, also can be according to requirements such as inter-chip pitch that is covered and differences in height, and unified again being installed on the circuit board after the employing auxiliary fixture is located by connecting described radiator together.
The integrated heat dissipating method of the embodiment of the invention adopts the mode that bindiny mechanism is set between radiator that a plurality of chips that a plurality of radiators combine to correspondence are dispelled the heat, not only improved the integral heat sink effect of a plurality of chips that have height error or differing heights, guarantee that each single radiator closely contacts with corresponding chip, and the bigger chip of caloric value is transmitted to heat on the lower radiator of temperature fast, heat on the circuit board can evenly be distributed, thereby provide preferable heat dispersion for the chip on the circuit board.In addition, employing and the integrated hackly surface of radiator not only can be guaranteed effectively to be located by connecting between radiator, and increase the contact-making surface duty between the radiator as bindiny mechanism in the present embodiment method, are comparatively preferential a kind of execution modes.But the serrated contact surfaces design is not a sole mode, also can design the contact surface between the radiator during concrete enforcement according to the actual requirements, as with as described in contact surface be designed to L shaped, trapezoidal etc., and this contact surface also not only is confined to design on the cooling base of radiator, also can design on the outermost radiating fin of radiator.In addition, in embodiments of the present invention, described bindiny mechanism also can be specially a T shape radiator bridge that is arranged between the described two adjacent radiators, and the positioning match part that is shaped in the cooling base opposite side of described two adjacent radiators.In the present embodiment method by described bindiny mechanism with described two adjacent radiators be located by connecting together detailed process be with the lower surface of described radiator bridge horizontal part respectively with the upper surface contact matching of the positioning match part of described two adjacent radiator opposite sides, so that described two adjacent radiators are located by connecting together.If have height error between the chip that is covered, between the upper and lower contact surface of described radiator bridge and described positioning match part, also can further add the elastic heat conducting pad.In addition, for preventing the slippage from the described two adjacent radiators of described radiator, the present embodiment method also further comprises described radiator bridge is fixed on the described two adjacent radiators.
Based on a total design, the embodiment of the invention also provides a kind of integrated cooling system, is used to a plurality of chips of installing on the circuit board to dispel the heat.Described integrated cooling system comprises one or more radiator cascade chain, described each bar radiator cascade chain comprises a plurality of radiators and a plurality of bindiny mechanism, described each radiator correspondence respectively is installed on the chip, described each bindiny mechanism is arranged at respectively between the per two adjacent radiators, be used for correspondence two adjacent radiators are located by connecting together, the chip that is covered is dispelled the heat.
The integrated cooling system of the embodiment of the invention both can be applicable under the natural heat dissipation condition, also can be applicable to carry out under the air operated compulsory type wind-cooling heat dissipating condition with fan, as as described in circuit board one side install fan or compulsory type wind-cooling heat dissipating system etc. additional, on described circuit board, to form the heat transmission gas channel.Wherein, described radiator adopts thermal conductivity preferred materials such as metal to make usually, and each radiator comprises a cooling base and a plurality of radiating fin that stretches out from described cooling base upper surface.When adopting compulsory type wind-cooling heat dissipating mode, be formed with gas channel on the described circuit board, described radiator cascade chain is arranged in rows along described gas channel direction, described each bindiny mechanism is arranged at respectively between the per two adjacent radiators in each bar radiator cascade chain, is used for correspondence two adjacent radiators are located by connecting together.When described radiator is installed, the bearing of trend of described radiating fin and described gas channel direction being consistent, can obtaining preferable radiating effect, is comparatively preferred mounting means.Described radiator can adopt heat-conducting glue directly to stick on the corresponding chip, also can utilize screw or fastener to be fixed on the circuit board.
As shown in Figure 4, be two structural representations that the radiators contact connects of the integrated cooling system of the embodiment of the invention.Described two radiators 70 are installed in respectively on two chip blocks 50,55, and described two chips 50,55 are installed on the circuit board 40, and chip 50 is a little more than chip 55.Each radiator 70 comprises cooling base 72 and a plurality of radiating fin 71 that stretches out from described cooling base 72 upper surfaces.In the present embodiment, described radiator 70 is to adopt screw on circuit board 40, offers an oval fixing screw hole 90 respectively at each radiator four jiaos, wears the location for screw and uses.Described two radiators 70 are located by connecting together by bindiny mechanism 80.In the present embodiment, described bindiny mechanism 80 is the serrated contact surfaces of cooling base 72 opposite sides that are shaped in two adjacent radiators 70.This two radiator 70 is fitted the location mutually and is fully contacted connection by the serrated contact surfaces of cooling base 72 respective side.Adopt this connected mode, a plurality of radiators are linked together to form as shown in Figure 5 radiator cascade chain 100, the a plurality of chips 50 that covered are dispelled the heat, and the chip 50 that wherein caloric value is big will conduct to heat on the radiator that temperature is lower in the chain by this radiator cascade chain 100.
For guaranteeing effectively contact connection between the radiator 70, can fix a radiator 70 earlier during installation, promote another radiator 70 again and draw close, after the close contact matching of the serrated contact surfaces of two radiators 70, with screw radiator 70 is fixed on the circuit board 40 again; Also can be according to requirements such as chip 50 spacings that covered and differences in height, unified again being installed on the circuit board 40 after the employing auxiliary fixture is located by connecting described radiator 70 together.
As shown in Figure 6, the integrated cooling system of the embodiment of the invention also can comprise many heat radiation cascade chains 100, described heat radiation cascade chain 100 is installed on the circuit board 40, and each bar heat radiation cascade chain 100 all extends along gas channel 110 directions that form on the described circuit board 40.Be the air-cooled airflow direction that passes through from gas channel among the figure shown in the arrow, the radiator of mouthful position of generally being in the wind is owing to directly arrived by wind, and heat radiation is very fast, and temperature is lower, and the locational radiator in following air port is subjected to the blocking temperature of previous stage radiator higher.Because the heat conduction efficiency of metal heat sink is far above air transmitted, heat will be transmitted to the lower place of temperature along radiator cascade chain from the higher place of temperature, and will be opposite with airflow direction, finally make the heat homogenizing of each chip on the circuit board.
The integrated cooling system of the embodiment of the invention adopts the mode that bindiny mechanism is set between radiator that a plurality of chips that a plurality of radiators combine to correspondence are dispelled the heat, not only improved the integral heat sink effect of a plurality of chips that have height error or differing heights, guarantee that each single radiator closely contacts with corresponding chip, and the bigger chip of caloric value is transmitted to heat on the lower radiator of temperature fast, heat on the circuit board can evenly be distributed, thereby provide preferable heat dispersion for the chip on the circuit board.In addition, employing and the integrated serrated appearance face of radiator are as bindiny mechanism in the integrated cooling system of present embodiment, not only can guarantee effectively to be located by connecting between radiator, and increase the contact-making surface duty between the radiator, be comparatively preferential a kind of execution mode.But the serrated contact surfaces design is not a sole mode, also can design the contact surface between the radiator during concrete enforcement according to the actual requirements, as with as described in contact surface be designed to L shaped, trapezoidal etc., and this contact surface also not only is confined to design on the cooling base of radiator, also can design on the outermost radiating fin of radiator.
See also Fig. 7 again, be two structural representations that the radiators contact connects of the integrated cooling system of another embodiment of the present invention.The integrated cooling system of present embodiment more is applicable to the chip distance situation far away on the circuit board.In the present embodiment, described two radiators 75 are installed in respectively on two chip blocks 50,55, and described two chips 50,55 are installed on the circuit board 40, and chip 50 is a little more than chip 55.Each radiator 75 comprises cooling base 76 and a plurality of radiating fin 77 that stretches out from described cooling base 76 upper surfaces.Described two radiators 75 are located by connecting together by bindiny mechanism.In the present embodiment, described bindiny mechanism comprises that one is arranged at the T shape radiator bridge 120 between described two radiators, and the positioning match part 85 that is shaped in described two adjacent radiator 75 opposite sides.Described positioning match part 85 is that cooling base 76 respective side by each radiator 75 stretch out and form, the lower surface of described T shape radiator bridge 120 horizontal parts respectively with the upper surface contact matching of the positioning match part 85 of described two radiators, 75 opposite sides, to be located by connecting together with described two radiators 75.Described radiator bridge 120 can adopt zigzag or other to increase the shape of contact area with the upper and lower contact surface of described positioning match part 85, to guarantee described radiator bridge 120 and the fully contact connection of corresponding radiator 75, carries out heat conduction.In addition, owing to have difference in height between chip 50 and the chip 55, therefore also need added resilience heat conductive pad 130 between the upper and lower contact surface of described radiator bridge 120 and described positioning match part 85, all can effectively contact connection with corresponding two radiators 75 to guarantee described radiator bridge 120.Simultaneously, for preventing the slippage of radiator bridge 120 from the radiator 75, can fix with modes such as bolt and nuts between described radiator bridge 120 and the radiator 75.
Based on total design, the embodiment of the invention also provides a kind of heat abstractor of correspondence, is used for constituting the integrated cooling system of the foregoing description, for the chip of installing on the circuit board dispels the heat.Described heat abstractor comprises a radiator and the connecting portion that is arranged at least one side of described radiator.Described radiator comprises a cooling base and a plurality of radiating fin that stretches out from described cooling base upper surface.Described connecting portion can be the contact surface that is shaped in described cooling base side, is used for corresponding contact connection with another heat abstractor, and described contact surface is zigzag, L shaped or step surface.Described connecting portion also can comprise positioning match part that is shaped in described cooling base one side and the T shape radiator bridge that is connected with described positioning match part contact, the lower surface of described T shape radiator bridge horizontal part and the upper surface contact matching of described positioning match part.The upper and lower contact surface of described radiator bridge and described positioning match part can increase the surface of contact area for zigzag or other, and also can set up the elastic heat conducting pad according to the actual requirements between described upper and lower contact surface.
From the technical scheme of the above embodiment of the invention as can be seen:
The embodiment of the invention adopts the mode that bindiny mechanism is set between radiator that a plurality of chips that a plurality of radiators combine to correspondence are dispelled the heat, not only improved the integral heat sink effect of a plurality of chips that have height error or differing heights, guarantee that each single radiator closely contacts with corresponding chip, and the bigger chip of caloric value is transmitted to heat on the lower radiator of temperature fast, heat on the circuit board can evenly be distributed, thereby provide preferable heat dispersion for the chip on the circuit board.In addition, the embodiment of the invention can reduce the influence that board structure of circuit designs and device layout is dispelled the heat, particularly for the circuit board in the forced air cooling formula cooling system, not only can make the layout neat appearance of device on the circuit board, do not block the air channel, improve the diffusion of heat in the unit interval, utilize the stronger capacity of heat transmission of metal can make that heat as much as possible evenly distributes on the circuit board simultaneously, reduce the thermal stress generation.
[0041] just preferred implementation of the present invention is described more than, those skilled in the art is in the scheme scope of the technology of the present invention, and common variation and the replacement carried out all should be included in protection scope of the present invention.
Claims (12)
1. an integrated heat dissipating method is used to a plurality of chips of installing on the circuit board to dispel the heat, and it is characterized in that this method may further comprise the steps:
On each chip, install a radiator respectively;
Bindiny mechanism is set respectively between per two adjacent radiators to be located by connecting described two adjacent radiators together and to form radiator cascade chain, the chip that is covered is dispelled the heat, and wherein the chip that caloric value is big will conduct to heat on the radiator that temperature is lower in the chain by this radiator cascade chain; Described bindiny mechanism is specially and is shaped in two adjacent radiator opposite sides, is used for the contact surface of location cooperation mutually, the described step that described two adjacent radiators are located by connecting together is specially: the corresponding location of fitting mutually of contact surface with described two adjacent radiator opposite sides makes two adjacent radiators fully contact connection.
2. the method for claim 1 is characterized in that, described method further comprises, forms gas channel on described circuit board, and described radiator is arranged in rows along described gas channel direction; Described the step that forms radiator cascade chain is specially being provided with respectively between the per two adjacent radiators that bindiny mechanism is located by connecting described two adjacent radiators together: bindiny mechanism is set respectively between the per two adjacent radiators in each row radiator group described two adjacent radiators are located by connecting together and form radiator cascade chain.
3. method as claimed in claim 2 is characterized in that, described radiator comprises a cooling base and a plurality of radiating fin that stretches out from described cooling base upper surface, and described radiating fin extends along described gas channel direction.
4. as each described method in the claim 1 to 3, it is characterized in that described method further comprises, at fit the mutually contact surface place coated with thermally conductive material of location of described two adjacent radiators.
5. as each described method in the claim 1 to 3, it is characterized in that described contact surface is zigzag, L shaped or step surface.
6. integrated cooling system, be used to a plurality of chips of installing on the circuit board to dispel the heat, it is characterized in that, described integrated cooling system comprises at least one radiator cascade chain, described radiator cascade chain comprises a plurality of radiators and a plurality of bindiny mechanism, described each radiator correspondence respectively is installed on the chip, and described each bindiny mechanism is arranged at respectively between the per two adjacent radiators, is used for correspondence two adjacent radiators are located by connecting together; Described bindiny mechanism is specially and is shaped in two adjacent radiator opposite sides, is used for the contact surface of location cooperation mutually.
7. system as claimed in claim 6, it is characterized in that, described circuit board is provided with gas channel, described integrated cooling system comprises many radiator cascade chains, described radiator cascade chain is arranged in rows along described gas channel direction, described each bindiny mechanism is between the per two adjacent radiators that are arranged at respectively in each bar radiator cascade chain, is used for correspondence two adjacent radiators are linked together.
8. system as claimed in claim 7 is characterized in that, described radiator comprises a cooling base and a plurality of radiating fin that stretches out from described cooling base upper surface, and the bearing of trend of described radiating fin is consistent with described gas channel direction.
9. as each described system in the claim 6 to 8, it is characterized in that described contact surface place is coated with Heat Conduction Material.
10. as each described system in the claim 6 to 8, it is characterized in that described contact surface is zigzag, L shaped or step surface.
11. heat abstractor, for the chip of installing on the circuit board dispels the heat, described heat abstractor comprises a radiator, described radiator comprises a cooling base and a plurality of radiating fin that stretches out from described cooling base upper surface, it is characterized in that described heat abstractor also comprises: the connecting portion that is arranged at least one side of described radiator; Described connecting portion is formed in one in described cooling base side, is used for locating so that two heat abstractors fully contact the contact surface of connection with corresponding the applying mutually of connecting portion of adjacent heat abstractor.
12. device as claimed in claim 11 is characterized in that, described contact surface is zigzag, L shaped or step surface.
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| CN200710124126XA CN101150101B (en) | 2007-10-23 | 2007-10-23 | Integrated heat radiation method, system and corresponding heat radiation device |
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| CN200710124126XA CN101150101B (en) | 2007-10-23 | 2007-10-23 | Integrated heat radiation method, system and corresponding heat radiation device |
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|---|---|---|---|---|
| CN102449759B (en) | 2011-09-30 | 2013-08-28 | 华为技术有限公司 | Radiator |
| US9411384B2 (en) * | 2013-06-07 | 2016-08-09 | Western Digital Technologies, Inc. | Method and system for attachment of a heat sink to a circuit board |
| CN109168288B (en) * | 2014-09-26 | 2020-07-14 | 华为技术有限公司 | Radiator and electronic product |
| CN106102306B (en) * | 2016-06-29 | 2019-08-06 | 华为技术有限公司 | A kind of circuit board and heat dissipating method, communication equipment of communication equipment |
| CN106793717B (en) * | 2017-03-22 | 2023-07-21 | 歌尔科技有限公司 | Heat radiation structure and virtual reality product |
| CN108630640B (en) * | 2018-06-20 | 2024-04-26 | 东莞市李群自动化技术有限公司 | Integrated radiator with temperature gradient |
| WO2020062253A1 (en) * | 2018-09-30 | 2020-04-02 | 北京比特大陆科技有限公司 | Circuit board, computing device and cooling case |
| CN109643705A (en) * | 2018-10-31 | 2019-04-16 | 北京比特大陆科技有限公司 | Circuit board and chip layout method calculate equipment |
| WO2020102983A1 (en) * | 2018-11-20 | 2020-05-28 | 北京比特大陆科技有限公司 | Circuit board and supercomputing server |
| CN110234217A (en) * | 2019-07-18 | 2019-09-13 | 深圳祖师汇科技股份有限公司 | A kind of automobile data recorder with bridging type radiator structure |
| CN113811150A (en) * | 2021-08-12 | 2021-12-17 | 珠海英搏尔电气股份有限公司 | Heat dissipation bridge, motor controller, power assembly and vehicle |
| CN217985815U (en) * | 2022-07-01 | 2022-12-06 | 北京比特大陆科技有限公司 | Radiator, circuit board module and electronic equipment |
-
2007
- 2007-10-23 CN CN200710124126XA patent/CN101150101B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101150101A (en) | 2008-03-26 |
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