CN2850216Y

CN2850216Y - Radiator

Info

Publication number: CN2850216Y
Application number: CN 200520066881
Authority: CN
Inventors: 龙文彬
Original assignee: Mitac Precision Technology Shunde Ltd
Current assignee: Mitac Precision Technology Shunde Ltd
Priority date: 2005-11-08
Filing date: 2005-11-08
Publication date: 2006-12-20
Anticipated expiration: 2015-11-08

Abstract

The utility model discloses a radiator that is used for radiating heat to a plurality of electronic elements. The radiator comprises a heat radiating base, a housing, a heat conducting pipe, a heat radiating fan and heat radiating fins, wherein the heat radiating base and the housing are integrated, and the heat radiating base is attached on the surface of more than one electronic element. One end of the heat conducting pipe is embedded in the heat radiating base, and the other end is attached on the heat radiating fins. The heat radiating fan and the heat radiating fins are arranged in the housing, and the heat radiating fins are arranged at the position of the air outlet of the heat radiating fan. The utility model alters the situation that the radiators are independently arranged at a plurality of electronic elements that need to radiate in some area of the electronic device, and the utility model increases heat radiating performance and lowers cost, and is suitable for the situation that a plurality of electronic elements need to radiate in some area of each electronic device.

Description

A kind of heat abstractor

Technical field

The utility model relates to a kind of heat abstractor, particularly a kind of heat abstractor that a plurality of electronic components are dispelled the heat.

Background technology

Along with development of science and technology, the integrated level of some electronic components strengthens, and operating frequency also constantly increases, and therefore is necessary heat abstractor to be set to reduce temperature of electronic component on the surface of some electronic component, ensures its normal and stable operation.Yet in the electronic installation of Shi Yonging, generally be load onto heat abstractor respectively separately greatly and on the electronic component that needs to dispel the heat at present at power.Because therefore the compact development trend of electronic installation certainly will have the restriction of some electronic components for fear of the space, some simple radiating devices can only be installed, to seek the balance between heat dispersion and the heat abstractor volume.

As shown in Figure 1, this known first kind of radiator commonly used includes a cooling base 1, heat pipe 2, fan 3, radiating fin 4.The part that cooling base 1 is attached at electronical elements surface can increase subsides heat conduction copper billet usually, and then is attached on the electronical elements surface, to reduce thermal resistance, improves pyroconductivity.This heat pipe 2 is embedded in cooling base 1 and is attached on the radiating fin 4.The heat that electronic component gives out during work conducts to radiating fin 4 via cooling base 1, heat pipe 2, and then is dispelled the heat by 3 pairs of radiating fins 4 of radiator fan.This radiator fan 3 adopts air intake to become the streaming fan for sleeping in of an angle of 90 degrees with the air-out angle, forms forced convertion, and radiating fin 4 is placed in its air outlet place.

As shown in Figure 2, this known second kind of radiator commonly used only is attached on cooling base 5 one surfaces by a heat conduction copper billet 6 and forms, and the fin shape is arranged on cooling base 5 another surfaces usually, increases area of dissipation with weight reduction.Contact distribute heat by radiator and air.Its heat-sinking capability is limited, poor effect.

Above-mentioned these two kinds of radiator combinations usually are used in a certain zone of each electronic installation, its shortcoming is that used heat abstractor number is many, number of assembling steps is many, has increased Material Cost and assembly cost, but has the portions of electronics element can not obtain efficiently radiates heat when heat pipe is not utilized effectively.

Summary of the invention

The utility model has overcome the deficiencies in the prior art, and a kind of heat abstractor is provided.This heat abstractor has increased heat dissipation region, thereby has reduced the quantity of used radiator, has reduced Material Cost and assembly cost.

For reaching above purpose, a plurality of independent fansink designs in a certain zone in the electronic installation can be become conjoined structure, heat pipe is embedded in wherein, and heat conducts to radiating fin via cooling base, heat pipe, with fan radiating fin is dispelled the heat again.

Because adopt technique scheme, the heat abstractor that the utility model provides has such beneficial effect, has increased heat dissipation region, has improved integral heat sink efficient, and has reduced the quantity of used radiator, has reduced Material Cost and assembly cost.

Description of drawings

Fig. 1 is known first kind of radiator stereogram.

Fig. 2 is known second kind of radiator stereogram.

Fig. 3 is the combination stereogram of CPU of the present utility model and VGA heat abstractor.

Embodiment

Below in conjunction with accompanying drawing the utility model is described in further detail.

Please refer to shown in Figure 3, it is the embodiment of the utility model, this heat abstractor is provided with a cooling base 10, the distribution of the electronic component that this cooling base 10 can dispel the heat with the need and change shape, be separately positioned on central processing unit and the VGA processor relative position in present embodiment, and this cooling base 10 has the radiating block 11 of a plurality of marshallings, and is provided with a heat pipe caulking groove 12 on this cooling base 10, is embedded with a heat pipe 13 in this heat pipe caulking groove 12.

In addition, on cooling base 10, be equipped with a housing 20, this housing 20 is one-body molded with cooling base 10, and be mounted with radiator fan 30 in this housing 20, and be covered with a hollow cover plate 21 on this housing 20, and this housing 20 is provided with radiating fin 22 away from cooling base 10 1 sides, and this radiating fin 22 is positioned at radiator fan 30 air outlets, and is pasted with on this radiating fin 22 by the heat pipe 13 of cooling base 10 1 ends to housing 20 extensions.

When this heat abstractor comes into operation, cooling base 10 with respect to central processing unit and VGA processor part can increase paste the heat conduction copper billet and then be attached at central processing unit and VGA processor surface on, heat pipe 13 closely contacts with the heat conduction copper billet again, the heat conduction copper billet is attached between cooling base and the electronic building brick can effectively reduce thermal resistance, so can improve radiating efficiency.The heat that central processing unit and VGA processor produce during work conducts to radiating fin 22 by cooling base 10, heat pipe 13.Radiator fan 30 dispels the heat to radiating fin 22 again.Radiator fan 30 adopts air intake to become the streaming fan for sleeping in of an angle of 90 degrees with the air-out angle, forms forced convertion, and radiating fin 22 is placed in its air outlet place.Certainly the radiating block 11 of the marshalling of cooling base 10 surface settings also can distribute certain heat in the air of contact with it, but radiating effect is limited.So structural change in the past central processing unit and VGA processor the situation that radiator dispels the heat is installed separately, its benefit has: 1, the heat pipe effect is fully used, and has solved the bad problem of VGA processor heat radiation; 2, reduce die sinking respectively and made the expense that radiator base increased; 3, reduced the quantity of used radiator, saved Material Cost and installation cost.

Certainly be not limited in the practical operation above-mentioned central processing unit and VGA processor be carried out the integrated design radiator, can be in the practical operation according to actual conditions, each radiator that needs the electronic component of heat radiation to install in a certain zone in the electronic installation is carried out integrated design, be embedded in each electronic element radiating pedestal and be attached on the radiating fin 22 by heat pipe 13, heat is conducted on the radiating fin 22, utilize 30 pairs of radiating fins 22 of radiator fan to dispel the heat again.So-called regional radiator promptly is installed, thereby is played the effect that improves heat dispersion and reduce cost.

Claims

1. heat abstractor, comprise cooling base, housing, heat pipe, radiating fin, radiator fan, wherein radiating fin and radiator fan are placed in the housing and radiating fin is positioned at radiator fan air outlet place, it is characterized in that: one-body molded and this cooling base of described cooling base and housing is attached at more than one electronical elements surface, and described heat pipe one end is embedded on the cooling base, the other end is attached on the radiating fin.

2. heat abstractor according to claim 1 is characterized in that: described cooling base can increase subsides heat conduction copper billet with respect to the surface portion of electronic component, and its another surface portion can be provided with radiating block.

3. heat abstractor according to claim 1 is characterized in that: described radiating fin is arranged in the housing away from the cooling base place.

4. heat abstractor according to claim 1 is characterized in that: described radiator fan adopts air intake to become the streaming fan for sleeping in of an angle of 90 degrees with the air-out angle.