CN106102306B - A kind of circuit board and heat dissipating method, communication equipment of communication equipment - Google Patents
A kind of circuit board and heat dissipating method, communication equipment of communication equipment Download PDFInfo
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- CN106102306B CN106102306B CN201610507027.9A CN201610507027A CN106102306B CN 106102306 B CN106102306 B CN 106102306B CN 201610507027 A CN201610507027 A CN 201610507027A CN 106102306 B CN106102306 B CN 106102306B
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- heat dissipation
- dissipation channel
- working media
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of circuit board of communication equipment and heat dissipating method, communication equipment, which includes: substrate, at least one low-power consumption area and at least one high power consumption area are divided on substrate；Radiator, including the first heat dissipation channel and the second heat dissipation channel being connected to the first heat dissipation channel, working media in first heat dissipation channel is liquid phase and is used to radiate to device in low-power consumption area, the junction of first heat dissipation channel and the second heat dissipation channel is provided with the choke apparatus for reducing the first heat dissipation channel abrupt change of cross-section, the working medium pressure for the liquid phase that choke apparatus is used to make to flow into out of first heat dissipation channel reduces, and working media is flowed into the second heat dissipation channel and the device in high power consumption area is radiated and vaporized.In the above scheme, make working media form vaporization in the second heat dissipation channel by the choke apparatus of setting, flowed back by the working media that choke apparatus avoids vaporization, to improve working media to the heat dissipation effect of electric elements.
Description
Technical field
The present invention relates to the circuit board and heat dissipating method of field of communication technology more particularly to a kind of communication equipment, lead to
Believe equipment.
Background technique
Multiple and different heating devices is distributed in section communication equipment, on circuit board, power density difference is big, exists simultaneously
The framework of the complete mirror image of upper and lower frames, needs that gravity is overcome to influence, and circuit board includes substrate, and the multiple devices being disposed on the substrate
Part, and the heat dissipation of multiple devices is radiated by radiator, which includes heat sink module corresponding with each device,
Multiple heat sink modules together, solve to radiate by placed in series by control flow and mass dryness fraction, but the work in pipeline
Medium, since quality can gentlier float up, will not circulate, to influence whole device after vaporization in pipeline
Heat dissipation effect.
Summary of the invention
The present invention provides a kind of circuit board of communication equipment and heat dissipating methods, communication equipment, to improve circuit board
Heat dissipation effect, and then improve the heat dissipation effect of communication equipment.
The present invention provides a kind of circuit board of communication equipment, which includes:
Substrate is divided at least one low-power consumption area and at least one high power consumption area on the substrate；
Low energy-consumption electronic device at least one described low-power consumption area is set；
High power consumption device at least one described high power consumption area is set；
Further include:
Radiator, including the first heat dissipation channel and the second heat dissipation channel being connected to first heat dissipation channel, and institute
The first heat dissipation channel and second heat dissipation channel are stated for accommodating working media, the working media in first heat dissipation channel
For liquid phase and for radiating to the low energy-consumption electronic device, the junction of first heat dissipation channel and the second heat dissipation channel is provided with
The choke apparatus for reducing the first heat dissipation channel abrupt change of cross-section, the choke apparatus is for making from first heat dissipation channel
The working medium pressure of the liquid phase of interior inflow reduces, and the working media is for being flowed into second heat dissipation channel to the height
Power consuming devices radiate and part vaporizes.
In the above-described embodiment, by the first heat dissipation channel of setting, the second heat dissipation channel and setting in the first heat dissipation
Choke apparatus between channel and the second heat dissipation channel is formed in the radiator structure on substrate, so that the working media of liquid phase is to low
The heat dissipation of power consumption electric elements, the working media of gas phase is to high power consumption heat dissipation electric elements heat dissipation.Simultaneously as the choked flow dress of setting
It sets so that working media forms vaporization in the second heat dissipation channel, is flowed back by the working media that choke apparatus avoids vaporization,
To improve working media to the heat dissipation effect of electric elements.
Choke apparatus therein is so that the structure that the abrupt change of cross-section of the first heat dissipation channel is reduced.Pass through the mutation in channel
It reduces and realizes pressure loss, so that the working media of liquid phase can be realized part vaporization.In specific setting, choke apparatus can be with
Arbitrarily to can be realized the device or structure that reduce working medium pressure, in a specific embodiment, the resistance
Stream device is baffle, is provided with multiple through-holes or slit or notch on the baffle.I.e. the choke apparatus uses on baffle
Some structures are set and realize the pressure for changing liquid phase medium, so that choke apparatus can when entering in the second heat dissipation channel
With vaporization.The structures such as above-mentioned through-hole, slit or notch use single-row arrangement, so that working media energy in specific setting
It is enough to be smoothly flowed into the second heat dissipation channel.
The first heat dissipation channel and the second heat dissipation channel in above scheme can be formed on substrate using different structures.
Specifically, first heat dissipation channel and second heat dissipation channel are pipeline or open up groove on the substrate, it is described
Second heat dissipation channel is pipeline or opens up groove on the substrate, in specific setting, can according to practical situation into
Row setting.
When low-power consumption area and high power consumption area are arranged on substrate, it can be configured according to practical situation, be had at one
In the embodiment of body, the number in the low-power consumption area is one and is located at the middle position of the circuit board, the high power consumption
The number in area is two, and two high power consumptions distinguish the two sides for being listed in the low-power consumption area.
The embodiment of the invention also provides a kind of heat dissipating method of the circuit board of communication equipment, the circuit board is above-mentioned
Circuit board the described method comprises the following steps:
It is radiated by the working media of liquid phase to the low energy-consumption electronic device in the low-power consumption area in low-power consumption area；
In choke apparatus, the pressure reduction of the working media of liquid phase, and still keep liquid phase state；
Into after high power consumption area, at least part working media becomes gas phase by liquid phase and takes away high power consumption device production
Raw heat.
In the above-described embodiment, it is radiated by the working media of liquid phase to low-power consumption electric elements, the work of gas phase is situated between
The heat dissipation electric elements heat dissipation of confrontation high power consumption.Improve radiating efficiency.Simultaneously as the choke apparatus of setting makes working media
Vaporization is formed in the second heat dissipation channel, is flowed back by the working media that choke apparatus avoids vaporization, to improve work
Heat dissipation effect of the medium to electric elements.
Working media therein by liquid phase carries out heat dissipation to the low energy-consumption electronic device in low-power consumption area and specifically includes:
The temperature & pressure of the working media of supercooling is that T1&P1 enters the first heat dissipation channel, and passes through the first heat dissipation channel
Successively pass through all low energy-consumption electronic devices, in this section of region, the working media uses pure single-phase heat exchange, and work is reached after the completion of heat exchange
The temperature & pressure for making medium reaches T2&P2, wherein P2 is greater than the corresponding saturation pressure of T2.
It is therein described in choke apparatus, the pressure reduction of the working media of liquid phase, and still keep liquid phase state；Into
Behind high power consumption area, at least part working media gas phase is become by liquid phase and take away high power consumption device generation heat it is specific
Include:
The working media of liquid phase generates pressure drop dP when flowing through choke apparatus, into the temperature of the working media in high power consumption device area
Degree and pressure are T2& (P2-dP), wherein P2-dP is greater than or equal to the saturation pressure under T2 is corresponded to, and the working media is at least
A part becomes to enter in high power consumption area after gas phase to radiate to the high power consumption device.
The present invention also provides a kind of communication equipment, the communication equipment packet and setting are in the intracorporal multiple circuits of the cabinet
Plate, the circuit board are circuit board described in any of the above embodiments, and the communication equipment further includes condenser, and the condenser goes out
Mouth is connected to the first heat dissipation channel of each circuit board, and working media enters each circuit board from the outlet of the condenser
The first heat dissipation channel, the import of the condenser is connected to the second heat dissipation channel of each circuit board, and at least part changes
For gas phase working media entered by the import of the condenser from the second heat dissipation channel of each circuit board it is described cold
Condenser, the working media that the condenser is used to be changed into described at least part gas phase is cooling, keeps the working media complete
Portion is changed into liquid phase.
In the above-described embodiment, by the first heat dissipation channel of setting, the second heat dissipation channel and setting in the first heat dissipation
Choke apparatus between channel and the second heat dissipation channel is formed in the radiator structure on substrate, so that the working media of liquid phase is to low
The heat dissipation of power consumption electric elements, the working media of gas phase is to high power consumption heat dissipation electric elements heat dissipation.Simultaneously as the choked flow dress of setting
It sets so that working media forms vaporization in the second heat dissipation channel, is flowed back by the working media that choke apparatus avoids vaporization,
To improve working media to the heat dissipation effect of electric elements.
In addition, the communication equipment further includes control device, the control device in order to further improve heat dissipation effect
Heat for being distributed according to the circuit board and condenser described in the power consumption control in low-power consumption area are input to first heat dissipation
The flow of the working media in channel and the working media the entrance temperature and the working media it is described into
Pressure at mouthful, so that the working media being located in first heat dissipation channel keeps liquid phase.It is filled by the control of setting
It sets and guarantees that the working media for sending condenser to convey keeps liquid phase in the first heat dissipation channel.
More preferably, the communication equipment further includes detection device, and the detection device is used to detect Soviet Union's Sohu's condenser
The mass dryness fraction of the working media of entrance；
The mass dryness fraction that control device is also used to detect in the detection device is more than setting value, adjusts going out for the condenser
Flow quantity.Mass dryness fraction is adjusted by control device so as to adjust the radiating efficiency of entire communication equipment.It is described dry in specific setting
Degree setting value is located in 0.1~0.6 range.The range of mass dryness fraction is controlled by setting detection device and control device, so as to
The effective heat dissipation effect for improving condenser.
Detailed description of the invention
Fig. 1 is the top view of circuit board provided in an embodiment of the present invention；
Fig. 2 is the bottom view of circuit board provided in an embodiment of the present invention；
Fig. 3~Fig. 5 is the structural schematic diagram of choke apparatus provided in an embodiment of the present invention.
Appended drawing reference:
10- substrate 11- low-power consumption area 12- high power consumption area
20- radiator 21- the first heat dissipation channel 22- choke apparatus
221- baffle 222- slit 223- through-hole 224- notch
23- the second heat dissipation channel 30- high power consumption device 40- low energy-consumption electronic device
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with attached drawing to the present invention make into
It is described in detail to one step, it is clear that described embodiments are only a part of the embodiments of the present invention, rather than whole implementation
Example.Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts
All other embodiment, shall fall within the protection scope of the present invention.
Firstly the need of explanation be board application provided in an embodiment of the present invention in a communications device, especially communication cabinet
In vivo, when being arranged in communication cabinet body, it is provided with the circuit board of different function, circuit board provided by the invention is to solve
When being radiated using condenser to circuit board, the working media that condenser uses can be vaporized, under the effect of gravity, vaporization
Working media is located above, and the working media of liquid is located below, and causes the working media of vaporization that can not flow back into condenser
The problem of being cooled down.
In addition, in the present embodiment, power consumption < 50W of device is low energy-consumption electronic device, but the division of low energy-consumption electronic device is not
It is only limitted to above-mentioned condition, can be determined according to the power consuming devices on actual circuit board.It is low for placing the region of low energy-consumption electronic device
Power consumption area, the region for placing high power consumption device is high power consumption area.
As shown in Figures 1 and 2, Fig. 1 and Fig. 2 respectively illustrates the circuit board of communication equipment provided in an embodiment of the present invention
Structural schematic diagram.
The present invention provides a kind of circuit board of communication equipment, which includes:
Substrate 10 is divided at least one low-power consumption area 11 and at least one high power consumption area 12 on substrate 10；
Low energy-consumption electronic device 40 at least one low-power consumption area 11 is set；
High power consumption device 30 at least one high power consumption area 12 is set；
Further include:
Radiator 20, including the first heat dissipation channel 21 and the second heat dissipation channel 23 being connected to the first heat dissipation channel 21,
And first heat dissipation channel 21 and the second heat dissipation channel 23 for accommodating working media, the working media in the first heat dissipation channel 21 is
Liquid phase and for radiating to low energy-consumption electronic device 40, the junction of the first heat dissipation channel 21 and the second heat dissipation channel 23, which is provided with, makes the
The choke apparatus 22 that one heat dissipation channel, 21 abrupt change of cross-section reduces, what choke apparatus 22 was used to make to flow into out of first heat dissipation channel 21
The working medium pressure of liquid phase reduces, and working media radiates to high power consumption device 30 for being flowed into the second heat dissipation channel 23
And part vaporizes.
In the above-described embodiment, by the first heat dissipation channel 21 of setting, the second heat dissipation channel 23 and setting first
Choke apparatus 22 between heat dissipation channel 21 and the second heat dissipation channel 23 forms radiator structure on the substrate 10, so that liquid phase
Working media radiates to low-power consumption electric elements, and the working media of gas phase is to high power consumption heat dissipation electric elements heat dissipation.Simultaneously as
The choke apparatus 22 of setting makes working media form vaporization in the second heat dissipation channel 23, avoids vapour by choke apparatus 22
The working media of change flows back, to improve working media to the heat dissipation effect of electric elements.
In order to facilitate the structure and working principle for understanding circuit board provided in this embodiment, below with reference to specific attached drawing
And it is described in detail in embodiment.
Continue to refer to figure 1, on the circuit board in the present embodiment on be divided into two kinds of regions, one kind is low-power consumption area 11, separately
One kind is high power consumption area 12, wherein the number in low-power consumption area 11 and high power consumption area 12 can be according to the device on actual substrate 10
Depending on part actual conditions.In the present embodiment, for convenience of explanation, using a low-power consumption area 11, Liang Ge high power consumption area 12
Example is described in detail.Specifically as shown in Figure 1, in the present embodiment, the number in low-power consumption area 11 is one and is located at electricity
The middle position of road plate, the number in high power consumption area 12 is two, and Liang Ge high power consumption area 12 is arranged on the two sides in low-power consumption area 11.
Wherein, it is provided with multiple low energy-consumption electronic devices 40 in low-power consumption area 11, multiple high power consumption devices 30 are provided in high power consumption area 12.
The first heat dissipation channel 21 in radiator 20 is corresponded with low-power consumption area 11, the second heat dissipation channel 23 and Gao Gong
It consumes area 12 to correspond, and is provided in the junction of the first heat dissipation channel 21 and the second heat dissipation channel 23 and can be realized pressure drop
Low choke apparatus 22.When specifically used: the working media (T1&P1) of the liquid phase of supercooling passes through the first heat dissipation channel 21 successively
By all low energy-consumption electronic devices 40, in this section of region, the working media temperature & pressure of pure single-phase heat exchange, the liquid phase after heat absorption reaches
To T2&P2, wherein P2 is greater than the corresponding saturation pressure of T2 temperature of working media, to guarantee that working media is logical in the first heat dissipation
The state of liquid phase is always maintained in road 21.Wherein, in setting, the radiator of low energy-consumption electronic device 40 can be low energy-consumption electronic device 40
Series connection is also possible to parallel connection or a combination thereof；The working media of liquid phase after heat absorption enters in choke apparatus 22, fills in choked flow
The place that 22 entrance restricted zone reduces suddenly for circulation area is set, generates pressure reduction dP at this time；Working media enters later
30th area of high power consumption device, and its temperature & pressure is T2& (P2-dP), in the present embodiment, passes through setting choke apparatus 22
Structure, so that working media in P2-dP is slightly larger than or is equal to working media corresponding saturation pressure, work when temperature is T2 at this time
Make medium to undergo phase transition in the second heat dissipation channel 23, gas phase is become by liquid phase, and the working media of gas phase is to high power consumption area
High power consumption device 30 in 12 radiates.
It can be seen from foregoing description in the present embodiment, pass through the first heat dissipation channel 21, the second heat dissipation channel of setting
23 and the choke apparatus 22 that is arranged between the first heat dissipation channel 21 and the second heat dissipation channel 23 form heat dissipation on the substrate 10
Structure, so that the working media of liquid phase radiates to low-power consumption electric elements, the working media of gas phase is to high power consumption heat dissipation electric appliance member
Part heat dissipation.Simultaneously as the choke apparatus 22 of setting makes working media form vaporization in the second heat dissipation channel 23, pass through resistance
Stream device 22 avoids the working media reflux of vaporization, to overcome gravity, improves working media and dissipates to electric elements
Thermal effect.
In the present embodiment, the first heat dissipation channel 21 and the second heat dissipation channel 23 can be formed using different structures, be had
Body, the first heat dissipation channel 21 and the second heat dissipation channel 23 are pipeline or open up groove on the substrate 10.Using pipeline
When, i.e., by the fixed one side for deviating from low energy-consumption electronic device 40 on the substrate 10 of pipeline, often by heat-conducting glue, connector or others
See that fixed form is fixed on the substrate 10 by pipeline, and pipeline passes through each low energy-consumption electronic device 40 and high power consumption device 30, and
When using the structure, choke apparatus 22 is filled in pipeline, and pipeline is divided into the first heat dissipation channel 21 and the second heat dissipation channel 23.
When using groove structure, i.e., slot structure is opened up out by tool on the substrate 10, which is used as the first heat dissipation channel
21 and second heat dissipation channel 23, it should be appreciated that when using slot structure, it should, will using encapsulation half with substrate 10 to box
Groove seals, and only flows out the opening at both ends, to guarantee that working media can flow in the trench.
Fig. 3~Fig. 5 is referred to together, Fig. 3~Fig. 5 shows the choke apparatus of different structure, in specific setting, choked flow dress
Setting 22 can be realized using different structures, and in a specific embodiment, choke apparatus 22 includes baffle 221, baffle
Multiple through-holes 223, slit 222 or notch 224 are provided on 221.I.e. the choke apparatus 22, which is used, is arranged one on baffle 221
A little structures realize the pressure for changing liquid phase mediums, so that choke apparatus 22 can be with when entering in the second heat dissipation channel 23
Vaporization.The structures such as above-mentioned through-hole 223, slit 222 or notch 224 are in specific setting, using single-row arrangement.Specifically, choked flow
Device 22 uses structure as shown in Figure 3, i.e., slit 222 is arranged on baffle 221, which forms working media circulation
Channel, the pressure reduction to working media is realized by the slit 222 of setting；Or as shown in figure 4, the choke apparatus 22 is
Multiple through-holes 223 are provided on baffle 221, the cross section of the through-hole 223 can be different shape, such as square, rectangular
The different shape such as shape, pentalpha, hexagon or abnormity, is not limited only to square through hole 223 shown in Fig. 4.It can by Fig. 4
To find out, the single setting of multiple through-holes 223, and the number that through-hole 223 is arranged can guarantee work depending on practical situation
Make the pressure reduction that medium realizes dP after flowing through through-hole 223, guarantees to vaporize in the second heat dissipation channel 23.Or it uses
Structure as shown in Figure 5 realizes the pressure drop to working media by notch 224 that is, when multiple notches 224 are arranged on plate
It is low.
The embodiment of the invention also provides a kind of heat dissipating method of circuit board, which is above-mentioned circuit board, described
Method the following steps are included:
It is radiated by the working media of liquid phase to the low energy-consumption electronic device in low-power consumption area；
In choke apparatus, the pressure reduction of the working media of liquid phase, and still keep liquid phase state；
Into after high power consumption area, at least part working media becomes gas phase by liquid phase and takes away high power consumption device production
Raw heat.
In the above-described embodiment, it is radiated by the working media of liquid phase to low-power consumption electric elements, the work of gas phase is situated between
The heat dissipation electric elements heat dissipation of confrontation high power consumption.Improve radiating efficiency.Simultaneously as the choke apparatus of setting makes working media
Vaporization is formed in the second heat dissipation channel, is flowed back by the working media that choke apparatus avoids vaporization, to improve work
Heat dissipation effect of the medium to electric elements.The detailed operation of this method has carried out detailed retouch in above structure embodiment
It states, details are not described herein.
In addition, the communication equipment includes cabinet cabinet body the embodiment of the invention also provides a kind of communication equipment, and setting exists
The intracorporal multiple circuit boards of cabinet, circuit board are circuit board described in above-mentioned specific embodiment, and communication equipment further includes condenser,
The outlet of condenser is connected to the first heat dissipation channel of each circuit board, and the outlet of working media condenser enters each circuit
First heat dissipation channel of plate, the import of condenser are connected to the second heat dissipation channel of each circuit board, are changed at least partially
The working media of gas phase enters condenser by the import of condenser from the second heat dissipation channel of each circuit board, and condenser is used for
It is cooling to the working media for being changed into gas phase at least partially, so that working media is completely reformed into liquid phase.
In the above-described embodiment, as shown in Figures 2 and 3, pass through the first heat dissipation channel 21, the second heat dissipation channel of setting
23 and the choke apparatus 22 that is arranged between the first heat dissipation channel 21 and the second heat dissipation channel 23 form heat dissipation on the substrate 10
Structure, so that the working media of liquid phase radiates to low-power consumption electric elements, the working media of gas phase is to high power consumption heat dissipation electric appliance member
Part heat dissipation.Simultaneously as the choke apparatus 22 of setting makes working media form vaporization in the second heat dissipation channel 23, pass through resistance
Stream device 22 avoids the working media reflux of vaporization, to improve working media to the heat dissipation effect of electric elements.
In addition, communication equipment described in the communication equipment further includes control device in order to further improve heat dissipation effect, institute
It states condenser described in the power consumption control of heat and low-power consumption area of the control device for distributing according to the circuit board and is input to institute
The flow and the working media for stating the working media of the first heat dissipation channel are situated between in the temperature of the entrance and the work
Matter the entrance pressure so that be located at first heat dissipation channel in the working media keep liquid phase.Pass through control
The pressure and flow of the control working media of device processed enable working media to enter first with a suitable state
Heat dissipation channel, and guarantee still to be able to keep liquid phase after the heat for absorbing low-power consumption area.
In order to further improve the effect of heat dissipation, preferably, communication equipment provided in this embodiment further includes detection
Device, the detection device are used to detect the mass dryness fraction of the working media of the entrance of the condenser；Control device is further used
It is more than setting value in the mass dryness fraction detected in the detection device, adjust the condenser goes out flow quantity, to improve condenser
Condensation effect.Mass dryness fraction is adjusted by control device so as to adjust the radiating efficiency of entire communication equipment.In specific setting, institute
Mass dryness fraction setting value is stated in the range of 0.1~0.6, such as 0.3,0.35,0.4 numerical value arbitrarily between 0.3~0.4,
The range of mass dryness fraction is controlled, by setting detection device and control device so as to effectively improve the heat dissipation effect of condenser
Fruit.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (11)
1. a kind of circuit board characterized by comprising
Substrate is divided at least one low-power consumption area and at least one high power consumption area on the substrate；
Low energy-consumption electronic device at least one described low-power consumption area is set；
High power consumption device at least one described high power consumption area is set；
Further include:
Radiator, including the first heat dissipation channel and the second heat dissipation channel being connected to first heat dissipation channel, and described
For accommodating working media, the working media in first heat dissipation channel is temperature for one heat dissipation channel and second heat dissipation channel
Degree with the liquid phase that pressure is T1 and P1 and for radiating to the low energy-consumption electronic device, lead to by first heat dissipation channel and the second heat dissipation
The junction in road is provided with the choke apparatus for reducing the first heat dissipation channel abrupt change of cross-section, and the choke apparatus is for will be from
The temperature and pressure flowed into first heat dissipation channel is that the working medium pressure of the liquid phase of T2 and P2 reduces, wherein P2 is big
In the corresponding saturation pressure of T2；The working media carries out the high power consumption device for being flowed into second heat dissipation channel
It radiates and at least part vaporizes.
2. circuit board as described in claim 1, which is characterized in that the choke apparatus is the section so that the first heat dissipation channel
It is mutated the structure reduced.
3. circuit board as claimed in claim 2, which is characterized in that the choke apparatus is baffle, is provided on the baffle
Multiple through-holes or slit or notch.
4. circuit board as claimed in claim 3, which is characterized in that the through-hole or slit or notch single-row arrangement.
5. circuit board as described in claim 1, which is characterized in that first heat dissipation channel is pipeline or is provided with the base
Groove on plate；
Second heat dissipation channel is pipeline or opens up groove on the substrate.
6. a kind of heat dissipating method of the circuit board of communication equipment, the circuit board is circuit board as described in claim 1, special
Sign is, the described method comprises the following steps:
The temperature and pressure of the working media of supercooling is that T1 and P1 enters the first heat dissipation channel, and by the first heat dissipation channel according to
Secondary to pass through all low energy-consumption electronic devices, in this section of region, the working media uses pure single-phase heat exchange, and work is reached after the completion of heat exchange
The temperature and pressure of medium reaches T2 and P2, wherein P2 is greater than the corresponding saturation pressure of T2；
In choke apparatus, the pressure reduction of the working media of liquid phase, and still keep liquid phase state；
Into after high power consumption area, at least part working media becomes gas phase by liquid phase and takes away high power consumption device generation
Heat.
7. the heat dissipating method of circuit board as claimed in claim 6, which is characterized in that described in choke apparatus, the work of liquid phase
Make the pressure reduction of medium, and still keeps liquid phase state；Into after high power consumption area, at least part working media is by liquid phase
Become gas phase and the heat for taking away high power consumption device generation specifically include:
Pressure drop dP is generated when the working media of liquid phase flows through choke apparatus, into the working media in high power consumption device area temperature and
Pressure is T2 and (P2-dP), wherein saturation pressure of the P2-dP more than or equal to T2 under corresponding, the working media at least one
Divide after becoming gas phase to enter in high power consumption area and radiate to the high power consumption device.
8. a kind of communication equipment, which is characterized in that including cabinet body, and setting is in the intracorporal multiple circuit boards of the cabinet, described
Circuit board is such as circuit board according to any one of claims 1 to 5, and the communication equipment further includes condenser, the condensation
The outlet of device is connected to the first heat dissipation channel of each circuit board, and working media enters described each from the outlet of the condenser
First heat dissipation channel of circuit board, the import of the condenser are connected to the second heat dissipation channel of each circuit board, and at least one
The import for dividing the working media for being changed into gas phase to pass through the condenser from the second heat dissipation channel of each circuit board enters
The condenser, the working media that the condenser is used to be changed into described at least part gas phase is cooling, makes the work
Medium is completely reformed into liquid phase.
9. communication equipment as claimed in claim 8, which is characterized in that the communication equipment further includes control device, the control
Condenser described in the power consumption control of heat and low-power consumption area that device processed is used to be distributed according to the circuit board is input to described the
The flow of the working media of one heat dissipation channel and the working media exist in the temperature of the entrance and the working media
The pressure of the entrance, so that the working media being located in first heat dissipation channel keeps liquid phase.
10. communication equipment as claimed in claim 9, which is characterized in that the communication equipment further includes detection device, the inspection
Survey the mass dryness fraction of the working media of entrance of the device for detecting the condenser；
The mass dryness fraction that control device is further used for detecting in the detection device is more than setting value, adjusts going out for the condenser
Flow quantity, to improve the condensation effect of condenser.
11. communication equipment as claimed in claim 10, which is characterized in that the mass dryness fraction setting value is located at 0.1~0.6 range
It is interior.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610507027.9A CN106102306B (en) | 2016-06-29 | 2016-06-29 | A kind of circuit board and heat dissipating method, communication equipment of communication equipment |
| PCT/CN2017/075356 WO2018000848A1 (en) | 2016-06-29 | 2017-03-01 | Circuit board for communication device and heat dissipation method, communication device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610507027.9A CN106102306B (en) | 2016-06-29 | 2016-06-29 | A kind of circuit board and heat dissipating method, communication equipment of communication equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106102306A CN106102306A (en) | 2016-11-09 |
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| CN106102306B (en) * | 2016-06-29 | 2019-08-06 | 华为技术有限公司 | A kind of circuit board and heat dissipating method, communication equipment of communication equipment |
| CN209069695U (en) * | 2018-07-24 | 2019-07-05 | 江苏苏净集团有限公司 | A kind of aerosol dilution device |
| CN109922599B (en) * | 2019-03-28 | 2020-12-15 | 华为技术有限公司 | Circuit board, circuit board manufacturing method and electronic equipment |
| CN114698230B (en) * | 2022-02-23 | 2023-05-12 | 中国电子科技集团公司第二十九研究所 | Three-dimensional integrated structure of printed circuit board embedded with micro-channels and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1825246A (en) * | 2005-02-25 | 2006-08-30 | 富准精密工业(深圳)有限公司 | Cooler for several heating elements |
| CN101150101A (en) * | 2007-10-23 | 2008-03-26 | 华为技术有限公司 | Integrated heat radiation method, system and corresponding heat radiation device |
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| US6501654B2 (en) * | 2000-09-29 | 2002-12-31 | Nanostream, Inc. | Microfluidic devices for heat transfer |
| CN100495691C (en) * | 2005-01-31 | 2009-06-03 | 杨开艳 | CPU radiator |
| JP5906607B2 (en) * | 2011-08-17 | 2016-04-20 | 富士通株式会社 | Loop heat pipe and electronic device provided with the loop heat pipe |
| CN202476021U (en) * | 2012-02-07 | 2012-10-03 | 山东大学 | Power electronic integration module tiny passage liquid cooling substrate with double trapezoid cross section fins |
| CN103672814B (en) * | 2013-12-16 | 2017-10-13 | 深圳市华星光电技术有限公司 | Heat-radiation loop pipe and the backlight module with the heat-radiation loop pipe |
| JP2016054248A (en) * | 2014-09-04 | 2016-04-14 | 富士通株式会社 | Cooling module, cooling module mounting substrate, and electronic device |
| CN106102306B (en) * | 2016-06-29 | 2019-08-06 | 华为技术有限公司 | A kind of circuit board and heat dissipating method, communication equipment of communication equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1825246A (en) * | 2005-02-25 | 2006-08-30 | 富准精密工业(深圳)有限公司 | Cooler for several heating elements |
| CN101150101A (en) * | 2007-10-23 | 2008-03-26 | 华为技术有限公司 | Integrated heat radiation method, system and corresponding heat radiation device |
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| WO2018000848A1 (en) | 2018-01-04 |
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