CN1825246A - Cooler for several heating elements - Google Patents
Cooler for several heating elements Download PDFInfo
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- CN1825246A CN1825246A CN 200510033333 CN200510033333A CN1825246A CN 1825246 A CN1825246 A CN 1825246A CN 200510033333 CN200510033333 CN 200510033333 CN 200510033333 A CN200510033333 A CN 200510033333A CN 1825246 A CN1825246 A CN 1825246A
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- cooling
- heating elements
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- several heating
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Abstract
The invention provides a cooling device used for plural heating elements. It includes compressor, condenser, evaporator, and cool medium cycling loop. The evaporator includes at least two cooling block adhering to the heating element. A splitter box connects cooling block flow channel and transferring cool medium pipeline. The evaporator also includes a casing and bottom board to sealing the cooling block in it to avoid the humidity filtering into the circuit board. Pressing components are set between casing and cooling block to make the cooling block contact with heating element tightly to improve heat emission effect.
Description
[technical field]
The present invention relates to a kind of cooling back installation.
[background technology]
Along with the growth year by year of global electronic industrial technology, the technological development of computing machine central microprocessor (CPU) is innovation constantly also, make microprocessor growing, and then cause consumed power raising, the thermal value of microprocessor significantly to rise towards the trend that the computing clock pulse reaches the usefulness enhancing soon.The pioneer of recent global advanced electronics technology exploitation, just produce the heat dissipation problem that huge power consumption derives and meet with unprecedented bottleneck because of breaking through the interior chip of microprocessor, under the function situation that can't keep system stability, abandoned researching and developing the faster microprocessor of computing clock pulse.The mode that present single CPU is divided into two CPU is shared heat load, might become one of method that does not solve heat dissipation problem, and the working temperature that effectively reduces this microprocessor has become the necessary condition of powerful arithmetic capability.
The computer system that with the dual micro processor is platform in the past successfully is used in large-scale workstation and the high-order server field, and dual micro processor has a large amount of operational data of processing and powerful advantages such as multitasking ability, make that the single microprocessor system caused overload that system delay or unsettled situation are overcome in the past under the execution compute mode of full load.Yet usually the thermal value of dual micro processor is far above the single microprocessor system, and because two microprocessors sharing out the work and help one another each other, when one of them microprocessor can't bear to use or during corrupted, whole sets of computer main frame may operate and stop.In order to solve the heat dissipation problem of dual micro processor, move thermal technology and the heat radiation product except the exploitation tool is high performance, because two microprocessors working temperature difference each other under start, standby and full-speed operation state is little, must consider that this high efficiency heat radiation device provides the identical heat energy power of moving at two microprocessors, even otherwise the development of the arithmetic core of dual micro processor is ultimate attainment again, also can't bring into play its best usefulness.
And the physical characteristics of well-known electronic product if the working temperature of microprocessor can be reduced to normal temperature or below the normal temperature, then can promote the running performance and the degree of stability of microprocessor significantly, shortens operation time and reduces power consumption.The cooling technology of present dual micro processor, adopt radiating fin with heat dissipation technologys such as air blast cooling mode or liquid cooled modes mostly, as shown in Figure 1, two heating radiators 100 are installed in respectively on two microprocessors 200, the surface is provided with the heat radiation scale at some intervals on each heating radiator 100, first air conduit 300 connects hair-dryers (figure does not show) and heating radiators 100, thereby second air conduit 400 is connected between two heating radiators 100 and is directed at the cooling that two heating radiators 100 are realized two microprocessors 200 with the cold wind that hair-dryer is blown out.So, aforementioned heating radiator is made by lighter aluminium usually, does not possess the ability of fast and efficiently high-speed computation high temperature heating microprocessor later being reduced in the shortest time below the normal temperature.And this kind utilizes the type of cooling of concatenation type, and after air flow stream was crossed first microprocessor, preheating was a high temperature gas flow, so that can't guarantee that enough cooling poweies remove the heat of second microprocessor, causes dual micro processor that the unbalanced phenomenon of heat radiation takes place.
Reduce to below the normal temperature in the microprocessor surface temperature of the compression of prior art utilization at present refrigerating circulation system in computing machine, most typical example is to utilize the evaporator in the refrigerating circulation system to contact with the heater element surface, wherein has the flow passage structure that refrigerant is passed through in the evaporator, the phase transformation that endothermic process when flowing through this flow passage structure by refrigerant produced and discharge the evaporation latent heat (latent heat ofevaporation) of refrigerant, the heat that distribute on the heater element surface is taken away, and reached the purpose that reduces the heater element working temperature.And the compression refrigerating circulation system is to be combined by compressor, condenser, evaporator and kapillary usually.Though can use the freeze cycle technology at present in the heat radiation field of heater element, bright few researchist is absorbed in Application and Development at the structure of dual micro processor system and the freeze cycle cooling device of functionality improvement.
And other cooling technology field is applied in the middle of the dual micro processor system in the past, the existing stake in the exploitation different structure, the heat abstractor of function, wherein having much has been disclosed in the patent documentation, US5 for example, 912,802, the tool pipeline that TW265430 disclosed and microprocessor cooling system more than the heat radiation hair-dryer of relative binding fin is arranged, TW241723, the heating radiator improved structure of the industrial dual micro processor computing machine that CN2653576 disclosed, the computer heat radiating device that is used for two CPU (central processing unit) that TW535939 disclosed, the heat radiator improvement of two central processing units that TW534584 disclosed, the temperature balance structure of two central processing units that TW242767 disclosed etc.
The heating radiator that only is used in dual micro processor still has following problems and shortcoming to wait to overcome in design, makes to use and be extended to the space that still has following improvement in various heating heater elements and the computing machine dual micro processor system with prior art and freeze cycle technology:
(1) the heat abstractor body is overweight, and long-term use can cause circuit board damage
Be used for the high power dual micro processor with existing heat dissipation technology at present, the modal heating radiator that is to use axial fan to be fixed in the radiating fin top, raising year by year along with the microprocessor thermal value, soluble scheme is nothing more than the volume that increases radiating fin and increase fan dimension and rotating speed, in the vertical type computer cabinet, circuit board is normally perpendicular to floor mounted, circuit board is under the situation of bearing two groups of overweight pressure of heating radiator for a long time, then easily cause circuit board to produce twisted phenomena, and heating radiator is subjected to the influence of gravity or vibrations when overweight and also break away from original position easily.
(2) the inhomogeneous radiating effect that influences of air current flow distribution
Another prior art is the radiating fin of installing out of the ordinary on dual micro processor, flow to two radiating fins by the fan group guiding outer gas stream that is installed in server inside, again pre-thermal current is drained into outside to reach the purpose of heat radiation, yet the position of two microprocessors ornaments is difference to some extent, and then influence the airflow rate that fan blows to fin, cause the degree of heat radiation of two microprocessors to differ, cause bearing the abundant cooling that the lower microprocessor of airflow rate is difficult to obtain cold airflow, cause that the microprocessor heat-sinking capability is not good and overheated burns away from fan end.
(3) installation steps of evaporator are loaded down with trivial details
Accessory and part in the evaporator are too much, cause procedure of processing loaded down with trivial details, and manufacturing cost is increased and the fraction defective raising, and the user wastes time and energy installing not only, also increase the careless mistake in the installation process easily.
(4) the concatenation type cooling system can't be brought into play the best hot merit energy that moves
Known cooling system utilizes the type of cooling of concatenation type, as shown in Figure 1, be to flow through first microprocessor with fluid to cool off, move heat the back fluid preheating be the fluid of high temperature, so that can't guarantee that enough cooling poweies remove the heat of second microprocessor, cause dual micro processor that the unbalanced phenomenon of heat radiation takes place.
(5) location between cooling block and the heating heater element is difficult in the evaporator
Adaptation between the cooling surface of cooling block and the heating heater element surface is the key of moving the thermal efficiency, yet, as shown in Figure 2, it is inhomogeneous as if the application of force in housing 600 that cooling block 500 is installed in the assembling process, can cause 700 offsets of O type ring, secondly if fit too tight between location O type ring 700 and the housing 600, then the O type ring 700 difficult cooling blocks 500 that drive slide up and down along housing 600 inwalls, easily cause 700 offsets of O type ring, cause cooling block to tilt and only contact, even there is the interface heat conducting material (TIM) of getting well also might cause heater element 800 overheated risks of burning under this situation for point or line with heater element 800 surfaces.
(6) amount of moisture increase and moisture have a very wide distribution on the circuit board
Because the precise electronic part on the circuit board is considerably responsive for moisture and moisture, and amount of moisture that two cooling blocks in the double evaporators are built up and the moisture distribution range on the circuit board all are more than times of monolithic, if no moisture isolation structure design between cooling block and the circuit board, then cause infiltrating in the circuit board too much moisture and moisture, influence gently then can cause the aging of circuit board line in one's power, shorten the life-span that circuit board uses, seriously then can burn because of the short circuit current of part on the circuit board.
[summary of the invention]
At above-mentioned shortcoming, be that example describes below with embodiment.
Present embodiment technical matters to be solved is to provide a kind of security in a plurality of heater element individual works and cooling device that is used for several heating elements of optimum temperature of reaching.
Present embodiment another technical matters to be solved is to provide a kind of and can contacts fully closely with heater element, promotes the cooling device that is used for several heating elements of radiating effect.
Present embodiment another technical matters to be solved is to provide a kind of have rapid installation and the pinpoint cooling device that is used for several heating elements.
A present embodiment technical matters more to be solved is to provide a kind of cooling device that is used for several heating elements that has in the moisture infiltration circuit board that is condensed around the isolated cooling block.
Present embodiment provides a kind of cooling device that is used for several heating elements, this cooling device comprises the refrigerant circulation circuit that is made of compressor, condenser, evaporator and conveying refrigerant pipeline, wherein this evaporator comprises that several cooling block correspondences that are provided with runner are attached on the heater element, the cooling block runner links to each other by a flow dividing structure with carrying between the refrigerant pipeline, and this flow dividing structure uniform distribution flows into the interior cold medium flux of some cooling blocks.This evaporator further comprises a housing, be provided with the mobile runner of cooling matchmaker fluid in the cooling block, at least one splitter box is set in the housing, this splitter box is connected with pipeline with two cooling blocks respectively, be provided with pressing element between housing and the cooling block, one base plate is set between cooling block and the heater element, and housing and base plate are sealed in cooling block therebetween.
Compared with prior art, the cooling device that present embodiment is used to cool off several heating elements can design microminiaturization with cooling device under the restriction that is subjected to the space, and distribute the cold medium flux that flows in two cooling blocks equably by this splitter box, to reach safe operating temperature, this pressing element applies balanced power downwards to cooling block, guarantee that cooling block closely contacts fully with heater element, promote its radiating effect, and this base plate can be positioned at cooling block respectively the centre of surface of heater element apace, performance is installed rapidly and the accurate function of location, and reaches advantages such as the moisture infiltration circuit board that is condensed around the isolated cooling block is interior.
[description of drawings]
Be further described in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the synoptic diagram of the cooling system principle of traditional concatenation type type of cooling;
Fig. 2 is the inaccurate sectional view that is offset in location between conventional evaporator cooling device and the heater element;
Fig. 3 is the synoptic diagram of the compression refrigerating circulation system principle of present embodiment cooling device;
Fig. 4 is the schematic perspective view of present embodiment evaporator;
The cut-open view that Fig. 5 is looked in the cross section along V-V among Fig. 4 by the present embodiment evaporator;
Fig. 6 is the perspective exploded view of present embodiment evaporator;
Fig. 7 is the vertical view of present embodiment cooling block cavity portion;
Fig. 8 is the perspective exploded view of another embodiment evaporator; And
Fig. 9 is the stereographic map of another embodiment cooling block.
[embodiment]
Fig. 3 is used for the compression refrigerating circulation system principle schematic of the cooling device (describe for simplifying, be designated hereinafter simply as cooling device) of several heating elements for present embodiment.The present embodiment cooling device is used to remove and is arranged at the heat that the microprocessor 10 on the circuit board 11 is produced.Be appreciated that ground, the present embodiment cooling device also can be used for cooling off other electronic component with some thermals source and non-electronic component.Describing for simplifying, below is that example describes with two microprocessors.
This cooling device comprises an evaporator 1, a compressor 2, a condenser 3 and carries the refrigerant pipeline that this refrigerant pipeline comprises a capillary feed tube 5 and escape pipe 6.
This evaporator 1 comprises two cooling blocks 15, is appreciated that ground, and the quantity of cooling block 15 is not defined as two, gets final product with the quantity of microprocessor 10 is corresponding.This cooling block 15 is individually fixed on two microprocessors 10 by a retaining element 18.This retaining element 18 comprises a housing 18a and a base plate 18b, this housing 18a and base plate 18b are fixed to circuit board 11 tops (please join Fig. 4) by some screws 34, thereby forming respectively between housing 18a and the base plate 18b, between base plate 18b and the circuit board 11 and extraneous one of adiabatic upper plenum 20 and cavity 21 once, cooling block 15 and microprocessor 10 are placed in respectively in upper plenum 20 and the following cavity 21, one flow dividing structure is set in the upper plenum 20, and flow dividing structure is a splitter box 19 in the present embodiment.Circuit board 11 belows and base plate 18b opposite face are provided with a backboard 12, the below of circuit board 11 carried out the thermal insulation sealing and to have a heating function, prevent to produce unnecessary moisture condensation below circuit board 11.
See also Fig. 4 to Fig. 6, the upper face center of the cap 15a of cooling block 15 is provided with a pilot hole 25, and this cap 15a is provided with a cylindric pressure section 26 around pilot hole 25.Housing 18a end face is offered two ring-type locating slots 27, and the ring-type pressure section 26 of cooling block 15 cap 15a is inserted in this locating slot 27, places a packing ring 31 in this locating slot 27, presses the space so that an elasticity to be provided.The springs 28 of planting in the pilot hole 25 of cooling block 15 cap 15a, this spring 28 between housing 18a and cooling block 15, thereby make the cooling surface 23 of cooling block 15 contact fully closely to provide elastic pressure to press cooling block 15 downwards with microprocessor 10.Housing 18a shown in Fig. 4 is a square shape structure, but also can be other shape, as circle etc.
The shape of this splitter box 19, structure, size, position can change according to the actual requirements, have one first chamber 40 and second chamber 41 in the splitter box 19, be connected with pipeline 24 with two cooling blocks, 15 15b of cavity portion respectively, a cover plate 19a is installed in splitter box 19 tops so that splitter box 19 is sealed.19a is provided with two perforates (indicating) on the cover plate, thereby plugs connection splitter box 19 and capillary feed tube 5 and escape pipe 6 for capillary feed tube 5 and escape pipe 6.Refrigerant flows into first chamber 40 by capillary feed tube 5, the mean allocation cold medium flux flows in the runner 22 of two cooling blocks 15 via the inlet 39 of runner 22 in this first chamber 40, refrigerant after absorbing heat flow to second chamber 41 by the outlet 38 of runner 22, is flowed out by escape pipe 6 again.These splitter box 19 uniform distributions flow into the cold medium flux in two cooling blocks 15, guarantee the heat energy power of moving that two cooling blocks, 15 tools are identical, to reach two cooling block 15 security at work and the effects of optimum temperature.
Between housing 18a and the base plate 18b, also be respectively equipped with an O- ring seal 30,32 between base plate 18b and the circuit board 11, the elasticity when providing is fixedly pressed and is made up and down that cavity 20,21 and external environment have better adiabatic sealing effectiveness.
Figure 7 shows that the vertical view of cooling block cavity of the present invention portion, the runner 22 of cooling block 15 can be arranged in the 15b of cavity portion of cooling block 15 (please join Fig. 6) by job operations such as borings, this runner 22 connects perforation by some holes 37 and forms, the periphery in this hole 37 can change according to the actual requirements, as be linear pattern, also can be nonlinear type such as sawtooth pattern, camber etc.The outlet 38 of the corresponding connection runner 22 of the distribution pipeline 24 of splitter box 19 (please join Fig. 6) and inlet 39.The periphery of present embodiment mesopore 37 is circular, thereby in runner 22 tube walls formation fold, refrigerant flows between fold runner tube wall and produces turbulent phenomenon because of friction, and then the hot effect that passes of the boiling of strengthening refrigerant, and owing to fold runner tube wall can increase the area of dissipation of refrigerant and further improve the hot usefulness that passes.This cooling block 15 forms two partial structure up and down, to make things convenient for the processing of runner 22, cap 15a and the 15b of cavity portion can be made by different materials, material as cap 15a is the harder brass of quality, the 15b of cavity portion material is the red copper of thermal conductivity height, this cap 15a can be engaged with the 15b of cavity portion by welding manner to be one.
Fig. 8 to Fig. 9 is the perspective exploded view of another embodiment evaporator 1 ', this evaporator 1 ' is basic identical with the structure of the evaporator 1 of previous embodiment, difference is: cooling surface 23 peripheries of the cavity portion 15b ' lower end of cooling block 15 ' are provided with the some pilot holes 35 along circumferential array in this evaporator 1 ', be extended with the some reference columns 36 corresponding on the locating slot 29 of base plate 18b ' end face with pilot hole 35, this reference column 36 is inserted in this pilot hole 35, thereby the 15b ' of cavity portion of cooling block 15 ' is located by connecting with base plate 18b ', to reach the precisely function of location of further reinforcement.
Claims (15)
1. cooling device that is used for several heating elements, it comprises by compressor, condenser, evaporator and the refrigerant circulation circuit of carrying the refrigerant pipeline to constitute, it is characterized in that: this evaporator comprises that at least two cooling block correspondences that are provided with runner are attached on the heater element, and the cooling block runner is connected by a flow dividing structure with carrying between the refrigerant pipeline.
2. the cooling device that is used for several heating elements as claimed in claim 1 is characterized in that: wherein this conveying refrigerant pipeline comprises escape pipe and capillary feed tube.
3. the cooling device that is used for several heating elements as claimed in claim 2 is characterized in that: wherein this flow dividing structure is a splitter box, and it comprises that two chambers are connected with escape pipe and capillary feed tube respectively.
4. the cooling device that is used for several heating elements as claimed in claim 1 is characterized in that: wherein this cooling block comprises that one is used for the cavity portion and the cap that contact with heater element, and runner is arranged in this cavity portion.
5. the cooling device that is used for several heating elements as claimed in claim 4 is characterized in that: wherein this evaporator comprises a housing and a base plate, forms one between housing and the base plate for the ccontaining sealed cavity of cooling block.
6. the cooling device that is used for several heating elements as claimed in claim 5 is characterized in that: wherein this housing end face is provided with fluting, and this cooling block cap top is provided with a pressure section, and the apical margin correspondence of this pressure section is arranged in the fluting of this housing end face.
7. the cooling device that is used for several heating elements as claimed in claim 6 is characterized in that: wherein be provided with between this housing end face and the cooling block cap and be used for cooling block is applied flexible member towards the snap-in force of heater element.
8. the cooling device that is used for several heating elements as claimed in claim 5, it is characterized in that: wherein this heater element is for being located at the microprocessor of a circuit board top, this evaporator further comprises the backboard of being located at the circuit board below, and microprocessor is placed in the sealed cavity of backboard and base plate formation.
9. the cooling device that is used for several heating elements as claimed in claim 5 is characterized in that: wherein this base plate is provided with some reference columns, and the cavity portion bottom surface of this cooling block is provided with some pilot holes for the reference column insertion.
10. cooling device that is used for several heating elements, comprise two cavitys and be positioned at the outer conveying refrigerant pipeline of two cavitys, wherein a cavity is accommodated heater element in it, it is characterized in that: this cooling device also comprises some another cavity and corresponding cooling blocks that are attached on the several heating elements of being positioned at, be provided with the runner that the cooling matchmaker is flowed in each cooling block, the runner of these cooling blocks is connected with carrying the refrigerant pipeline by a flow dividing structure.
11. the cooling device that is used for several heating elements as claimed in claim 10 is characterized in that: wherein this another cavity is made of a housing and a base plate, is provided with a flexible member between housing and the cooling block.
12. the cooling device that is used for several heating elements as claimed in claim 11 is characterized in that: wherein this heater element is attached at circuit board top, and a backboard is attached at this circuit board below to should the base plate place, and base plate and backboard form above-mentioned this cavity.
13. as each described cooling device that is used for several heating elements of claim 10 to 12, it is characterized in that: wherein this flow dividing structure comprises the chamber of two independences, wherein a chamber links to each other with the inlet of cooling block runner respectively, and another chamber links to each other with the outlet of cooling block runner respectively.
14. the cooling device that is used for several heating elements as claimed in claim 13 is characterized in that: wherein this conveying refrigerant pipeline comprises a capillary feed tube that links to each other with this chamber and an escape pipe that links to each other with this another chamber.
15. the cooling device that is used for several heating elements as claimed in claim 14 is characterized in that: wherein this runner is for to be made of some holes, and the periphery in hole is a nonlinear type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100333335A CN100363864C (en) | 2005-02-25 | 2005-02-25 | Cooler for several heating elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100333335A CN100363864C (en) | 2005-02-25 | 2005-02-25 | Cooler for several heating elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1825246A true CN1825246A (en) | 2006-08-30 |
| CN100363864C CN100363864C (en) | 2008-01-23 |
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ID=36935950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100333335A Expired - Fee Related CN100363864C (en) | 2005-02-25 | 2005-02-25 | Cooler for several heating elements |
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| Country | Link |
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| CN (1) | CN100363864C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102609061A (en) * | 2012-01-13 | 2012-07-25 | 珠海佳一电子技术有限公司 | Miniature evaporation radiator for CPU (central processing unit) and GPU (graphics processing unit) of high-speed computer |
| CN106102306A (en) * | 2016-06-29 | 2016-11-09 | 华为技术有限公司 | The circuit board of a kind of communication equipment and heat dissipating method, communication equipment |
| CN110320476A (en) * | 2019-06-17 | 2019-10-11 | 中国科学院物理研究所 | The analogue battery equipment of gas is produced in situ detection liquid state batteries |
| CN111435061A (en) * | 2019-01-11 | 2020-07-21 | 青岛海尔空调器有限总公司 | Chip heat exchanger and variable frequency air conditioner |
| WO2022228266A1 (en) * | 2021-04-28 | 2022-11-03 | 北京国家新能源汽车技术创新中心有限公司 | Heat dissipation device, power module, and vehicle |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4445818A1 (en) * | 1994-12-21 | 1995-06-14 | Bernhard Hilpert | Computer housing suitable for applications in industry |
| US6116040A (en) * | 1999-03-15 | 2000-09-12 | Carrier Corporation | Apparatus for cooling the power electronics of a refrigeration compressor drive |
| US6526768B2 (en) * | 2001-07-24 | 2003-03-04 | Kryotech, Inc. | Apparatus and method for controlling the temperature of an integrated circuit device |
| CN2650207Y (en) * | 2003-06-19 | 2004-10-20 | 中国科学院理化技术研究所 | Miniature refrigerating device for computer chip radiation |
| CN2664195Y (en) * | 2003-10-17 | 2004-12-15 | 鸿富锦精密工业（深圳）有限公司 | Liquid cooling type heat sink |
-
2005
- 2005-02-25 CN CNB2005100333335A patent/CN100363864C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102609061A (en) * | 2012-01-13 | 2012-07-25 | 珠海佳一电子技术有限公司 | Miniature evaporation radiator for CPU (central processing unit) and GPU (graphics processing unit) of high-speed computer |
| CN106102306A (en) * | 2016-06-29 | 2016-11-09 | 华为技术有限公司 | The circuit board of a kind of communication equipment and heat dissipating method, communication equipment |
| CN106102306B (en) * | 2016-06-29 | 2019-08-06 | 华为技术有限公司 | A kind of circuit board and heat dissipating method, communication equipment of communication equipment |
| CN111435061A (en) * | 2019-01-11 | 2020-07-21 | 青岛海尔空调器有限总公司 | Chip heat exchanger and variable frequency air conditioner |
| CN110320476A (en) * | 2019-06-17 | 2019-10-11 | 中国科学院物理研究所 | The analogue battery equipment of gas is produced in situ detection liquid state batteries |
| WO2022228266A1 (en) * | 2021-04-28 | 2022-11-03 | 北京国家新能源汽车技术创新中心有限公司 | Heat dissipation device, power module, and vehicle |
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|---|---|
| CN100363864C (en) | 2008-01-23 |
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