CN219628239U - Novel liquid cooling radiator - Google Patents

Novel liquid cooling radiator Download PDF

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Publication number
CN219628239U
CN219628239U CN202320745755.9U CN202320745755U CN219628239U CN 219628239 U CN219628239 U CN 219628239U CN 202320745755 U CN202320745755 U CN 202320745755U CN 219628239 U CN219628239 U CN 219628239U
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cover plate
plate
liquid
spiral
phase change
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CN202320745755.9U
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闫晓峰
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Liande Electronic Technology Changshu Co ltd
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Liande Electronic Technology Changshu Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14Thermal energy storage

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Abstract

The utility model provides a novel liquid cooling radiator which improves heat transmission efficiency and provides higher efficiency heat conduction performance, reliability and service life. It comprises the following steps: a first cover plate; a plurality of spiral pipes, which are combined to form a matrix arrangement of spiral pipes; the second cover plate comprises a spiral pipe positioning plate and a bottom cover plate, the bottom cover of the spiral pipe positioning plate is provided with the bottom cover plate, and a phase change medium storage cavity is arranged below an area formed by the bottom cover plate corresponding to the matrix positioning holes of the spiral positioning plate; sintering a capillary structure; and a phase change medium which is a gaseous/liquid phase change medium; the middle part of the first cover plate is convexly provided with a heat exchange cavity, the periphery of the heat exchange cavity is provided with a liquid inlet and a liquid outlet, and working medium cooling liquid enters the heat exchange cavity after passing through the liquid inlet and flows out from the liquid outlet after contacting with the exposed surface of the spiral pipe for heat exchange; the spiral pipe locating plate is provided with matrix locating holes corresponding to the bottom of the spiral pipe.

Description

Novel liquid cooling radiator
Technical Field
The utility model relates to the technical field of radiator structures, in particular to a novel liquid cooling radiator.
Background
With the development of science and technology, the performance of electronic equipment is continuously improved, parts with high internal frequency and high power consumption are widely applied, meanwhile, the volume of the electronic equipment is continuously reduced, the integration level is continuously increased, and heat is generated in the running process of an electronic product, so that the performance and the reliability of the electronic product are directly affected, and therefore, a heat dissipation device is required to improve the performance exertion of the product; the prior art mainly includes two major types of heat dissipation technologies, namely an air cooling technology and a liquid cooling technology. The air cooling technology comprises a natural convection air cooling technology and a forced convection air cooling technology, wherein the natural convection air cooling technology is mainly used for electronic devices with smaller heating capacity per unit volume, the forced convection air cooling technology is generally combined with a heat pipe technology, but the heat pipe has the problems of small effective heat transfer area, larger heat resistance between the heat pipe and a radiator, low single heat transfer efficiency, poor compactification performance and the like. The prior art generally adopts a liquid cooling technology to solve the cooling problem of electronic devices with larger heat generation per unit volume, and aims at the problems of high working environment temperature, compact space volume and large control power of a heating element with high power density, and the common liquid cooling cold plate is difficult to meet the heat dissipation requirement of the heating element with high power density.
In this context, a new type of liquid-cooled radiator is urgently needed.
Disclosure of Invention
In view of the above, the present utility model provides a novel liquid-cooled heat sink that improves heat transfer efficiency and provides more efficient thermal conductivity and reliability and service life.
Novel liquid cooling radiator, its characterized in that includes:
a first cover plate;
a plurality of spiral pipes, which are combined to form a matrix arrangement of spiral pipes;
the second cover plate comprises a spiral pipe positioning plate and a bottom cover plate, the bottom cover of the spiral pipe positioning plate is provided with the bottom cover plate, and a phase change medium storage cavity is arranged below an area formed by the bottom cover plate corresponding to the matrix positioning holes of the spiral positioning plate;
sintering a capillary structure;
and a phase change medium which is a gaseous/liquid phase change medium;
the middle part of the first cover plate is convexly provided with a heat exchange cavity, the periphery of the heat exchange cavity is provided with a liquid inlet and a liquid outlet, and working medium cooling liquid enters the heat exchange cavity after passing through the liquid inlet and flows out from the liquid outlet after contacting with the exposed surface of the spiral pipe for heat exchange; the spiral tube locating plate is provided with matrix locating holes corresponding to the bottom of the spiral tube, the bottom of the corresponding spiral tube is fixedly inserted into the matrix locating holes, the spiral tube comprises a column cavity with an opening at the lower end and a closed upper end, the column cavity is communicated with a phase change medium storage cavity below, a sintering capillary structure is arranged on the bottom surface area of the phase change medium storage cavity, and the exposed surface of the bottom cover plate is used for being in contact with an electronic device to be cooled.
It is further characterized by:
the bottom surface of the first cover plate is inwards concave to form an installation caulking groove of the second cover plate, and the second cover plate is embedded in the installation caulking groove and then is assembled in a sealing way through sealant, so that the sealing reliability of the inner cavity is ensured;
four positioning holes are further formed in the peripheral position, corresponding to the mounting caulking groove, of the first cover plate, and the connecting bolts penetrate through the positioning holes and are fixedly connected with the device to be mounted, so that stable and reliable assembly of the whole structure is ensured;
the spiral tube positioning plate further comprises a front convex plate, a notch groove is formed in the position, corresponding to the front convex plate, of the first cover plate, a profiling convex plate is arranged in the position, corresponding to the front convex plate, of the bottom cover plate, the front convex plate is covered on the convex plate, the front convex plate and the convex plate are packaged with a liquid injection channel, the liquid inlet end of the liquid injection channel is sealed before being used, the liquid outlet end of the liquid injection channel is communicated into the phase change medium storage cavity, the liquid inlet end of the liquid injection channel is opened before being used, then phase change medium is injected, and then the liquid inlet end is sealed;
the top of the heat exchange cavity of the first cover plate is provided with a concave positioning groove corresponding to each spiral pipe, the top of each spiral pipe is propped against the upper plate area of the concave positioning groove, the upper and lower positions of the spiral pipes are ensured to be reliably positioned, and the position of the spiral pipes is not influenced by the flow of cooling liquid.
After the utility model is adopted, the temperature of a certain part of the bottom cover plate is increased by contacting with a heat source, the liquid phase-change medium is rapidly evaporated into hot gas in a vacuum ultra-low pressure environment and simultaneously absorbs heat energy, the hot gas phase-change medium is transferred to a position with lower far-end temperature in the space of a matrix support column and a phase-change medium storage cavity and is liquefied into the liquid phase-change medium and simultaneously releases heat energy, the liquid phase-change medium flows back to the heat source position according to the capillary principle through a fine structure of a sintered capillary structure, and the spiral pipes of the array work repeatedly, so that the cooling liquid flows along a spiral, the heat exchange area is increased, and the fluidity of the cooling liquid is increased along the spiral flow, so that the heat exchange is more uniform and reliable; it improves heat transfer efficiency, provides more efficient thermal conductivity and reliability and life.
Drawings
FIG. 1 is a top view of the present utility model;
FIG. 2 is a perspective exploded view of the present utility model;
FIG. 3 is a schematic view of the structure of section A-A of FIG. 1 according to the present utility model;
FIG. 4 is a schematic view of the B-B cross-section of FIG. 2 (only cross-hatching of the spiral tube) in accordance with the present utility model; the names corresponding to the serial numbers are as follows:
the heat exchange device comprises a first cover plate 10, a heat exchange cavity 11, a liquid inlet 12, a liquid outlet 13, a mounting caulking groove 14, a positioning hole 15, a notch groove 16, a spiral pipe 20, a column cavity 21, a second cover plate 30, a spiral pipe positioning plate 31, a matrix positioning hole 311, a front convex plate 312, a bottom cover plate 32, a convex plate 321, a phase change medium storage cavity 33, a liquid injection channel 34, a sintering capillary structure 40, a phase change medium 50 and a connecting bolt 60.
Detailed Description
1-4, the novel liquid cooling radiator comprises a first cover plate 10, a plurality of spiral pipes 20, a second cover plate 30, a sintered capillary structure 40 and a phase change medium 50;
the middle part of the first cover plate 10 is convexly provided with a heat exchange cavity 11, the periphery of the heat exchange cavity 11 is provided with a liquid inlet 12 and a liquid outlet 13, the liquid inlet 12 and the liquid outlet 13 are respectively arranged along the middle parts of two short sides of the rectangular heat exchange cavity 11, the spiral pipe 20 is blocked in the straight line flow direction, and working medium cooling liquid enters the heat exchange cavity 11 after passing through the liquid inlet 12 and contacts with the exposed surface of the spiral pipe 20 for heat exchange and flows out of the liquid outlet 13; the working medium cooling liquid flows out after flowing reliably in the heat exchange cavity 11 for a long distance;
a plurality of spiral pipes 20 are combined to form spiral pipes arranged in a matrix; the figures of the specific embodiments are rectangular arrays of 6 x 9;
the second cover plate 30 comprises a spiral tube positioning plate 31 and a bottom cover plate 32, the bottom cover of the spiral tube positioning plate 31 is provided with the bottom cover plate 32, and a phase change medium storage cavity 33 is arranged below a region formed by the bottom cover plate 32 corresponding to the matrix positioning holes 311 of the spiral positioning plate 31;
the phase change medium 50 is in particular a gaseous/liquid phase change medium;
the spiral tube locating plate 31 is provided with matrix locating holes 311 corresponding to the bottom of the spiral tube 20, the bottom of the corresponding spiral tube 20 is fixedly inserted into the matrix locating holes 311, the spiral tube 20 comprises a column cavity 21 with an opening at the lower end and a closed upper end, when the spiral tube locating plate is in practical implementation, the top of the spiral tube 20 forms an upper end closed structure through a top plate which is jacked into the heat exchange cavity 11, when the spiral tube locating plate is manufactured, the upper end closed structure is formed by welding the contact position between the top of the spiral tube 20 and the first cover plate 10, and meanwhile, the bottom of the spiral tube 20 is inserted into the matrix locating holes 311 and welded again, so that the column cavity 21 of the spiral tube 20 cannot be communicated with the heat exchange cavity 11, the column cavity 21 is only communicated with a phase change medium storage cavity 33 below, a sintered capillary structure 40 is arranged on the bottom surface of the phase change medium storage cavity 33, and the exposed surface of the bottom cover plate 32 is used for contacting with an electronic device to be cooled.
In specific implementation, the bottom surface of the first cover plate 10 is concaved inwards to form the mounting caulking groove 14 of the second cover plate 30, the second cover plate 30 is assembled in a sealing way through sealant after being embedded in the mounting caulking groove 14, so that the sealing reliability of an internal cavity is ensured, and the bottom cover plate 32 of the second cover plate 30 is arranged on the same plane with the bottom surface of the first cover plate 10 after being packaged in place, so that the planeness of the whole structure is ensured;
four positioning holes 15 are further formed in the peripheral position, corresponding to the mounting caulking groove 14, of the first cover plate 10, each positioning hole is a U-shaped hole with a notch on the outer side, and the connecting bolts 60 penetrate through the positioning holes 15 and are fixedly connected with a device to be mounted, so that stable and reliable assembly of the whole structure is ensured.
In specific implementation, the spiral tube positioning plate 31 further includes a front convex plate 312, the position of the first cover plate 10 corresponding to the front convex plate 312 is provided with a notch groove 16, the position of the bottom cover plate 32 corresponding to the front convex plate 312 is provided with a profiled convex plate 321, the front convex plate 312 is covered on the convex plate 321, the front convex plate 312 and the convex plate 321 are packaged to form a liquid injection channel 34, the liquid inlet end of the liquid injection channel 34 is closed before being used, the liquid outlet end of the liquid injection channel 34 is communicated into the phase change medium storage cavity 33, the liquid inlet end of the liquid injection channel 34 is opened before being used, then the phase change medium 50 is injected, and then the liquid inlet end is blocked.
The top of the heat exchange cavity 11 of the first cover plate 10 is provided with a concave positioning groove corresponding to each spiral pipe 20, and the top of the column cavity 21 of each spiral pipe 20 is propped up in the upper plate area of the concave positioning groove and then welded and fixed, so that the upper and lower positions of the spiral pipes 20 are reliably positioned, and the position of the spiral pipes is not affected by the flow of cooling liquid.
The working principle is that the temperature of a certain part of the bottom cover plate is increased by contacting with a heat source, a liquid phase-change medium is rapidly evaporated into hot gas in a vacuum ultra-low pressure environment and absorbs heat energy at the same time, the hot gas phase-change medium is transferred to a position with lower far-end temperature in the space of a matrix support column and a phase-change medium storage cavity and is liquefied into the liquid phase-change medium to release heat energy at the same time, the liquid phase-change medium flows back to the heat source position according to the capillary principle through a fine structure of a sintered capillary structure, the working is repeated, the spiral pipes of the array are arranged, so that cooling liquid flows along a spiral, the heat exchange area is increased, and the fluidity of the cooling liquid is increased along the spiral flow, so that the heat exchange is more uniform and reliable; the heat conduction mode is spiral three-dimensional plane multi-directional conduction, and the conduction efficiency is high; the product can use corrosion-resistant materials to provide more efficient heat conduction and service life without surface treatment.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (5)

1. Novel liquid cooling radiator, its characterized in that includes:
a first cover plate;
a plurality of spiral pipes, which are combined to form a matrix arrangement of spiral pipes;
the second cover plate comprises a spiral pipe positioning plate and a bottom cover plate, the bottom cover of the spiral pipe positioning plate is provided with the bottom cover plate, and a phase change medium storage cavity is arranged below an area formed by the bottom cover plate corresponding to the matrix positioning holes of the spiral positioning plate;
sintering a capillary structure;
and a phase change medium which is a gaseous/liquid phase change medium;
the middle part of the first cover plate is convexly provided with a heat exchange cavity, the periphery of the heat exchange cavity is provided with a liquid inlet and a liquid outlet, and working medium cooling liquid enters the heat exchange cavity after passing through the liquid inlet and flows out from the liquid outlet after contacting with the exposed surface of the spiral pipe for heat exchange; the spiral tube locating plate is provided with matrix locating holes corresponding to the bottom of the spiral tube, the bottom of the corresponding spiral tube is fixedly inserted into the matrix locating holes, the spiral tube comprises a column cavity with an opening at the lower end and a closed upper end, the column cavity is communicated with a phase change medium storage cavity below, a sintering capillary structure is arranged on the bottom surface area of the phase change medium storage cavity, and the exposed surface of the bottom cover plate is used for being in contact with an electronic device to be cooled.
2. The novel liquid-cooled heat sink of claim 1, wherein: the bottom surface of the first cover plate is inwards concave to form an installation caulking groove of the second cover plate, and the second cover plate is embedded in the installation caulking groove and then is assembled in a sealing mode through sealant.
3. The novel liquid-cooled heat sink of claim 1, wherein: the periphery position of the first cover plate corresponding to the mounting caulking groove is also provided with four positioning holes, and the connecting bolts penetrate through the positioning holes and are fixedly connected with the device to be mounted.
4. The novel liquid-cooled heat sink of claim 1, wherein: the spiral pipe locating plate is characterized in that the spiral pipe locating plate further comprises a front convex plate, a notch groove is formed in the position, corresponding to the front convex plate, of the first cover plate, a profiling convex plate is arranged in the position, corresponding to the front convex plate, of the bottom cover plate, the front convex plate is covered on the convex plate, the front convex plate and the convex plate are packaged with a liquid injection channel, the liquid inlet end of the liquid injection channel is sealed before being used, the liquid outlet end of the liquid injection channel is communicated to the phase change medium storage cavity, the liquid inlet end of the liquid injection channel is opened before being used, then phase change medium is injected, and then the liquid inlet end is blocked.
5. The novel liquid-cooled heat sink of claim 1, wherein: the top of the heat exchange cavity of the first cover plate is provided with a concave positioning groove corresponding to each spiral pipe, and the top of each spiral pipe is propped against the upper plate area of the concave positioning groove.
CN202320745755.9U 2023-04-07 2023-04-07 Novel liquid cooling radiator Active CN219628239U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320745755.9U CN219628239U (en) 2023-04-07 2023-04-07 Novel liquid cooling radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320745755.9U CN219628239U (en) 2023-04-07 2023-04-07 Novel liquid cooling radiator

Publications (1)

Publication Number Publication Date
CN219628239U true CN219628239U (en) 2023-09-01

Family

ID=87772418

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320745755.9U Active CN219628239U (en) 2023-04-07 2023-04-07 Novel liquid cooling radiator

Country Status (1)

Country Link
CN (1) CN219628239U (en)

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