CN110943058B - Heat radiator - Google Patents
Heat radiator Download PDFInfo
- Publication number
- CN110943058B CN110943058B CN201911045835.8A CN201911045835A CN110943058B CN 110943058 B CN110943058 B CN 110943058B CN 201911045835 A CN201911045835 A CN 201911045835A CN 110943058 B CN110943058 B CN 110943058B
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- Prior art keywords
- heat pipe
- heat
- air outlet
- air inlet
- liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention discloses a radiator, which comprises a cooling seat and a heat pipe, wherein the cooling seat is connected with the heat pipe, the heat pipe is spirally arranged, two ends of the heat pipe are communicated by a pipeline, a plurality of sections of liquid metal and low-boiling-point liquid are alternately arranged in the heat pipe, and the boiling point of the low-boiling-point liquid is between 50 ℃ and 100 ℃. According to the invention, through the alternative arrangement of the liquid metal and the low-boiling-point liquid, when the low-boiling-point liquid in the heat pipe is heated, the low-boiling-point liquid is subjected to phase change, and pressure difference is generated between adjacent pipelines, so that the liquid metal is pushed to move, the liquid metal is used as a heat transfer main body, and the liquid metal is pushed to circularly move in the heat pipe through the low-boiling-point liquid, so that the heat transfer performance is improved.
Description
Technical Field
The invention relates to the field of chip heat dissipation, in particular to a heat radiator.
Background
With the development of integration, miniaturization and high-frequency high-speed of the current chip technology, the heating power of the chip per unit area is larger and higher, the temperature is higher and higher, but the fault rate of the high-power chip is obviously improved due to the influence of the temperature, and the American air force department[1]The investigation result of (2) shows that the failure rate of the electronic device caused by the temperature is as high as 55%, and the reliability of the electronic equipment is reduced by 5% for every 1 ℃ increase of the temperature. Therefore, heat dissipation is particularly important for electronic components. The market scale of the radiator as a main radiating device of the electronic element is steadily increased, and statistical data shows that the market of the Chinese radiating technology is increased from 900 billion yuan in 2011 to 1386 billion yuan in 2017, and can reach 2000 billion yuan in 2022.
Among the existing chip cooling technologies, the most common heat dissipation methods are air cooling heat dissipation technology and liquid cooling heat dissipation technology.
The liquid cooling and heat dissipation technology can realize the high-efficiency cooling of the high-power chip by directly driving the liquid in the tube to circularly flow through the power device, but the cost is high and the volume is large because the auxiliary power device is arranged.
The air-cooled heat dissipation technology is generally combined with the heat pipe technology, and the current mainstream chip air-cooled heat sink structure includes heat dissipation fins, a heat pipe cooling base, a fan and other components. The heat pipe has good isothermal performance, heat generated by the chip can be quickly transferred to the radiating fins through high-efficiency heat conductivity of the heat pipe, air cooling is performed on the heat pipe through the fan, and heat dissipation is achieved through forced convection heat exchange of air. Its cooling capacity is directly limited by the thermal conductivity of the heat pipe. When the chip heats seriously, the heat pipe is easy to reach the heat transfer limit and the heat transfer performance is deteriorated, so that the temperature of the chip is rapidly increased, and the working environment of the chip is deteriorated.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: a heat sink is provided to improve heat transfer performance of the heat sink.
The solution of the invention for solving the technical problem is as follows:
the utility model provides a radiator, includes cooling seat, heat pipe, the cooling seat is connected with the heat pipe, and the heat pipe heliciform sets up, and the pipeline intercommunication is used at the both ends of heat pipe, is equipped with a plurality of sections liquid metal, low boiling point liquid in the heat pipe in turn, the boiling point of low boiling point liquid is between 50 ℃ to 100 ℃.
As a further improvement of the above technical solution, the cooling base includes a base and a fixing block, the spiral extending direction of the heat pipe is transversely arranged, the base is located below the heat pipe, the heat pipe surrounds the fixing block, the heat pipe is clamped between the fixing block and the base, grooves are formed in the faces of the base opposite to the fixing block, and the heat pipe is connected with the grooves.
As a further improvement of the above technical solution, the heat pipe further comprises a heat dissipation assembly, wherein the heat dissipation assembly comprises a plurality of heat dissipation fins fixed together, and the plurality of heat dissipation fins are arranged at intervals along the spiral extension direction of the heat pipe; the heat dissipation assembly is welded with the heat pipe; the heat pipe is arranged in the mounting area, and the base is connected with the heat dissipation fins below the heat dissipation fins.
As a further improvement of the technical scheme, the low boiling point liquid is absolute ethyl alcohol.
As a further improvement of the above technical solution, the liquid metal is gallium indium alloy.
As a further improvement of the technical scheme, the cooling device further comprises an air inlet fan, wherein the air inlet fan is arranged on one side wall of the cooling seat, and the air outlet direction of the air inlet fan faces the heat pipe.
As a further improvement of the technical scheme, the air outlet direction of the air inlet fan is perpendicular to the spiral extending direction of the heat pipe, and the air outlet direction of the air inlet fan faces the heat pipe.
As a further improvement of the technical scheme, the cooling device further comprises an air outlet fan, wherein the air outlet fan is arranged on one side of the cooling seat, the air outlet fan and the air inlet fan are arranged oppositely, and the air outlet direction of the air outlet fan is far away from the heat pipe.
As a further improvement of the technical scheme, the heat pipe comprises a throttle plate, the throttle plate is fixedly connected with a base, a throttle hole is formed in the throttle plate, the inner diameter of the throttle hole close to the heat pipe is gradually reduced, and the air inlet fan is fixedly connected with the throttle plate.
As a further improvement of the technical scheme, the throttle holes are provided with a plurality of arrays distributed on the throttle plate.
The invention has the beneficial effects that: according to the invention, through the alternative arrangement of the liquid metal and the low-boiling-point liquid, when the low-boiling-point liquid in the heat pipe is heated, the low-boiling-point liquid is subjected to phase change, and pressure difference is generated between adjacent pipelines, so that the liquid metal is pushed to move, the liquid metal is used as a heat transfer main body, and the liquid metal is pushed to circularly move in the heat pipe through the low-boiling-point liquid, so that the heat transfer performance is improved.
The invention is used for: the field of chip heat dissipation.
Drawings
In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is clear that the described figures are only some embodiments of the invention, not all embodiments, and that a person skilled in the art can also derive other designs and figures from them without inventive effort.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic illustration of an explosive structure of the present invention;
FIG. 3 is a schematic view showing the distribution of working medium in the heat pipe;
fig. 4 is a schematic view of the overall construction of the throttle plate.
In the figure, 1, a cooling base; 11. a base; 12. a fixed block; 13. a groove; 2. a heat pipe; 21. an evaporation section; 22. a condensing section; 23. a liquid injection port; 24. liquid is filled; 25. a metal liquid plug; 26. an air lock; 3. an air intake fan; 4. an air outlet fan; 5. a throttle plate; 51. a fixing plate; 52. an orifice; 6. mounting a plate; 7. and heat dissipation fins.
Detailed Description
The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention. In addition, all the coupling/connection relationships mentioned herein do not mean that the components are directly connected, but mean that a better coupling structure can be formed by adding or reducing coupling accessories according to specific implementation conditions. All technical characteristics in the invention can be interactively combined on the premise of not conflicting with each other.
Referring to fig. 1 to 4, a heat sink includes a cooling base 1, a heat pipe 2, an inlet fan 3, and an outlet fan 4. The cooling seat 1 comprises a base 11 and a fixing block 12, wherein the base 11 plays a role in uniform heat, and the base 11 is fixedly connected with the fixing block 12 through screws.
The welding of heat pipe 2 end to end has annotate liquid mouth 23, before filling working medium in heat pipe 2, carry out evacuation processing to heat pipe 2 earlier, it has low boiling point liquid and liquid metal to pour into through annotating liquid mouth 23 in heat pipe 2, the boiling point of low boiling point liquid sets up to between 50 ℃ -100 ℃, low boiling point liquid and liquid metal set up in turn, the completion is sealed after the working medium is poured into, low boiling point liquid and liquid metal pass through ultrasonic oscillation, after static the putting, form liquid stopper 24 and metal liquid stopper 25 and gas stopper 26 respectively, thereby cut apart the pipeline. In this embodiment, the low boiling point liquid is absolute ethyl alcohol, and the liquid metal is gallium-indium alloy. Because the gallium-indium alloy and the absolute ethyl alcohol are not mutually soluble, the metal liquid plug 25 can be formed under the action of the surface tension of the gallium-indium alloy, and the liquid plug 24 can be formed on the upper side of the metal liquid plug 25 under the action of gravity due to the smaller tension of the absolute ethyl alcohol.
When the chip works and generates heat, the anhydrous ethanol and the gallium-indium alloy generate heat transfer with the chip through the cooling seat 1, and when the temperature of the evaporation section 21 rises, the liquid plug 24 is vaporized, the pressure is increased, so that pressure difference is generated between adjacent pipelines, and the metal liquid plug 25 in the pipeline is pushed to move. The rest of the condensation section 22 is subjected to heat exchange with the surrounding air, the temperature is reduced, the anhydrous ethanol vapor is condensed into liquid, the pressure is reduced, and the liquid flows back to the evaporation section 21 under the combined action of gravity, capillary force and pressure. Therefore, under the combined action of the heat source and the cold source, the reciprocating oscillation of the liquid metal in the pipe is formed through the vapor-liquid phase change of the absolute ethyl alcohol in the pipe. After the vibration is severe to a certain degree, single-phase circulating flow along a certain direction can be formed, and the heat is transferred from the hot end to the cold end.
The side of the cooling seat 1 is fixed with a throttle plate 5, two sides of the throttle plate 5 are respectively integrally formed with a fixed plate 51, and the fixed plate 51 and the throttle plate 5 are arranged perpendicular to each other. Two fixing plates 51 integrally formed with the throttle plate 5 are fixedly connected to the two side walls of the base 11 by screws, respectively, and the throttle plate 5 is perpendicular to the bottom surface of the base 11 and parallel to the spiral extending direction of the heat pipe 2.
The throttle plate 5 is provided with a plurality of throttle holes 52 penetrating the throttle plate 5, and the plurality of throttle holes 52 are distributed in an array. The throttle hole 52 gradually decreases in inner diameter near the heat pipe 2. One side of the throttle plate 5, which is far away from the heat pipe 2, is fixedly connected with an air inlet fan 3 through a screw, and an air outlet of the air inlet fan 3 faces the heat pipe 2. When the intake fan 3 is operated, the air flow flows into the throttle hole 52 from the side with the larger inner diameter of the throttle hole 52 and flows out from the side with the smaller inner diameter of the throttle hole 52, the air is compressed during the air flow flowing into the throttle hole 52, and in practical conditions, the temperature of the air is basically kept unchanged during the compression process, and the pressure of the air is increased; when the air flow flows out from the throttle hole 52, the air pressure outside the throttle hole 52 is low, the flowing air flow expands, the temperature around the throttle hole 52 is reduced due to the throttling effect, and the environment near the throttle hole 52 is cooled, so that the temperature difference between the heat pipe 2 condensation section 22 and the surrounding air is increased, the heat transfer speed between the heat pipe 2 and the air is increased, and the heat pipe 2 condensation section 22 can be cooled quickly.
The side of the cooling base 1 is fixed with a mounting plate 6 through screws, two sides of the mounting plate 6 are respectively integrally formed with a fixing plate 51, and the fixing plate 51 and the mounting plate 6 are perpendicular to each other. Two fixing plates 51 integrally formed with the mounting plate 6 are fixedly connected to the two side walls of the base 11 by screws, respectively. Air outlet fan 4 is fixed in the one side that heat pipe 2 was kept away from to mounting panel 6 through the screw, and air outlet fan 4 sets up with air inlet fan 3 relatively, and air outlet fan 4's air-out direction is unanimous with air inlet fan 3's air-out direction, and air outlet fan 4 makes the air that near heat pipe 2 is heated can be better to the direction flow of keeping away from heat pipe 2, has strengthened the mobility of air.
The fixing block 12 is fixedly connected with a plurality of radiating fins 7, the radiating fins 7 are distributed in a linear array along the spiral extending direction of the heat pipe 2, and the radiating fins 7 are attached to the outer peripheral surface of the heat pipe 2.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that the present invention is not limited to the details of the embodiments shown and described, but is capable of numerous equivalents and substitutions without departing from the spirit of the invention as set forth in the claims appended hereto.
Claims (7)
1. A heat sink, characterized by: the cooling device comprises a cooling seat (1) and a heat pipe (2), wherein the cooling seat (1) is connected with the heat pipe (2), the heat pipe (2) is spirally arranged, two ends of the heat pipe (2) are communicated through a pipeline, a plurality of sections of liquid metal and low-boiling-point liquid are alternately arranged in the heat pipe (2), and the boiling point of the low-boiling-point liquid is 50-100 ℃; the cooling device is characterized by further comprising an air inlet fan (3), wherein the air inlet fan (3) is arranged on one side wall of the cooling seat (1), the air outlet direction of the air inlet fan (3) faces the heat pipes (2), and the air outlet direction of the air inlet fan (3) is perpendicular to the spiral extending direction of the heat pipes (2); the air conditioner is characterized by further comprising a throttle plate (5), the throttle plate (5) is fixedly connected with the base (11), a throttle hole (52) is formed in the throttle plate (5), the inner diameter of the throttle hole (52) is gradually reduced close to the heat pipe (2), the central axis of the throttle hole (52) is perpendicular to the spiral extending direction of the heat pipe (2), and the air inlet fan (3) is fixedly connected with the throttle plate (5); the heat pipe is characterized by further comprising a heat dissipation assembly, wherein the heat dissipation assembly comprises a plurality of heat dissipation fins (7) which are fixed together, and the plurality of heat dissipation fins (7) are arranged at intervals along the spiral extending direction of the heat pipe (2); the heat dissipation assembly is welded with the heat pipe (2); the heat pipe is characterized in that the heat radiating fins (7) are provided with mounting areas with downward openings, the heat pipe (2) is arranged in the mounting areas, and the base (11) is connected with the heat radiating fins (7) below the heat radiating fins (7).
2. A heat sink according to claim 1, wherein: cooling seat (1) includes base (11) and fixed block (12), the spiral extending direction of heat pipe (2) transversely sets up, base (11) are located the below of heat pipe (2), heat pipe (2) encircle fixed block (12), heat pipe (2) are pressed from both sides between fixed block (12) and base (11), all set up on base (11) and fixed block (12) the face relative fluted (13), heat pipe (2) are connected with recess (13).
3. A heat sink according to claim 1, wherein: the low boiling point liquid is set to be absolute ethyl alcohol.
4. A heat sink according to claim 1, wherein: the liquid metal is gallium-indium alloy.
5. A heat sink according to claim 1, wherein: the air outlet direction of the air inlet fan (3) is perpendicular to the spiral extending direction of the heat pipe (2), and the air outlet direction of the air inlet fan (3) faces the heat pipe (2).
6. A heat sink according to claim 1, wherein: the cooling seat is characterized by further comprising an air outlet fan (4), wherein the air outlet fan (4) is arranged on one side of the cooling seat (1), the air outlet fan (4) is arranged opposite to the air inlet fan (3), and the heat pipe (2) is far away from the air outlet direction of the air outlet fan (4).
7. A heat sink according to claim 1, wherein: the throttle holes (52) are provided with a plurality of arrays distributed on the throttle plate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911045835.8A CN110943058B (en) | 2019-10-30 | 2019-10-30 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911045835.8A CN110943058B (en) | 2019-10-30 | 2019-10-30 | Heat radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110943058A CN110943058A (en) | 2020-03-31 |
| CN110943058B true CN110943058B (en) | 2021-11-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911045835.8A Active CN110943058B (en) | 2019-10-30 | 2019-10-30 | Heat radiator |
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| CN (1) | CN110943058B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113152229A (en) * | 2021-03-25 | 2021-07-23 | 江为志 | Intelligent asphalt road water-cooling microwave maintenance vehicle and cooling control method |
| CN115161815A (en) * | 2022-05-24 | 2022-10-11 | 广东职业技术学院 | Multifunctional textile machine |
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| CN2672863Y (en) * | 2003-10-24 | 2005-01-19 | 莫列斯公司 | Heat radiating module with double fan |
| CN102036531A (en) * | 2009-09-29 | 2011-04-27 | 陈亮合 | Necking cover-shaped assembling frame for radiator |
| CN103824823A (en) * | 2014-03-10 | 2014-05-28 | 吴鸿平 | Internal source and source adding fluid heat exchange system |
| CN105633037A (en) * | 2016-01-08 | 2016-06-01 | 西安交通大学 | Pulsation heat pipe radiating apparatus for cooling chips |
| CN109360816A (en) * | 2018-12-06 | 2019-02-19 | 深圳市超频三科技股份有限公司 | A kind of radiator |
| CN209232773U (en) * | 2018-10-24 | 2019-08-09 | 四川九洲电器集团有限责任公司 | Two-fluid self-circulating radiating device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205213250U (en) * | 2015-12-23 | 2016-05-04 | 黑龙江工业学院 | Can radiating electric box of remote control |
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2019
- 2019-10-30 CN CN201911045835.8A patent/CN110943058B/en active Active
Patent Citations (6)
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|---|---|---|---|---|
| CN2672863Y (en) * | 2003-10-24 | 2005-01-19 | 莫列斯公司 | Heat radiating module with double fan |
| CN102036531A (en) * | 2009-09-29 | 2011-04-27 | 陈亮合 | Necking cover-shaped assembling frame for radiator |
| CN103824823A (en) * | 2014-03-10 | 2014-05-28 | 吴鸿平 | Internal source and source adding fluid heat exchange system |
| CN105633037A (en) * | 2016-01-08 | 2016-06-01 | 西安交通大学 | Pulsation heat pipe radiating apparatus for cooling chips |
| CN209232773U (en) * | 2018-10-24 | 2019-08-09 | 四川九洲电器集团有限责任公司 | Two-fluid self-circulating radiating device |
| CN109360816A (en) * | 2018-12-06 | 2019-02-19 | 深圳市超频三科技股份有限公司 | A kind of radiator |
Non-Patent Citations (1)
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