CN103824823A

CN103824823A - Internal source and source adding fluid heat exchange system

Info

Publication number: CN103824823A
Application number: CN201410082810.6A
Authority: CN
Inventors: 吴鸿平; 卢红龙
Original assignee: Individual
Current assignee: Individual
Priority date: 2014-03-10
Filing date: 2014-03-10
Publication date: 2014-05-28
Anticipated expiration: 2034-03-10
Also published as: CN103824823B

Abstract

The invention discloses an internal source for exchanging the working heat of high-power semiconductor integration modules and a source adding fluid heat exchange system thereof. The internal source consists of a working medium phase-change circulating heat exchange device and a drive source thereof. At first, by using the working heat with source power from the semiconductor integration modules, a heat pump without mechanical motion is formed and the heat pump is called as an internal source heat exchange system; through the mutual matching of the formula doses of power structure working mediums, working heat is immediately generated to immediately drive the working mediums to circulate, working medium phase change immediately occurs to immediately accelerate the circulation, heat exchange and heat dissipation are immediately carried out through the circulation, and conversion is immediately carried out by using the working heat of the semiconductor integration modules without accumulating temperature rise; and on the basis of fully utilizing the internal source, an external source is added to enhance the heat exchange, so that the internal source and the source adding fluid heat exchange system thereof are formed, and according to the demands of various types of high-power semiconductor integration modules, the aim of quantificationally controlling the working temperature rise is achieved. The internal source and the source adding fluid heat exchange system thereof can be widely applied to various computers, power supplies, LEDs (Light Emitting Diodes), power amplifiers, laser equipment, radar equipment, infrared equipment and the like.

Description

Endogenous and add source fluid heat-exchange system

Technical field

The present invention relates to a kind of device that exchanges high power semi-conductor integration module work calories, especially utilize from the work calories of semiconductor integration module inside and promote working medium circulation phase-change heat-exchange and form by external source endogenous and add source fluid heat-exchange system for driving source.

Background technology

At present, semiconductor integration module integrated level is more and more higher, power is increasing, the heat of following its work to produce is also increasing, if there is no capable radiating and cooling scheme, to become " heating core " and cannot work, for example: high integrated 300 watts of LED are under room temperature environment, the radiator that no matter adopts which kind of good conductor to manufacture, because solid material conduction of velocity is slow, in a few minutes LED substrate temperature all can exceed 80 ℃ above and enter power-off protection, at special network server, supercomputer machine room special dimension is continued to use common good conductor heat loss through conduction device, not for the individual heating problem that solves of semiconductor module, the air channel of carrying dry Cryogenic air to form by closed case by Large Central Air Conditioning System, heat exchange in order in the lump, because consuming too many water power, cost is very high, can not promote, but do not adopt air channel cooling, solve heating problem for the individual specialty of various semiconductor modules, in open environment, dispel the heat, when temperature is during higher than 24 ℃, passive heat loss through conduction mode cannot make it drop to suitable working temperature, only has the work temperature rise of active this class thermal source of low-temperature heat exchange mode ability management and control, now the heat-exchange system of all commercialization reduction work temperature rises is all failed take high power semi-conductor integration module work calories as driving source to promote working medium circulation and is carried out phase-change heat-exchange, also fail to realize autologousization, microminiaturized, in the time relating to high-power form of energy conversion, general compressor cooling or the cold-producing medium slowly-releasing of adopting got involved, by pipeline, cold is inputted to semiconductor integration module hot junction and carry out the heat exchange of single external source formula, because its structure is difficult to independence, power consumption is large, heavy, stress be poor, cost is still high, can only be applied on the main equipment of indivedual permission traction annexes, although dispelled the heat to fluid heat transfer by the progress of good conductor heat loss through conduction, but it is only the primary stage, can not be applied at large on various high power semi-conductor integration modules.

Summary of the invention

In order to overcome the drawback of existing heat-exchange system, the invention provides and be a kind ofly applicable to the endogenous of heat exchange under hot environment and add source fluid heat-exchange system, this system is combined closely by heat exchange underplate heat exchange face and semiconductor integration module thermal conductive surface by working medium circulation phase change heat exchange device, first the driving source of utilizing is the work calories from the latter inside, form the heat pump of integrated machinery-free motion, referred to as endogenous fluid heat transfer system, fill a prescription and the mutual coupling of dosage by power structure working medium, the instant work calories that produces promotes working medium circulation immediately, the instant Working fluid phase changing that occurs is accelerated circulation immediately, IMU is crossed and is looped heat exchange and heat radiation, immediately utilize semiconductor integration module work calories to transmit conversion and do not accumulate self temperature rise, and making full use of additional external source enhanced heat exchange on endogenous basis, form endogenous and add source working medium circulation phase-change heat exchange system, according to the needs of all kinds high power semi-conductor integration module, reach the object of its work temperature rise of quantitative management and control.

The technical solution adopted for the present invention to solve the technical problems is: a kind of heat exchange base plate by choke valve communication loop with fluid working substance evaporation tubes chamber, the heat-transfer surface of its base plate and semiconductor integration module thermal conductive surface are combined closely, heat-transfer surface is radiating surface relatively, on the radiating surface of base plate, there is evaporation tube or vaporization chamber, in base plate, there is evaporation road, the evaporation tubes chamber on heat exchange floor connects and composes by choke valve the endogenous fluid heat transfer system that sealing circulates with the pipeline running in the guide in the radiating fin on base plate radiating surface, utilize the work calories of semiconductor integration module to drive the interior working medium circulation phase-change heat-exchange of piping chamber on heat exchange floor, in the piping chamber of heat exchange base plate, can carry out the working medium circulation phase-change heat-exchange of three kinds of modes, a kind of is the mode of the direct evaporative phase-change heat exchange of working medium, claim endogenous circulating fluid direct heat transfer, be called for short direct changing type system, the second is the phase-change heat-exchange mode that the first aerogenesis of working medium evaporates again, claim the heat exchange of endogenous circulating fluid refrigeration, be called for short the cold formula system of changing, the third is that additional external source participates in heat exchange on the first or the second basis, claim to add source circulating fluid heat-exchange system, be called for short and add the formula system of changing, these three kinds of modes circulating line structure from working medium formula, be different, direct changing type and add and change formula heat exchange base plate and possess evaporation tube, evaporation road, vaporization chamber, cold change formula and add change formula heat exchange base plate and possess aerogenesis pipeline and evaporation tubes, in the pipeline of heat exchange base plate, can be divided into again and possessing or without two kinds of starting drives of concussion, in heat radiation connecting line, can be divided into again and possess or promote two kinds, device without synthetic air-flow, working medium formula all adopts the mixed non-azeotropic refrigerant under two or more malleation or the negative pressure of preparing by a certain percentage, the object of non-azeotropic formulation is that boiling and then azeotropic or azeotropic not occur in batches, direct changing type adopts non-azeotropic and vapor of mixture formula working medium, the cold formula of changing adopts non-azeotropic and non-vapor of mixture formula working medium, add the formula of changing and be and be based upon direct changing type or coldly determine again working medium formula after changing formula, working medium dosage mates mutually with heat exchange power structure, available external source is compressor, semiconductor, three kinds of refrigeration modes of magnetic fluid, be connected and combine at the pipeline on heat exchange floor with direct changing type or the cold formula of changing by external source pipeline, radiating treatment after heat exchange also can be taked various ways, can by with the integrated circulatory system of heat exchange base plate in condenser pipe and radiating fin, also can form split by condenser pipe and shell fin, by the intensity of heat exchange baseplate temp feedback regulation working medium circulation phase-change heat-exchange, realize the work temperature rise of quantitative management and control self, according to various types of high power semi-conductor integration module work calories characteristics, can form following various embodiment, and form thus endogenous and add source fluid heat-exchange system.

The invention has the beneficial effects as follows: current semiconductor integrated technology is improving constantly speed, frequency, in power, although obtain marked improvement at minimizing electronics turbulent flow, but the work calories of supervening due to semi-conducting material character is unescapable, especially high integration is high-power and at the semiconductor integration module higher than the open heat exchange of 28 ℃ of environment, endogenous fluid heat transfer system is the necessary technical scheme of its work calories of management and control all the time, the heat wherein conversion of management and control form of energy being produced, and add the indispensable protection measure especially of source fluid heat-exchange system, manufacturing cost is lower, can be widely used in various computers, power supply, LED, power amplifier, laser, radar, infrared grade in equipment, assurance high power semi-conductor integration module wherein can be increased work efficiency, reduce hot type amount, even do not use fan cooling, avoid mechanicalness noise and wearing and tearing, make various semiconductor integrated equipments be convenient to realize microminiaturized, autologousization, mobile, energy-saving and water-saving, realize the green machine room of network, all there is immeasurable benefit.

Accompanying drawing explanation

Below in conjunction with drawings and Examples, the present invention is further described:

Fig. 1 is first embodiment of the invention signal---endogenous circulating fluid direct heat transfer system.

Fig. 2 is second embodiment of the invention signal---endogenous circulating fluid refrigeration heat-exchange system.

Fig. 3 is third embodiment of the invention signal---endogenous circulating and evaporating chamber fluid direct heat transfer system.

Fig. 4 is four embodiment of the invention signal---adds source compressor fluid and directly changes system.

Fig. 5 is fifth embodiment of the invention signal---adds source semiconductor fluid and directly changes system.

Fig. 6 is sixth embodiment of the invention signal---add the cold system of changing of source semiconductor fluid.

Fig. 7 is seventh embodiment of the invention signal---adds source magnetic fluid and directly changes system.

Fig. 8 is eighth embodiment of the invention signal---add the cold system of changing of source magnetic fluid.

In figure: 1. evaporation tube 2. base plate 3. radiating surface 4. heat-transfer surface 5. semiconductor integration module 6. choke valve 7. condenser pipe 8. return duct 9. string sheet 10. oscillator 11. aerogenesis roads 12. evaporate 13. bubbler tube 14. fractionation mouth 15. fractionating column 16. weak solution pipe 17. collecting pipe 18. synthesizing jet-flow devices 19. and absorb and dissolve pipe 20. concentrated solution pipe 21. vaporization chamber 22. isocon 23. upper port 24. lower port 25. high-voltage tube 26. low-voltage tube 27. semiconductor temperature difference electric device 28. generating tubes 29. and export 30. import 31. magnetic tube road 32 coil .33. heat exchanger tubes

Embodiment

Fig. 1 is first embodiment of the invention signal, split for showing for the purpose of clear, soared in top and done broken section in bottom, it is characterized in that evaporation tube 1 is attached on the radiating surface 3 of base plate 2, heat-transfer surface 4 and semiconductor integration module 5 thermal conductive surfaces of base plate are combined closely, fluid working substance enters into evaporation tube by choke valve 6 and forms thus heat exchange base plate, on base plate radiating surface, also has radiating fin, the pipeline interting in radiating fin is condenser pipe 7, set out and be connected with condenser pipe by evaporation tube, condenser pipe is connected with return duct 8, return duct connects and composes the direct changing type circulation line of sealing by the choke valve on base plate and evaporation tube, in its pipeline, working medium adopts the two or more non-azeotropic of preparing by a certain percentage and azeotropic refrigerant, formula is divided into startup, easily boil, three batches of azeotropic, this is the thermal source that the little then jumping characteristic of heat increases when starting, in direct changing type heat exchange base plate, the liquid formulation working medium choke valve of flowing through enters evaporation tube section start, this place is exactly the region that heat exchange underplate heat exchange face and semiconductor integration module thermal conductive surface are combined closely, immediately evaporated intraductal working medium to utilize the region of carrying out heat exchange, very responsive to heat, starting component share minimum is liquid gas mixed phase, as long as slightly work calories just can be pressed structure direction startup circulation, possesses initial velocity, in the time that work calories increases, the component explosive evaporation of easily boiling of lion's share undergoes phase transition, become gaseous state from liquid state, gasification is pressed and is increased, improve speed by circulation initial velocity direction, in the time that work calories reaches rated temperature, together with the working medium generation azeotropic of all different boiling of middle share, the gas of azeotropic vaporization is taken advantage of a situation and is entered circulation along former velocity attitude, in nonsynchronous explosive evaporation, high-power heat carrys out not occur large eddy current temporarily, the variation that is proportionate of amount of heat and circulation rate, form optimum cyclic process, working medium has been utilized the work calories from semiconductor integration module by formula dosage, become gaseous state by liquid state, undergo phase transition, and promote circulation to take away fast heat according to structure loop direction, so carry out working medium circulation phase-change heat-exchange process, immediately realize the management and control of heat exchanging base plate temperature rise, various vaporizing system cryogens are through autologousization fin heat radiation condensation in condenser pipe, to return duct, after collecting pipe is fused, enter again next circulation, in heat exchange base plate evaporation tube, section start is installed the fixing string silk in the fixing string sheet in one end 9 and two ends, and oscillator 10 is installed in relevant position outside its pipeline, the concussion that utilizes oscillator to produce is applied to increases amplitude on tongue piece, concussion is applied on string silk increases shake frequently, the concussion of tongue piece and string silk can destroy liquid tension effectively, so as working medium circulation starting drive, cause gas to be convenient to improve the probability of vacateing liquid, working medium dosage also can appropriate interference, significantly shorten the process from being heated to boiling, be equivalent within 2 seconds of energising, in non-azeotropic working medium, start component, almost can directly enter into boiling, by test, install after starting drive, the evaporation initial velocity that can be enhanced about more than once, be very beneficial for improving endogenous circulation rate and heat exchange efficiency, effectively avoid the process limitations that working medium accuracy of dose is high simultaneously, form thus endogenous circulating fluid direct heat transfer system.

Fig. 2 is second embodiment of the invention signal, for clarity sake do broken section in both sides, radiating fin is not drawn entirely, it is characterized in that the duct connecting forms aerogenesis road 11 and evaporation road 12 in base plate 2, the heat-transfer surface 4 of base plate is combined with semiconductor integration module 5 thermal conductive surfaces, fluid working substance enters into aerogenesis road by choke valve and evaporation road forms heat exchange base plate thus, on the radiating surface 3 of aerogenesis road and evaporation road and base plate, run in the guide the cold formula circulating line that changes that various pipelines in radiating fin connect and compose sealing, in its pipeline, working medium is formulated by a certain percentage by the lower boiling mixed non-azeotropic refrigerant of two or more height, this is that the heat then power that breaks with tremendous force does not subtract when starting, the thermal source that jumping characteristic is little, form the solution relation that low boiling point refrigerant is dissolved in solute and the solvent of higher boiling point cold-producing medium, or in pressure, form the class solution relation of dissolving of being bordering on, in the time not accepting semiconductor integration module work calories, in the cold evaporation road that changes formula heat exchange base plate, only contain the saturated gas of more than one solute cold-producing mediums, in the time starting to accept work calories, first change the concentrated solution that the choke valve 6 of flowing through in formula heat exchange base plate enters in aerogenesis road and accept heat by cold, in concentrated solution in aerogenesis road, solute seethes with excitement rapidly, most of solute generates and enters bubbler tube 13 in bubble mode from solution, carry out aerogenesis heat exchange for the first time, and promote bubble with this and rise to fractionation mouth 14 through the broken bubble of taper screen cloth along bubbler tube, gas-liquid shunting, gas solute and liquid solution enter respectively circulation separately, gas solute is up through fractionating column 15, enter the cold-producing medium that condenser pipe 7 becomes liquid gas mixed state after the condensation of autologousization radiating fin, the choke valve 6 of flowing through again enters evaporation road section start, due to two kinds of ducts of heat exchange base plate set aerogenesis and evaporation, accept semiconductor integration module work calories simultaneously, thereby low boiling liquid gaseous refrigerant explosive evaporation fast, there is phase transformation comparatively thoroughly, the heat exchange of gasifying for the second time, the ability that its gasification absorption latent heat promotion tape loop is walked heat reaches refrigeration heat exchange degree, high boiling solvent becomes weak solution by concentrated solution after producing low-boiling point gas solute, utilize the potential energy being raised while producing bubble, diffuse out after fractionation mouth along the descending weak solution pipe 16 that enters into of bubbler tube outer wall, utilize cross over pipe effect to dispel the heat by voltage rise to collecting pipe 17 places through autologousization fin, before entering collecting pipe, evaporation road end locates to install synthesizing jet-flow device 18, sucking evaporation road end gas solute by the concussion of its pipe interior diaphragm is ejected in absorption dissolving pipe 19, promote gas solute to be dissolved into fast in the weak solution of the collecting pipe side mouth of flowing through, solution absorption must be faster in absorption dissolving pipe for solute, the speed of kind of refrigeration cycle is just faster, the cold formula ability of changing is just stronger, the weak solution that absorbs gas solute becomes concentrated solution and enters concentrated solution pipe 20, concentrated solution pipe communicates with base plate aerogenesis road by choke valve, carry out recirculation, so, utilize the work calories of semiconductor integration module, in heat exchange base plate, point gas and two circulations of liquid complete Working fluid phase changing heat transfer process, immediately realize the management and control of heat exchanging base plate temperature rise, also can in heat exchange base plate aerogenesis road and evaporation road, section start be installed by string sheet or string silk, outside Bing Qi road, concussion source is installed in relevant position, can cause that string sheet or string silk shake in liquid refrigerant, improve and produce gas solute and the efficiency of evaporating gasification, form thus endogenous circulating fluid refrigeration heat-exchange system.

Fig. 3 is third embodiment of the invention signal, for clarity sake make midship section view, it is characterized in that the radiating surface of base plate 23 to seal and form vaporization chamber 21, heat-transfer surface 4 at base plate is combined closely with semiconductor integration module 5 thermal conductive surfaces, fluid working substance enters into vaporization chamber by choke valve 6 and forms thus heat exchange base plate, according to heat exchange power, draw the isocon 22 of some around vaporization chamber, isocon upper port 23 and vaporization chamber top seal, isocon lower port 24 is introduced on base plate in vaporization chamber through choke valve after collecting pipe 17 set, form the vaporization chamber direct changing type circulation line of sealing, working medium adopts the non-azeotropic of two or more water base preparations and azeotropic refrigerant in vaporization chamber and pipeline, working medium has been utilized the work calories from semiconductor integration module, in vaporization chamber, seethe with excitement until azeotropic respectively, part undergoes phase transition heat exchange, become vapour gaseous state by liquid state, rise to top and enter isocon, from top to bottom carry out circulation cooling, immediately realize the management and control of heat exchanging base plate temperature rise, form thus endogenous circulating and evaporating chamber fluid direct heat transfer system.

Fig. 4 is four embodiment of the invention signal, for clarity sake do broken section in bottom, it is characterized in that adhering to evaporation tube 1 at the radiating surface 3 of base plate 2, heat-transfer surface 4 at base plate is combined closely with semiconductor integration module 5 thermal conductive surfaces, fluid working substance enters into evaporation tube by choke valve and forms thus heat exchange base plate, the evaporation tube that heat exchange base plate adheres to and the direct changing type circulation line that runs in the guide pipeline in the radiating fin on base plate radiating surface and connect and compose sealing, on this basis, the high-voltage tube 25 of external source compressor cooling is first by self fin heat radiation condensation, or run in the guide in direct changing type radiating fin and dispel the heat after condensation by complications, be connected with the evaporation road 12 that connects duct formation in base plate, in it, working medium enters tortuous evaporation road by choke valve 6, after gasification, draw with the low-voltage tube 26 of external source compressor cooling and be connected from evaporation road end, form and both have an also compound heat exchange base plate in tool evaporation road of evaporation tube, in the direct changing type circulatory system, working medium does not communicate with compressor cooling working medium, by two separately independent loops system by heat exchange base plate and on it radiating fin combine to form and add source compressor and directly change system, in direct changing type pipeline, working medium and the course of work are with first embodiment, same compressor can form multiple source compressor fluids that add by parallel connection and directly change system, and start or close according to heat exchange baseplate temp feedback and add source compressor operating, realize the management and control of heat exchanging base plate temperature rise.

Fig. 5 is fifth embodiment of the invention signal, for clarity sake make midship section view, it is characterized in that running through evaporation road 12 in base plate 2, heat-transfer surface 4 at base plate is bonding with semiconductor temperature difference electric device 27 hot sides, semiconductor temperature difference electric device huyashi-chuuka (cold chinese-style noodles) and semiconductor integration module 5 thermal conductive surfaces are combined closely, fluid working substance enters into evaporation road by choke valve 6 and forms thus heat exchange base plate, wherein semiconductor temperature difference electric device belongs to typical semiconductor integration module category, be equal to heat exchange base plate and two level semiconductor integration modules are combined closely, the evaporation road that runs through base plate directly changes system with the source semiconductor fluid that adds that runs in the guide the condenser pipe 7 in radiating fin on base plate radiating surface 3 and connect and compose sealing, in direct changing type pipeline, working medium and the course of work are with first embodiment, liquid refrigerant passes through choke valve, oscillator 10 shakes string sheet 9, fast boiling becomes gaseous state mutually, because heat exchange base plate possesses enough exchange capability of heat, the Btu utilization that the work of semiconductor temperature difference electric device hot side can be produced also exchanges away, can provide subzero low temperature and the heat exchange of semiconductor integration module thermal conductive surface below 30 ℃ at semiconductor temperature difference electric device huyashi-chuuka (cold chinese-style noodles).

Fig. 6 is sixth embodiment of the invention signal, what for clarity sake show is dorsal view, it is characterized in that the pipeline adhering at the radiating surface 3 of base plate 2 forms generating tube 28 and evaporation tube 1, heat-transfer surface 4 at base plate is bonding with semiconductor temperature difference electric device 27 hot sides, semiconductor temperature difference electric device huyashi-chuuka (cold chinese-style noodles) and semiconductor integration module 5 thermal conductive surfaces are combined closely, fluid working substance enters into generating tube by choke valve 6 and evaporation tube forms heat exchange base plate thus, be equal to heat exchange base plate and two level semiconductor integration modules are combined closely, what on the radiating surface of heat exchange base plate generating tube and evaporation tube and base plate, run in the guide that various pipelines in radiating fin connect and compose sealing adds the cold system of changing of source semiconductor fluid, the cold interior working medium of formula pipeline and same second embodiment of the course of work of changing, synthesizing jet-flow device 18 promotes GAS ABSORPTION dissolving to make heat exchange base plate possess enough refrigeration exchange capability of heat, the Btu utilization that the work of semiconductor temperature difference electric device hot side can be produced also exchanges away, can provide subzero low temperature and the heat exchange of semiconductor integration module thermal conductive surface below 30 ℃ at semiconductor temperature difference electric device huyashi-chuuka (cold chinese-style noodles).

Fig. 7 is seventh embodiment of the invention signal, for clarity sake only display section of radiating fin, it is characterized in that connecting and composing tortuous evaporation road 12 in the side of base plate 2 by U-shaped pipe and perforation duct, its outlet 29 with run in the guide the Article 1 condenser pipe 7 in radiating fin on the radiating surface 3 of base plate and be connected to form first group, be connected to form second group by the Article 1 evaporation tube 1 being attached on the radiating surface of base plate with the Article 2 condenser pipe running in the guide in radiating fin, first, two groups connect into series pipe from beginning to end each other with next group, heat-transfer surface 4 at base plate is combined closely with semiconductor integration module 5 thermal conductive surfaces, enter evaporation tube head at each group condenser pipe tail by choke valve connection and form heat exchange base plate, between the condenser pipe of walking out at radiating fin the last item and heat exchange floor evaporation road import 30, be connected by magnetic tube road 31, what formation sealed adds source magnetic fluid direct changing type pipeline, magnetic tube road overcoat has coil 32, inner sleeve has heat exchanger tube 33, in serial pipe, shared working medium is that azeotropic magnetic fluid cold-producing medium is formulated by a certain percentage by two or more non-azeotropic, receive the heat of rated power during though each component boiling point is different, also can there is common boiling, this working medium is owing to being operated in serial pipe, azeotropic operating mode is the mixed state of liquid gas, in evaporation tubes, gas phase is more than liquid phase, in condenser pipe, liquid phase is more than gas phase, due to series connection, the circulation of last group is next group circulation initial velocity is provided, out there is by the last item condenser pipe the magnetic fluid that certain circulation rate mostly is liquid phase through too much group circulation and enter magnetic tube road, magnetic fluid is accepted magnetic tube road exterior loop magnetic fields, by loop direction generation paramagnetic effect and produce paramagnetic heat, low power paramagnetic heat reversible flow is shed by condenser pipe radiating fin, high-power heat is absorbed by working medium in the heat exchanging pipe being overlapped in magnetic tube road, heat exchanging pipe enters near evaporating import, by before magnetic tube map paramagnetic out, also run in the guide in radiating fin, promote to form independently phase transformation cycle heat exchange by paramagnetic heat, paramagnetic exchange heat is gone out, in the process that enters the tortuous evaporation of heat exchange base plate road, demagnetization also constantly absorbs heat, also carry out explosive evaporation phase-change heat-exchange simultaneously, in addition, also can organize condenser pipe at each is exported to and on the connecting line entering between evaporation tube, overlaps coil 32 and form magnetic tube road 31, be there is to multistage or secondary paramagnetic effect in the magnetic fluid of circulation, its paramagnetic heat is shed by upper one group of condenser pipe adverse current, carry out explosive evaporation phase-change heat-exchange in next group evaporation tube in, demagnetization absorbs the heat of evaporation tube, magnetic fluid circulation power comes from the work calories of semiconductor integration module, without mechanical pump, by heat exchange baseplate temp FEEDBACK CONTROL coil working, realize the management and control of heat exchanging base plate temperature rise, form and add source magnetic fluid and directly change system thus.

Fig. 8 is eighth embodiment of the invention signal, it is characterized in that the pipeline adhering at the radiating surface 3 of base plate 2 forms generating tube 28 and evaporation tube 1, heat-transfer surface 4 and semiconductor integration module 5 thermal conductive surfaces of base plate are combined closely, fluid working substance enters into generating tube by choke valve and evaporation tube forms heat exchange base plate thus, what on the radiating surface of its generating tube and evaporation tube and base plate, run in the guide that various pipelines in radiating fin connect and compose sealing adds the cold formula pipeline that changes of source magnetic fluid, in pipeline, working medium is formulated by a certain percentage by the two or more non-azeotropic magnetic fluid mix refrigerant of high low boiling, its working medium course of work is with second embodiment, participate in the magnetic fluid working medium of gas solute phase transformation circulation after condensation becomes liquid gas admixture, on the connecting line entering before evaporation tube, overlap coil 32 and form magnetic tube road 31, liquid gaseous state magnetic fluid working medium by time by loop direction generation paramagnetic effect and produce paramagnetic heat, paramagnetic heat is gone out by the reverse exchange of interior the overlapped heat exchanger tube of condenser pipe 7, liquid gaseous working medium after paramagnetic enters through choke valve 6 evaporation tube being attached on heat exchange base plate, demagnetization heat absorption in the process of evaporative phase-change heat absorption, realize the heat exchange of heat exchanging base plate dual refrigeration, the magnetic fluid working medium that participates in solution circulation is absorbing after dissolved gas working medium formation concentrated solution, by the heat radiation of radiating fin on concentrated solution pipe 20, on the connecting line entering before generating tube, overlap coil 32 and form magnetic tube road 31, concentrated solution magnetic fluid working medium by time there is paramagnetic effect, paramagnetic heat is gone out by overlapping the reverse exchange of heat exchanger tube 33 in concentrated solution pipe, concentrated solution working medium after paramagnetic enters through choke valve 6 generating tube being attached on heat exchange base plate, demagnetization heat absorption in the process of aerogenesis heat absorption, realize the aerogenesis heat exchange of heat exchanging base plate and the heat exchange of magnetic refrigeration, in a word, the no matter circulation of solute gas magnetic fluid or the solution magnetic fluid work calories of its driving source from semiconductor integration module that circulate, without mechanical pump, by heat exchange baseplate temp FEEDBACK CONTROL coil working, realize the management and control of heat exchanging base plate temperature rise, form and add the cold system of changing of source magnetic fluid thus.

Claims

One kind to be used to from the work calories of semiconductor integration module inside be that driving source promotes working medium circulation phase-change heat-exchange and form by external source endogenous and add source fluid heat-exchange system, it is characterized in that having the heat exchange base plate by choke valve communication loop of fluid working substance evaporation tubes chamber, the heat-transfer surface of its base plate and semiconductor integration module thermal conductive surface are combined closely, heat-transfer surface is radiating surface relatively, on the radiating surface of base plate, there is evaporation tube or vaporization chamber, in base plate, there is evaporation road, the evaporation tubes chamber on heat exchange floor connects and composes by choke valve the endogenous fluid heat transfer system that sealing circulates with the pipeline running in the guide in the radiating fin on base plate radiating surface, in the piping chamber of heat exchange base plate, can carry out the working medium circulation phase-change heat-exchange of three kinds of modes, a kind of is the mode of the direct evaporative phase-change heat exchange of working medium, claim endogenous circulating fluid direct heat transfer, be called for short direct changing type system, the second is the phase-change heat-exchange mode that the first aerogenesis of working medium evaporates again, claim the heat exchange of endogenous circulating fluid refrigeration, be called for short the cold formula system of changing, the third is that additional external source participates in heat exchange on the first or the second basis, claim to add source circulating fluid heat-exchange system, be called for short and add the formula system of changing, these three kinds of modes circulating line structure from working medium formula, be different, direct changing type and add and change formula heat exchange base plate and possess evaporation tube, evaporation road, vaporization chamber, cold change formula and add change formula heat exchange base plate and possess aerogenesis pipeline and evaporation tubes, in the pipeline of heat exchange base plate, can be divided into again and possessing or without two kinds of starting drives of concussion, in heat radiation connecting line, can be divided into again and possess or promote two kinds, device without synthetic air-flow, working medium formula all adopts the mixed non-azeotropic refrigerant under two or more malleation or the negative pressure of preparing by a certain percentage, the object of non-azeotropic formulation is that boiling and then azeotropic or azeotropic not occur in batches, direct changing type adopts non-azeotropic and vapor of mixture formula working medium, the cold formula of changing adopts non-azeotropic and non-vapor of mixture formula working medium, add the formula of changing and be and be based upon direct changing type or coldly determine again working medium formula after changing formula, working medium dosage mates mutually with heat exchange power structure, available external source is compressor, semiconductor, three kinds of refrigeration modes of magnetic fluid, be connected and combine at the pipeline on heat exchange floor with direct changing type or the cold formula of changing by external source pipeline, radiating treatment after heat exchange also can be taked various ways, can by with the integrated circulatory system of heat exchange base plate in condenser pipe and radiating fin, also can form split by condenser pipe and shell fin, by the intensity of heat exchange baseplate temp feedback regulation working medium circulation phase-change heat-exchange, realize the work temperature rise of quantitative management and control self, according to various types of high power semi-conductor integration module work calories characteristics, can form following various embodiment, and form thus endogenous and add source fluid heat-exchange system.
2. according to claim 1 endogenous and add source fluid heat-exchange system, it is characterized in that: evaporation tube 1 is attached on the radiating surface 3 of base plate 2, heat-transfer surface 4 and semiconductor integration module 5 thermal conductive surfaces of base plate are combined closely, fluid working substance enters into evaporation tube by choke valve 6 and forms thus heat exchange base plate, on base plate radiating surface, also has radiating fin, the pipeline interting in radiating fin is condenser pipe 7, set out and be connected with condenser pipe by evaporation tube, condenser pipe is connected with return duct 8, return duct connects and composes the direct changing type circulation line of sealing by the choke valve on base plate and evaporation tube, in its pipeline, working medium adopts the two or more non-azeotropic of preparing by a certain percentage and azeotropic refrigerant, formula is divided into startup, easily boil, three batches of azeotropic, in direct changing type heat exchange base plate, the liquid formulation working medium choke valve 6 of flowing through enters evaporation tube section start, this place is exactly the region that heat exchange underplate heat exchange face and semiconductor integration module thermal conductive surface are combined closely, immediately evaporated intraductal working medium to utilize the region of carrying out heat exchange, very responsive to heat, starting component share minimum is liquid gas mixed phase, as long as slightly work calories just can be pressed structure direction startup circulation, possesses initial velocity, in the time that work calories increases, the component explosive evaporation of easily boiling of lion's share undergoes phase transition, become gaseous state from liquid state, gasification is pressed and is increased, improve speed by circulation initial velocity direction, in the time that work calories reaches rated temperature, together with the working medium generation azeotropic of all different boiling of middle share, the gas of azeotropic vaporization is taken advantage of a situation and is entered circulation along former velocity attitude, working medium has been utilized the work calories from semiconductor integration module by formula dosage, become gaseous state by liquid state, undergo phase transition, and promote circulation to take away fast heat according to structure loop direction, so carry out working medium circulation phase-change heat-exchange process, immediately realize the management and control of heat exchanging base plate temperature rise, various vaporizing system cryogens are through autologousization fin heat radiation condensation in condenser pipe 7, to return duct, after collecting pipe is mutually fused, enter again next circulation, in heat exchange base plate evaporation tube, section start is installed the fixing string silk in the fixing string sheet in one end 9 and two ends, and oscillator 10 is installed in relevant position outside its pipeline, the concussion that utilizes oscillator to produce is applied to increases amplitude on tongue piece, concussion is applied on string silk increases shake frequently, form thus endogenous circulating fluid direct heat transfer system.
3. according to claim 1 endogenous and add source fluid heat-exchange system, it is characterized in that: the duct connecting in base plate 2 forms aerogenesis road 11 and evaporation road 12, the heat-transfer surface 4 of base plate is combined with semiconductor integration module 5 thermal conductive surfaces, fluid working substance enters into aerogenesis road by choke valve and evaporation road forms heat exchange base plate thus, on the radiating surface 3 of aerogenesis road and evaporation road and base plate, run in the guide the cold formula circulating line that changes that various pipelines in radiating fin connect and compose sealing, in its pipeline, working medium is formulated by a certain percentage by the lower boiling mixed non-azeotropic refrigerant of two or more height, form the solution relation that low boiling point refrigerant is dissolved in solute and the solvent of higher boiling point cold-producing medium, or in pressure, form the class solution relation of dissolving of being bordering on, in the time starting to accept work calories, first change the concentrated solution that the choke valve 6 of flowing through in formula heat exchange base plate enters in aerogenesis road and accept heat by cold, in concentrated solution in aerogenesis road, solute seethes with excitement rapidly, most of solute generates and enters bubbler tube 13 in bubble mode from solution, carry out aerogenesis heat exchange for the first time, and promote bubble with this and rise to fractionation mouth 14 through the broken bubble of taper screen cloth along bubbler tube, gas-liquid shunting, gas solute and liquid solution enter respectively circulation separately, gas solute is up through fractionating column 15, enter the cold-producing medium that condenser pipe 7 becomes liquid gas mixed state after the condensation of autologousization radiating fin, the choke valve 6 of flowing through again enters evaporation road section start again, due to two kinds of ducts of heat exchange base plate set aerogenesis and evaporation, accept semiconductor integration module work calories simultaneously, thereby low boiling liquid gaseous refrigerant explosive evaporation fast, there is phase transformation comparatively thoroughly, the heat exchange of gasifying for the second time, the ability that its gasification absorption latent heat promotion tape loop is walked heat reaches refrigeration heat exchange degree, high boiling solvent becomes weak solution by concentrated solution after producing low-boiling point gas solute, utilize the potential energy being raised while producing bubble, diffuse out after fractionation mouth along the descending weak solution pipe 16 that enters into of bubbler tube outer wall, utilize cross over pipe effect to dispel the heat by voltage rise to collecting pipe 17 places through autologousization fin, before entering collecting pipe, evaporation road end locates to install synthesizing jet-flow device 18, sucking evaporation road end gas solute by the concussion of its pipe interior diaphragm is ejected in absorption dissolving pipe 19, promote gas solute to be dissolved into fast in the weak solution of the collecting pipe side mouth of flowing through, weak solution becomes concentrated solution and enters concentrated solution pipe 20, concentrated solution pipe communicates with heat exchange base plate aerogenesis road by choke valve, carry out recirculation, so, utilize the work calories of semiconductor integration module, in heat exchange base plate, point gas and two circulations of liquid complete Working fluid phase changing heat transfer process, immediately realize the management and control of heat exchanging base plate temperature rise, also can in heat exchange base plate aerogenesis road and evaporation road, section start be installed by string sheet or string silk, outside Bing Qi road, concussion source is installed in relevant position, can cause that string sheet or string silk shake in liquid refrigerant, improve and produce gas solute and the efficiency of evaporating gasification, form thus endogenous circulating fluid refrigeration heat-exchange system.
4. according to claim 1 endogenous and add source fluid heat-exchange system, it is characterized in that: the radiating surface of base plate 23 is sealed and forms vaporization chamber 21, heat-transfer surface 4 at base plate is combined closely with semiconductor integration module 5 thermal conductive surfaces, fluid working substance enters into vaporization chamber by choke valve 6 and forms thus heat exchange base plate, according to heat exchange power, draw the isocon 22 of some around vaporization chamber, isocon upper port 23 and vaporization chamber top seal, isocon lower port 24 is introduced vaporization chamber bottom through choke valve and is formed the direct changing type circulation line sealing after collecting pipe 17 set, working medium adopts the non-azeotropic of two or more water base preparations and azeotropic refrigerant in vaporization chamber and pipeline, working medium has been utilized the work calories from semiconductor integration module, in vaporization chamber, seethe with excitement until azeotropic respectively, become vapour gaseous state by liquid state, rise to top and enter isocon, from top to bottom carry out circulation cooling, immediately realize the management and control of heat exchanging base plate temperature rise, form thus endogenous circulating and evaporating chamber fluid direct heat transfer system.
5. according to claim 1 endogenous and add source fluid heat-exchange system, it is characterized in that: the radiating surface 3 at base plate 2 adheres to evaporation tube 1, heat-transfer surface 4 at base plate is combined closely with semiconductor integration module 5 thermal conductive surfaces, fluid working substance enters into evaporation tube by choke valve and forms thus heat exchange base plate, the evaporation tube that heat exchange floor is adhered to and the direct changing type circulation line that runs in the guide the pipeline in radiating fin on the radiating surface of plate and connect and compose sealing, on this basis, the high-voltage tube 25 of external source compressor cooling is first by self fin heat radiation condensation, or run in the guide in direct changing type radiating fin and dispel the heat after condensation by complications, be connected with the evaporation road 12 that connects duct formation in base plate, in it, working medium enters tortuous evaporation road by choke valve 6, after gasification, draw with the low-voltage tube 26 of external source compressor cooling and be connected from evaporation road end, form and both have an also compound heat exchange base plate in tool evaporation road of evaporation tube, in the direct changing type circulatory system, working medium does not communicate with compressor cooling working medium, by two separately independent loops system by heat exchange base plate and on it radiating fin combine to form and add source compressor and directly change system, in direct changing type pipeline, working medium and the course of work are with first embodiment, same compressor can form multiple source compressor fluids that add by parallel connection and directly change system, and start or close according to heat exchange baseplate temp feedback and add source compressor operating, realize the management and control of heat exchanging base plate temperature rise.
6. according to claim 1 endogenous and add source fluid heat-exchange system, it is characterized in that: in base plate 2, run through evaporation road 12, heat-transfer surface 4 at base plate is bonding with semiconductor temperature difference electric device 27 hot sides, semiconductor temperature difference electric device huyashi-chuuka (cold chinese-style noodles) and semiconductor integration module 5 thermal conductive surfaces are combined closely, fluid working substance enters into evaporation road by choke valve 6 and forms thus heat exchange base plate, be equal to heat exchange base plate and two level semiconductor integration modules are combined closely, the evaporation road that runs through heat exchange floor directly changes system with the source semiconductor fluid that adds that runs in the guide the condenser pipe 7 in radiating fin on the radiating surface 3 of base plate and connect and compose sealing, provide low temperature and the heat exchange of semiconductor integration module thermal conductive surface by semiconductor temperature difference electric device huyashi-chuuka (cold chinese-style noodles).
7. according to claim 1 endogenous and add source fluid heat-exchange system, it is characterized in that: the pipeline adhering at the radiating surface 3 of base plate 2 forms generating tube 28 and evaporation tube 1, heat-transfer surface 4 at base plate is bonding with semiconductor temperature difference electric device 27 hot sides, semiconductor temperature difference electric device huyashi-chuuka (cold chinese-style noodles) and semiconductor integration module 5 thermal conductive surfaces are combined closely, fluid working substance enters into generating tube by choke valve 6 and evaporation tube forms heat exchange base plate thus, be equal to heat exchange base plate and two level semiconductor integration modules are combined closely, what on the radiating surface of heat exchange base plate generating tube and evaporation tube and plate, run in the guide that various pipelines in radiating fin connect and compose sealing adds the cold system of changing of source semiconductor fluid, provide low temperature and the heat exchange of semiconductor integration module thermal conductive surface by semiconductor temperature difference electric device huyashi-chuuka (cold chinese-style noodles).
8. according to claim 1 endogenous and add source fluid heat-exchange system, it is characterized in that: the side at base plate 2 connects and composes tortuous evaporation road 12 by U-shaped pipe and perforation duct, its outlet 29 with run in the guide the Article 1 condenser pipe 7 in radiating fin on the radiating surface 3 of base plate and be connected to form first group, be connected to form second group by the Article 1 evaporation tube 1 being attached on the radiating surface of base plate with the Article 2 condenser pipe running in the guide in radiating fin, first, two groups connect into series pipe from beginning to end each other with next group, heat-transfer surface 4 at base plate is combined closely with semiconductor integration module 5 thermal conductive surfaces, enter evaporation tube head at each group condenser pipe tail by choke valve connection and form heat exchange base plate, between the condenser pipe of walking out at radiating fin the last item and heat exchange floor evaporation road import 30, be connected by magnetic tube road 31, what formation sealed adds source magnetic fluid direct changing type pipeline, magnetic tube road overcoat has coil 32, inner sleeve has heat exchanger tube 33, in serial pipe, shared working medium is that azeotropic magnetic fluid cold-producing medium is formulated by a certain percentage by two or more non-azeotropic, receive the heat of rated power during though each component boiling point is different, also can there is common boiling, this working medium is owing to being operated in serial pipe, azeotropic operating mode is the mixed state of liquid gas, in evaporation tubes, gas phase is more than liquid phase, in condenser pipe, liquid phase is more than gas phase, due to series connection, the circulation of last group is next group circulation initial velocity is provided, out there is by last group condenser pipe the magnetic fluid that certain circulation rate mostly is liquid phase through too much group circulation and enter magnetic tube road, magnetic fluid is accepted magnetic tube road exterior loop magnetic fields, by loop direction generation paramagnetic effect and produce paramagnetic heat, small-power paramagnetic heat reversible flow is shed by condenser pipe radiating fin, high-power heat is absorbed by working medium in the heat exchanging pipe being overlapped in magnetic tube road, heat exchanging pipe enters near evaporating import, by before magnetic tube map paramagnetic out, also run in the guide in radiating fin, promote to form independently phase transformation cycle heat exchange by paramagnetic heat, paramagnetic exchange heat is gone out, entering in the process of the tortuous duct of heat exchange base plate demagnetization and constantly absorb heat, also carry out explosive evaporation phase-change heat-exchange simultaneously, in addition, also can organize condenser pipe at each is exported to and on the connecting line entering between evaporation tube, overlaps coil 32 and form magnetic tube road 31, be there is to multistage or secondary paramagnetic effect in the magnetic fluid of circulation, its paramagnetic heat is shed by upper one group of condenser pipe adverse current, carry out explosive evaporation phase-change heat-exchange in next group evaporation tube in, demagnetization absorbs the heat of evaporation tube, magnetic fluid circulation power comes from the work calories of semiconductor integration module, without mechanical pump, by heat exchange baseplate temp FEEDBACK CONTROL coil working, realize the management and control of heat exchanging base plate temperature rise, form and add source magnetic fluid and directly change system thus.
9. according to claim 1 endogenous and add source fluid heat-exchange system, it is characterized in that: the pipeline adhering at the radiating surface 3 of base plate 2 forms generating tube 28 and evaporation tube 1, heat-transfer surface 4 and semiconductor integration module 5 thermal conductive surfaces of base plate are combined closely, fluid working substance enters into generating tube by choke valve and evaporation tube forms heat exchange base plate thus, what on the radiating surface of its generating tube and evaporation tube and plate, run in the guide that various pipelines in radiating fin connect and compose sealing adds the cold formula pipeline that changes of source magnetic fluid, in pipeline, working medium is formulated by a certain percentage by the lower boiling non-azeotropic magnetic fluid mix refrigerant of two or more height, its working medium course of work is with second embodiment, participate in the magnetic fluid working medium of gas solute phase transformation circulation after condensation becomes liquid gas admixture, on the connecting line entering before evaporation tube, overlap coil 32 and form magnetic tube road 31, liquid gaseous state magnetic fluid working medium by time by loop direction generation paramagnetic effect and produce paramagnetic heat, paramagnetic heat is gone out by the reverse exchange of interior the overlapped heat exchanger tube of condenser pipe 7, liquid gaseous working medium after paramagnetic enters through choke valve 6 evaporation tube being attached on heat exchange base plate, demagnetization heat absorption in the process of evaporative phase-change heat absorption, realize the heat exchange of heat exchanging base plate dual refrigeration, the magnetic fluid working medium that participates in solution circulation is absorbing after dissolved gas working medium formation concentrated solution, by the heat radiation of radiating fin on concentrated solution pipe 20, on the connecting line entering before generating tube, overlap coil 32 and form magnetic tube road 31, concentrated solution magnetic fluid working medium by time press loop direction generation paramagnetic effect, paramagnetic heat is gone out by overlapping the reverse exchange of heat exchanger tube 33 in concentrated solution pipe, concentrated solution working medium after paramagnetic enters through choke valve 6 generating tube being attached on heat exchange base plate, demagnetization heat absorption in the process of aerogenesis heat absorption, realize the aerogenesis heat exchange of heat exchanging base plate and the heat exchange of magnetic refrigeration, in a word, the no matter circulation of solute gas magnetic fluid or the solution magnetic fluid work calories of its driving source from semiconductor integration module that circulate, without mechanical pump, by heat exchange baseplate temp FEEDBACK CONTROL coil working, realize the management and control of heat exchanging base plate temperature rise, form and add the cold system of changing of source magnetic fluid thus.