CN2664195Y - Liquid cooling type heat sink - Google Patents
Liquid cooling type heat sink Download PDFInfo
- Publication number
- CN2664195Y CN2664195Y CN 200320117271 CN200320117271U CN2664195Y CN 2664195 Y CN2664195 Y CN 2664195Y CN 200320117271 CN200320117271 CN 200320117271 CN 200320117271 U CN200320117271 U CN 200320117271U CN 2664195 Y CN2664195 Y CN 2664195Y
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- CN
- China
- Prior art keywords
- cooling
- liquid
- cooling body
- feeding device
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
A liquid cooling type heat sink comprises a cooling body for absorbing heat of heating elements; the cooling body is provided with a cavum for storing cooling liquid; the cooling body is also provided with a liquid input device and a liquid output device which are communicated with the cavum respectively; a diversion device corresponding to the liquid input device is arranged inside the cavum of the cooling body; the diversion device guides the cooling liquid through the liquid input device to the cavum and moves along an inner surface of the cooling body, and then the cooling liquid has a full heat exchange with the cooling body and flows out from the liquid output device, thereby taking heat of the cooling body away.
Description
[technical field]
The utility model relates to a kind of heat abstractor, particularly about a kind of liquid-cooling heat radiator that is used for cooling electronic components.
[background technology]
Along with electronic technology constantly develops, electronic component running frequency and speed are also in continuous lifting.But the heat that high-frequency high-speed will make electronic component produce is more and more, and temperature is also more and more higher, and performance and stability when the electronic component operation in serious threat for guaranteeing the normal operation of electronic component energy, need effectively dispel the heat to electronic component.But existing air-cooled heat abstractor more and more is difficult to satisfy the heat radiation needs of high-frequency high-speed electronic component, and for this reason, liquid-cooled radiating system is adopted by industry gradually.
U.S. Patent application has disclosed a liquid-cooled radiating system 2002/0070007A1 number, this liquid-cooled radiating system comprises a reservoir, this reservoir is surrounded by the base that contacts with heater element and loam cake two parts and forms, be covered with an inlet and a liquid outlet on being somebody's turn to do, cooling fluid enters this reservoir from this inlet, after carrying out heat exchange with this base, flow out from this liquid outlet, thereby the heat of this base is taken away.Yet, because this base contacts with heater element, therefore most of heat is accumulated on this base, because this base is more smooth, the cooling fluid that enters from this inlet is splash owing to the reflex of base, cause quite a few cooling fluid not moved, thereby influence heat-transfer effect along susceptor surface.
[summary of the invention]
The liquid-cooling heat radiator that provides a kind of heat exchange respond well is provided the purpose of this utility model.
The technical solution of the utility model is: a kind of liquid-cooling heat radiator, it comprises a cooling body in order to the heat that absorbs heater element, be provided with a cavity that is used to store cooling fluid in this cooling body, this cooling body also is provided with feeding device and the liquid discharge device that communicates with this cavity respectively, this cooling body in its cavity inside to should one part flow arrangement being set feeding device, this part flow arrangement guiding enters the inner surface movement of the cooling fluid of this cavity along this cooling body from this feeding device, carry out flowing out from this liquid discharge device after the sufficient heat exchange with this cooling body, thereby take away the heat of this cooling body.
Since liquid-cooling heat radiator of the present utility model in this cooling body cavity to being provided with a part flow arrangement by feeding device, the cryogenic liquid that has just entered this cavity from this feeding device is being guided along this cavity inner surface movement, this inner surface is the highest place of temperature normally, therefore, the more preceding case of heat-transfer effect is good.
[description of drawings]
In conjunction with the embodiments the utility model is further described with reference to the accompanying drawings.
Fig. 1 is the assembly drawing of the utility model liquid-cooling heat radiator.
Fig. 2 is the stereogram of the cooling body of the utility model liquid-cooling heat radiator.
Fig. 3 is the cutaway view of Fig. 2 along hatching III-III.
Fig. 4 is the cutaway view of another embodiment of the cooling body of the utility model liquid-cooling heat radiator.
[embodiment]
Below in conjunction with accompanying drawing the utility model liquid-cooling heat radiator is described in further detail.
See also Fig. 1, a schematic diagram for the utility model liquid-cooling heat radiator, this liquid-cooling heat radiator comprises a cooling body 10 and a pump housing 50 that closely contact with heat-generating electronic elements (figure do not show), and this pump housing 50 passes through a drain pipe 100 and a feed tube 200 links to each other with this cooling body 10.This cooling body 10 is used to absorb the heat that heat-generating electronic elements produces, be provided with an enclosure space (will introduce in detail) that is used for storing cooling fluid in it at Fig. 3, this enclosure space, drain pipe 100, the pump housing 50 and feed tube 200 form a liquid circulation loop, under the driving of this pump housing 50, this cooling fluid direction along arrow indication among Fig. 1 in this circulation circuit flows, thereby the heat that continuously cooling body 10 is absorbed is taken away.Because cooling fluid has absorbed the heat of cooling body 10, the coolant temperature that flows out cooling body 10 raises, if the cooling fluid that allows temperature raise just enters next circulation through behind the natural cooling, radiating effect is obviously bad, therefore, the utility model liquid-cooling heat radiator also establishes one in order to reduce the cooling device of coolant temperature, as most fin 30 in the appropriate location in above-mentioned liquid circulation loop, also can on fin 30, install fan (figure does not show) additional, improve radiating effect.
Clear in order to illustrate, the cooling body 10 among Fig. 1, fin 30 and the pump housing 50 are to disperse to be provided with, and are appreciated that ground, and said elements also can be incorporated into together, as the fin 30 and the pump housing 50 directly are installed on the cooling body 10, can save than large space like this.
Please consult Fig. 2 and Fig. 3 together, this cooling body 10 comprises that a base that contacts with heater element 11 and is positioned at the loam cake 12 on this base 11, should go up this 12 with base 11 between form the cavity 14 that is used to store cooling fluid of a sealing, this cooling fluid in this cavity 14 and cooling body 10 carry out heat exchange.Being provided with sealing ring or fluid sealant between this loam cake 12 and this base 11 reveals to prevent cooling fluid.
This loam cake 12 is provided with a pair of jockey that is connected with feed tube 200 and drain pipe 100 of being used for, according to the flow direction of cooling fluid, with its called after feeding device 18 and liquid discharge device 19.
This base 11 is being provided with a part flow arrangement to position that should feeding device 18, part flow arrangement in the present embodiment is column, below be referred to as branch fluidization tower 20, this minute fluidization tower 20 comprise that an installation portion 21 that is mounted to this base 11, is from a body portion 22 and a head 23 from these body portion 22 continuous one extensions that these installation portion 21 one are extended.These head 23 peripheries are taper, and thin lower end, upper end is thick, and these head 23 at least a portion put in this feeding device 18.Like this, when cooling fluid when this feeding device 18 enters this cavity 14, this cooling fluid along this minute fluidization tower 20 head 23 the taper periphery evenly, flow into smoothly, can make so the temperature that just entered than the cooling fluid at the end along base 11 Surface runoff, thereby better absorb the heat of base 11.
By above-mentioned introduction as can be known, the effect of the part flow arrangement in the utility model is in order to guide the cavity 14 that cooling fluid enters this cooling body 10 evenly, smoothly, make the temperature that just entered than the cooling fluid at the end along base 11 Surface runoff, thereby better absorb the heat of base 11.Be appreciated that ground, part flow arrangement of the present utility model can also have other shape and structure, as Fig. 4, part flow arrangement for a kind of tapered bulk, call branching block 20 ' in the following text, this branching block 20 ' has 25 ', one a relative thinner upper end 22 ' and a relative thicker lower end 24 ', arc periphery that is taper.This upper end 22 ' puts in this feeding device 18, and this lower end 24 ' is connected to this base 11.Cooling fluid flows into the cavity 14 of this cooling body 10 along the arc periphery 25 ' of this taper, move along the surface of this cooling body 10 then, absorbs the heat of cooling body 10 to greatest extent.
In the foregoing description, this feeding device 18 is located at loam cake 12 middle parts of this cooling body 10, part flow arrangement is as minute fluidization tower 20 or promptly corresponding base 11 middle parts that are arranged at this cooling body 10 of branching block 20 ', setting will bring following benefit like this: because heater element is usually located at the lower surface middle part of this base 11, when heat transferred further is passed to this part flow arrangement to this base 11, this part flow arrangement can carry out heat exchange with cooling fluid, thereby increases heat exchange area, improves heat-transfer effect.
Claims (9)
1. liquid-cooling heat radiator, it comprises a cooling body in order to the heat that absorbs heater element, be provided with a cavity that is used to store cooling fluid in this cooling body, this cooling body is provided with feeding device and the liquid discharge device that communicates with this cavity respectively, cooling fluid is in this feeding device enters this cavity, carry out flowing out from this liquid discharge device after the heat exchange with this cooling body, thereby take away the heat of this cooling body, it is characterized in that: this cooling body in its cavity inside to should one part flow arrangement being set feeding device, cooling fluid enters this cavity along at least one surface of this part flow arrangement, and along an inner surface movement of this cooling body.
2. liquid-cooling heat radiator as claimed in claim 1, it is characterized in that: this cooling body comprises a base that contacts with heater element, and a loam cake that is tightly connected with this base, this cavity is formed between this base and this loam cake, and the inner surface of this cooling body is meant the surface of this base.
3. liquid-cooling heat radiator as claimed in claim 2 is characterized in that: this feeding device is formed at this loam cake, and this part flow arrangement is installed on the base of this feeding device correspondence.
4. liquid-cooling heat radiator as claimed in claim 3 is characterized in that: this feeding device is formed at this loam cake middle part.
5. liquid-cooling heat radiator as claimed in claim 3 is characterized in that: this part flow arrangement is column, and it comprises that one is installed on installation portion, a body portion and a head that extends from this body portion from this installation portion extension of this cooling body bottom.
6. liquid-cooling heat radiator as claimed in claim 5 is characterized in that: this head to small part puts in this feeding device.
7. liquid-cooling heat radiator as claimed in claim 5 is characterized in that: the head of this part flow arrangement is tapered, and thin lower end, upper end is thick, and cooling fluid flows into this cavity along the head peripheral surface of this part flow arrangement.
8. liquid-cooling heat radiator as claimed in claim 3 is characterized in that: this part flow arrangement is a taper bulk, and thin lower end, upper end is thick, and this upper end puts in this feeding device, and this lower end is installed on this cooling body base.
9. liquid-cooling heat radiator as claimed in claim 8 is characterized in that: the part flow arrangement of this taper bulk has an arc periphery, and cooling fluid is along peripheral this cavity that flows into of this arc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320117271 CN2664195Y (en) | 2003-10-17 | 2003-10-17 | Liquid cooling type heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320117271 CN2664195Y (en) | 2003-10-17 | 2003-10-17 | Liquid cooling type heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2664195Y true CN2664195Y (en) | 2004-12-15 |
Family
ID=34346642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320117271 Expired - Lifetime CN2664195Y (en) | 2003-10-17 | 2003-10-17 | Liquid cooling type heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2664195Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100363864C (en) * | 2005-02-25 | 2008-01-23 | 富准精密工业(深圳)有限公司 | Cooler for several heating elements |
| US7444827B2 (en) | 2005-02-25 | 2008-11-04 | Foxconn Technology Co., Ltd | Cooling device for multiple heat-generating components |
| CN101005747B (en) * | 2006-01-21 | 2010-05-26 | 富准精密工业(深圳)有限公司 | Liquid cooling heat sink and heat exchanger for said liquid cooling heat sink |
| CN102290388A (en) * | 2011-08-11 | 2011-12-21 | 深圳市润芯科技有限公司 | Electronic control device, heat pipe radiator and manufacturing method of heat pipe radiator |
-
2003
- 2003-10-17 CN CN 200320117271 patent/CN2664195Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100363864C (en) * | 2005-02-25 | 2008-01-23 | 富准精密工业(深圳)有限公司 | Cooler for several heating elements |
| US7444827B2 (en) | 2005-02-25 | 2008-11-04 | Foxconn Technology Co., Ltd | Cooling device for multiple heat-generating components |
| CN101005747B (en) * | 2006-01-21 | 2010-05-26 | 富准精密工业(深圳)有限公司 | Liquid cooling heat sink and heat exchanger for said liquid cooling heat sink |
| CN102290388A (en) * | 2011-08-11 | 2011-12-21 | 深圳市润芯科技有限公司 | Electronic control device, heat pipe radiator and manufacturing method of heat pipe radiator |
| CN102290388B (en) * | 2011-08-11 | 2013-09-11 | 深圳市润芯科技有限公司 | Electronic control device, heat pipe radiator and manufacturing method of heat pipe radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20131017 Granted publication date: 20041215 |