CN2612070Y - Liquid cooling radiator - Google Patents
Liquid cooling radiator Download PDFInfo
- Publication number
- CN2612070Y CN2612070Y CN 03223378 CN03223378U CN2612070Y CN 2612070 Y CN2612070 Y CN 2612070Y CN 03223378 CN03223378 CN 03223378 CN 03223378 U CN03223378 U CN 03223378U CN 2612070 Y CN2612070 Y CN 2612070Y
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- liquid
- radiator
- cooling
- coldplate
- pump
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Abstract
A liquid cooling heat radiator for cooling electric element substantially comprise a circuit composed of a cooling plate, a heat radiator and a pump, a cooling liquid circulated in the circuit via driven by the pump. The cooling plate can absorb the heat generated by an electric element, arranged with a cooling liquid channel which two ends are respectively arranged with a liquid inlet and a liquid outlet. The heat radiator is arranged on the top of the cooling plate, comprising a plurality of radiating fins and a heat radiating tube through in the radiating fins, while the liquid inlet of the heat radiating tube is connected with the liquid outlet of the cooling plate. The pump is provided with a liquid pump opening and a liquid discharge opening while the liquid pump opening is connected with the liquid outlet f the heat radiating tube, and the liquid discharge opening is connected with the liquid inlet of the cooling plate.
Description
[technical field]
The utility model is about a kind of liquid-cooling heat radiator, refers to a kind of liquid-cooling heat radiator that is used for cooling electronic components especially.
[background technology]
Along with the continuous development of electronic technology, electronic component running frequency and speed are also in continuous lifting.Yet the heat that high-frequency high-speed will make electronic component produce is more and more, and temperature is also more and more higher, and performance and stability when the electronic component operation in serious threat for guaranteeing the normal operation of electronic component energy, need effectively dispel the heat to electronic component.But existing independent forced air-cooled heat abstractor is difficult to satisfy the heat radiation needs of high-frequency high-speed electronic component, and for this reason, industry combines forced air-cooled heat abstractor and improves radiating efficiency with the pressure liquid-cooling heat radiator.
People's Republic of China's patent has promptly disclosed a kind of computer master radiating device No. 99254044.5, mainly by coldplate, in be provided with water of radiation casing, radiator, the pump of number of metal sheet and connect conduit therebetween and the cooling fluid that is installed with in it is formed.Coldplate is a hollow type structure, in establish some common circulation roads that form of dividing plates that are staggered and an end tool breach.Coldplate from electronical elements surface heat absorption and with heat transferred to cooling fluid, the cooling fluid after the heat absorption is transmitted to water tank by conduit under the driving of pump, and carries out dispelling the heat first time.Then, the cooling fluid in the water tank is imported in the radiator, and dispels the heat the second time auxiliary the carrying out down of fan.This computer master radiating device lumps together air blast cooling and forced fluid cold junction preferably, and radiating efficiency is improved a lot.
Yet, above-mentioned coldplate and radiator design for separate type, need to be passed to a water tank by conduit earlier after the cooling fluid heat absorption in the coldplate, and then be delivered to radiator, make that whole master radiating device structure is quite numerous and jumbled and heavy, easily hamper peripheral other electron component, and be difficult to produce in batches, these are all disagreed with current electronic product lighting developing direction.In addition, the circulation road of coldplate is only formed by some dividing plates, and it is less to contact area between cooling fluid and circulation road, causes heat exchanger effectiveness not good.
[summary of the invention]
The purpose of this utility model is to provide a kind of compact conformation, the respond well liquid-cooling heat radiator of heat exchange.
The purpose of this utility model is achieved through the following technical solutions: the utility model liquid-cooling heat radiator mainly comprises loop of being made up of a coldplate, a radiator and a pump and the cooling fluid that circulates in this loop under this pump drives.This coldplate is to be used for absorbing the heat that an electronic component produces, and is provided with a cooling passage in it, and these cooling passage two ends are respectively a liquid inlet and a liquid outlet.This radiator is arranged on the end face of this coldplate, and it comprises that some fin and are located in the radiating tube in these fin, and an end of this radiating tube links to each other with the liquid outlet of this coldplate.This pump has a liquid pumping hole and a leakage fluid dram, and this liquid pumping hole links to each other with the other end of this radiating tube, and this leakage fluid dram links to each other with the liquid inlet of this coldplate.
On the basis of technique scheme, the utility model further is provided with some heat exchange posts in the cooling passage of this coldplate.
Owing to adopt technique scheme, the utility model liquid-cooling heat radiator is the integral type design that radiator is arranged on the coldplate end face, makes structure compact more, and is easy to produce in batches.Simultaneously, coldplate also can directly arrive radiator with heat transferred, to improve radiating efficiency.In addition,, make that the heat exchange area between cooling fluid and the coldplate increases, and strengthen the turbulent flow in the coolant flow process, can improve the heat exchange efficiency between coldplate and the cooling fluid because of in the cooling passage of coldplate, laying some heat exchange posts.
The utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of the utility model liquid-cooling heat radiator.
Fig. 2 is the three-dimensional combination figure of the utility model liquid-cooling heat radiator.
Fig. 3 is the assembly drawing of the utility model liquid-cooling heat radiator and related elements.
[embodiment]
See also Fig. 1 and Fig. 2, the utility model liquid-cooling heat radiator 1 mainly comprises a coldplate 10, a radiator 20 and a pump 30.
This coldplate 10 is a hollow type structure, and some interlaced arrangement and an end have the dividing plate 12 and a top board 18 common cooling passages that form of breach in it.Also be laid with some heat exchange posts 14 in this cooling passage, to strengthen the heat exchange between cooling fluid and the coldplate 10.On the sidewall of this coldplate 10, be positioned at the cooling passage two ends and be respectively equipped with a liquid outlet 16 and a liquid inlet 17.
This pump 30 is fixed on the support 36 by a fastener 38, and it has a liquid pumping hole 32 and a leakage fluid dram 34, and this liquid pumping hole 32 directly is connected with the outlet end 234 of the radiating tube 23 of this radiator 20, and its junction also is coated with waterproof material.Obviously, the liquid pumping hole 32 of this pump 30 also can be connected with radiating tube 23 by other indirect modes such as conduits.One conduit 50 links together the liquid inlet 17 of this leakage fluid dram 34 with this coldplate 10, makes this coldplate 10, this radiator 20, this pump 30 and this conduit 50 form a closed-loop path.
During work, the bottom surface of this coldplate 10 fits on the electronic component (figure does not show), to absorb the heat that electronic component produces and to be delivered to cooling fluid in the coldplate 10, form high temperature coolant, high temperature coolant is under the driving of pump 30, be delivered to by liquid outlet 16 and dispel the heat in the radiating tube 23 of this radiator 20 and lower the temperature, form cryogenic liquid, cryogenic liquid is back under the driving of pump 30 in this coldplate 10, begin new round circulation again, the heat that can effectively electronic component be produced that circulates and so forth distributes.Radiating tube 23 also can be with the fin 21 of heat transferred to this radiator 20, and by the auxiliary heat dissipation of fan 40, to improve radiating efficiency.In addition, this coldplate 10 also can directly conduct to heat on the radiator 20 that is arranged on its end face, makes better heat-radiation effect.
See also Fig. 3, the utility model liquid-cooling heat radiator 1 is arranged in the casing of electronic apparatus 60, and structure is very compact, and can not hamper peripheral electronic component 62.The air outlet of this radiator 20 is over against a power supply unit 66, can easily hot-air be discharged into the outside of case of electronic device 60 by the air duct in this power supply unit 66, can cool off this power supply unit 66 simultaneously, to reach system radiating effect preferably.Pump 30 is arranged on contiguous these radiator 20 1 sides, and is fixed on the microscope carrier 64, and obviously, this pump 30 also can be seated in the optional position as required.
Claims (7)
1. liquid-cooling heat radiator, comprise a coldplate, the loop that one radiator and a pump are formed and be located in this loop and can be in the cooling fluid that in this loop, circulates under the driving of this pump, establish a cooling passage in this coldplate, these cooling passage two ends are respectively a liquid inlet and a liquid outlet, this radiator comprises that some fin and are arranged in the radiating tube in these fin, this pump has a liquid pumping hole and a leakage fluid dram, it is characterized in that: this radiator is arranged on the top of this coldplate, one end of this radiating tube links to each other with the liquid outlet of this coldplate, the liquid pumping hole of this pump links to each other with the other end of this radiating tube, and the leakage fluid dram of this pump links to each other with the liquid inlet of this coldplate.
2. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: this cooling passage is formed by the dividing plate that some interlaced arrangement and an end have a breach.
3. liquid-cooling heat radiator as claimed in claim 2 is characterized in that: be provided with some heat exchange posts in this cooling passage.
4. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: the fin of this radiator is coated with a shell, forms an air channel.
5. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: be equiped with a fan on this radiator.
6. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: the junction between this coldplate, this radiator and this pumping all is coated with waterproof material.
7. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: the air outlet of this radiator is over against a power supply unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03223378 CN2612070Y (en) | 2003-01-24 | 2003-01-24 | Liquid cooling radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03223378 CN2612070Y (en) | 2003-01-24 | 2003-01-24 | Liquid cooling radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2612070Y true CN2612070Y (en) | 2004-04-14 |
Family
ID=34162757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03223378 Expired - Fee Related CN2612070Y (en) | 2003-01-24 | 2003-01-24 | Liquid cooling radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2612070Y (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7353862B2 (en) | 2005-10-03 | 2008-04-08 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Liquid cooling device |
| US7631686B2 (en) | 2005-08-25 | 2009-12-15 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Liquid cooling device |
| CN101902895A (en) * | 2009-05-27 | 2010-12-01 | 鸿富锦精密工业（深圳）有限公司 | Cooling system |
| CN106681461A (en) * | 2017-01-06 | 2017-05-17 | 广东虹勤通讯技术有限公司 | Heat dissipation structure of electronic product |
| CN107548270A (en) * | 2017-09-09 | 2018-01-05 | 中微冷却技术（深圳）有限公司 | cooling device |
| CN108150275A (en) * | 2017-12-30 | 2018-06-12 | 苏州春兴精工股份有限公司 | A kind of cooling heat transferring container |
| CN109688760A (en) * | 2017-10-19 | 2019-04-26 | 讯凯国际股份有限公司 | Pumping, pumping combination and liquid cooling system |
| CN110566847A (en) * | 2019-09-09 | 2019-12-13 | 广州市明道文化科技集团股份有限公司 | LED stage lighting matrix system with centralized liquid cooling heat dissipation |
| US10599196B2 (en) | 2005-05-06 | 2020-03-24 | Asetek Danmark A/S | Cooling system for a computer system |
| US10613601B2 (en) | 2003-11-07 | 2020-04-07 | Asetek Danmark A/S | Cooling system for a computer system |
-
2003
- 2003-01-24 CN CN 03223378 patent/CN2612070Y/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11287861B2 (en) | 2003-11-07 | 2022-03-29 | Asetek Danmark A/S | Cooling system for a computer system |
| US10613601B2 (en) | 2003-11-07 | 2020-04-07 | Asetek Danmark A/S | Cooling system for a computer system |
| US10599196B2 (en) | 2005-05-06 | 2020-03-24 | Asetek Danmark A/S | Cooling system for a computer system |
| US11287862B2 (en) | 2005-05-06 | 2022-03-29 | Asetek Danmark A/S | Cooling system for a computer system |
| US7631686B2 (en) | 2005-08-25 | 2009-12-15 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Liquid cooling device |
| US7353862B2 (en) | 2005-10-03 | 2008-04-08 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Liquid cooling device |
| CN101902895A (en) * | 2009-05-27 | 2010-12-01 | 鸿富锦精密工业（深圳）有限公司 | Cooling system |
| CN106681461A (en) * | 2017-01-06 | 2017-05-17 | 广东虹勤通讯技术有限公司 | Heat dissipation structure of electronic product |
| CN107548270B (en) * | 2017-09-09 | 2019-10-11 | 中微冷却技术（深圳）有限公司 | Cooling equipment |
| CN107548270A (en) * | 2017-09-09 | 2018-01-05 | 中微冷却技术（深圳）有限公司 | cooling device |
| CN109688760A (en) * | 2017-10-19 | 2019-04-26 | 讯凯国际股份有限公司 | Pumping, pumping combination and liquid cooling system |
| CN108150275A (en) * | 2017-12-30 | 2018-06-12 | 苏州春兴精工股份有限公司 | A kind of cooling heat transferring container |
| CN110566847A (en) * | 2019-09-09 | 2019-12-13 | 广州市明道文化科技集团股份有限公司 | LED stage lighting matrix system with centralized liquid cooling heat dissipation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040414 Termination date: 20100224 |