CN109346445A - A kind of micro-channel heat sink generating spiral flow - Google Patents
A kind of micro-channel heat sink generating spiral flow Download PDFInfo
- Publication number
- CN109346445A CN109346445A CN201810995348.7A CN201810995348A CN109346445A CN 109346445 A CN109346445 A CN 109346445A CN 201810995348 A CN201810995348 A CN 201810995348A CN 109346445 A CN109346445 A CN 109346445A
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- heat sink
- microchannel
- micro
- channel
- spiral flow
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Abstract
The present invention provides a kind of micro-channel heat sink for generating spiral flow, including silicon substrate bottom plate, heat sink and cover board, the silicon substrate bottom plate, heat sink and cover board are successively bonded, it is heat source below silicon substrate bottom plate, it is described heat sink to be bonded by upper substrate and lower substrate, the upper substrate is equipped with diversion channel, interflow slot and microchannel, etches groove on the side wall of microchannel；Skewed slot is etched on the lower substrate, is connected to microchannel side wall upper groove；The cover board is equipped with inlet and outlet, and cooling working medium is imported from import, and after being further separated into microchannel by diversion channel, economic cooperation chute interflow is exported from outlet.The each microchannel inner side slot and kerve of micro-channel heat sink of the present invention change fluidal texture, generate spiral flow, strengthen the mixing and heat transfer of cold fluid and hot fluid, improve the heat transfer efficiency of micro-channel heat sink.
Description
Technical field
The invention belongs to the technical field of heat dissipation of microelectronic chip, and in particular to a kind of micro channel heat for generating spiral flow
It is heavy.
Background technique
With the development of electronic industry, electronics miniaturization, integration degree are higher and higher, the heat dissipation function of electronic chip
Rate is multiplied, and heat flow density is up to 100 W/cm2It is even higher, thus there is an urgent need to new and effective heat-exchange device, with
Guarantee the trouble free service of electronic equipment.The heat exchange property of microchannel meets the cooling requirement of integrated circuit, micro channel heat well
It is heavy to replace traditional heat exchanger channels.In order to further increase exchange capability of heat, the parameter to microchannel, channel arrangement side are needed
Formula, wall structure etc. optimize, to improve heat exchange property.
Often setting and the angled block in flow direction on wall surface in macroscopic path are strong in favor of exchanging heat
Change, but can be with bigger crushing.This method is also applied in microchannel, and in microchannel, side wall addition baffle is micro- logical
Road is heat sink, has the bilateral micro-channel heat sink of rib in microchannel bottom, when baffle and flow direction are at an acute angle, the chaos of generation
Convection current can significantly increase the mixing of cold fluid and hot fluid, meanwhile, thermal resistance declines also with the high increase of rib, micro-channel heat sink
Heat transfer is greatly strengthened.It is to improve micro-channel heat sink it can be seen that changing fluidal texture and promoting the mixing of cold fluid and hot fluid
The effective means of performance；The thermal boundary layer flowed in microchannel is constantly destroyed, is the important method for reducing thermal resistance.The two is ok
It is achieved by the measure of rib and slot that various period profiles are arranged in wall surface etc..
Summary of the invention
The object of the present invention is to provide a kind of micro-channel heat sinks for generating spiral flow, reinforce cold fluid and hot fluid using spiral flow
The exchange of mixing and heat, reaches augmentation of heat transfer.
In order to achieve the above object, the present invention is achieved through the following technical solutions:
A kind of micro-channel heat sink generating spiral flow, including silicon substrate bottom plate, heat sink and cover board, the silicon substrate bottom plate, heat sink and lid
Plate is successively bonded, and is heat source below silicon substrate bottom plate, it is described it is heat sink be bonded by upper substrate and lower substrate, set on the upper substrate
There are diversion channel, interflow slot and microchannel, etches groove on the side wall of microchannel；Skewed slot is etched on the lower substrate, is led to micro-
The connection of road side wall upper groove；The cover board is equipped with inlet and outlet, and cooling working medium is imported from import, is diverted by diversion channel
After entering microchannel, economic cooperation chute interflow is exported from outlet, and flowing of the fluid in microchannel will receive lateral groove and bottom surface slot
It influences, generates spiral flow, strengthen the mixing and heat transfer of bottom high temperature fluid and top low temperature fluid, to increase micro-channel heat sink
Heat transfer efficiency.
Groove on the microchannel side wall is in periodic distribution, and the skewed slot on the lower substrate is in periodic distribution, and two
Person's corresponding position interconnects, and forms the channel of periodic distribution.
The cover board is provided with one or several imports, and the cover board is provided with one or several outlets.
The invention has the advantages that
1) each microchannel inner side slot and kerve can change fluidal texture in micro-channel heat sink, generate spiral flow, strengthen hot and cold stream
The mixing and heat transfer of body, improve the heat transfer efficiency of micro-channel heat sink.
2) kerve and side channel can also periodically destroy thermal boundary layer in micro-channel heat sink, reduce thermal resistance, improve heat transfer efficiency.
3) in microchannel bottom and groove at side surface, apparent pressure drop will not be generated, thus the case where not increasing power consumption
Lower guarantee heat transfer efficiency.
Detailed description of the invention
Fig. 1 is a kind of perspective view of micro-channel heat sink for generating spiral flow of the present invention.
Fig. 2 is a kind of helical form streamline of micro-channel heat sink for generating spiral flow of the present invention.
Fig. 3 is that a kind of micro-channel heat sink each section for generating spiral flow of the present invention is bonded schematic diagram.
Fig. 4 is that the connection of the lateral groove and bottom surface slot of a kind of micro-channel heat sink for generating spiral flow of the present invention is illustrated
Figure.
Fig. 5 is the cover board, upper substrate and lower substrate distribution of a kind of micro-channel heat sink for generating spiral flow of the present invention
Figure.
In figure: 1, silicon substrate bottom plate, 2, heat sink, 3, cover board, 4, import, 5, outlet, 6, upper substrate, 7, lower substrate, 8, bottom surface
Slot, 9, lateral groove, 10, microchannel, 11, microchannel side wall, 12, diversion channel, 13, interflow slot, 14, hot-fluid.
Specific embodiment
In conjunction with attached drawing, a kind of micro-channel heat sink generating spiral flow provided by the invention is described further.
Referring to Fig.1 ~ Fig. 5, a kind of micro-channel heat sink generating spiral flow, including the silicon substrate bottom plate 1, heat sink being bonded together
2 and cover board 3.There is hot-fluid 14 below the silicon substrate bottom plate 1.Import 4 and outlet 5 are provided on the cover board 3.Described heat sink 2 by
Upper substrate 6 and lower substrate 7 are bonded, and the upper substrate 6 is equipped with microchannel 10, diversion channel 12 and interflow slot 13, described micro- logical
Several lateral grooves 9 of periodic distribution are provided on the side wall 11 in road 10.Several periodic distributions are provided on the lower substrate 7
Bottom surface slot 8.The fluid imported by import 4 enters in microchannel 10 under the effect of diversion channel 12, due to by 8 He of bottom surface slot
Under the collective effect of lateral groove 9, helical form streamline is generated, the mixing and heat transfer of cold fluid and hot fluid are enhanced, then fluid is by closing
Chute 13 is exported from outlet 5.
Wherein, import 4 is connected to diversion channel 12, and diversion channel 12 is connected to the beginning of microchannel 10, and interflow slot 13 leads to micro-
The end in road 10 is connected to, and is finally collaborated slot 13 and is connected to outlet 5.
There are lateral groove 9, the bottom on lateral groove 9 and lower substrate 7 in the two sides of the side wall 11 of microchannel 10 on the upper substrate 6
Face slot 8 is connected to, so that generating spiral flow.
The import 4 can be one or more, and the outlet 5 is also possible to one or more.
There are also the effects for periodically destroying thermal boundary layer for the bottom surface slot 8 and lateral groove 9.
Embodiment 1
A kind of micro-channel heat sink generating spiral flow, including be bonded together silicon substrate bottom plate 1, heat sink 2 and cover board 3.Hot-fluid 14
Heat sink 2 lower substrate 7 is passed to by silicon substrate bottom plate 1, cooling working medium is then that the import 4 being arranged from cover board 3 imports heat sink 2, warp
Enter microchannel 10, common work of the cooling working medium by bottom surface slot 8 and lateral groove 9 in microchannel 10 after crossing diversion channel 12
With generation spiral flow strengthens the mixing and heat transfer of cold fluid and hot fluid (working medium), then exports by interflow slot 13 from outlet 5.It is described
Heat sink 2 are bonded by upper substrate 6 and lower substrate 7, and the upper substrate 6 is equipped with microchannel 10, diversion channel 12 and interflow slot 13,
Several lateral grooves 9 of periodic distribution are provided on the side wall 11 of the microchannel 10.Several weeks are provided on the lower substrate 7
The bottom surface slot 8 of phase property distribution.The fluid imported by import 4 enters in microchannel 10 under the effect of diversion channel 12, due to by
Under the collective effect of bottom surface slot 8 and lateral groove 9, helical form streamline is generated, the mixing and heat transfer of cold fluid and hot fluid is enhanced, then flows
Body is exported by interflow slot 13 from outlet 5, heat sink 2 hot-fluid 14 will be transmitted to by silicon substrate bottom plate 1, be taken away micro-channel heat sink,
Reach heat sinking function.
Wherein, the number of the import 4 on cover board 3 and outlet 5 can be determined according to the requirement of Working fluid flow uniformity, uniformly
The number of 4 neclear export 5 of import can suitably increase when property requires high.
In addition, there are a lateral groove 9 in the two sides of the side wall 11 of microchannel 10 on upper substrate 6, on the side wall 11 of microchannel 10
Lateral groove 9 is connected to the bottom surface slot 8 on lower substrate 7, could generate spiral flow in this way.The quantity of lateral groove 9 and bottom surface slot 8, with
And the geometric parameters such as groove width, groove depth, separation, spiral angle of attack, it can be true according to conditions such as specific thermal transmission requirement and flowing velocities
It is fixed.
The bottom surface slot 8 and lateral groove 9 are other than generating spiral flow, and there are also the effects for periodically destroying thermal boundary layer.
The above is only the preferred embodiment for the present invention, it is noted that for those skilled in the art,
Without departing from the inventive concept of the premise, several improvements and modifications can also be made, these improvements and modifications also should be regarded as this
In invention protection scope.
Claims (4)
1. a kind of micro-channel heat sink for generating spiral flow, including silicon substrate bottom plate, heat sink and cover board, which is characterized in that the silicon substrate
Bottom plate, heat sink and cover board are successively bonded, and are heat sources below silicon substrate bottom plate, it is described it is heat sink be bonded by upper substrate and lower substrate,
The upper substrate is equipped with diversion channel, interflow slot and microchannel, etches groove on the side wall of microchannel；It is etched on the lower substrate
Skewed slot out is connected to microchannel side wall upper groove；The cover board is equipped with inlet and outlet, and cooling working medium imports from import, leads to
After excessive trough shunting enters microchannel, economic cooperation chute interflow is exported from outlet.
2. a kind of micro-channel heat sink for generating spiral flow according to claim 1, which is characterized in that the microchannel side wall
On groove be in periodic distribution, the skewed slot on the lower substrate is in periodic distribution, and the two corresponding position interconnects, and is formed
The channel of periodic distribution.
3. a kind of micro-channel heat sink for generating spiral flow according to claim 1 or 2, which is characterized in that the cover board is set
It is equipped with one or several imports.
4. a kind of micro-channel heat sink for generating spiral flow according to claim 1 or 2, which is characterized in that the cover board is set
It is equipped with one or several outlets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810995348.7A CN109346445B (en) | 2018-08-29 | 2018-08-29 | Micro-channel heat sink capable of generating spiral flow |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810995348.7A CN109346445B (en) | 2018-08-29 | 2018-08-29 | Micro-channel heat sink capable of generating spiral flow |
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| Publication Number | Publication Date |
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| CN109346445A true CN109346445A (en) | 2019-02-15 |
| CN109346445B CN109346445B (en) | 2020-10-27 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112361857A (en) * | 2020-11-11 | 2021-02-12 | 中国工程物理研究院激光聚变研究中心 | Heat transfer enhancement method based on functional fluid coupling of fractal tree-shaped microchannel and phase-change microcapsule |
| CN115014107A (en) * | 2022-05-26 | 2022-09-06 | 西安交通大学 | Double-effect enhanced heat exchange micro-channel heat sink with wing-shaped flow dividing ribs |
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| CN1964777A (en) * | 2004-06-11 | 2007-05-16 | 康宁股份有限公司 | Microstructure designs for optimizing mixing and pressure drop |
| CN101309747A (en) * | 2005-03-23 | 2008-11-19 | 维罗西股份有限公司 | Surface features in microprocess technology |
| CN1794444A (en) * | 2005-11-10 | 2006-06-28 | 上海交通大学 | Micropassage type radiator based on diamond film |
| CN106653711A (en) * | 2016-10-27 | 2017-05-10 | 湖北工程学院 | Cooling device with internal micro-channel heat sink module |
| CN108022893A (en) * | 2017-11-13 | 2018-05-11 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of three-dimensional stacked high-performance micro-cooling device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112361857A (en) * | 2020-11-11 | 2021-02-12 | 中国工程物理研究院激光聚变研究中心 | Heat transfer enhancement method based on functional fluid coupling of fractal tree-shaped microchannel and phase-change microcapsule |
| CN112361857B (en) * | 2020-11-11 | 2022-02-15 | 中国工程物理研究院激光聚变研究中心 | Heat transfer enhancement method based on functional fluid coupling of fractal tree-shaped microchannel and phase-change microcapsule |
| CN115014107A (en) * | 2022-05-26 | 2022-09-06 | 西安交通大学 | Double-effect enhanced heat exchange micro-channel heat sink with wing-shaped flow dividing ribs |
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