CN210119065U - Heat pipe circulation drinking liquid semiconductor refrigerating system and refrigerating equipment - Google Patents
Heat pipe circulation drinking liquid semiconductor refrigerating system and refrigerating equipment Download PDFInfo
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- CN210119065U CN210119065U CN201920233212.2U CN201920233212U CN210119065U CN 210119065 U CN210119065 U CN 210119065U CN 201920233212 U CN201920233212 U CN 201920233212U CN 210119065 U CN210119065 U CN 210119065U
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Abstract
The utility model relates to a refrigeration technology discloses a liquid semiconductor refrigerating system is drunk in heat pipe circulation, including semiconductor refrigeration chip (1), with the heat pipe hot junction heat dissipation module of the hot junction contact of this semiconductor refrigeration chip (1) and with circulating water cooling refrigeration module (10) of the cold junction contact of semiconductor refrigeration chip (1). Furthermore, the utility model also provides a refrigeration plant who has liquid semiconductor refrigerating system is drunk in heat pipe circulation. The utility model discloses the hot junction heat to semiconductor refrigeration chip gives off untimely among the current refrigeration plant, the problem that cold junction and hot junction heat exchange efficiency are low adopts heat pipe radiating module at semiconductor refrigeration chip's hot junction, adopts liquid cooling heat transfer unit (2), storage container (3) and pumping installations (4) to link to each other the closed loop's that forms circulation liquid way refrigerates at semiconductor refrigeration chip's (1) cold junction, can not only strengthen semiconductor refrigeration chip's work efficiency, simple structure moreover, low cost.
Description
Technical Field
The utility model relates to a refrigeration technology specifically relates to a liquid semiconductor refrigerating system is drunk in heat pipe circulation. Furthermore, the utility model discloses still relate to one kind and include the refrigeration plant of liquid semiconductor refrigerating system is drunk in heat pipe circulation.
Background
Semiconductor refrigeration technology has gained wider application since the end of the 20 th century 50 s, due to its unique advantages. Semiconductor refrigeration chip's theory of operation is that semiconductor refrigeration chip is when having the electric current to pass through, will produce heat transfer between the both ends, the heat will be followed one end and shifted to the other end, thereby produce the difference in temperature and form cold and hot end, but semiconductor self has resistance, will produce heat when the electric current passes through the semiconductor, thereby can influence the heat transfer, and heat between two polar plates also can carry out reverse heat transfer through air and semiconductor material self, reach certain difference in temperature when cold and hot end, the volume of these two kinds of heat transfers is equal mutually, will reach a balance point, positive and reverse heat transfer offsets each other, the temperature in cold and hot end just can not continue to change this moment, semiconductor refrigeration chip's refrigeration efficiency can reduce, can stop work even.
In addition, not only the hot end contends for the cold energy of the cold end, but also the refrigeration efficiency is low because the drinking liquid in the prior art can not effectively transfer heat or even damage the heat convection movement of the drinking liquid in the process of contacting with the cold end.
For the reasons, the prior art is difficult to improve the working efficiency of the semiconductor refrigeration chip, and the refrigeration effect is not ideal.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a liquid semiconductor refrigerating system is drunk in heat pipe circulation, this liquid semiconductor refrigerating system is drunk in heat pipe circulation's refrigeration efficiency is higher, can effectively improve refrigeration effect.
Another object of the utility model is to provide a refrigeration plant, this refrigeration plant can refrigerate the drinking liquid effectively, and refrigeration efficiency is higher.
In order to achieve the above object, the utility model provides a liquid semiconductor refrigerating system is drunk in heat pipe circulation, including semiconductor refrigeration chip, with the heat dissipation module of the hot junction contact of semiconductor refrigeration chip, and with the refrigeration module of the cold junction contact of semiconductor refrigeration chip; the heat dissipation module comprises a heat pipe unit, a heat dissipation piece and a cooling air driving device for providing cooling air for the heat dissipation piece, wherein the heat pipe unit is arranged between the heat dissipation piece and the hot end of the semiconductor refrigeration chip so as to dissipate heat; the refrigeration module comprises a liquid cooling heat exchange unit, a storage container and a pumping device, wherein the liquid cooling heat exchange unit, the storage container and the pumping device are connected through a liquid path to form a circulating liquid path, and a liquid motion track formed by the circulating liquid path can guide the heat convection motion of liquid and can form local turbulence.
Preferably, the part of the heat pipe unit in contact with or adjacent to the hot end of the semiconductor refrigeration chip is a heat pipe evaporator, and the part in contact with or adjacent to the heat sink is a heat pipe condenser, wherein the heat pipe unit comprises a substrate and a heat pipe, a heat pipe groove is formed on the substrate, the middle section of the heat pipe is embedded in the heat pipe groove and protrudes from the heat pipe groove to be in contact with the hot end of the semiconductor refrigeration chip, and the two end regions are bent to be respectively inserted into the heat sink from two sides of the heat sink.
Specifically, a heat insulation plate is arranged between the substrate and the heat dissipation member.
More preferably, the heat sink includes a side plate and heat sinks, and a cooling air convection duct is formed between the heat sinks, wherein the cooling air driving device includes an air supply device disposed at an inlet of the cooling air convection duct and/or an air extraction device disposed at an outlet of the cooling air convection duct.
Preferably, the cold end of the semiconductor refrigeration chip extends into a concave part of the shell of the liquid-cooling heat exchange unit so as to increase the contact conduction area.
In a preferred embodiment, the pumping device is installed at the inlet or outlet of the liquid-cooled heat exchange unit to form an integrated module with the liquid-cooled heat exchange unit.
Specifically, the cold energy conduction part is arranged on one side of the shell of the liquid cooling heat exchange unit, which is in contact with the cold end of the semiconductor refrigeration chip.
As a specific implementation form, the cold energy conducting part of the liquid-cooling heat exchange unit is formed with a shell inner bulge for forming the local turbulent flow.
More specifically, the inside of the shell of the liquid cooling heat exchange unit protrudes to form a circuitous path so as to increase the length of the path of the liquid passing through the liquid cooling heat exchange unit.
Preferably, the inlet of the storage container is arranged at an upper portion of the storage container and the outlet is arranged at a lower portion of the storage container to enable the local turbulence to be created by liquid impact generated by the height difference.
On the basis of the technical scheme of the utility model, the utility model also provides a refrigeration plant, wherein, this refrigeration plant has according to any one of above-mentioned technical scheme heat pipe circulation drink liquid semiconductor refrigerating system.
Through the above technical scheme of the utility model, according to semiconductor refrigeration chip's theory of operation and characteristic, increased heat pipe radiating module in semiconductor refrigeration chip's hot junction to the heat energy that conduction semiconductor refrigeration chip produced reduces the temperature in semiconductor refrigeration chip hot junction. Meanwhile, a circulating liquid path formed by the liquid cooling heat exchange unit, the storage container and the pumping device is additionally arranged at the cold end of the semiconductor refrigeration chip, the heat convection movement of liquid can be guided by the liquid movement track formed by the circulating liquid path, local turbulence can be formed, the original natural convection heat exchange mode of water is converted into a forced convection heat exchange mode, the convection heat exchange coefficient is increased, the refrigeration efficiency of the semiconductor refrigeration chip is increased under the condition that the material and the current of the semiconductor chip are not changed, the energy is saved, the cost is lower, and the semiconductor refrigeration chip is simple and practical.
Other features and advantages of the present invention will be described in detail in the detailed description which follows.
Drawings
The following drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without limiting the scope of the invention to the drawings and the embodiments described below. In the drawings:
FIG. 1 is a schematic diagram of the overall structure of a heat pipe cycle drinking liquid semiconductor refrigeration system according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of a first embodiment of the protrusion inside the shell of the liquid cooling heat exchange unit of the present invention;
FIG. 3 is a schematic structural view of a second embodiment of the protrusion inside the housing of the liquid cooling heat exchange unit of the present invention;
FIG. 4 is a schematic view of the structure of the concave portion of the housing of the liquid cooling heat exchange unit of the present invention;
fig. 5 is a schematic structural diagram of a specific embodiment of the heat pipe heat dissipation module of the present invention.
Description of the reference numerals
1 semiconductor refrigeration chip 2 liquid cooling heat exchange unit
21 housing 211 recess
22 case internal bulge 3 storage container
4 pumping device 5 heat pipe unit
51 cooling fin 511 cooling air convection duct
52 insulation board 53 substrate
54 heat pipe 541 heat pipe groove
55 side plate 6 heat sink
7 cooling air driving device 8 circulating liquid path
9 heat radiation module 10 refrigeration module
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.
It should be noted that, in the following description, for clarity of explanation of the technical solution of the present invention, directional terms such as "outside", "inside", and the like are used according to the meaning of the parts of the heat pipe circulation drinking liquid semiconductor refrigeration system, where the parts are normally referred to, for example, the part through which the liquid passes is the inside, and the opposite part is the outside.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either directly or indirectly through intervening media, either internally or in any combination thereof. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1, the heat pipe circulation drinking liquid semiconductor refrigeration system of the present invention includes a semiconductor refrigeration chip 1, a heat dissipation module 9 in contact with the hot end of the semiconductor refrigeration chip 1, and a refrigeration module 10 in contact with the cold end of the semiconductor refrigeration chip 1, wherein the heat dissipation module 9 includes a heat pipe unit 5, a heat dissipation member 6, and a cooling air driving device 7 for providing cooling air to the heat dissipation member 6, and the heat pipe unit 5 is disposed between the heat dissipation member 6 and the hot end of the semiconductor refrigeration chip 1 to dissipate heat; the refrigeration module 10 comprises a liquid cooling heat exchange unit 2, a storage container 3 and a pumping device 4, wherein liquid paths are connected to form a circulating liquid path 8, and the circulating liquid path 8 has the function that the formed liquid motion track can guide the thermal convection motion of liquid and can form local turbulent flow.
Specifically, when the semiconductor refrigeration chip 1 of the utility model is electrified, the heat of the cold end is transferred to the hot end, so that the temperature of the cold end is reduced, the temperature of the hot end is increased, the cold end and the hot end of the semiconductor refrigeration chip 1 are formed, the basis of whether the semiconductor refrigeration chip 1 can operate for a long time is to have good heat dissipation, which is a prerequisite condition for obtaining ideal cold end temperature, therefore, the heat pipe evaporation part of the heat dissipation module of the utility model can rapidly transfer the heat energy at the hot end of the semiconductor refrigeration chip 1 to the condensation part of the heat pipe and rapidly conduct the heat energy out through the heat dissipation part 2, the liquid cooling heat exchange unit 2 connected with the cold end of the semiconductor refrigeration chip 1 can conduct the cold energy generated at the cold end of the semiconductor refrigeration chip 1 into a closed loop liquid path formed by the connection of the liquid cooling heat exchange unit 2, the storage container 3 and the pumping device 4, therefore, the temperature difference between the hot end and the cold end of the semiconductor refrigeration chip 1 is kept small all the time. The semiconductor refrigeration chip 1 can achieve the maximization of refrigeration efficiency under the condition that the material is unchanged and the current is unchanged. The utility model discloses the liquid movement track that refrigerating system's circulation liquid way 8 formed can guide the hot convection current motion of liquid, and can form local turbulent flow, this has promoted the hot convection current motion of liquid greatly, the temperature diffusion has been strengthened, make the cold energy conduction that 1 cold junction of semiconductor refrigeration chip produced into by liquid cooling heat transfer unit 2 with the liquid cooling heat transfer unit 2 that 1 cold junction of semiconductor refrigeration chip links to each other, storage container 3 and pumping device 4 link to each other in the closed loop liquid way that forms, obtain the cold liquid of temperature lower relatively (like water, beverage or fruit juice).
Specifically, for example, the inlet of the storage container 3 is located at the upper part of the storage container, and the outlet is located at the lower part of the storage container, which has the advantages that the drinking liquid entering through the inlet impacts the liquid level in the storage container 3, so that the liquid in the storage container 3 is locally turbulent by the action of the height difference, the liquid with lower temperature at the inlet is rapidly mixed with the liquid with higher temperature in the storage container 3 by the action of the local turbulence, the overall temperature of the liquid in the storage container 3 is rapidly reduced, and the temperature of the liquid in the entire container is more uniform, and the phenomena that the temperature of the liquid in the upper part of the storage container 3 is lower and the temperature of the liquid in the lower part is higher do not occur.
The utility model discloses a heat pipe unit can be the heat pipe heat dissipation form of various structural style, as the utility model discloses a preferred structural style, as shown in fig. 5, heat pipe unit 5 includes base plate 53 and heat pipe 54, be formed with heat pipe groove 531 on the base plate 53, heat pipe 54's interlude is inlayed and is established in heat pipe groove 531 and from this heat pipe groove 531 in the protruding with the hot junction contact of semiconductor refrigeration chip 1, the regional crooked in both ends is in order to follow separately the inside of this heat-dissipating piece 6 is inserted to the both sides of heat-dissipating piece 6. In order to better conduct the heat in the heat pipe to the heat sink 6, the evaporation part of the heat pipe 54 is fixed on the base plate 53 through the heat pipe groove 531, the semiconductor refrigeration chip 1 is attached to the base plate, the hot end heat energy of the semiconductor refrigeration chip 1 is conducted to the base plate 53 and the evaporation part of the heat pipe 54 at the same time, the area of the evaporation part of the heat pipe 54 absorbing the heat energy is increased, and the efficiency of conducting the heat energy is correspondingly increased. Meanwhile, the two end regions of the heat pipe 54 are bent, so that the volume of the heat pipe unit is reduced, and the condensation part of the heat pipe 54 is inserted into the heat sink 6 from the two sides of the heat sink 6, so that the heat pipe unit has the advantages of increasing the contact area between the heat sink 6 and the condensation part of the heat pipe 54 and improving the heat conduction efficiency.
Meanwhile, a heat insulation plate 52 is required to be arranged between the substrate 53 and the heat sink 6 to ensure that the heat energy at the hot end of the semiconductor refrigeration chip 1 is not directly conducted to the heat sink 51 and the evaporation part of the heat pipe 54. The heat insulation board 52 is used for directly causing the evaporation part of the heat pipe 54 to absorb excessive heat to cause the temperature difference between the evaporation part and the condensation part to be smaller and smaller, so that the heat pipe 54 loses the heat conduction function, and the heat dissipation efficiency of the heat dissipation module 9 is improved, if the hot-end heat energy of the semiconductor refrigeration chip 1 is directly conducted to the substrate 53 and then conducted to the evaporation part of the heat pipe 54. The heat insulation board 52 can prevent heat energy from being directly conducted to the heat dissipation fins 51 without passing through the heat pipe 54, so that normal operation of the heat pipe 54 is guaranteed, meanwhile, due to the effect of the heat insulation board 52, the substrate 52 can be close to the heat dissipation member 6, and the whole heat dissipation unit 5 is enabled to be minimum in size and more compact in structure on the premise of guaranteeing the highest heat dissipation efficiency.
In a preferred embodiment, the heat sink 6 of the present invention comprises a side plate 55 and heat sinks 51, wherein a cooling air convection duct 511 is formed between the heat sinks 51, and the cooling air driving device 7 comprises an air supply device disposed at an inlet of the cooling air convection duct 511 and/or an air exhaust device disposed at an outlet of the cooling air convection duct 511. The common feature of both the air supply device and the air draft device is that the convection of air in the cooling air convection duct 511 can be accelerated, so that the dissipation of heat energy of the heat dissipation fins 51 is accelerated, the temperature of the heat dissipation member 6 is reduced, the heat dissipation efficiency of the heat dissipation unit 5 is improved, and the refrigeration efficiency of the semiconductor refrigeration chip 1 is improved.
Further, as shown in fig. 4, in order to achieve a higher efficiency of refrigeration, in addition to rapidly conducting heat at the hot end of the semiconductor refrigeration chip 1, the cold end of the semiconductor refrigeration chip 1 also needs to rapidly absorb heat of the drinking liquid to be cooled, so as to prevent the hot end of the semiconductor refrigeration chip 1 from competing for cold energy at the cold end, which requires that the cold end of the semiconductor refrigeration chip 1 is embedded into the concave portion 211 of the housing 21 of the liquid-cooled heat exchange unit 2 to increase the contact conduction area, and the larger the contact area, the higher the conduction efficiency.
As a preferred embodiment, one side of the shell of the liquid-cooling heat exchange unit 2 contacting the cold end of the semiconductor chip 1 is a cold energy conducting portion, the cold energy conducting portion is formed with a shell inner protrusion 22 for increasing the contact area of the liquid, the protrusion portion shown in fig. 2 is the shell inner protrusion 22 parallel to the direction of the liquid passing, after the liquid enters from the inlet, the liquid is divided into a plurality of channels along the direction indicated by the arrow, so that the liquid in the liquid-cooling heat exchange unit 2 can form local turbulence, thereby accelerating the cooling speed of the liquid and improving the refrigeration efficiency. The raised part shown in fig. 3 is the inside protrusion 22 of the housing in a circuitous form, and when the inside turbulence of the liquid cooling heat exchange unit 2 is formed, the length of the liquid passing through of the liquid cooling heat exchange unit 2 can be increased, and the contact time of the liquid and the cold energy conduction part is prolonged, so that the cooling effect of the liquid is better, and the cooling efficiency is higher.
As a specific implementation manner, the outlet position of liquid cooling heat exchange unit 2 has increased pumping device 4 in cold junction circulating fluid path 8 of semiconductor refrigeration chip 1 in fig. 1, if change pumping device 4's position, install pumping device 4 in liquid cooling heat exchange unit 2's import position department, also belong to equally the utility model discloses a protection scope. The pumping device 4 can be directly installed at the position of the outlet or the inlet of the liquid cooling heat exchange unit 2 without a connecting pipeline, and forms an integrated module with the liquid cooling heat exchange unit 2, so that the integrated structure is simpler, and the installation is more convenient. However, no matter the pumping device 4 is installed at the inlet of the liquid cooling heat exchange unit 2 or at the outlet of the liquid cooling heat exchange unit 2, the pumping device 4 can make the liquid in the storage container form local turbulence, so that the mixing speed of the liquid with a lower temperature and the liquid with a higher temperature in the storage container can be increased, and meanwhile, the pumping device 4 can also rapidly convey the liquid water passing through the liquid cooling heat exchange unit 2 into the storage container to prevent the liquid temperature from rising back to some extent due to the overlong retention time of the liquid in the pipeline. Meanwhile, the outside of the storage container and the pipelines connecting the parts can be provided with heat-insulating layers, so that the liquid in the whole circulating liquid path 8 can be ensured to keep a specific temperature. In the heat pipe circulation drinking liquid semiconductor refrigeration system, the pumping device 4 mainly functions to change the natural convection mode of the liquid in the circulation liquid path 8 at the cold end of the semiconductor refrigeration chip 1 into the forced convection mode, wherein the heat exchange coefficient of the natural convection mode is as follows: 200 to 1000W/(m)2DEG C.), and the heat transfer coefficient of the forced convection mode is as follows: 1000 to 15000W/(m)2DEG C.), the heat exchange coefficient of the liquid is increased, therefore, the water-cooled heat exchanger2, the conduction efficiency is improved, and the cooling effect of the liquid is better.
Furthermore, the utility model also provides a refrigeration plant, this refrigeration plant have above-mentioned scheme the heat pipe circulation drink liquid semiconductor refrigerating system.
In conclusion, the utility model discloses a liquid semiconductor refrigerating system is drunk in heat pipe circulation has increased heat pipe radiating module 9 at semiconductor refrigeration chip 1's hot junction to the heat energy that conduction semiconductor refrigeration chip 1 produced reduces the temperature in semiconductor refrigeration chip 1 hot junction. Meanwhile, a circulating liquid path 8 consisting of the liquid cooling heat exchange unit 2, the storage container 3 and the pumping device 4 is additionally arranged at the cold end of the semiconductor refrigeration chip 1, the heat convection movement of liquid can be guided by the liquid movement track formed by the circulating liquid path 8, local turbulence can be formed, the original natural convection heat exchange mode of water is converted into a forced convection heat exchange mode, the convection heat exchange coefficient is increased, the refrigeration efficiency of the semiconductor refrigeration chip 1 is increased under the condition that the material and the current of the semiconductor chip are not changed, the energy is saved, the cost is lower, and the semiconductor refrigeration chip is simple and practical.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the details of the above embodiments, and the technical concept of the present invention can be within the scope of the present invention to perform various simple modifications to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and in order to avoid unnecessary repetition, the present invention does not need to describe any combination of the features.
In addition, various embodiments of the present invention can be combined arbitrarily, and the disclosed content should be regarded as the present invention as long as it does not violate the idea of the present invention.
Claims (11)
1. A heat pipe circulating drinking liquid semiconductor refrigeration system is characterized by comprising a semiconductor refrigeration chip (1), a heat dissipation module (9) in contact with the hot end of the semiconductor refrigeration chip (1), and a refrigeration module (10) in contact with the cold end of the semiconductor refrigeration chip (1);
the heat dissipation module (9) comprises a heat pipe unit (5), a heat dissipation piece (6) and a cooling air driving device (7) used for providing cooling air for the heat dissipation piece (6), wherein the heat pipe unit (5) is arranged between the heat dissipation piece (6) and the hot end of the semiconductor refrigeration chip (1) to dissipate heat;
the refrigeration module (10) comprises a liquid cooling heat exchange unit (2), a storage container (3) and a pumping device (4), wherein the liquid cooling heat exchange unit, the storage container and the pumping device are connected through liquid paths to form a circulating liquid path (8), and the heat convection movement of liquid can be guided by the liquid movement track formed by the circulating liquid path (8), and local turbulence can be formed.
2. A heat pipe circulating potable liquid semiconductor refrigeration system according to claim 1, wherein the portion of the heat pipe unit (5) in contact with or adjacent to the hot end of the semiconductor refrigeration chip (1) is a heat pipe evaporator, and the portion in contact with or adjacent to the heat sink (6) is a heat pipe condenser, wherein the heat pipe unit (5) comprises a base plate (53) and a heat pipe (54), a heat pipe groove (531) is formed on the base plate (53), a middle section of the heat pipe (54) is embedded in the heat pipe groove (531) and protrudes from the heat pipe groove (531) to be in contact with the hot end of the semiconductor refrigeration chip (1), and both end regions are bent to be inserted into the inside of the heat sink (6) from both sides of the heat sink (6), respectively.
3. A heat pipe circulating potable liquid semiconductor refrigeration system according to claim 2, characterized in that a heat insulating plate (52) is provided between the base plate (53) and the heat sink (6).
4. A heat pipe circulating drinking liquid semiconductor refrigeration system according to claim 2, wherein the heat sink (6) comprises side plates (55) and heat sinks (51), a cooling air convection air duct (511) is formed between the heat sinks (51), and the cooling air driving device (7) comprises an air supply device arranged at an inlet of the cooling air convection air duct (511) and/or an air extraction device arranged at an outlet of the cooling air convection air duct (511).
5. A heat pipe cycle potable liquid semiconductor refrigeration system according to claim 1, wherein the cold end of the semiconductor refrigeration chip (1) extends into a recess (211) of the housing of the liquid-cooled heat exchange unit (2) to increase contact conduction area.
6. A heat pipe circulating potable liquid semiconductor refrigeration system according to claim 1, wherein the pumping means (4) is mounted at the inlet or outlet of the liquid-cooled heat exchange unit (2) to form an integrated module with the liquid-cooled heat exchange unit (2).
7. A heat pipe circulating drinking liquid semiconductor refrigeration system as claimed in any one of claims 1 to 6, wherein the side of the housing of the liquid-cooled heat exchange unit (2) in contact with the cold end of the semiconductor refrigeration chip (1) is a cold energy conducting portion.
8. A heat pipe circulating potable liquid semiconductor refrigeration system according to claim 7, characterized in that the cold energy conducting portion of the liquid-cooled heat exchange unit (2) is formed with a housing internal protrusion (22) for creating the local turbulence.
9. A heat pipe circulating potable liquid semiconductor refrigeration system according to claim 8, wherein the protrusions (22) inside the housing of the liquid-cooled heat exchange unit (2) form a circuitous path to increase the length of the path that the liquid passing through the liquid-cooled heat exchange unit (2) travels.
10. A heat pipe circulating potable liquid semiconductor refrigeration system according to any of claims 1-6, characterized in that the inlet of the storage container (3) is arranged at an upper portion of the storage container and the outlet is arranged at a lower portion of the storage container (3) to enable the formation of the local turbulence by liquid impact generated by a height difference.
11. A refrigeration appliance, wherein the refrigeration appliance comprises a heat pipe circulating potable liquid semiconductor refrigeration system according to any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920233212.2U CN210119065U (en) | 2019-02-21 | 2019-02-21 | Heat pipe circulation drinking liquid semiconductor refrigerating system and refrigerating equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920233212.2U CN210119065U (en) | 2019-02-21 | 2019-02-21 | Heat pipe circulation drinking liquid semiconductor refrigerating system and refrigerating equipment |
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| CN210119065U true CN210119065U (en) | 2020-02-28 |
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| CN201920233212.2U Active CN210119065U (en) | 2019-02-21 | 2019-02-21 | Heat pipe circulation drinking liquid semiconductor refrigerating system and refrigerating equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111479039A (en) * | 2020-03-13 | 2020-07-31 | 北京青木子科技发展有限公司 | Freezing camera system supporting liquid circulation heat dissipation and heat dissipation method |
| CN114719556A (en) * | 2021-01-06 | 2022-07-08 | 青岛海尔特种电冰柜有限公司 | Water dispenser and control method |
| CN114719555A (en) * | 2021-01-06 | 2022-07-08 | 青岛海尔特种电冰柜有限公司 | Drinking machine and control method |
-
2019
- 2019-02-21 CN CN201920233212.2U patent/CN210119065U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111479039A (en) * | 2020-03-13 | 2020-07-31 | 北京青木子科技发展有限公司 | Freezing camera system supporting liquid circulation heat dissipation and heat dissipation method |
| CN114719556A (en) * | 2021-01-06 | 2022-07-08 | 青岛海尔特种电冰柜有限公司 | Water dispenser and control method |
| CN114719555A (en) * | 2021-01-06 | 2022-07-08 | 青岛海尔特种电冰柜有限公司 | Drinking machine and control method |
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