CN218218121U - Liquid cooling phase change heat radiator for electronic component - Google Patents
Liquid cooling phase change heat radiator for electronic component Download PDFInfo
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- CN218218121U CN218218121U CN202222313998.3U CN202222313998U CN218218121U CN 218218121 U CN218218121 U CN 218218121U CN 202222313998 U CN202222313998 U CN 202222313998U CN 218218121 U CN218218121 U CN 218218121U
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Abstract
The utility model provides an electronic component liquid cooling phase transition heat abstractor, belonging to the technical field of electronic component heat dissipation, comprising an equipment bracket, an evaporation box body and a condensation box body; the evaporation box body is arranged at the upper end of the equipment support, an evaporation liquid cooling plate is arranged in the evaporation box body, and the evaporation liquid cooling plate is attached to the radiating element; a condenser heat exchange tube and an air cooling channel are arranged in the condensation box body; the upper end of the condenser heat exchange tube is provided with a refrigerant gas pipeline used for communicating the upper end of the evaporative liquid cooling plate, and the lower end of the condenser heat exchange tube is provided with a refrigerant liquid pipeline used for communicating the lower end of the evaporative liquid cooling plate; and a condensing fan is arranged in the air cooling channel. The liquid cooling phase change heat dissipation device for the electronic component provided by the utility model completes the circulation through the temperature difference and gravity of the refrigerant, and the device has simple structure; the refrigerant is always in a closed environment during operation without consideration of freezing prevention, liquid supplementation and the like; the whole refrigerating system saves energy and increases the reliability of the equipment.
Description
Technical Field
The utility model belongs to the technical field of the electronic components heat dissipation, more specifically says, relates to an electronic components liquid cooling phase transition heat abstractor.
Background
Aiming at the field of heat dissipation of electronic components at present, the heat productivity of electronic equipment is higher and higher, and particularly electronic components such as insulated gate bipolar transistors (IGBT for short) in power transmission and distribution equipment are generally arranged in a centralized mode, the space is small, the heat is large, forced air cooling is used in the industry at present, the IGBT with small heat productivity can still adopt liquid cooling (such as glycol solution and the like) basically for the IGBT with large heat productivity, and the operation can be completed only by considering winter freezing prevention, liquid supplement in operation and complex configuration of an external pump set, a heat dissipation system and a pipeline system.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electronic components liquid cooling phase transition heat abstractor aims at solving the refrigerant and need in service the fluid infusion and set up outside pump package and lead to the refrigerating system complicated problem.
In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides an electronic components liquid cooling phase transition heat abstractor, includes:
the upper end surface of the equipment support and the lower end surface of the equipment support form an included angle;
the evaporation box body is arranged at the upper end of the equipment support, an evaporation liquid cooling plate is arranged in the evaporation box body, and the evaporation liquid cooling plate is attached to a radiating element;
the condenser box body is positioned above the evaporation box body, and a condenser heat exchange tube and an air cooling channel communicated with the outside air are arranged in the condenser box body; the upper end of the condenser heat exchange tube is provided with a refrigerant gas pipeline for communicating the upper end of the evaporated liquid cooling plate, and the lower end of the condenser heat exchange tube is provided with a refrigerant liquid pipeline for communicating the lower end of the evaporated liquid cooling plate; the condenser heat exchange tube, the refrigerant liquid pipeline, the evaporation liquid cooling plate and the refrigerant gas pipeline are sequentially connected end to form a first circulation channel; and a condensing fan is arranged in the air cooling channel, and the air cooling channel is used for cooling the refrigerant in the heat exchange tube of the condenser.
As another embodiment of the present application, the first circulation channel includes a plurality of cooling circulation pipes arranged in parallel, and the plurality of cooling circulation pipes are distributed in a loop shape.
As another embodiment of the present application, a needle valve is provided on the cooling circulation line.
As another embodiment of the application, the inner walls of the heat exchange tubes of the condenser and the inner wall of the refrigerant flow channel of the evaporation liquid cooling plate are both provided with heat exchange enhancement parts.
As another embodiment of the present application, the heat exchange enhancing part is a convex structure.
As another embodiment of the present application, a heat conducting layer is disposed between the evaporation liquid cooling plate and the heat dissipation element.
As another embodiment of the present application, the heat conductive layer is a heat conductive silicone grease.
As another embodiment of the present application, the evaporating liquid cooling plate is longitudinally arranged to divide the evaporating tank into a front cavity and a rear cavity; the upper end and the lower end of the evaporated liquid cooling plate are respectively provided with an upper channel and a lower channel which are communicated with the front cavity and the rear cavity; the front cavity, the upper channel, the rear cavity and the lower channel are sequentially connected end to form a second circulation channel; and a circulating fan is arranged at the lower end of the front cavity.
As another embodiment of the present application, the flow area of the front cavity is larger than the flow area of the rear cavity.
As another embodiment of this application, the evaporation box with the condensation box interval sets up, just be provided with connection structure support piece between the evaporation box with the condensation box.
The utility model provides an electronic components liquid cooling phase transition heat abstractor's beneficial effect lies in: compared with the prior art, the liquid cooling phase change heat dissipation device for the electronic component realizes circulation by the aid of gravity and temperature difference, the gaseous refrigerant is condensed into the liquid refrigerant in the condensation box and is conveyed into the evaporation box by the aid of gravity, and the heat of the heat dissipation element is absorbed in the evaporation box to form the gaseous refrigerant; the circulation is completed through the temperature difference and gravity of the refrigerant, and the device has a simple structure; the refrigerant is always in a closed environment during operation without consideration of freezing prevention, liquid supplementation and the like; the whole refrigerating system saves energy, increases the reliability of the equipment and ensures the safe and stable operation of electronic components.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural view of a liquid-cooled phase-change heat dissipation device for electronic components according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a cooling apparatus provided by an embodiment of the present invention;
fig. 3 is a side view of a cooling apparatus provided by an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a first circulation channel according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a second circulation channel according to an embodiment of the present invention.
In the figure: 1. an equipment support; 2. an evaporation box body; 3. a condensing box body; 4. a refrigerant gas line; 5. a refrigerant liquid line; 6. a needle valve; 7. a condenser heat exchange tube; 8. a condensing fan; 9. a fin; 10. a connecting structural support; 11. a heat dissipating element; 12. a circulation fan; 13. evaporating the liquid cooling plate; 14. a heat exchange enhancement part.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 5, the liquid-cooled phase change heat dissipation device for electronic components according to the present invention will now be described. The liquid-cooled phase change heat dissipation device for the electronic component comprises an equipment support 1, an evaporation box body 2 and a condensation box body 3; the upper end surface of the equipment bracket 1 and the lower end surface of the equipment bracket 1 form an included angle; the evaporation box body 2 is arranged at the upper end of the equipment bracket 1, an evaporation liquid cold plate 13 is arranged in the evaporation box body 2, and the evaporation liquid cold plate 13 is attached to the radiating element 11; the condensing box body 3 is positioned above the evaporating box body 2, and a condenser heat exchange tube 7 and an air cooling channel communicated with the outside air are arranged in the condensing box body 3; the upper end of the heat exchange tube 7 of the condenser is provided with a refrigerant gas pipeline 4 for communicating the upper end of the evaporative liquid cooling plate 13, and the lower end of the heat exchange tube 7 of the condenser is provided with a refrigerant liquid pipeline 5 for communicating the lower end of the evaporative liquid cooling plate 13; the condenser heat exchange tube 7, the refrigerant liquid pipeline 5, the evaporated liquid cooling plate 13 and the refrigerant gas pipeline 4 are sequentially connected end to form a first circulation channel; a condensing fan 8 is arranged in the air cooling channel, and the air cooling channel is used for cooling a refrigerant in the heat exchange tube 7 of the condenser.
Compared with the prior art, the liquid cooling phase change heat dissipation device for the electronic component provided by the utility model has the advantages that the upper end surface and the lower end surface of the equipment bracket 1 are arranged at an included angle, and a circulating gravity environment condition is provided for the evaporation box body 2 and the condensation box body 3; gravity is the circulating power of the refrigerant in the first circulating passage; the outside air introduced into the air-cooled passage by the condensing fan 8 serves as a cold source for cooling the refrigerant in the first circulation passage.
The medium in the first circulation channel is a refrigerant, the refrigerant is cooled by outside air in the heat exchange tube 7 of the condenser to form a low-temperature liquid refrigerant, the low-temperature liquid refrigerant enters the refrigerant liquid pipeline 5, the low-temperature liquid refrigerant enters the refrigerant flow channel in the evaporated liquid cold plate 13 through the refrigerant liquid pipeline 5 and exchanges heat with the radiating element 11 through the evaporated refrigerant plate, the refrigerant absorbs heat in the heat exchange process and becomes a gaseous refrigerant, and the gaseous refrigerant flows back to the heat exchange tube 7 of the condenser from the refrigerant gas pipeline 4.
The utility model provides an electronic components liquid cooling phase transition heat abstractor, the refrigerant relies on gravity and difference in temperature to realize the circulation, and gaseous state refrigerant condenses to liquid refrigerant in the condensation box 3 to rely on gravity to carry to evaporation box 2 in, and absorb the heat of radiating element 11 and form gaseous state refrigerant in evaporation box 2; the circulation is completed through the temperature difference and the gravity of the refrigerant, and the device has a simple structure; the refrigerant is always in a closed environment during operation without consideration of freezing prevention, liquid supplementation and the like; the whole refrigerating system is energy-saving, the reliability of the equipment is improved, and the safe and stable operation of electronic components is ensured.
Optionally, an angle between the upper end surface and the lower end surface of the device bracket 1 is α, and a value of α may be adjusted according to an environmental requirement. The same heat dissipation device can be matched with functional supports with different alpha angles, and the heat dissipation amount can be correspondingly changed along with the change of the angles so as to adapt to different installation environments. The connecting structure supporting piece 10 is arranged between the evaporation box body 2 and the condensation box body 3, so that the evaporation box body 2 and the condensation box body 3 are arranged at intervals and are parallel, and the arrangement of the refrigerant gas pipeline 4 and the refrigerant liquid pipeline 5 which are positioned at two sides of the evaporation box body 2 and the condensation box body 3 is facilitated.
Optionally, the air cooling channel is horizontally arranged; a plurality of condensing fans 8 are arranged at intervals along the length direction of the condensing box body 3 on one side of the air cooling channel close to the air outlet.
In some possible embodiments, referring to fig. 1, fig. 2 and fig. 5, the first circulation channel includes a plurality of parallel cooling circulation pipes, and the plurality of cooling circulation pipes are distributed in a loop shape. A plurality of cooling circulation pipelines all form closed circulation pipeline respectively, when appearing the refrigerant and reveal all the way, can not influence the refrigeration work on other ways, have improved the reliability of equipment safety.
Each cooling circulation pipeline is provided with a needle valve 6, and the needle valve 6 can be used for pressurizing and detecting the inside of the system, vacuumizing, filling refrigerant, maintaining and detecting and the like.
The refrigerant flow channels of the condenser heat exchange tubes 7 and the evaporation liquid cold plate 13 are used as main heat exchange structures, heat exchange enhancing parts 14 can be arranged on the inner walls of the condenser heat exchange tubes and the evaporation liquid cold plate, the heat exchange enhancing parts 14 can be made into protrusions in thread shapes or other shapes, and the height directions of the protrusions are consistent with the radial directions of the flow channels or pipelines. The heat exchange enhancing part 14 can increase the bypass flow inside the flow channel or the pipe and increase the heat exchange area inside, so as to enhance the heat exchange. The outer side wall of the heat exchange tube 7 of the condenser can be provided with fins 9 extending outwards.
In order to improve the cooling effect of the heat dissipation element 11, a heat conduction layer, such as heat conduction silicone grease, may be further disposed between the heat dissipation element 11 and the evaporation liquid cooling plate 13. The heat conduction layer enhances the bonding strength between the heat dissipation element 11 and the evaporation liquid cooling plate 13, and ensures the heat transfer effect.
In some possible embodiments, please refer to fig. 2 to 4, the evaporating liquid cooling plate 13 is longitudinally arranged to divide the evaporating tank 2 into a front cavity and a rear cavity; the upper end and the lower end of the evaporation liquid cold plate 13 are respectively provided with an upper channel and a lower channel which are communicated with the front cavity and the rear cavity; the front cavity, the upper channel, the rear cavity and the lower channel are sequentially connected end to form a second circulating channel; the lower end of the front chamber is provided with a circulation fan 12.
The circulating medium in the second circulating channel is air, and the low-temperature air flows from top to bottom in the front cavity under the action of the circulating fan 12 and exchanges heat with the heat dissipation element 11 on the evaporation liquid cooling plate 13 in the flowing process; the low-temperature air absorbs heat when passing through the front cavity to form medium-temperature air, then enters the upper channel, and exchanges heat with the gaseous refrigerant in the refrigerant gas pipeline 4 connected with the evaporated liquid cold plate 13 in the upper channel, and the medium-temperature air is cooled to form medium-low-temperature air; the medium-low temperature air enters the rear cavity, and secondary heat exchange is realized between the medium-low temperature air and the heat dissipation element 11 in the rear cavity to form high-temperature air; high-temperature air enters the lower channel, and exchanges heat with liquid refrigerant in the refrigerant liquid pipeline 5 connected with the evaporation liquid cooling plate 13 in the lower channel, and finally low temperature is recovered. The second circulation passage increases air turbulence around the heat radiating element 11 and increases the heat radiating area of the heat radiating element 11, thereby improving the heat radiating efficiency of the heat radiating element 11.
Because the temperature of the gaseous refrigerant is higher than that of the liquid refrigerant, the heat exchange amount of the air and the gaseous refrigerant is less than that of the liquid refrigerant, namely the heat exchange amount in the upper channel is less than that in the lower channel.
In the second circulation passage, the flow area of the front chamber is larger than that of the rear chamber. The larger the flow area, the lower the flow velocity at the same flow rate. Because the flow area of the front cavity is larger than that of the rear cavity, the low-temperature air has lower wind speed in the front cavity, the low air temperature is favorable for the heat dissipation of the heat dissipation element 11, but the low wind speed is not favorable for the heat dissipation; the air with medium and low temperature has high wind speed in the back cavity, the wind speed is favorable for heat dissipation, but the medium and low temperature is not favorable for heat dissipation. Through adjusting the flow area of front cavity and rear cavity, make the velocity of flow of low temperature air be less than the velocity of flow of the air of medium-high temperature, and then reached the unanimous purpose of the front and back portion heat dissipation capacity of guaranteeing radiating element 11, guaranteed radiating element 11's temperature uniformity.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. Electronic components liquid cooling phase transition heat abstractor, its characterized in that includes:
the upper end surface of the equipment support and the lower end surface of the equipment support form an included angle;
the evaporation box body is arranged at the upper end of the equipment support, an evaporation liquid cooling plate is arranged in the evaporation box body, and the evaporation liquid cooling plate is attached to a radiating element;
the condenser box body is positioned above the evaporation box body, and a condenser heat exchange tube and an air cooling channel communicated with outside air are arranged in the condenser box body; the upper end of the condenser heat exchange tube is provided with a refrigerant gas pipeline for communicating the upper end of the evaporated liquid cooling plate, and the lower end of the condenser heat exchange tube is provided with a refrigerant liquid pipeline for communicating the lower end of the evaporated liquid cooling plate; the condenser heat exchange tube, the refrigerant liquid pipeline, the evaporation liquid cooling plate and the refrigerant gas pipeline are sequentially connected end to form a first circulation channel; and a condensing fan is arranged in the air cooling channel, and the air cooling channel is used for cooling the refrigerant in the heat exchange tube of the condenser.
2. The liquid-cooled phase-change heat dissipation device for electronic components of claim 1, wherein the first circulation channel comprises a plurality of parallel cooling circulation pipes, and the plurality of cooling circulation pipes are distributed in a zigzag shape.
3. The liquid-cooled phase-change heat dissipation device for electronic components of claim 2, wherein the cooling circulation line is provided with a needle valve.
4. The liquid-cooled phase-change heat dissipation device for electronic components of claim 1, wherein the inner walls of the heat exchange tubes of the condenser and the refrigerant channels of the evaporating liquid-cooled plate are provided with heat exchange enhancement portions.
5. The liquid-cooled phase-change heat dissipation device for electronic components of claim 4, wherein the heat exchange enhancement portion is a protrusion structure.
6. The liquid-cooled phase-change heat dissipation device for electronic components of claim 1, wherein a heat conductive layer is disposed between the evaporating liquid-cooled plate and the heat dissipation element.
7. The liquid-cooled phase-change heat dissipation device for electronic components of claim 6, wherein said heat conductive layer is a thermally conductive silicone grease.
8. The liquid-cooled phase-change heat dissipation device for electronic components as recited in claim 1, wherein the evaporation liquid cooling plate is disposed longitudinally to divide the evaporation tank into a front cavity and a rear cavity; the upper end and the lower end of the evaporated liquid cooling plate are respectively provided with an upper channel and a lower channel which are communicated with the front cavity and the rear cavity; the front cavity, the upper channel, the rear cavity and the lower channel are sequentially connected end to form a second circulation channel; and a circulating fan is arranged at the lower end of the front cavity.
9. The liquid-cooled phase-change heat dissipation device for electronic components of claim 8, wherein the flow area of said front cavity is larger than the flow area of said back cavity.
10. The liquid-cooled phase-change heat dissipation device for electronic components of claim 1, wherein the evaporation tank and the condensation tank are spaced apart from each other, and a connecting structure support is disposed between the evaporation tank and the condensation tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222313998.3U CN218218121U (en) | 2022-08-31 | 2022-08-31 | Liquid cooling phase change heat radiator for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222313998.3U CN218218121U (en) | 2022-08-31 | 2022-08-31 | Liquid cooling phase change heat radiator for electronic component |
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| Publication Number | Publication Date |
|---|---|
| CN218218121U true CN218218121U (en) | 2023-01-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222313998.3U Active CN218218121U (en) | 2022-08-31 | 2022-08-31 | Liquid cooling phase change heat radiator for electronic component |
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| Country | Link |
|---|---|
| CN (1) | CN218218121U (en) |
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- 2022-08-31 CN CN202222313998.3U patent/CN218218121U/en active Active
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