CN208238295U - A kind of heat pipe-type semiconductor heat-exchange system - Google Patents

A kind of heat pipe-type semiconductor heat-exchange system Download PDF

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Publication number
CN208238295U
CN208238295U CN201820303075.0U CN201820303075U CN208238295U CN 208238295 U CN208238295 U CN 208238295U CN 201820303075 U CN201820303075 U CN 201820303075U CN 208238295 U CN208238295 U CN 208238295U
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header
heat
flat tube
chilling plate
semiconductor chilling
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CN201820303075.0U
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Inventor
孙继东
丁式平
何慧丽
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Beijing Hot Mdt Infotech Ltd
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Beijing Hot Mdt Infotech Ltd
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Abstract

A kind of heat pipe-type semiconductor heat-exchange system, including evaporator, condenser and connecting pipe;The import of the outlet connection condenser of the evaporator, the import of the outlet connection evaporator of condenser;The condenser is located at the top of evaporator;The evaporator includes the first header, the second header, multiple flat tubes, semiconductor chilling plate group and the fins set for being connected to the first header and the second header;The both ends of all flat tubes are inserted into respectively in the first header and the second header being placed in parallel, and flat tube longitudinal arrangement between the first header and the second header;The fins set is mounted between flat tube and flat tube;The semiconductor chilling plate group is mounted between flat tube and fins set, and the cold end of the semiconductor chilling plate group is contacted with fins set, and the hot end of semiconductor chilling plate group is contacted with the side of flat tube.

Description

A kind of heat pipe-type semiconductor heat-exchange system
Technical field
This application involves heat dissipation refrigerating fields, in particular to a kind of heat pipe-type semiconductor heat-exchange system.
Background technique
For semiconductor refrigeration radiating, it is primarily present wind-cooling heat dissipating, water-cooling, heat pipe heat radiation and heat pipe and wind at present Fan combination four kinds of common radiating modes of heat dissipation: wind-cooling heat dissipating efficiency is lower;Water-cooling is high-efficient, but structure is complex, Volume is big;Heat pipe heat radiation energy conservation and environmental protection and structure is simple, but radiating efficiency is to be improved;The radiating efficiency of heat pipe and combination of fans It improves a lot compared with heat pipe heat radiation.
Heat exchange of heat pipe mainly by fit with semiconductor chilling plate hot end pedestal, for the heat-conductive thermo tube of efficient heat transfer Fin composition with for heat dissipation, absorbs the heat that semiconductor chilling plate hot end generates by heat pipe, and transfer heat to wing It radiates at piece;But this heat exchanger heat exchange efficiency is still undesirable.
Summary of the invention
The shortcomings that the purpose of this utility model is exactly to overcome the prior art, and a kind of efficient heat pipe-type half is provided Conductor heat-exchange system.
A kind of in order to achieve the above object, the technical solution of the present invention is: heat pipe-type semiconductor heat-exchange system, including Evaporator, condenser and connecting pipe;The import of the outlet connection condenser of the evaporator, the outlet of condenser, which connects, steams Send out the import of device;The condenser is located at the top of evaporator;The evaporator includes the first header, the second header, connects Multiple flat tubes, semiconductor chilling plate group and the fins set of logical first header and the second header;Distinguish at the both ends of all flat tubes It is inserted into the first header and the second header being placed in parallel, and flat tube is longitudinal between the first header and the second header Arrangement;The fins set is mounted between flat tube and flat tube;The semiconductor chilling plate group is mounted between flat tube and fins set, The cold end of the semiconductor chilling plate group is contacted with fins set, and the hot end of semiconductor chilling plate group is contacted with the side of flat tube, this After sample semiconductor chilling plate is powered, the cooling capacity that the cold end of semiconductor chilling plate generates carries out heat exchange by fins set and air, Cooling surrounding air, the coolant liquid in heat and evaporator that the hot end of semiconductor chilling plate generates carry out heat exchange.
Further, a kind of heat pipe-type semiconductor heat-exchange system includes evaporator, condenser, fluorine pump and connecting pipe; The import of the outlet connection fluorine pump of the evaporator, the import of the outlet connection condenser of fluorine pump, the outlet of condenser, which connects, steams Send out the import of device;The evaporator includes the more of the first header, the second header, the first header of connection and the second header A flat tube, semiconductor chilling plate group and fins set;The first header being placed in parallel and are inserted into the both ends of all flat tubes respectively In two headers, and flat tube longitudinal arrangement between the first header and the second header;The fins set be mounted on flat tube with Between flat tube;The semiconductor chilling plate group is mounted between flat tube and fins set, the cold end of the semiconductor chilling plate group with Fins set contact, the hot end of semiconductor chilling plate group is contacted with the side of flat tube.
Further, multiple microchannels are provided on the flat tube of the evaporator, are connected to first by the microchannel of flat tube Header and the second header, and the microchannel of flat tube corresponds to flat tube along the first header and the second header longitudinal arrangement; Flat tube is with the first header and the second header by being welded and fixed and sealing.
Further, semiconductor chilling plate pedestal, semiconductor system are additionally provided between the semiconductor chilling plate group and flat tube Each semiconductor chilling plate in cold group is mounted on the heat absorbing end in semiconductor chilling plate pedestal, semiconductor chilling plate pedestal Radiating end is mounted on flat tube.
The utility model has the advantage that 1, heat exchange efficiency height;2, simple for production, complicated large scale equipment is not needed, It is at low cost;3, without using compressor, being passed directly into coolant liquid in flat tube can be realized the refrigeration effect of air-conditioning.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the first form of the utility model heat pipe-type semiconductor heat-exchange system.
Fig. 2 is the structural schematic diagram of second of form of the utility model heat pipe-type semiconductor heat-exchange system.
Fig. 3 is the structural schematic diagram of the utility model evaporator.
Fig. 4 is the structural schematic diagram of flat tube in Fig. 3.
In figure: 100, evaporator;110, the first header;120, the second header;130, flat tube;131, microchannel; 140, semiconductor chilling plate group;150, fins set;200, condenser;300, fluorine pumps.
Specific embodiment
The utility model is further illustrated with embodiment below, as described below is only the preferred embodiment of the utility model , it is not intended to limit the utility model, it is right although the utility model is described in detail with reference to the foregoing embodiments For those skilled in the art, it is still possible to modify the technical solutions described in the foregoing embodiments, or Equivalent replacement of some of the technical features.Within the spirit and principle of the utility model, it is made it is any modification, Equivalent replacement, improvement etc., should be included within the scope of protection of this utility model.
Embodiment one:
Please refer to shown in Fig. 1, the utility model heat pipe-type semiconductor heat-exchange system include evaporator 100, condenser 200, Evaporator fan (unmarked in figure to come out), condenser fan (unmarked in figure to come out) and connecting pipe;The evaporator The import of 100 outlet connection condenser 200, the import of the outlet connection evaporator 100 of condenser 200;The condenser 200 Positioned at the top of evaporator 100;The evaporator fan is mounted on evaporator 100;Condenser fan is mounted on condenser 200 On;Punching has coolant liquid in heat pipe-type semiconductor heat-exchange system, and the coolant liquid is freon.
The condenser 200 is air-cooled condenser or evaporative condenser.
It please refers to shown in Fig. 3, the evaporator 100 includes the first header 110, the second header 120, the first collection of connection Flow tube 110 and a flat tube 130 of the second header more than 120, semiconductor chilling plate group 140 and fins set 150;All flat tubes 130 Both ends are inserted into respectively in the first header 110 and the second header 120, and the first header 110 is relative to the second header 120 Parallel;Flat tube 130 is with the first header 110 and the second header 120 by being welded and fixed and sealing;The fins set 150 It is mounted between flat tube 130 and flat tube 130;The semiconductor chilling plate group 140 is installed between flat tube 130 and fins set 150;Institute The cold end for stating semiconductor chilling plate group 140 is contacted with fins set, the hot end of semiconductor chilling plate group 140 and the side of flat tube 130 Contact;Heat-conducting silicone grease is equipped between the side that the hot end of semiconductor chilling plate group 140 is contacted with flat tube 130.
The working principle of heat pipe-type semiconductor heat-exchange system in the present embodiment: semiconductor chilling plate group 140, evaporator fan Work is separately energized with condenser fan, the cooling capacity that 140 cold end of semiconductor chilling plate group generates is through fins set 150 and surrounding air Carry out heat exchange, cooling surrounding air;In the flat tube 130 of heat and evaporator 100 that 140 hot end of semiconductor chilling plate group generates Coolant liquid carry out heat exchange, the coolant liquid in flat tube 130 absorbs heat and is simultaneously evaporated to gas, and the gaseous state for evaporating formation is cooling Liquid, gaseous state coolant liquid enter gas-guide tube through the first header 110, enter condenser 200, condenser 200 and cold source through gas-guide tube Heat exchange is carried out, the coolant liquid in condenser 200 is condensed into liquid, and releases heat, condenses the liquid coolant of formation in weight Enter evaporator 100 by catheter under the action of power to be exchanged heat again;Endlessly indoor thermal energy is passed in this way Output is gone, and is reduced temperature in room, is achieved the purpose that refrigeration.
Embodiment two:
Please refer to shown in Fig. 2, the utility model heat pipe-type semiconductor heat-exchange system include evaporator 100, condenser 200, Evaporator fan (unmarked in figure to come out), condenser fan (unmarked in figure to come out), fluorine pump 300 and connecting pipe;Institute State the import of the outlet connection fluorine pump 300 of evaporator 100, the import of the outlet connection condenser 200 of fluorine pump 300, condenser 200 Outlet connection evaporator 100 import;The installation site limit for the evaporator 100 and condenser 200 that the addition of fluorine pump 300 avoids System, while circulation power is increased for entire circulation loop;The evaporator fan is mounted on evaporator 100;Condenser wind Fan is mounted on condenser 200;Punching has coolant liquid in heat pipe-type semiconductor heat-exchange system, and the coolant liquid is freon;It please join It examines shown in Fig. 3, the evaporator 100 includes the first header 110, the second header 120, the first header 110 of connection and the A flat tube 130 of two header more than 120, semiconductor chilling plate group 140 and fins set 150;The both ends of all flat tubes 130 are inserted into respectively In first header 110 and the second header 120, the first header 110 is parallel relative to the second header 120;Flat tube 130 with the first header 110 and the second header 120 by being welded and fixed and sealing;The fins set 150 is mounted on flat tube Between 130 and flat tube 130;The semiconductor chilling plate group 140 is installed between flat tube 130 and fins set 150;The semiconductor system The cold end of cold group 140 is contacted with fins set, and the hot end of semiconductor chilling plate group 140 is contacted with the side of flat tube 130;Semiconductor Heat-conducting silicone grease is equipped between the side that the hot end of cooling piece group 140 is contacted with flat tube 130.
The working principle of heat pipe-type semiconductor heat-exchange system in the present embodiment: semiconductor chilling plate group 140, is steamed fluorine pump 300 Hair device fan and condenser fan are separately energized work, the cooling capacity that 140 cold end of semiconductor chilling plate group generates through fins set 150 with Surrounding air carries out heat exchange, cooling surrounding air;The heat that 140 hot end of semiconductor chilling plate group generates and evaporator 100 Coolant liquid in flat tube 130 carries out heat exchange, and the coolant liquid in flat tube 130 absorbs heat and is evaporated to gas, evaporates formation Gaseous state coolant liquid, gaseous state coolant liquid enter gas-guide tube through the first header 110, enter condenser 200, condenser through gas-guide tube 200 carry out heat exchange with cold source, and the coolant liquid in condenser 200 is condensed into liquid, and releases heat, and the liquid for condensing formation is cold But liquid enters evaporator 100 under the pumping pressure of fluorine pump 300 and is exchanged heat again;So endlessly indoor thermal energy It transfers out, reduces temperature in room, achieve the purpose that refrigeration.
In two embodiments described above, it is provided with multiple microchannel 131(on the flat tube 130 of the evaporator 100 and asks With reference to shown in Fig. 4), the first header 110 and the second header 120, and flat tube 130 are connected to by the microchannel 131 of flat tube 130 Microchannel 131 correspond to flat tube 130 along 120 longitudinal arrangement of the first header 110 and the second header.The condenser 200 It is air-cooled condenser or evaporative condenser.
In addition, the semiconductor chilling plate group 140 of the evaporator 100 includes that semiconductor chilling plate pedestal and being mounted on partly is led Multiple semiconductor chilling plates on cold pedestal of system, the cold end of semiconductor chilling plate are mounted in semiconductor chilling plate pedestal The radiating end of heat absorbing end, semiconductor chilling plate pedestal is mounted on flat tube;The heat absorbing end of the semiconductor chilling plate pedestal and half Heat-conducting silicone grease is provided between conductor cooling piece;It is provided between the radiating end and flat tube 130 of the semiconductor chilling plate pedestal Heat-conducting silicone grease.
First header 110, the second header 120, flat tube 130, semiconductor chilling plate pedestal 160 and fins set 151 are made of aluminum alloy materials.Certainly, in other embodiments, the first header 110, the second header 120, flat tube 130, semiconductor chilling plate pedestal 160 and fins set 151 are to be made to be made of other materials of aluminum alloy materials.
It should be noted that for each embodiment above-mentioned, for simple description, therefore, it is stated as component or portion Part combination, but those skilled in the art should understand that, the application is not limited by described component names, because of foundation The application, certain components may be implemented the function of above-mentioned corresponding component also within the scope of protection of this application.Secondly, ability Field technique personnel also should be aware of, and the embodiments described in the specification are all preferred embodiments, and related component is not It must be necessary to the application.
In several embodiments provided herein, it should be understood that disclosed technology contents can pass through others Mode is realized.Wherein, the apparatus embodiments described above are merely exemplary, such as the division of the unit, only A kind of logical function partition, there may be another division manner in actual implementation, for example, multiple units or components can combine or Person is desirably integrated into another system, or some features can be ignored or not executed.
The above is only the preferred embodiment of the application, it is noted that for the ordinary skill people of the art For member, under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications are also answered It is considered as the protection scope of the application.

Claims (4)

1. a kind of heat pipe-type semiconductor heat-exchange system, including evaporator, condenser and connecting pipe;It is characterized by: described The import of the outlet connection condenser of evaporator, the import of the outlet connection evaporator of condenser;The condenser is located at evaporation The top of device;The evaporator includes the multiple of the first header, the second header, the first header of connection and the second header Flat tube, semiconductor chilling plate group and fins set;The first header and second being placed in parallel is inserted at the both ends of all flat tubes respectively In header, and flat tube longitudinal arrangement between the first header and the second header;The fins set be mounted on flat tube with it is flat Between pipe;The semiconductor chilling plate group is mounted between flat tube and fins set, the cold end and wing of the semiconductor chilling plate group The contact of piece group, the hot end of semiconductor chilling plate group are contacted with the side of flat tube, after such semiconductor chilling plate is powered, semiconductor system The cooling capacity that cold cold end generates carries out heat exchange, cooling surrounding air, the heat of semiconductor chilling plate by fins set and air The coolant liquid in the heat and evaporator generated is held to carry out heat exchange.
2. a kind of heat pipe-type semiconductor heat-exchange system according to claim 1, it is characterised in that: it further include fluorine pump, it is described Fluorine pump is mounted between the outlet of evaporator and the import of condenser.
3. a kind of heat pipe-type semiconductor heat-exchange system according to claim 1 or 2, it is characterised in that: the evaporator It is provided with multiple microchannels on flat tube, the first header and the second header are connected to by the microchannel of flat tube, and flat tube is micro- Channel corresponds to flat tube along the first header and the second header longitudinal arrangement;Flat tube and the first header and the second header are logical It crosses and is welded and fixed and seals.
4. a kind of heat pipe-type semiconductor heat-exchange system according to claim 1 or 2, it is characterised in that: the semiconductor system Cold is additionally provided with semiconductor chilling plate pedestal between group and flat tube, each semiconductor chilling plate installation in semiconductor chilling plate group It is mounted on flat tube in the radiating end of the heat absorbing end in semiconductor chilling plate pedestal, semiconductor chilling plate pedestal.
CN201820303075.0U 2018-03-06 2018-03-06 A kind of heat pipe-type semiconductor heat-exchange system Active CN208238295U (en)

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CN201820303075.0U CN208238295U (en) 2018-03-06 2018-03-06 A kind of heat pipe-type semiconductor heat-exchange system

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111750713A (en) * 2020-05-15 2020-10-09 华北电力大学 Vapor-liquid phase separation type loop heat pipe heat dissipation device with inserted porous membrane and working method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111750713A (en) * 2020-05-15 2020-10-09 华北电力大学 Vapor-liquid phase separation type loop heat pipe heat dissipation device with inserted porous membrane and working method thereof

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