CN114531830A - Power module and power cabinet - Google Patents

Abstract

The invention discloses a power module, comprising a radiator, a power semiconductor device, a conductive row and a power module structural body. The radiator includes at least one condenser and at least one evaporator, and the evaporator is arranged on the lower layer of the power module structural body. The condenser is arranged on the upper layer of the main body of the power module structure, the device installation surface of the evaporator is a vertical plane, the condenser is provided with at least two air inlet surfaces, and the air inlet surface of the condenser and the device installation surface of the evaporator form together Y-shaped structure layout. The power module has a compact structure and high space utilization, which can improve the heat exchange capability of the power module, improve the power density of the equipment, and reduce the overall cost of the system.

Description

A power module and power cabinet

technical field

The invention relates to the technical field of heat dissipation of power electronic equipment, in particular to a power module power cabinet.

Background technique

High-power power electronic equipment is mainly composed of power semiconductors, heat sinks, capacitors, inductors, and some distribution switching devices. The radiator is mainly responsible for transferring the heat generated by the power conversion of the power semiconductor during the working process. Considering factors such as maintenance and electrical performance, the current conventional practice is to integrate IGBTs, heat sinks, and capacitors into a module called a power module.

With the development of the industry, the power of power electronic equipment is getting bigger and bigger, and the calorific value also increases accordingly. However, due to the limitation of installation volume and cost, the size of the equipment needs to be further reduced, the power density is further increased, and the development of heat dissipation technology has gradually become a bottleneck restricting the development of the industry.

The traditional cooling technology mainly includes air cooling and water cooling. Water cooling itself is a more suitable and ideal choice for heat dissipation of high-power electronic equipment due to its large medium density and heat capacity, and high heat carrying capacity. However, for reasons and considerations of maintenance, reliability and cost, in many occasions, air-cooled heat dissipation has its irreplaceable advantages and status.

The layout of the existing power module and its cabinet is shown in Figure 1. One or more power modules form a cabinet. The radiator adopts a fin structure. The air-cooled radiator used mainly adopts ordinary radiators such as aluminum extrusion profiles, inserts, welded fins, etc. In order to further improve the power density, a heat pipe will be added on the basis of the above radiator to further enhance the heat conduction and heat dissipation capacity of the radiator. A vent is opened at the position of the module heat sink corresponding to the air guide cavity, and the heat generated during the operation of the power semiconductor device is transferred out of the cabinet through the drive of the fan.

The heat dissipation efficiency of the heat sink used in the power module of the prior art is low, and a large heat exchange area is required, so that the structure is bulky.

Under the condition of further increasing the power density, increasing the heat pipe cannot meet the requirement of heat dissipation. In order to further improve the heat exchange efficiency of the radiator, the radiator was replaced with a two-phase flow radiator. A two-phase flow heat dissipation system in the prior art generally includes an evaporator, a condenser, and a steam pipe and a liquid pipe connecting the evaporator and the condenser, and the inner empty circuit formed by the communication of these components is filled with a condensable working medium. After the evaporator absorbs the heat of the heat source, its internal working medium boils and vaporizes, and enters the condenser through the steam pipe. After the condenser releases heat to other media, the vaporized working medium in the evaporator condenses into a liquid state; then, it returns to the evaporator through the liquid pipe. , and this cycle continues to realize the continuous transmission and dissipation of heat flow of the heat source. There are two main ways to drive the working fluid flow: pump drive and thermosiphon principle. Evaporators and condensers can be heat exchangers that directly exchange heat with air, such as copper tubes and aluminum fins, parallel flow heat exchangers, etc., or various forms of heat exchangers that exchange heat with refrigerant. In simple terms, thermosiphon is a process in which the fluid in a closed system or an open system expands and contracts with heat, the hot goes up, and the cold goes down. The two-phase flow radiator used in the present invention is a thermosiphon type radiator.

The area of the radiator condenser of the two-phase flow cooling system in the prior art is insufficient, and increasing the area of the condenser leads to an increase in the cabinet, occupies a large structural space, and is not conducive to the improvement of power density.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide a power module, which has a compact structure, high space utilization, improves the heat exchange capability of the power module, improves the power density of the equipment, and reduces the overall cost of the system.

In order to solve the above technical problems, the present invention provides a power module, including a radiator, a power semiconductor device, a conductive row and a power module structural body, the radiator includes at least one condenser and at least one evaporator, and the evaporator is provided with The condenser is arranged on the lower layer of the main body of the power module structure, the condenser is arranged on the upper layer of the main body of the power module structure, the device installation surface of the evaporator is a vertical plane, the condenser is provided with at least two air inlet surfaces, the At least two air inlet surfaces of the condenser and the installation surface of the evaporator device together form a Y-shaped structural layout.

Preferably, the evaporator and the condenser are connected by pipelines, the refrigerant is filled in the closed cavity and sealed to form a closed system, and the pipeline connecting the evaporator and the condenser is provided with a special evaporation gas pipe and a return liquid pipe, The refrigerant forms a uniform circulating flow direction in the closed system.

Preferably, the evaporator and the condenser are connected by pipelines, the refrigerant is filled in the closed cavity and sealed to form a closed system, and the refrigerant inside the pipeline connecting the evaporator and the condenser forms an opposite flow direction, and the evaporation The refrigerant inside the evaporator evaporates and enters the condenser upward through the pipeline. After entering the condenser and condensing, the steam flows back through the pipeline and enters the evaporator downward at the same time.

Preferably, the condenser may consist of one or more condensers.

Preferably, the power semiconductor devices are respectively arranged on both sides of the evaporator.

Preferably, a cooling fan is provided at the central position of the power module structure body where the condenser is placed, and the cooling fan may be an axial fan or a centrifugal fan.

Preferably, the condenser of the radiator is a tube-fin type or a parallel flow heat exchanger.

Preferably, the power module further includes a capacitor, and the capacitor is disposed in the middle, lower or rear of the heat sink.

The present invention also discloses a power cabinet, the power cabinet includes at least one of the above-mentioned power modules.

After the above structure is adopted, a power module includes a radiator, a power semiconductor device, a conductive row, and a power module structure body, the radiator includes at least one condenser and at least one evaporator, and the evaporator is disposed in the power module structure The lower layer of the main body, the condenser is arranged on the upper layer of the main body of the power module structure, the device installation surface of the evaporator is a vertical plane, the condenser is arranged with at least two air inlet surfaces, and the condenser at least There are two air inlet surfaces and the installation surface of the evaporator device together to form a Y-shaped structure layout. The power module and the power cabinet have a compact structure, high space utilization, improve the heat exchange capacity of the power module, improve the power density of the equipment, and reduce the system integration. cost.

Description of drawings

FIG. 1 is a layout structure diagram of a power module and a cabinet in the prior art;

Fig. 2 is the overall structure diagram of the power module of the present invention;

3 is a structural diagram of a power module according to Embodiment 3 of the present invention;

4 is a layout diagram of a power module in a power cabinet according to Embodiment 4 of the present invention;

FIG. 5 is a structural diagram of a power module according to Embodiment 5 of the present invention;

FIG. 6 is a layout diagram of a power module in a power cabinet according to Embodiment 4 of the present invention.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

Example 1

Please refer to FIG. 2, which is an overall structural diagram of a power module of the present invention; the present embodiment discloses a power module, including a heat sink, a power semiconductor device 13, a conductive bar and a power module structural body, and the heat sink includes At least one condenser 11 and at least one evaporator 12, the evaporator 12 is arranged on the lower layer of the power module structural body, the condenser 11 is arranged on the upper layer of the power module structural body, the device mounting surface of the evaporator 12 is a vertical plane, The condenser 11 is provided with at least two air inlet surfaces, and the at least two air inlet surfaces of the condenser 11 and the device mounting surface of the evaporator 12 together form a Y-shaped structural layout.

In this embodiment, the radiator is a thermosiphon radiator.

The condenser 11 may consist of one or more condensers 11 .

In this embodiment, the power semiconductor devices 13 are IGBT modules or discrete devices, the power semiconductor devices 13 are respectively disposed on both sides of the evaporator 12 , and the power semiconductor devices transfer heat to the evaporator 12 during operation. After the refrigerant is heated, the temperature rises and the phase change gasification occurs, the liquid becomes gas, and the gas density decreases and naturally rises. After entering the condenser 11, the heat is transferred to the condenser 11, and the condenser 11 exchanges heat with the air. , the temperature of the carrier refrigerant decreases, and it returns to the evaporator 12 for heat exchange due to the action of gravity.

In this embodiment, the evaporator 12 and the condenser 11 are connected by pipelines, and the refrigerant is filled in the closed cavity and sealed to form a closed system. The pipeline connecting the evaporator 12 and the condenser 11 is provided with an evaporation gas pipe and a return flow. The liquid pipe, the refrigerant forms a uniform circulation flow direction in the closed system.

A cooling fan is provided on the top of the structural body of the power module, and the cooling fan may be an axial flow fan or a centrifugal fan.

Embodiment 2

This embodiment is based on the first embodiment, the difference is: the evaporator 12 and the condenser 11 are connected by pipelines, the refrigerant is filled in the closed cavity and sealed to form a closed system, and the pipes connecting the evaporator 12 and the condenser 11 The refrigerant inside the circuit forms the opposite flow direction. The refrigerant inside the evaporator 12 evaporates and enters the condenser 11 through the pipeline upwards.

Embodiment 3

Please refer to FIG. 3 and FIG. 4 . FIG. 3 is a structural diagram of a power module according to Embodiment 3 of the present invention. This embodiment is based on Embodiment 1. The condenser 11 is a two-phase flow condenser 11 . The flow condenser 11 is a tube-fin type or parallel flow heat exchanger, the evaporator 12 is an aluminum plate or copper plate with a hollow inner cavity, and the condenser 11 and the evaporator 12 are connected into a closed cavity through pipelines. The airtight cavity is evacuated, and then the refrigerant is added. The refrigerant can be common refrigerant refrigerants such as R134a, R410A, R22, and R12.

Referring to FIG. 3 , the layout of the capacitor 14 added to the power module of this embodiment is shown in the figure, and the capacitor 14 is disposed in the middle of the thermosiphon radiator.

In this embodiment, the material of the evaporator 12 or the condenser 11 may be metal materials such as aluminum and copper.

The condenser 11 and the evaporator 12 may have clear gas pipelines and liquid pipelines for circulating flow, or only gas pipelines, and gas-liquid mixed flow.

A cooling fan is provided at the central position where the condenser 11 is placed in the structural body of the power module, and the cooling fan may be an axial flow fan or a centrifugal fan.

Embodiment 4

This embodiment discloses a power cabinet, which includes at least one power module according to Embodiment 3. Please refer to FIG. 4 . FIG. 4 is a layout diagram of the power module in the power cabinet according to Embodiment 4 of the present invention; The layout of the power modules in the power cabinet is shown in Figure 4. Each power cabinet is provided with one or more power modules, and the heat generated during the operation of the power semiconductors is taken into the air by forced ventilation or blowing by fans.

Embodiment 5

Please refer to FIG. 5 , which is a structural diagram of a power module according to Embodiment 5 of the present invention.

This embodiment is based on the first embodiment, and the capacitor 14 is disposed at the rear of the thermosiphon radiator.

Embodiment 6

This embodiment discloses a power cabinet, which includes at least one power module according to Embodiment 5. Please refer to FIG. 6 . The layout of the power module in this embodiment in the power cabinet is shown in FIG. 6 , and each power cabinet is provided with a one or more power modules.

The power module and the power cabinet have compact structure and high space utilization, improve the heat exchange capability of the power module, improve the power density of the equipment, and reduce the overall cost of the system.

It should be understood that the above are only the preferred embodiments of the present invention, which should not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly used in Other related technical fields are similarly included in the scope of patent protection of the present invention.

Claims (9)

1. The utility model provides a power module, includes radiator, power semiconductor device, leads electrical drainage and power module structure main part, its characterized in that, the radiator includes at least one condenser and at least one evaporimeter, the evaporimeter sets up in power module structure main part's lower floor, the condenser sets up in power module structure main part's upper strata, the device installation face of evaporimeter is vertical plane, the condenser is provided with two at least air inlet faces, two at least air inlet faces of condenser and the device installation face of evaporimeter constitute Y type structural configuration jointly.

2. The power module according to claim 1, wherein the evaporator and the condenser are connected through a pipeline, a refrigerant is filled in the sealed cavity and sealed to form a sealed system, the pipeline connecting the evaporator and the condenser is provided with a special evaporation gas pipe and a special reflux liquid pipe, and the refrigerant forms a uniform circulating flow direction in the sealed system.

3. The power module according to claim 1, wherein the evaporator and the condenser are connected by a pipeline, a refrigerant is filled in the sealed cavity and sealed to form a sealed system, the refrigerant in the pipeline connecting the evaporator and the condenser forms opposite flow directions, the refrigerant in the evaporator evaporates and enters the condenser through the pipeline, and the steam flows back and enters the evaporator through the pipeline after entering the condenser for condensation.

4. A power module according to claim 1, characterized in that the condenser may consist of one or more condensers.

5. The power module according to claim 1, wherein the power semiconductor devices are respectively disposed on both sides of the evaporator.

6. The power module as claimed in claim 1, wherein a heat dissipation fan is disposed at a middle position of the power module structure body where the condenser is disposed, and the heat dissipation fan may be an axial flow fan or a centrifugal fan.

7. The power module of claim 1, wherein the condenser of the heat sink is a tube fin or parallel flow heat exchanger.

8. The power module of claim 1, further comprising a capacitor disposed in a middle, lower, or rear portion of the heat sink.

9. A power cabinet, characterized by comprising a power module according to any one of claims 1 to 9.

Images