CN112449555A

CN112449555A - Active thermosyphon heat dissipation system for high-power inverter

Info

Publication number: CN112449555A
Application number: CN202011146835.XA
Authority: CN
Inventors: 叶胜林; 温进; 胡子晨; 夏洁; 牛瑞根
Original assignee: Envision Energy Co Ltd
Current assignee: Envision Energy Co Ltd; Envision Energy Ltd
Priority date: 2020-10-23
Filing date: 2020-10-23
Publication date: 2021-03-05

Abstract

The invention discloses a heat dissipation system for a high-power inverter, which comprises three independent units: the power cabinet heat dissipation unit, the filter cabinet heat dissipation unit, the control cabinet and the grid-connected cabinet heat dissipation unit. The power cabinet radiating unit comprises a plurality of fin-type thermosyphon heat exchangers and a first thermosyphon heat exchanger for radiating the IGBT module, and the filtering cabinet radiating unit, the control cabinet and the grid-connected cabinet radiating unit respectively comprise a plurality of fin-type thermosyphon heat exchangers.

Description

Active thermosyphon heat dissipation system for high-power inverter

Technical Field

The invention relates to the technical field of new energy, in particular to an active thermosiphon heat dissipation system for a high-power inverter.

Background

In order to continuously utilize energy and reduce environmental pollution, new energy power generation technologies such as photovoltaic power generation and wind power generation are well developed in recent years, and have been connected to a power grid in a large scale. An inverter and/or a converter can be used in photovoltaic power generation, wind power generation and energy storage products, the inverter and the converter can generate a large amount of heat during working, and a cooling device is usually equipped to carry out heat dissipation and cooling treatment on the inverter and the converter in order to ensure normal operation of the inverter and the converter.

Currently, the common cooling methods include forced air cooling and liquid cooling. The forced air cooling technology is a cooling method for taking away heat by driving working airflow to pass through a heating surface by using a fan, the method is relatively poor in heat dissipation capability, is easily influenced by environmental temperature and is difficult to meet the heat dissipation requirement of a high-power inverter, and the inverter adopting the forced air cooling mode is wholly open and cannot meet the application requirements of scenes such as high humidity, high salt fog and the like; the liquid cooling technology is characterized in that heat is conducted to the heat exchanger through liquid circulation and then is subjected to air cooling centralized heat dissipation, the liquid cooling technology is high in heat dissipation capacity, the whole inverter cabinet can be fully sealed by the liquid cooling technology, the IP54 protection level is achieved, the liquid cooling technology is high in cost and relatively poor in reliability, leakage risks exist generally, and the maintenance cost of the whole life cycle is high.

Disclosure of Invention

Aiming at the problems in the prior art, the invention provides a heat radiation system for a high-power inverter, which divides the inverter into three independent units and respectively radiates the heat, and the heat radiation system comprises:

the power cabinet radiating unit is arranged in the power cabinet, and the power radiating unit comprises:

the evaporation end of the first thermosiphon heat exchanger comprises a plate-shaped cavity, an Insulated Gate Bipolar Transistor (IGBT) module in the inverter is attached to the evaporation end, the condensation end of the first thermosiphon heat exchanger comprises a fin extending out of the power cabinet, and the condensation end of the first thermosiphon heat exchanger passes through a plate-shaped cavity

Cooling by forced air cooling; and

the evaporation end of the second thermosiphon heat exchanger comprises fins, the evaporation end is sealed in the power cabinet, the condensation end of the second thermosiphon heat exchanger comprises fins, and the condensation end of the second thermosiphon heat exchanger is connected with the power cabinet through the fins

The power cabinet extends out;

the filtering cabinet radiating unit comprises a plurality of third thermosiphon heat exchangers, evaporation ends of the third thermosiphon heat exchangers comprise fins, the evaporation ends of the third thermosiphon heat exchangers are arranged at an air outlet at the top of a filtering inductor in the filtering cabinet, condensation ends of the third thermosiphon heat exchangers comprise fins, and the condensation ends of the third thermosiphon heat exchangers extend out of the filtering cabinet; and

the control cabinet and grid-connected cabinet radiating unit comprises a plurality of fourth thermosiphon heat exchangers, evaporation ends of the fourth thermosiphon heat exchangers comprise fins, evaporation ends of the fourth thermosiphon heat exchangers are sealed in the control cabinet and the grid-connected cabinet, condensation ends of the fourth thermosiphon heat exchangers comprise fins, and condensation ends of the fourth thermosiphon heat exchangers extend out of the control cabinet and the grid-connected cabinet.

Further, the IGBT module is arranged on the evaporation end of the first thermosiphon heat exchanger through a laminated busbar.

Furthermore, the fins at the condensation end of the first thermosiphon heat exchanger are integrated in a parallel air duct, and the air duct comprises an air inlet and a fan, wherein the fan is installed on one side opposite to the air inlet.

Furthermore, the air duct is a trapezoidal or rectangular flow equalizing air duct.

Further, fans are arranged at air outlets of the evaporation end and/or the condensation end of the second thermosiphon heat exchanger, the third thermosiphon heat exchanger and the fourth thermosiphon heat exchanger.

Further, the evaporation end and the condensation end of the first thermosiphon heat exchanger and/or the second thermosiphon heat exchanger and/or the third thermosiphon heat exchanger and/or the fourth thermosiphon heat exchanger are both in a cavity structure, the evaporation end and the cavity of the condensation end are communicated, a medium is contained in the cavity, the medium is in a liquid state at normal temperature and is stored in the cavity of the evaporation end, after the evaporation end is heated, the medium is subjected to phase change to become steam to realize heat absorption, the steam rises to the condensation end, and after cooling, the steam is condensed into a liquid state and flows back to the evaporation end.

The invention provides a heat dissipation system for a high-power inverter, which is suitable for the fields of wind power converters, energy storage converters PCS, photovoltaic inverters and the like. The heat dissipation system is used for different structures of the inverter, different thermosyphon heat exchanger schemes are adopted, the heat dissipation capacity of the air-cooled inverter is improved, the bottleneck that the high-power inverter adopts air-cooled heat dissipation is solved, the heat dissipation system is adopted on a system with 50-100 KW total loss, and the cost performance is very high. Meanwhile, each unit structure of the heat dissipation system is independent and adopts a full-sealed form, and active air cooling heat exchange is adopted in the cabinet, so that the protection level of IP54 is realized on the basis of air cooling, and the heat dissipation system can be suitable for high-corrosion and high-humidity areas. The three heat dissipation systems are constructed by coupling the thermosiphon heat exchanger and the fan, and the thermosiphon heat exchanger essentially adopts the phase change principle to transfer heat, and the heat transfer phase rate is high, so that the heat dissipation performance is superior to that of the traditional air cooling heat dissipation system, and the air cooling heat dissipation capacity can be improved. In addition, the use of the thermosiphon heat exchanger avoids the problem of leakage and has higher reliability.

Drawings

To further clarify the above and other advantages and features of embodiments of the present invention, a more particular description of embodiments of the present invention will be rendered by reference to the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. In the drawings, the same or corresponding parts will be denoted by the same or similar reference numerals for clarity.

Fig. 1 is a front view illustrating a heat dissipation system for a high power inverter according to an embodiment of the present invention;

fig. 2 is a side view of a heat dissipation system for a high power inverter according to an embodiment of the present invention; and

fig. 3 is a top view of parallel air ducts of a heat dissipation system for a high power inverter according to an embodiment of the present invention.

Detailed Description

In the following description, the present invention is described with reference to examples. One skilled in the relevant art will recognize, however, that the embodiments may be practiced without one or more of the specific details, or with other alternative and/or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention. Similarly, for purposes of explanation, specific numbers, materials and configurations are set forth in order to provide a thorough understanding of the embodiments of the invention. However, the invention is not limited to these specific details. Further, it should be understood that the embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale.

Reference in the specification to "one embodiment" or "the embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.

It should be noted that the embodiment of the present invention describes the process steps in a specific order, however, this is only for the purpose of illustrating the specific embodiment, and does not limit the sequence of the steps. Rather, in various embodiments of the present invention, the order of the steps may be adjusted according to process adjustments.

For the inverter with system loss more than 50KW, the bottleneck of the forced air cooling system is obvious, and if the liquid cooling technology is adopted, the cost is higher, and the leakage risk exists. Aiming at the problems, the invention provides a heat dissipation system for a high-power inverter, which is divided into three independent units, wherein the structures of the units are independent and all adopt a full-sealed form, active air cooling heat exchange is adopted in a cabinet through a thermosiphon heat exchanger, and the IP54 protection grade is realized on the basis of air cooling.

The thermosiphon heat exchanger includes an evaporation end and a condensation end. The evaporation end and the condensation end are both of a cavity structure, the cavities of the evaporation end and the condensation end are communicated, a medium is contained in the cavity, the medium is liquid at normal temperature and is stored in the cavity of the evaporation end, when the evaporation end is heated, the medium undergoes phase change to become steam, so that heat absorption is realized, the steam rises to the condensation end, and after cooling, the steam is condensed into liquid and flows back to the evaporation end.

The solution of the invention is further described below with reference to the accompanying drawings of embodiments.

Fig. 1 and 2 respectively show a front view and a side view of a heat dissipation system for a high power inverter according to an embodiment of the present invention. As shown in the figure, the heat dissipation system for the high-power inverter comprises a power cabinet heat dissipation unit, a filter cabinet heat dissipation unit, a control cabinet and a grid-connected cabinet heat dissipation unit, wherein the power cabinet heat dissipation unit, the filter cabinet heat dissipation unit, the control cabinet and the grid-connected cabinet heat dissipation unit are relatively independent and all adopt a fully-sealed form, and the heat dissipation system comprises:

the power cabinet heat dissipation unit is arranged in the power cabinet 101 and used for dissipating heat of each device in the power cabinet 101. The power cabinet 101 mainly includes key devices such as an insulated gate bipolar transistor IGBT module 1011, a capacitor 1012, and a Chopper1013, wherein:

the IGBT module 1011 radiates a large amount of heat during operation, and therefore, in the heat radiation system, the IGBT module 1011 is attached to the evaporation end 011 of the first thermosiphon heat exchanger. The evaporation end 111 of the first thermosiphon heat exchanger is a plate-shaped cavity, the first thermosiphon heat exchanger is sealed in the cabinet after being attached with the IGBT, the condensation end 112 of the first thermosiphon heat exchanger is in a fin form and extends out of the power cabinet, and the condensation end is cooled in a forced air cooling form. In one embodiment of the present invention, the IGBT module 1011 is mounted on the evaporation end 111 of the first thermosiphon heat exchanger through a laminated busbar. In the invention, an assembly which is formed by installing IGBT modules on a first thermosiphon heat exchanger and attaching structural members such as a plurality of laminated busbars is called as a set of kits, and the number of the kits installed in the power cabinet is determined according to the power grade of an inverter. In another embodiment of the present invention, the fins of the condensation end 112 of all the kits extend out of the cabinet and are integrated into a parallel air duct 003, the air duct 003 is as shown in fig. 3 and includes an air inlet 301 and a fan 302, wherein the fan 302 is installed at a side opposite to the air inlet 301, the air duct 003 can be designed as a trapezoidal or rectangular air-flow-equalizing air duct to ensure air flow equalization, the air flow of each condenser is uniform, the number of the fans 302 depends on losses and is integrated into a parallel air duct 003

The capacitors 1012, Chopper1013 and other devices are air-cooled, that is, a plurality of second thermosiphon heat exchangers are arranged in the power cabinet, the evaporation end 121 of each second thermosiphon heat exchanger is a fin type, the evaporation end 121 is sealed in the power cabinet, the air outlet of the evaporation end is matched with the fan 141, so that hot air in the power cabinet continuously circulates through the evaporation end to be cooled, the condensation end 122 of each second thermosiphon heat exchanger is a fin type, the condensation end extends out of the power cabinet and is matched with the fan 142, and the fan 142 drives the condensation end to move outwards

Part of air flows through the fins at the condensing end to be forced air-cooled;

the filter cabinet heat dissipation unit is arranged in the filter cabinet 102 and used for dissipating heat of each device in the filter cabinet 102. The main devices in the filter cabinet are machine and network side filter inductors. For the filter inductor, heat dissipation is performed in a manner that each filter inductor 1021 is matched with a third thermosiphon heat exchanger. The evaporation end 221 of the third thermosiphon heat exchanger is of a fin type and is installed at an air outlet at the top of the filter inductor 1021, meanwhile, a fan 241 is installed at the air outlet of the evaporation end, so that air in the cabinet is sucked into an inductive air duct from the bottom of the filter inductor 1021 for inductive heat dissipation, cooled air is sucked out by the fan 241 after being heated and flows through the fin of the evaporation end 221 of the third thermosiphon heat exchanger, a medium in the fin generates phase change heat absorption to cool hot air, a condensation end 222 of the third thermosiphon heat exchanger is of a fin type and extends out of the cabinet to be matched with the fan 242, the fan drives external air to flow through the fin of the condensation end to condense internal steam, the condensed medium flows back to the evaporation end again, and the purpose of inductive heat dissipation and control of the internal loop temperature of the; and

the control cabinet and grid-connected cabinet heat dissipation unit is arranged on a control cabinet 1031 and a grid-connected cabinet 1032 and used for heat dissipation of all devices in the control cabinet 1031 and the grid-connected cabinet 1032, the control cabinet 1031 and the grid-connected cabinet 1032 adopt series air ducts and share a circulation air duct, main heating devices comprise a circuit breaker 1033, a busbar and other auxiliary electrical devices, and an auxiliary transformer 1034 can also be integrated in the unit. And the control cabinet and the grid-connected cabinet radiating unit radiate heat of devices in the cabinet in a forced air cooling mode. A fourth thermosiphon heat exchanger is installed on the top of the wall surface between the control cabinet 1031 and the grid-connected cabinet 1032, the evaporation end 321 of the fourth thermosiphon heat exchanger is of a fin type, the fourth thermosiphon heat exchanger is sealed in the cabinet and is installed in cooperation with the fan 341, the fan 341 drives the air in the cabinet to circularly and sequentially flow through the evaporation end 321 of the fourth thermosiphon heat exchanger, the control cabinet 1031, the auxiliary transformer 1034 at the bottom of the control cabinet, the breaker 1033 and the grid-connected cabinet 1032 between the two cabinets, the air temperature rises to the highest temperature after returning to the evaporation end 321 again, the internal medium of the hot air absorbs heat and changes phase after flowing through the fins of the evaporation end 321, and the phase. The condensation end 322 of the fourth thermosiphon heat exchanger is fin-shaped and extends out of the cabinet to be matched with the fan 342, the fan 342 drives air outside the cabinet to continuously flow through the fins of the condensation end 322 to cool steam, the steam flows back to the evaporation end 321 after being condensed, and the heat generated by devices in the cabinet is continuously taken out of the cabinet in a circulating manner.

While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. It will be apparent to persons skilled in the relevant art that various combinations, modifications, and changes can be made thereto without departing from the spirit and scope of the invention. Thus, the breadth and scope of the present invention disclosed herein should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.

Claims

1. A heat dissipation system for a high-power inverter is characterized by comprising:

a power cabinet heat dissipation unit configured to be arrangeable at a power cabinet, the power heat dissipation unit comprising:

the device comprises a plurality of first thermosiphon heat exchangers, wherein an evaporation end of each first thermosiphon heat exchanger comprises a plate-shaped cavity, an insulated gate bipolar transistor I GBT module in an inverter is attached to the evaporation end, a condensation end of each first thermosiphon heat exchanger comprises a fin, the fin extends out of a power cabinet, and the condensation end of each first thermosiphon heat exchanger is cooled by forced air cooling; and

a plurality of second thermosiphon heat exchangers, an evaporation end of the second thermosiphon heat exchangers including fins, wherein the evaporation end of the second thermosiphon heat exchangers is sealed inside the power cabinet, and a condensation end of the second thermosiphon heat exchangers including fins, wherein the condensation end of the second thermosiphon heat exchangers extends out of the power cabinet;

the filter cabinet heat dissipation unit is configured to be arranged on the filter cabinet and comprises a plurality of third thermosiphon heat exchangers, evaporation ends of the third thermosiphon heat exchangers comprise fins, evaporation ends of the third thermosiphon heat exchangers are installed at an air outlet at the top of a filter inductor in the filter cabinet, condensation ends of the third thermosiphon heat exchangers comprise fins, and condensation ends of the third thermosiphon heat exchangers extend out of the filter cabinet; and

the control cabinet and the grid-connected cabinet radiating unit are configured to be arranged in the control cabinet and the grid-connected cabinet, the control cabinet and the grid-connected cabinet radiating unit comprise a plurality of fourth thermosiphon heat exchangers, evaporation ends of the fourth thermosiphon heat exchangers comprise fins, the evaporation ends of the fourth thermosiphon heat exchangers are sealed in the control cabinet and the grid-connected cabinet, condensation ends of the fourth thermosiphon heat exchangers comprise fins, and the condensation ends of the fourth thermosiphon heat exchangers extend out of the control cabinet and the grid-connected cabinet.

2. The heat dissipation system of claim 1, wherein the I GBT module is mounted on an evaporation end of the first thermosiphon heat exchanger by a laminated busbar.

3. The heat dissipation system of claim 1, wherein the power cabinet further comprises a capacitor and a chopper, and wherein a fan is disposed at an evaporation end of the second thermosiphon heat exchanger, the fan being configured to circulate air within the power cabinet to cool the capacitor, the chopper, and an ambient temperature within the power cabinet.

4. The heat dissipation system as recited in claim 1, wherein a fan is disposed at an evaporation end of the third thermosiphon heat exchanger, the fan being configured to enable air in the cabinet to be drawn into the inductive air duct from a bottom of the filter inductor to perform forced air cooling heat dissipation on the filter inductor.

5. The heat dissipation system of claim 1, wherein the fins of the condensation end of the first thermosiphon heat exchanger are integrated into a parallel air path, the air path comprising an air inlet and a fan, wherein the fan is mounted on a side opposite the air inlet.

6. The heat dissipating system of claim 5, wherein the air channel is a trapezoidal or rectangular flow equalizing air channel.

7. The heat dissipation system as claimed in claim 1, wherein the control cabinet and the grid-connected cabinet employ a serial air duct, the fourth thermosiphon heat exchanger is installed on a top portion of a middle wall surface of the control cabinet and the grid-connected cabinet, and a fan is disposed at an evaporation end of the fourth thermosiphon heat exchanger, and the fan is configured to enable air in the control cabinet and the grid-connected cabinet to form an air cooling cycle.

8. The heat dissipation system of claim 1, wherein the air outlets of the condensing ends of the second, third, and fourth thermosiphon heat exchangers are arranged with fans.

9. The heat dissipation system of any one of claims 1 to 8, wherein the evaporation end and the condensation end of the first thermosiphon heat exchanger and/or the second thermosiphon heat exchanger and/or the third thermosiphon heat exchanger and/or the fourth thermosiphon heat exchanger are both in a cavity structure, the evaporation end and the condensation end are communicated with each other, the cavity comprises a medium inside, the medium is in a liquid state at normal temperature and is stored in the cavity of the evaporation end, when the evaporation end is heated, the medium undergoes a phase change to become steam, so that heat absorption is realized, the steam rises to the condensation end, and after cooling, the steam is condensed into a liquid state and flows back to the evaporation end.