CN111741650A - Heat superconducting radiating plate, radiator and 5G base station equipment - Google Patents
Heat superconducting radiating plate, radiator and 5G base station equipment Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/08—Access point devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
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Abstract
The invention provides a thermal superconducting heat dissipation plate, a radiator and 5G base station equipment. The heat superconducting heat dissipation plate comprises a first heat dissipation area, a second heat dissipation area, a first liquid phase evaporation isolation area and a first connecting pipeline; the first heat dissipation area comprises a first liquid phase evaporation area and a first gas phase condensation heat dissipation area; the second heat dissipation area comprises a second liquid phase evaporation area, a second gas phase condensation heat dissipation area and a second condensate flow guiding isolation area; the first liquid phase evaporation isolation area is positioned between the second liquid phase evaporation area and the first gas phase condensation heat dissipation area and is used for isolating the second liquid phase evaporation area from the first gas phase condensation heat dissipation area; the first connecting pipeline is positioned on one side of the first liquid phase evaporation isolation area, which is far away from the second liquid phase evaporation area; the bottoms of the first liquid phase evaporation area and the second liquid phase evaporation area are inclined upwards along the direction of a back heat source; the first heat dissipation pipeline, the second heat dissipation pipeline and the first connecting pipeline are communicated with each other and are all heat superconducting heat dissipation pipelines, and heat transfer working mediums are filled in the heat superconducting heat dissipation pipelines. The invention is helpful for improving the heat dissipation efficiency and the heat dissipation uniformity.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a thermal superconducting heat dissipation plate, a heat radiator and 5G base station equipment.
Background
Along with the rapid development of science and technology, 5G and above communication application is more and more extensive, and along with communications facilities electronic components's power density is bigger and bigger simultaneously, electronic components distributes more and more complicated pluralism, has had different heat dissipation requirements to the different components and parts of different regions in the equipment.
The heat superconducting heat transfer technology comprises a phase change heat transfer technology which is characterized in that a working medium is filled in a closed and mutually communicated micro-channel system and the heat superconducting heat transfer is realized through the evaporation and condensation phase change of the working medium; and the phase change suppression (PCI) heat transfer technology for realizing high-efficiency heat transfer by controlling the microstructure state of the working medium in the closed system, namely, in the heat transfer process, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed, and the consistency of the microstructure of the working medium is achieved on the basis. Due to the rapid heat conduction characteristic of the heat superconducting technology, the equivalent heat conduction coefficient can reach more than 4000W/m ℃, and the temperature equalization of the whole heat superconducting heat dissipation plate can be realized.
The heat superconducting fin radiator is formed by taking a heat superconducting radiating plate as a radiating fin, mainly comprises a radiator substrate and a plurality of heat superconducting radiating plates arranged on the radiator substrate, and a heat source is arranged on the other plane of the radiator substrate. The heat of the heat source is conducted to the plurality of radiating fins through the substrate, and then is radiated to the surrounding environment through the radiating fins. The heat superconducting radiating plate is of a thin plate structure, so that the heat conduction speed is high, the size is small, the weight is light, the fin efficiency is high, and the fin efficiency is not changed along with the height of the fins, so that the heat superconducting radiating plate is widely applied to the heat dissipation of 5G communication equipment.
The structure of the heat superconducting radiating plate 1 'used on the radiator of 5G base station equipment is shown in figure 1 at present, a hexagonal honeycomb pipeline structure is mostly adopted, the pipeline structure is distributed over the whole heat superconducting radiating plate 1', and the quantity of heat transfer working media filled in the pipeline is generally smaller than the total volume of the hexagonal honeycomb pipeline. Because the radiator is vertically installed and used, the heat transfer working medium is mainly concentrated in the lower space (such as the area A marked by a dashed frame in FIG. 1) of the thermal superconducting heat dissipation plate 1' under the influence of gravity. When the charge is too low, a region without working medium (for example, a region B marked by a dashed line frame in fig. 1) may appear on the upper portion of the heat superconducting heat dissipation plate 1', and thus heat generated by the heat source on the upper portion of the heat sink cannot be conducted by the heat transfer working medium inside the heat superconducting heat dissipation plate, resulting in a high temperature of the local heat source. In order to solve the problem of high temperature of the upper heat source, the filling amount of the heat transfer working medium can be increased (as shown in fig. 1, the filling amount of the heat transfer working medium exceeds half of the total volume of the pipeline), but the lower heat source of the heat superconducting heat dissipation plate has long starting time and large bottom thermal resistance due to the influence of gravity, and the heat source positioned at the upper part of the heat radiator has high temperature, so that the defects of large temperature difference between the upper part and the lower part of the heat superconducting heat dissipation plate, poor heat dissipation effect of the heat radiator and the like are caused, and.
Therefore, how to solve the problems of high temperature of local heat source, large temperature difference between the upper part and the lower part of the thermal superconducting heat dissipation plate, poor heat dissipation effect of the heat sink, how to meet different heat dissipation requirements of different components and parts, and the like, has become one of the problems that needs to be solved urgently by the technical personnel in the field.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a thermal superconducting heat sink, a heat sink and a 5G base station device, which are used to solve the problems that the thermal superconducting heat sink in the prior art is prone to generate local heat source high temperature, the temperature difference between the upper part and the lower part of the thermal superconducting heat sink is large, the heat sink has poor heat dissipation effect, and the heat dissipation requirements of different electronic components in different areas in a multi-heat source heat dissipation system are different.
In order to achieve the above and other related objects, the present invention provides a thermal superconducting heat dissipating plate, including a first heat dissipating region, a second heat dissipating region, a first liquid phase evaporation isolation region, and a first connecting pipe; the second heat dissipation area is positioned above the first heat dissipation area; the first heat dissipation area comprises a first liquid phase evaporation area and a first gas phase condensation heat dissipation area positioned above the first liquid phase evaporation area, and first heat dissipation pipelines which are communicated with each other are distributed in the first liquid phase evaporation area and the first gas phase condensation heat dissipation area; the second heat dissipation area comprises a second liquid phase evaporation area, a second gas phase condensation heat dissipation area and a second condensate flow guiding isolation area, the second gas phase condensation heat dissipation area is positioned above the second liquid phase evaporation area, the second condensate flow guiding isolation area is positioned in the second gas phase condensation heat dissipation area, and second heat dissipation pipelines which are communicated with each other are distributed in the second liquid phase evaporation area and the second gas phase condensation heat dissipation area; the first liquid phase evaporation isolation area is positioned between the second liquid phase evaporation area and the first gas phase condensation heat dissipation area and is used for isolating the second liquid phase evaporation area from the first gas phase condensation heat dissipation area, and the first liquid phase evaporation isolation area extends from the bottom of the second liquid phase evaporation area to one side of the second liquid phase evaporation area, which is far away from the heat source; the first connecting pipeline is positioned on one side of the first liquid phase evaporation isolation area, which is far away from the second liquid phase evaporation area; the bottoms of the first liquid-phase evaporation area and the second liquid-phase evaporation area are inclined upwards along the direction of a back heat source; the first heat dissipation pipeline, the second heat dissipation pipeline and the first connecting pipeline are communicated with each other and are all heat superconducting heat dissipation pipelines, and heat transfer working mediums are filled in the heat superconducting heat dissipation pipelines.
Optionally, the thermal superconducting heat dissipation plate further includes a third heat dissipation region, a second liquid phase evaporation isolation region, and a second connection pipeline; the third heat dissipation area is positioned above the second heat dissipation area; the third heat dissipation area comprises a third liquid phase evaporation area, a third gas phase condensation heat dissipation area and a third condensate flow guiding isolation area, the third gas phase condensation heat dissipation area is positioned above the third liquid phase evaporation area, the third condensate flow guiding isolation area is positioned in the third gas phase condensation heat dissipation area, and third heat dissipation pipelines which are communicated with each other are distributed in the third liquid phase evaporation area and the third gas phase condensation heat dissipation area; the second liquid-phase evaporation isolation area is positioned between the third liquid-phase evaporation area and the second gas-phase condensation heat dissipation area and is used for isolating the third liquid-phase evaporation area from the second gas-phase condensation heat dissipation area, and the second liquid-phase evaporation isolation area extends from the bottom of the third liquid-phase evaporation area to one side of the third liquid-phase evaporation area, which is far away from the heat source; the bottom of the third liquid-phase evaporation zone is inclined upward in a direction away from the heat source; the second connecting pipeline is positioned on one side of the second liquid-phase evaporation isolation region, which is far away from the third liquid-phase evaporation region, and the third heat dissipation pipeline is communicated with the second heat dissipation pipeline through the second connecting pipeline; and the third heat dissipation pipeline and the second connecting pipeline are both heat superconducting heat dissipation pipelines.
Optionally, the second condensate flow guiding and isolating region is inclined upwards in a direction away from the heat source and extends to a pipeless region on a side, away from the heat source, of the thermal superconducting heat dissipation plate.
Optionally, the third condensate flow guiding and isolating area is inclined upwards in a direction away from the heat source and extends to a pipeless area on a side, away from the heat source, of the thermal superconducting heat dissipation plate.
Optionally, the surface morphology of the thermal superconducting heat dissipation plate includes one of single-sided swelling, double-sided swelling, single-sided flatness and double-sided flatness.
Optionally, the thermal superconducting heat sink further comprises a pipe-less heated region extending upward from a side of the first heat dissipation region to a side of the second heat dissipation region.
Optionally, the first heat dissipation pipeline and the second heat dissipation pipeline are distributed in a hexagonal honeycomb shape.
The invention also provides a heat superconducting radiator, which comprises a radiator substrate and a plurality of heat superconducting radiating plates in any scheme; the radiator substrate is provided with a first surface and a second surface opposite to the first surface, and the first surface is provided with a plurality of mounting areas for placing devices from bottom to top; the plurality of heat superconducting radiating plates are arranged on the second surface of the radiator substrate in parallel at intervals in the transverse direction, and each heat superconducting radiating plate extends along the longitudinal direction.
Optionally, the second surface of the heat sink substrate has a groove, and one end of the thermal superconducting heat dissipation plate has a bent portion, and the bent portion is inserted into the groove.
The invention also provides 5G base station equipment, the 5G base station equipment comprises a device and the thermal superconducting radiator in any scheme, and the device of the 5G base station equipment is arranged in the installation area of the radiator substrate.
As described above, the thermal superconducting heat sink, the heat sink and the 5G base station device of the present invention have the following advantages:
the structure of the existing heat superconducting radiating plate is optimally designed, the liquid-phase evaporation region and the gas-phase condensation radiating region are arranged in different radiating regions of the heat superconducting radiating plate, the gas-phase condensation radiating region and the liquid-phase evaporation region of the adjacent radiating regions are isolated by the liquid-phase evaporation isolating region, and the condensate flow guiding isolating region is arranged in the gas-phase condensation radiating region, so that the temperature difference between the upper part and the lower part of the heat superconducting radiating plate can be effectively reduced, the radiating effect of the heat superconducting radiator is improved, the problem that the performance of devices in the region is reduced and even loses efficacy due to excessive heat concentration can be avoided, the radiating efficiency and the radiating capacity of the whole heat superconducting radiator can be improved, and the development requirements of miniaturization, light weight, high integration degree, uniform temperature and the like of 5G base station equipment. The 5G base station equipment based on the thermal superconducting radiator can obviously improve the heat dissipation performance, and is beneficial to prolonging the service life of the equipment and improving the performance of the equipment.
Drawings
Fig. 1 is a schematic diagram of a prior art superconducting heat sink.
Fig. 2 is a schematic structural diagram of a superconducting heat sink according to a first embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a superconducting heat sink according to a second embodiment of the present invention.
Fig. 4 is a schematic structural view of a superconducting heat sink based on the superconducting heat dissipation plate according to the first embodiment.
Fig. 5 is a partially enlarged view illustrating the connection between the thermal superconducting heat dissipating plate and the heat sink substrate in the thermal superconducting heat sink of fig. 4.
Description of the element reference numerals
1', 1 thermal superconducting heat sink
111 first liquid phase evaporation zone
112 first gas phase condensation heat dissipation area
113 first heat radiation pipeline
121 second liquid phase evaporation zone
122 second vapor phase condensation heat-sink zone
123 second condensate flow guiding and isolating area
124 second heat dissipation pipeline
13 first liquid phase evaporation isolation zone
14 first connecting line
151 third liquid phase evaporation zone
152 third vapor phase condensation heat rejection zone
153 third condensate flow guiding and isolating area
154 third heat dissipation pipeline
16 second liquid phase evaporation isolation area
17 second connecting line
18 heat transfer working medium
19 no-pipe heated zone
20 filling sealing mouth
21 no-pipeline island region
22 a bent part
3 Heat dissipation area substrate
4 device
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 2 to 5. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention in a schematic manner, and the drawings only show the components related to the present invention rather than the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Example one
As shown in fig. 2, the present invention provides a thermal superconducting heat sink 1, where the thermal superconducting heat sink 1 includes a first heat dissipation region, a second heat dissipation region, a first liquid phase evaporation isolation region 13 and a first connecting pipeline 14; the second heat dissipation area is positioned above the first heat dissipation area; the first heat dissipation area includes a first liquid phase evaporation area 111 and a first gas phase condensation heat dissipation area 112 located above the first liquid phase evaporation area 111, first heat dissipation pipelines 113 which are mutually communicated are distributed in the first liquid phase evaporation area 111 and the first gas phase condensation heat dissipation area 112 (that is, the first liquid phase evaporation area 111 and the first gas phase condensation heat dissipation area 112 are mutually communicated), and a first condensate flow guiding isolation area (not shown) without a pipeline can be arranged in the first gas phase condensation heat dissipation area 112; the second heat dissipation area comprises a second liquid phase evaporation area 121, a second gas phase condensation heat dissipation area 122 and a second condensate flow guiding isolation area 123, the second vapor phase condensation heat rejection zone 122 is located above the second liquid phase evaporation zone 121 (as can be seen in connection with FIG. 2, the second liquid phase evaporation zone 121 is located above the first vapor phase condensation heat rejection zone 112), the second condensate diversion isolation region 123 is located in the second vapor phase condensation heat dissipation region 122 and is preferably spaced apart from the second liquid phase evaporation region 121 (i.e. there is still a communication pipe between the second vapor phase condensation heat dissipation region 122 and the second liquid phase evaporation region 121 for the heat transfer medium 18 to flow through, which communication pipe actually functions to space the second condensate diversion isolation region 123 from the first liquid phase evaporation isolation region 13), no distribution pipeline is arranged in the second condensate flow guiding and isolating region 123, so that the heat transfer working medium 18 cannot flow in the region to play an isolating role; second heat dissipation pipelines 124 which are communicated with each other are distributed in the second liquid phase evaporation area 121 and the second gas phase condensation heat dissipation area 122, and the second heat dissipation pipelines 124 and the first heat dissipation pipelines 113 are preferably distributed in a polygonal honeycomb shape; the first liquid phase evaporation isolation region 13 is located between the second liquid phase evaporation region 121 and the first gas phase condensation heat dissipation region 112, and is used for isolating the second liquid phase evaporation region 121 from the first gas phase condensation heat dissipation region 112, and the first liquid phase evaporation isolation region 13 extends from the bottom of the second liquid phase evaporation region 121 to the side of the second liquid phase evaporation region 121 away from the heat source (i.e. the first liquid phase evaporation isolation region 13 is in a nearly L-shaped structure); no circulation pipeline is distributed in the first liquid phase evaporation isolation region 13, so that the heat transfer working medium 18 in the second liquid phase evaporation region 121 cannot directly flow downwards to the first gas phase condensation heat dissipation region 112 due to the isolation of the first liquid phase evaporation isolation region 13, and thus the isolation effect is achieved; the first connecting pipeline 14 is positioned on the side of the first liquid phase evaporation isolation zone 13 away from the second liquid phase evaporation zone 121; the bottoms of the first liquid-phase evaporation zone 111 and the second liquid-phase evaporation zone 121 are both inclined upward along the direction of a back heat source (the heat source is a device 4 which can generate heat during operation); the first heat dissipation pipeline 113, the second heat dissipation pipeline 124 and the first connecting pipeline 14 are communicated with each other and are all heat superconducting heat dissipation pipelines, heat transfer working media 18 are filled in the heat superconducting heat dissipation pipelines, and the heat transfer working media 18 comprise liquid. The invention sets liquid phase evaporating area and gas phase condensing radiating area in different radiating areas of the heat superconducting radiating plate, the gas phase condensing radiating area and the liquid phase evaporating area in adjacent radiating areas are separated by the liquid phase evaporating isolating area, the condensate flow guiding isolating area is set in the gas phase condensing radiating area, the liquid condensed in the gas phase condensing radiating area flows to the liquid phase evaporating area intensively due to the separation of the condensate flow guiding isolating area, the redundant liquid flows to the gas phase condensing radiating area in the adjacent radiating area below the gas phase condensing radiating area through the upper end of the liquid phase evaporating isolating area in an overflow mode through a connecting pipeline, and is merged with the condensate liquid in the gas phase condensing radiating area, and flows to the liquid phase evaporating area in the area through the guidance of the condensate flow guiding isolating area in the area, and so on until the liquid phase evaporating area at the bottom of the heat superconducting radiating. When the temperature of any one gas phase condensation heat dissipation area is higher and the corresponding gas pressure is higher, the gas in the area naturally flows to the adjacent area with lower pressure (the corresponding temperature is also lower) for heat dissipation and condensation, so that the pressure in the whole heat superconducting heat dissipation plate is ensured to be relatively consistent, and the corresponding temperature is uniform and consistent. The heat source is arranged at the position corresponding to the liquid phase evaporation area, the heat sources are ensured to be close to the evaporation area of the heat superconducting heat dissipation plate, heat is quickly guided to the gas phase condensation heat dissipation area to be dissipated by liquid phase evaporation heat absorption, and the defects that the heat source at the upper part of the conventional heat superconducting heat dissipation plate is poor in heat dissipation due to the fact that the heat source is far away from the evaporation area, the lower part of the conventional heat superconducting heat dissipation plate is high in heat source temperature due to the fact that the pressure difference of a high liquid level and the flow resistance of a long-distance channel gas-liquid phase of a small pipeline are large, the heat dissipation capacity is low due to the fact that the gas. Meanwhile, the invention also has the advantages of uniform distribution of liquid working media, less filling amount of the working media (the filling amount of the working media is not more than one third of the volume of the whole heat superconducting radiating plate pipeline and can be reduced by more than about one half compared with the prior design), lower cost, stronger heat radiating capacity, uniform temperature, less limitation on the layout of electronic components (heat sources) and the like, so that the temperature difference between the upper part and the lower part of the heat superconducting radiating plate can be effectively reduced, the heat radiating effect of the heat superconducting radiating plate is improved, the problem that the performance of devices in the area is reduced or even loses efficacy due to excessive concentration of heat is avoided, the heat radiating efficiency and the heat radiating capacity of the whole heat superconducting radiating plate can be improved, and the development requirements of miniaturization, light weight, high integration degree, uniform temperature.
As an example, the thermal superconducting heat sink has only one potting sealing opening 20, which is usually located at the uppermost portion of the thermal superconducting heat sink and connected to the heat dissipation pipe in the heat dissipation region at the uppermost portion. For example, in the present embodiment, the filling sealing opening 20 is connected to the second heat dissipating pipe 124 at the uppermost portion of the second heat dissipating area. After the heat transfer working medium 18 is filled into the thermal superconducting heat dissipation plate, the filling sealing port 20 is sealed. The filling of the heat transfer working medium 18 through the potting opening 20 has the advantages of simple process, high reliability, good heat dissipation consistency and the like.
As an example, the second condensate guiding and isolating region 123 is inclined upwards in a direction away from the heat source and extends to a pipe-free region on a side of the thermal superconducting heat dissipation plate 1 away from the heat source. By arranging the inclined second condensate guiding and isolating area 123, the condensate preferentially flows to the second liquid phase evaporation area 121 along the inclined pipeline, and the redundant liquid overflows to the adjacent first gas phase condensation heat dissipation area 112 below the first liquid phase evaporation area through the upper end part of the first liquid phase evaporation isolating area 13, so that the balance between the liquid amount in each liquid phase evaporation area and the liquid amount in each gas phase condensation heat dissipation area is ensured.
The heat dissipation pipes of the functional regions inside the superconducting heat dissipation plate are connected to each other (for easy understanding, the positions and shapes of the functional regions are generally indicated by dashed boxes in fig. 2 and 3 of this embodiment, but actually, there is no strict separation boundary between the functional regions in reality). According to the pressure balance principle, the excess steam (with higher temperature and higher corresponding pressure) which is not condensed in the upper gas-phase condensation heat dissipation area flows downwards through the communication area to flow to the next adjacent gas-phase condensation heat dissipation area for heat dissipation and cooling; similarly, the uncondensed vapor (with higher temperature and corresponding higher pressure) in the lower part also flows upwards through the communication area and flows to the adjacent previous vapor phase condensation heat dissipation area for heat dissipation and condensation, and of course, the uncondensed vapor can also flow to the adjacent previous and next vapor phase condensation heat dissipation areas at the same time. Thereby ensuring the balance of the internal pressure and the uniformity of the temperature of the whole partitioned heat superconducting radiating plate.
As an example, the thermal superconducting heat dissipation plate realizes heat transfer based on a thermal superconducting heat transfer technology; for example, the heat transfer working medium 18 is filled in the sealed and mutually communicated micro-channels, and the phase change heat transfer technology of heat superconducting heat transfer is realized through evaporation or condensation phase change of the heat transfer working medium 18. The heat superconducting heat dissipation plate may be in a single-side expansion form formed by a rolling and blowing process, that is, the heat superconducting heat dissipation pipeline (including the first heat dissipation pipeline 113, the second heat dissipation pipeline 124, and the first connection pipeline 14) protrudes only on one surface of the heat superconducting heat dissipation plate, or may be in a double-side expansion form, that is, the heat superconducting heat dissipation pipeline protrudes on two surfaces of the heat superconducting heat dissipation plate at the same time, or may be in a welding type single-side flat, double-side flat, or double-side pipeline protrusion form, which is not strictly limited in this embodiment. As an example, the surface of the thermal superconducting heat sink may be anodized to form an oxide film (not shown) on the surface of the thermal superconducting heat sink, or subjected to a powder spraying process or a painting process, thereby improving the corrosion resistance of the thermal superconducting heat sink, and increasing the emissivity of the thermal superconducting heat sink to enhance the heat exchange with the ambient air.
It should be noted that the heat source, that is, the device, is a component capable of implementing a predetermined function, including but not limited to a microprocessor, a memory, a radio frequency generator, a power amplifier, a filter, a power manager, etc., which generates heat during operation to cause a temperature increase, and an excessively high temperature may reduce the operating speed of the device or even damage the device, so that the device needs to dissipate heat in time. The heat source is preferably disposed at a position corresponding to the liquid phase evaporation zone of each heat dissipation zone.
It should be noted that, in the present specification, definitions like "first", "second" (for example, a first heat dissipation area, a second heat dissipation area, a first liquid phase evaporation area, a second liquid phase evaporation area, etc.) are merely for convenience of description and have no substantial limiting meaning, and for example, a region formed by a plurality of liquid phase evaporation areas and a plurality of vapor phase condensation heat dissipation areas may be defined as the first heat dissipation area, or an upper region may be defined as the first heat dissipation area, etc.
As an example, the thermal superconducting heat dissipation plate further includes a non-pipe heated region 19, the non-pipe heated region 19 extends upward from one side of the first heat dissipation region to one side of the second heat dissipation region (the non-pipe heated region 19 in the second embodiment extends upward from one side of the first heat dissipation region to one side of the second heat dissipation region and the third heat dissipation region), and the non-pipe heated region can facilitate connection between the thermal superconducting heat dissipation plate and the heat sink substrate 3, and avoid damage to the thermal superconducting heat dissipation pipe when the thermal superconducting heat dissipation plate is connected to the heat sink substrate.
As an example, the first heat dissipation pipes 113 and the second heat dissipation pipes 124 are distributed in a hexagonal honeycomb shape, or the first heat dissipation pipes 113 and the second heat dissipation pipes 124 enclose a plurality of pipe-free islands with a hexagonal shape. As an example, the first heat dissipation pipes 113 are not distributed in the lower right region of the first heat dissipation region, but form a no-pipe island region 21 in the lower right region of the first heat dissipation region, or the first heat dissipation pipe 113 located at the bottommost portion of the first heat dissipation region is inclined upward in a direction away from the heat source; through with first heat dissipation pipeline 113 and second heat dissipation pipeline 124 set up to be hexagonal honeycomb distribution and first heat dissipation pipeline 113 tilt up of bottommost for can set up more pipeline passageways in limited heat dissipation region, and this passageway is comparatively gentle, and fluid resistance is little, is favorable to breaking away from of bubble to remove and the replenishment of liquid working medium, therefore can in time remove the bubble to keep away from heat source department and can in time replenish the liquid working medium after the condensation to near on heat source department.
The heat-superconducting heat dissipation plate can be directly contacted with devices to realize heat dissipation, for example, a plurality of devices can be directly attached to positions corresponding to each liquid phase evaporation area (as shown in figure 2), and the heat dissipation mode through the single heat-superconducting heat dissipation plate is particularly suitable for heat dissipation of low-power devices.
Example two
As shown in fig. 3, the present invention further provides another structure of a thermal superconducting heat dissipation plate 1, and the thermal superconducting heat dissipation plate 1 of the present embodiment is mainly different from the first embodiment in that the thermal superconducting heat dissipation plate 1 of the first embodiment includes only a first heat dissipation area and a second heat dissipation area, and thus includes only two liquid phase evaporation areas and two vapor phase condensation heat dissipation areas. The thermal superconducting heat sink of the present embodiment includes a third heat dissipation region, a second liquid phase evaporation isolation region 16, and a second connection pipe 17 in addition to the first heat dissipation region and the second heat dissipation region. The first heat dissipation area and the second heat dissipation area of the present embodiment have the same structure as the first embodiment, and please refer to the first embodiment for brevity. In this embodiment, the third heat dissipation area is located above the second heat dissipation area (so that the filling sealing opening 20 is connected to the pipeline of the third heat dissipation area); the third heat dissipation area includes a third liquid phase evaporation area 151, a third vapor phase condensation heat dissipation area 152 and a third condensate flow guiding isolation area 153, the third vapor phase condensation heat dissipation area 152 is located above the third liquid phase evaporation area 151, the third condensate flow guiding isolation area 153 is located in the third vapor phase condensation heat dissipation area 152 and preferably has a distance with the third liquid phase evaporation area 151 (i.e., a circulation pipeline is arranged between the third vapor phase condensation heat dissipation area and the third liquid phase evaporation area, the pipeline is substantially located above the second liquid phase evaporation isolation area 16), the third condensate flow guiding isolation area 153 is preferably inclined upward along a direction departing from the heat source and extends to a non-pipeline area on a side of the superconducting heat dissipation plate departing from the heat source, and third liquid phase evaporation areas 151 and third vapor phase condensation heat dissipation areas 152 are distributed with mutually communicated third pipeline 154 (i.e., the third liquid phase evaporation area 151 and the third vapor phase condensation heat dissipation area 152 are mutually communicated), the third heat dissipation pipelines 154 are preferably distributed in a polygonal honeycomb shape; the second liquid-phase evaporation and isolation area 16 is located between the third liquid-phase evaporation area 151 and the second vapor-phase condensation and heat dissipation area 122, and is used for isolating the third liquid-phase evaporation area 151 from the second vapor-phase condensation and heat dissipation area 122, and the second liquid-phase evaporation and isolation area 16 extends from the bottom of the third liquid-phase evaporation area 151 to the side of the third liquid-phase evaporation area 151 away from the heat source (in a nearly L-shaped structure); the bottom of the third liquid phase evaporation zone 151 is inclined upward in a direction away from the heat source; the second connecting pipeline 17 is located at a side of the second liquid phase evaporation isolation region 16 away from the third liquid phase evaporation region 151, and the second connecting pipeline 17 connects the third heat dissipation pipeline 154 and the second heat dissipation pipeline 124. The third heat dissipation pipeline 154 and the second connecting pipeline 17 are both heat superconducting heat dissipation pipelines, heat transfer working media 18 are filled in the heat superconducting heat dissipation pipelines, and the heat transfer working media 18 comprise liquid; the third heat dissipation channels 154 are also preferably hexagonal honeycomb shaped to increase channel area, reduce fluid resistance, and facilitate uniform distribution of the heat transfer medium 18. The working principle of the thermal superconducting heat sink of this embodiment is the same as that of the thermal superconducting heat sink of the first embodiment, and please refer to the description of the first embodiment. The heat superconducting radiating plate is divided into three radiating areas, more devices can be arranged, and the requirement of high integration level of 5G base equipment can be met.
Of course, the heat superconducting heat dissipation plate may further include 4 or more than 4 heat dissipation areas as needed, and the setting of each heat dissipation area refers to the foregoing content, that is, the heat superconducting heat dissipation plate may include 4 or more than 4 liquid phase evaporation areas, vapor phase condensation heat dissipation areas, condensate flow guiding isolation areas, and more liquid phase evaporation isolation areas, and the size of each area may be set according to the heat dissipation requirement of the heat source, and in this embodiment, the heat superconducting heat dissipation plate is not strictly limited and is not expanded one by one.
EXAMPLE III
As shown in fig. 4 and fig. 5, the present invention further provides a thermal superconducting heat sink, which includes a heat sink substrate 3 and a plurality of thermal superconducting heat sinks according to the first embodiment or the second embodiment (fig. 4 is a thermal superconducting heat sink taking the thermal superconducting heat sink in fig. 2 as an example); the heat sink substrate 3 has a first surface and a second surface opposite to the first surface, the first surface is provided with a plurality of mounting areas for placing the devices 4 from bottom to top, the mounting areas are preferably in one-to-one correspondence with the liquid phase evaporation areas, that is, if the heat superconducting heat dissipation plate in the first embodiment corresponds to the heat superconducting heat dissipation plate in the second embodiment, the number of the mounting areas is 2, if the heat superconducting heat dissipation plate in the second embodiment corresponds to the heat superconducting heat dissipation plate in the first embodiment, the number of the mounting areas is 3, the devices 4 mounted in a single mounting area can be single or multiple, types of the devices 4 mounted in different mounting areas can be the same or different, and the present embodiment is not limited thereto; the plurality of thermal superconducting heat dissipation plates are arranged on the second surface of the heat sink substrate 3 in parallel at intervals in the transverse direction, and each thermal superconducting heat dissipation plate extends in the longitudinal direction (that is, the device 4 is located on the side surface of the thermal superconducting heat dissipation device, that is, the thermal superconducting heat dissipation device is heated and conducts heat on the side surface).
As an example, the second surface of the heat sink substrate 3 has a groove, one end of the thermal superconducting heat sink has a bent portion 22, the bent portion 22 is inserted into the groove, and the bent portion 22 is generally formed by bending the non-pipe heated area 19 of the thermal superconducting heat sink. Specifically, a plurality of slots are distributed at intervals in the channel, the plurality of thermal superconducting heat dissipation plates are inserted into the slots through the bending portions 22 in a one-to-one correspondence manner, and the position of the heat sink substrate 3 corresponding to the first surface of the liquid phase evaporation area of each thermal superconducting heat dissipation plate is the installation area for placing the device 4, so that heat emitted by the device 4 can be conducted to the thermal superconducting heat sink as soon as possible through a short path. In this embodiment, each groove is perpendicular to the surface of the heat sink substrate 3, and in practical use, each groove may also be inclined by a certain angle compared to the surface of the heat sink substrate 3, and the perpendicular direction is only used for indicating a direction trend, and does not mean that an included angle of 90 degrees is formed with the horizontal plane in a strict sense. As an example, the thermal superconducting heat sink may be fixedly connected to the heat sink substrate 3 through any one or more of a mechanical extrusion process, a thermal conductive adhesive bonding process, or a brazing welding process, so as to increase the bonding strength as much as possible, reduce the bonding thermal resistance, and improve the heat dissipation capability and efficiency of the thermal superconducting heat sink.
As an example, a sintered wick heat pipe (not shown) is buried in the heat sink substrate 3. Sintering core heat pipe for by the metal powder sintering of certain mesh number on the inner wall of a metal pipe and the integrative sintering powder tube core of pipe wall that forms, the sintering in metal powder on the metal pipe is inside forms the imbibition core capillary structure, makes sintering core heat pipe has higher capillary suction, makes sintering core heat pipe's heat conduction direction does not receive the influence of gravity, and sintering imbibition core capillary structure has strengthened evaporation heat absorption and condensation and has released heat, has improved the heat conductivility and the transmission power of heat pipe greatly, makes sintering core heat pipe has great axial equivalent coefficient of heat conductivity (be several hundred times to the thousand times of copper). The sintering core heat pipe is embedded in the radiator substrate 3, so that heat generated by a device 4 arranged on the surface of the radiator substrate 3 can be quickly diffused to other positions of the radiator substrate 3, the heat distribution on the radiator substrate 3 is uniform, and the heat dissipation efficiency and the heat dissipation capacity of the heat superconducting radiator can be effectively improved.
The heat generated when the heat source (device 4) on the surface of the radiator substrate 3 works is quickly transferred to the whole radiator substrate 3 through the sintering core heat pipe, and the radiator substrate 3 quickly transfers the heat to each thermal superconducting radiating plate to finish the heat dissipation through the thermal superconducting radiating plates.
The heat superconducting radiator can be used for radiating various electronic devices with high power density, can effectively improve the radiating uniformity and radiating efficiency, and is particularly suitable for radiating 5G communication base station equipment with high integration level, high power, miniaturization, light weight and high heat flow density.
Example four
The invention also provides 5G base station equipment, wherein the 5G base station equipment comprises a device and the thermal superconducting radiator in the third embodiment, and the device of the 5G base station equipment is arranged in the installation area of the radiator substrate. For the introduction of the thermal superconducting heat sink, reference is also made to the foregoing, and details are not repeated for the sake of brevity. Including but not limited to a radio frequency generator, power amplifier, filter, microprocessor, memory, power manager, etc. The 5G base station equipment disclosed by the invention has the advantages that the heat dissipation efficiency and the heat dissipation uniformity can be greatly improved under the condition of not increasing the volume and the weight of the equipment, and the service life of the equipment is prolonged and the performance of the equipment is improved.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A heat superconducting heat dissipation plate is characterized by comprising a first heat dissipation area, a second heat dissipation area, a first liquid phase evaporation isolation area and a first connecting pipeline; the second heat dissipation area is positioned above the first heat dissipation area; the first heat dissipation area comprises a first liquid phase evaporation area and a first gas phase condensation heat dissipation area positioned above the first liquid phase evaporation area, and first heat dissipation pipelines which are communicated with each other are distributed in the first liquid phase evaporation area and the first gas phase condensation heat dissipation area; the second heat dissipation area comprises a second liquid phase evaporation area, a second gas phase condensation heat dissipation area and a second condensate flow guiding isolation area, the second gas phase condensation heat dissipation area is positioned above the second liquid phase evaporation area, the second condensate flow guiding isolation area is positioned in the second gas phase condensation heat dissipation area, and second heat dissipation pipelines which are communicated with each other are distributed in the second liquid phase evaporation area and the second gas phase condensation heat dissipation area; the first liquid phase evaporation isolation area is positioned between the second liquid phase evaporation area and the first gas phase condensation heat dissipation area and is used for isolating the second liquid phase evaporation area from the first gas phase condensation heat dissipation area, and the first liquid phase evaporation isolation area extends from the bottom of the second liquid phase evaporation area to one side of the second liquid phase evaporation area, which is far away from the heat source; the first connecting pipeline is positioned on one side of the first liquid phase evaporation isolation area, which is far away from the second liquid phase evaporation area; the bottoms of the first liquid-phase evaporation area and the second liquid-phase evaporation area are inclined upwards along the direction of a back heat source; the first heat dissipation pipeline, the second heat dissipation pipeline and the first connecting pipeline are communicated with each other and are all heat superconducting heat dissipation pipelines, and heat transfer working mediums are filled in the heat superconducting heat dissipation pipelines.
2. The thermal superconducting heat sink of claim 1, wherein: the heat superconducting heat dissipation plate further comprises a third heat dissipation area, a second liquid phase evaporation isolation area and a second connecting pipeline; the third heat dissipation area is positioned above the second heat dissipation area; the third heat dissipation area comprises a third liquid phase evaporation area, a third gas phase condensation heat dissipation area and a third condensate flow guiding isolation area, the third gas phase condensation heat dissipation area is positioned above the third liquid phase evaporation area, the third condensate flow guiding isolation area is positioned in the third gas phase condensation heat dissipation area, and third heat dissipation pipelines which are communicated with each other are distributed in the third liquid phase evaporation area and the third gas phase condensation heat dissipation area; the second liquid-phase evaporation isolation area is positioned between the third liquid-phase evaporation area and the second gas-phase condensation heat dissipation area and is used for isolating the third liquid-phase evaporation area from the second gas-phase condensation heat dissipation area, and the second liquid-phase evaporation isolation area extends from the bottom of the third liquid-phase evaporation area to one side of the third liquid-phase evaporation area, which is far away from the heat source; the bottom of the third liquid-phase evaporation zone is inclined upward in a direction away from the heat source; the second connecting pipeline is positioned on one side of the second liquid-phase evaporation isolation region, which is far away from the third liquid-phase evaporation region, and the third heat dissipation pipeline is communicated with the second heat dissipation pipeline through the second connecting pipeline; the third heat dissipation pipeline and the second connecting pipeline are both heat superconducting heat dissipation pipelines, and heat transfer working mediums are filled in the heat superconducting heat dissipation pipelines.
3. The thermal superconducting heat sink of claim 1, wherein: the second condensate flow guiding and isolating area inclines upwards along the direction departing from the heat source and extends to the pipeline-free area on the side, away from the heat source, of the heat superconducting heat dissipation plate.
4. The thermal superconducting heat sink of claim 1, wherein: the thermal superconducting heat dissipation plate further comprises a non-pipe heated region extending upward from one side of the first heat dissipation region to one side of the second heat dissipation region.
5. The thermal superconducting heat sink of claim 1, wherein: the first heat dissipation pipeline and the second heat dissipation pipeline are distributed in a hexagonal honeycomb shape.
6. Thermal superconducting cooling plate according to claim 2, characterized in that: the third condensate flow guiding and isolating area inclines upwards along the direction departing from the heat source and extends to the pipeline-free area on the side, away from the heat source, of the heat superconducting heat dissipation plate.
7. Thermal superconducting cooling plate according to any one of claims 1 or 2, characterized in that: the surface form of the heat superconducting heat dissipation plate comprises one of single-sided expansion, double-sided expansion, single-sided flatness and double-sided flatness.
8. A thermal superconducting heat sink, comprising a heat sink substrate and a plurality of thermal superconducting heat sink plates according to any one of claims 1 to 7; the radiator substrate is provided with a first surface and a second surface opposite to the first surface, and the first surface is provided with a plurality of mounting areas for placing devices from bottom to top; the plurality of heat superconducting radiating plates are arranged on the second surface of the radiator substrate in parallel at intervals in the transverse direction, and each heat superconducting radiating plate extends along the longitudinal direction.
9. The thermal superconducting heat sink of claim 8, wherein: the second surface of the radiator substrate is provided with a groove channel, one end of the heat superconducting radiating plate is provided with a bending part, and the bending part is inserted into the groove channel.
10. A5G base station device, the 5G base station device comprising means characterized by: the 5G base station apparatus further comprising a thermal superconducting heat sink according to any one of claims 8 or 9, the devices of the 5G base station apparatus being disposed at a mounting area of the heat sink substrate.
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| CN202010568097.1A CN111741650A (en) | 2020-06-19 | 2020-06-19 | Heat superconducting radiating plate, radiator and 5G base station equipment |
| PCT/CN2021/070652 WO2021253813A1 (en) | 2020-06-19 | 2021-01-07 | Thermal superconducting heat dissipation plate, heat dissipation device and 5g base station device |
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| CN202010568097.1A CN111741650A (en) | 2020-06-19 | 2020-06-19 | Heat superconducting radiating plate, radiator and 5G base station equipment |
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