CN216960588U - Heat dissipation device and electronic equipment - Google Patents
Heat dissipation device and electronic equipment Download PDFInfo
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- CN216960588U CN216960588U CN202122979111.XU CN202122979111U CN216960588U CN 216960588 U CN216960588 U CN 216960588U CN 202122979111 U CN202122979111 U CN 202122979111U CN 216960588 U CN216960588 U CN 216960588U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The application relates to the technical field of heat dissipation, in particular to a heat dissipation device and electronic equipment. Wherein, heat abstractor includes: a substrate; the cover plate is arranged at intervals with the substrate; the radiating fins are arranged between the base plate and the cover plate; and the heat pipe is connected with the substrate and the cover plate to form a closed cavity, the closed cavity is used for storing a refrigerant, and a woven layer structure is arranged in the closed cavity. The woven layer structure in the closed cavity can provide capillary force for the refrigerant, so that the heat dissipation device has the characteristic of gravity resistance. Meanwhile, the manufacturing process of the braided layer structure is simple, and the reliability of the radiator is improved to a certain extent.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat dissipation device and electronic equipment.
Background
As the current electronic devices gradually adopt a light and thin structure as a target, the size of each component should be reduced accordingly, but the heat generated by the size reduction of the electronic devices becomes a major obstacle for improving the performance of the electronic devices and systems. In order to solve the heat dissipation problem of high heat flux devices, many manufacturers have made a lot of attempts to improve the conventional heat pipe or VC heat sink. Among these improved designs, the improvement effect represented by the 3DVC process is particularly significant, and the heat dissipation performance is greatly improved compared with that of a heat pipe or a VC heat sink.
At present, 3DVC types are various in the market, however, one part of the 3DVC does not have the anti-gravity characteristic, and the other part of the 3DVC has the anti-gravity characteristic but has poor heat dissipation effect, so that the 3DVC can not meet the requirements of users.
SUMMERY OF THE UTILITY MODEL
In view of this, the present application provides a heat dissipation apparatus and an electronic device, so as to solve the technical problem that a part of the heat sink in the prior art does not have the anti-gravity property, and another part of the heat sink does not dissipate heat well and cannot meet the user requirement.
In order to solve the above technical problem, a first technical solution provided by the present application is: provided is a heat dissipating device including: a substrate; the cover plate is arranged at intervals with the substrate; the radiating fins are arranged between the base plate and the cover plate; and the heat pipe is connected with the substrate and the cover plate to form a closed cavity, the closed cavity is used for storing a refrigerant, and a woven layer structure is arranged in the closed cavity and used for providing capillary force for the refrigerant.
The heat pipe is characterized in that a first cavity is formed in the base plate, a second cavity is formed in the cover plate, the first cavity and the second cavity are communicated with the heat pipe to form a closed cavity, and the woven layer structure is arranged on the inner surfaces of the first cavity, the second cavity and the heat pipe.
Wherein the heat dissipation fins and the heat pipe are vertically connected between the base plate and the cover plate, respectively.
The heat pipe is vertically connected between the base plate and the cover plate, the radiating fins are horizontally distributed between the base plate and the cover plate in a stacking mode, and the heat pipe penetrates through the radiating fins.
The heat pipe is wound on the outer side of the radiating fin, the base plate is provided with a first pipeline, the cover plate is provided with a second pipeline, and the heat pipe is communicated with the first pipeline and the second pipeline respectively to form the closed cavity.
The surface of the base plate, which is far away from the cover plate, is provided with a first groove, the surface of the cover plate, which is far away from the base plate, is provided with a second groove, the first pipeline is embedded in the first groove, and the second pipeline is embedded in the second groove.
Wherein, still include: and the heat source connecting surface is used for connecting an external heat source, and the heat source connecting surface is the surface of the substrate far away from the cover plate or the surface of the cover plate far away from the substrate.
Wherein, heat exchange assembly includes: the first cold plate is arranged on the surface, far away from the base plate, of the cover plate; the second cold plate is arranged on the surface of the base plate, which is far away from the cover plate; the circulating pipe is connected with the first cold plate and the second cold plate and matched with the first cold plate and the second cold plate to form a circulating channel, and the circulating channel is used for storing circulating liquid; and the circulating pump is arranged on the circulating pipe.
In order to solve the above technical problem, a second technical solution provided by the present application is: an electronic apparatus is provided, including a body part including a heat source; a heat sink in contact with the heat source for dissipating heat from the heat source; wherein, the heat abstractor is any one of the above heat abstractor.
The beneficial effect of this application: different from the prior art, the heat pipe, the substrate and the cover plate form a closed cavity, and the refrigerant is stored in the closed cavity, so that the heat source connected with the substrate or the cover plate can be quickly radiated, and the radiating effect is good; the weaving layer structure is arranged in the closed cavity, and can provide capillary force for the refrigerant in the closed cavity, so that the heat dissipation device has the characteristic of gravity resistance and can normally work under the condition of counter-gravity installation.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation device according to a first embodiment of the present application;
fig. 2 is another schematic view of the woven structure of the first embodiment of the present application;
FIG. 3 is a schematic view of another structure of a heat pipe and a heat dissipating fin according to the first embodiment of the present application;
fig. 4 is a schematic structural diagram of a heat dissipation device according to a second embodiment of the present application;
fig. 5 is a schematic structural diagram of a heat dissipation device according to a third embodiment of the present application;
fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.
The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indicators such as up, down, left, right, front, and rear … … in the embodiments of the present application are only used to explain the relative position relationship between the components, the movement, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Fig. 1 is a schematic structural diagram of a heat dissipation device according to a first embodiment of the present disclosure. The heat dissipating device includes a base plate 11, a cover plate 12, a heat pipe 13, and heat dissipating fins 15. Wherein, apron 12 and base plate 11 interval set up, and radiating fin 15 sets up between base plate 11 and apron 12, and heat pipe 13 connects base plate 11 and apron 12 in order to form airtight cavity, and the refrigerant is stored in the airtight cavity, is provided with weaving layer structure 14 in the airtight cavity, and weaving layer structure 14 provides capillary force for the refrigerant.
When the heat dissipation device is used, under the condition that the temperature is slightly higher than the room temperature, the refrigerant in the cavity is in a boiling state, heat transferred from an external heat source on the base plate 11 or the cover plate 12 is transferred to the heat pipe 13 and the heat dissipation fins 15, and the heat pipe 13 and the heat dissipation fins 15 dissipate heat to the outside, so that the heat dissipation efficiency is improved, the temperature inside electronic equipment 40 (see fig. 6) adopting the heat dissipation device 10 is reduced, the normal operation of the equipment is ensured, and the service life of the equipment is prolonged. During the heat dissipation process, the braid structure 14 will generate capillary force, so that the heat dissipation device 10 has a certain anti-gravity characteristic in the counter-gravity field. In this embodiment, braided structure 14 is a fine structure, such as a mesh or fiber or a composite capillary or sintered powder, and in this embodiment, braided structure 14 is a sintered powder, such as copper powder.
It can be understood that a first cavity 113 is formed in the base plate 11, a second cavity 123 is formed in the cover plate 12, one end of the heat pipe 13 is welded to the base plate 11 and is communicated with the first cavity 113, and the other end of the heat pipe 13 is welded to the cover plate 12 and is communicated with the second cavity 123 to form a sealed cavity. The sealed cavity is filled with a refrigerant. When the temperature difference exists between the cover plate 12 and the substrate 11, the refrigerant can be boiled and can flow from the cover plate 12 to the substrate 11 through the braid structure 14, or the refrigerant can flow from the substrate 11 to the cover plate 12 through the braid structure 14, so that the contact area of the refrigerant with the substrate 11 and the cover plate 12 is increased, and the heat dissipation efficiency is improved; moreover, the heat sink 10 has anti-gravity performance, and can work normally even in the case of installation against gravity.
Specifically, braided structure 14 is disposed within first cavity 113, second cavity 123, and an inner surface of heat pipe 13. Specifically, in one embodiment, as shown in fig. 1, continuous braided structure 14 is disposed on the entire inner surface of first cavity 113 and the entire inner surface of second cavity 123, and continuous braided structure 14 is also disposed on the inner surface of heat pipe 13, and braided structure 14 in heat pipe 13 has one end connected to braided structure 14 in first cavity 113 on the side close to heat pipe 13 and the other end connected to braided structure 14 in second cavity 123 on the side close to heat pipe 13. In another embodiment, as shown in fig. 2, braided structure 14 is disposed on an inner surface of first cavity 113 on a side adjacent to heat pipe 13, an inner surface of second cavity 123 on a side adjacent to heat pipe 13, and the entire inner surface of heat pipe 13. In other embodiments, braid structure 14 may also be disposed on other inner sides of first cavity 113 and second cavity 123, which is not limited in this embodiment.
The heat pipe 13 and the heat dissipation fins 15 are disposed between the substrate 11 and the cover plate 12, and one end of the heat pipe 13 is connected to the substrate 11 and the other end is connected to the cover plate 12.
It will be appreciated that, in one embodiment, as shown in fig. 1 and 2, the heat pipe 13 is vertically disposed between the base plate 11 and the cover plate 12, the heat dissipation fins 15 are horizontally stacked between the base plate 11 and the cover plate 12, and the heat pipe 13 is disposed through the heat dissipation fins 15. That is, the base plate 11 and the cover plate 12 are parallel, the plurality of heat dissipation fins 15 are horizontally stacked between the base plate 11 and the cover plate 12, the heat pipe 13 is perpendicular to the base plate 11 and the cover plate 12, one end of the heat pipe 13 is welded on the base plate 11, the other end of the heat pipe 13 penetrates through the heat dissipation fins 15 to be welded with the cover plate 12, and the first cavity 113 and the second cavity 123 are communicated to form a closed cavity. In this embodiment, the heat pipe 13 may be provided with many, and many heat pipes 13 evenly distributed are in radiating fin 15, and heat pipe 13 can be set to flat pipe, and the increase is with radiating fin 15's area of contact, helps further improving the radiating efficiency. In the embodiment, the temperature substrate 11 and the cover plate 12 may be temperature equalizing plates (Vapor chambers) with better heat conduction performance, and the specific number of the flat tubes and the heat dissipation fins 15 is set according to the size of the heat sink in actual production, which is not limited in the embodiment.
In another embodiment, as shown in FIG. 3, the heat dissipating fins 15 and the heat pipes 13 are vertically connected between the base plate 11 and the cover plate 12, respectively. That is, the base plate 11 is parallel to the cover plate 12, the heat radiation fins 15 are vertically provided between the base plate 11 and the cover plate 12, and one end is connected to the base plate 11 and the other end is connected to the cover plate 12. The heat pipe 13 is also vertically arranged between the substrate 11 and the cover plate 12, and one end of the heat pipe is welded with the substrate 11, and the other end of the heat pipe is welded with the cover plate 12, so as to communicate the first cavity 113 and the second cavity 123 to form a closed cavity. In this embodiment, one heat pipe 13 may be provided, and the heat pipe 13 is a flat pipe, and the specific size of the long axis of the flat pipe is defined according to the requirement in actual production, which is not limited herein. The heat radiating fins 15 are provided in a plurality, and the plurality of heat radiating fins 15 can be arranged around the flat pipes.
The heat dissipating device 10 further includes a heat source connecting surface 16, and the heat source connecting surface 16 is used for connecting an external heat source. In one embodiment, as shown in fig. 1 and 2, the heat source connection face 16 is the surface of the base plate 11 remote from the cover plate 12. In one embodiment, as shown in fig. 3, the heat source connection surface 16 is a surface of the cover plate 12 away from the substrate 11. In another embodiment, the heat source connection surface 16 is a surface of the substrate 11 away from the cover plate 12 and a surface of the cover plate 12 away from the substrate 11 (not shown).
In this embodiment, a first cavity 113 is formed in the substrate 11, a second cavity 123 is formed in the cover plate 12, the heat pipe 13 communicates the first cavity 113 and the second cavity 123 to form a sealed cavity, and the braid structure 14 is disposed in the sealed cavity. Under the condition of counter-gravity installation, when a temperature difference exists between the base plate 11 and the cover plate 12, the refrigerant can be boiled, the braid structure 14 provides capillary force for the refrigerant, so that the refrigerant has certain antigravity on the counter-gravity occasion, and heat transferred on the base plate 11 or the cover plate 12 due to an external heat source is transferred to the heat pipe 13 and the radiating fin 15, so that the temperature inside electronic equipment 40 (see fig. 6) adopting the radiating device 10 is reduced, the normal operation of the equipment is ensured, and the service life of the equipment is prolonged.
Fig. 4 is a schematic structural diagram of a heat dissipation device according to a second embodiment of the present application. The heat dissipation device includes a substrate 11, a cover plate 12, a first pipe 112 disposed on the substrate 11, a second pipe 122 disposed on the cover plate 12, a heat pipe 13, and a heat dissipation fin 15. The heat pipe 13 is connected to the first pipe 112 and the second pipe 122 to form a sealed cavity, the sealed cavity is also filled with a refrigerant, and the braided layer structure 14 is disposed in the sealed cavity.
When the heat dissipation device is used, the heat dissipation device 10 is installed under the condition of counter-gravity, when a temperature difference exists between the base plate 11 and the cover plate 12, the refrigerant in the closed cavity can boil, the braid structure 14 provides capillary force for the refrigerant, so that the refrigerant has certain antigravity on the counter-gravity occasion, heat on the base plate 11 can be transferred to the cover plate 12, or heat on the cover plate 12 is transferred to the base plate 11, heat between the base plate 11 and the cover plate 12 is exchanged, heat dissipation is accelerated, and the heat dissipation effect is good.
The heat pipe 13 is wound on the outer side of the heat dissipation fin 15, and is connected to the first pipe 112 on the base plate 11 and the second pipe 122 on the cover plate 12 to form a closed cavity.
Specifically, a first groove 111 is formed in the surface of the base plate 11, which is far away from the cover plate 12, a second groove 121 is formed in the surface of the cover plate 12, which is far away from the base plate 11, a first pipeline 112 is embedded in the first groove 111, a second pipeline 122 is embedded in the second groove 121, the heat pipe 13 is located outside the space between the base plate 11 and the cover plate 12, one end of the heat pipe 13 is connected with the first pipeline 112, and the other end of the heat pipe is connected with the second pipeline 122, so as to form an annular surrounding structure which is arranged outside the heat dissipation fin 15, and the annular surface, which is close to one side of the heat dissipation fin 15, is not in contact with the surface of the heat dissipation fin 15. The first pipe 112, the second pipe 122 and the heat pipe 13 are welded or integrally formed, which is not limited in this embodiment.
In addition, the heat dissipating device 10 further includes a plurality of heat dissipating tubes 18, the plurality of heat dissipating tubes 18 are disposed between the base plate 11 and the cover plate 12, wherein a portion of the heat dissipating tubes 18 are disposed through the heat dissipating fins 15, and one end of the heat dissipating tubes is welded to the base plate 11 and the other end is welded to the cover plate 12; the other part of the radiating pipe 18 is arranged outside the radiating fin 15, one end of the radiating pipe is welded with the base plate 11, and the other end of the radiating pipe is welded with the cover plate 12. A plurality of radiating pipes 18 are provided to further improve the radiating efficiency.
In the present embodiment, the heat pipe 13 is connected to the first pipe 112 on the substrate 11 and the second pipe 122 on the cover plate 12 to form a sealed cavity, and the braid structure 14 is disposed on the entire inner surface of the heat pipe 13, the first pipe 112 and the second pipe 122. When there is the difference in temperature between base plate 11 and apron 12, the refrigerant in the airtight cavity takes place the boiling, under the effect of the capillary force that weaving layer structure 14 provided, the refrigerant in the airtight cavity has certain antigravity characteristic under the adverse gravity occasion, can give apron 12 with the heat transfer on the base plate 11, perhaps gives base plate 11 with the heat transfer on the apron 12 to exchange the heat between base plate 11 and apron 12, make heat transfer device 10 be no matter in the same direction as gravity installation or the installation of adverse gravity all can normally work.
Fig. 5 is a schematic structural diagram of a heat dissipation device according to a third embodiment of the present application. The heat sink 10 includes a base plate 11, a cover plate 12, a heat pipe 13, and heat radiating fins 15. The cover plate 12 and the substrate 11 are arranged at an interval, the heat dissipation fins 15 are distributed between the substrate 11 and the cover plate 12 in a horizontal stacking manner, one end of the heat pipe 13 is arranged on the substrate 11, and the other end of the heat pipe penetrates through the heat dissipation fins 15 to be connected with the cover plate 12, so that a closed cavity is formed, and a refrigerant is filled in the closed cavity.
In an embodiment, a braided layer structure 14 is disposed in the sealed chamber, and specific structure is described in the first embodiment, which is not described in detail in this embodiment.
In another embodiment, no braid structure 14 is provided within the enclosed chamber, i.e., no braid structure 14 is provided on the inner surface of the heat pipe 13. However, in order to realize that the heat dissipation device 10 has a certain antigravity property under the condition of antigravity, in this embodiment, the heat dissipation device further includes a heat exchange assembly, the heat exchange assembly is respectively connected to the base plate 11 and the cover plate 12, and bypasses the heat dissipation fins 15, so as to exchange heat between the base plate 11 and the cover plate 12, thereby not only improving heat exchange efficiency between the base plate 11 and the cover plate 12, but also enabling the heat dissipation device 10 to normally work under the condition of antigravity installation.
Specifically, the heat exchange assembly includes a first cold plate 171, a second cold plate 172, a circulation pipe 173, and a circulation pump 174. The first cold plate 171 is disposed on the surface of the cover plate 12 away from the substrate 11; the second cold plate 172 is disposed on the surface of the substrate 11 away from the cover plate 12; the circulation pipe 173 connects the first cold plate 171 and the second cold plate 172, and forms a circulation channel for storing circulation fluid in cooperation with the first cold plate 171 and the second cold plate 172; the circulation pump 174 is disposed on the circulation pipe 173 for providing power to the circulation fluid to exchange heat between the first cold plate 171 and the second cold plate 172, and thus exchange heat between the base plate 11 and the cover plate 12.
It is understood that the first cold plate 171 is in contact with a side of the cover plate 12 remote from the base plate 11, and the second cold plate 172 is in contact with a side of the base plate 11 remote from the cover plate 12. In the present embodiment, the first cold plate 171 and the cover plate 12, and the second cold plate 172 and the base plate 11 may be integrally formed, or may be separately designed to meet the requirements of engineering applications. In addition, in this embodiment, the circulating liquid may be water with a large specific heat capacity.
In addition, the present embodiment also includes a heat source connection surface 16, the heat source connection surface 16 is disposed on a side surface of the first cold plate 171 away from the cover plate 12, and the first cold plate 171 is connected to an external heat source.
In this embodiment, when the heat exchanging device 10 is used, the circulation pump 174 is turned on, the circulation pump 174 circulates the circulation liquid in the circulation channel from the first cold plate 171 to the second cold plate 172, and then transfers the heat on the first cold plate 171 to the second cold plate 172 through the circulation liquid, the second cold plate 172 transfers the heat to the substrate 11 through heat transfer, the substrate 11 transfers the heat to the heat pipe 13 and the heat dissipating fins 15, and the heat dissipating fins 15 dissipate heat, so as to improve the heat exchanging efficiency between the substrate 11 and the cover plate 12, and the heat exchanging device 10 can normally work regardless of being installed along or against gravity.
Fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present application. An electronic apparatus 40 includes a body portion 41 and a heat sink 10. The main body 41 includes a heat source 411, the heat dissipation device 10 includes a heat source connection surface 16, and the heat source connection surface 16 is in contact with the heat source 411 for dissipating heat from the heat source 411, so as to prolong the service life of the main body 41. The heat dissipation device 10 in this embodiment may be any one of the first embodiment, the second embodiment, and the third embodiment, and the structure of the heat dissipation device 10 in the above embodiments has been described in detail, and is not described herein again. The body portion 41 may be a projector.
The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes that can be directly or indirectly applied to other related technologies, which are made by using the contents of the present specification and the accompanying drawings, are also included in the scope of the present application.
Claims (9)
1. A heat dissipating device, comprising:
a substrate;
the cover plate is arranged at intervals with the substrate;
the radiating fins are arranged between the base plate and the cover plate; and
the heat pipe is connected with the substrate and the cover plate to form a closed cavity, the closed cavity is used for storing a refrigerant, and a woven layer structure is arranged in the closed cavity and used for providing capillary force for the refrigerant.
2. The heat dissipating device of claim 1, wherein a first cavity is formed in the base plate, a second cavity is formed in the cover plate, the first cavity and the second cavity are both in communication with the heat pipe to form the sealed cavity, and the braid structure is disposed on the first cavity, the second cavity, and the inner surface of the heat pipe.
3. The heat dissipating device of claim 2, wherein the heat dissipating fins and the heat pipe are vertically connected between the base plate and the cover plate, respectively.
4. The heat dissipating device as claimed in claim 2, wherein the heat pipe is vertically connected between the base plate and the cover plate, the heat dissipating fins are horizontally stacked between the base plate and the cover plate, and the heat pipe is penetratingly disposed on the heat dissipating fins.
5. The heat dissipation device of claim 1, wherein the heat pipe is disposed around the outer side of the heat dissipation fin, the base plate is provided with a first pipeline, the cover plate is provided with a second pipeline, and the heat pipe is respectively communicated with the first pipeline and the second pipeline to form the sealed cavity.
6. The heat dissipation device as claimed in claim 5, wherein a first groove is formed on a surface of the substrate away from the cover plate, a second groove is formed on a surface of the cover plate away from the substrate, the first pipe is embedded in the first groove, and the second pipe is embedded in the second groove.
7. The heat dissipating device of claim 1, further comprising:
and the heat source connecting surface is used for connecting an external heat source, and the heat source connecting surface is the surface of the substrate far away from the cover plate or the surface of the cover plate far away from the substrate.
8. The heat dissipating device of claim 1, further comprising: a heat exchange assembly, the heat exchange assembly comprising:
the first cold plate is arranged on the surface of the cover plate far away from the base plate;
the second cold plate is arranged on the surface of the base plate far away from the cover plate;
the circulating pipe is connected with the first cold plate and the second cold plate and matched with the first cold plate and the second cold plate to form a circulating channel, and the circulating channel is used for storing circulating liquid; and
and the circulating pump is arranged on the circulating pipe.
9. An electronic device, comprising:
a body part including a heat source; and
a heat sink in contact with the heat source for dissipating heat from the heat source;
wherein the heat sink is the heat sink of any one of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122979111.XU CN216960588U (en) | 2021-11-30 | 2021-11-30 | Heat dissipation device and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122979111.XU CN216960588U (en) | 2021-11-30 | 2021-11-30 | Heat dissipation device and electronic equipment |
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| CN216960588U true CN216960588U (en) | 2022-07-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024041078A1 (en) * | 2022-08-22 | 2024-02-29 | 超聚变数字技术有限公司 | Heat dissipation module and electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024041078A1 (en) * | 2022-08-22 | 2024-02-29 | 超聚变数字技术有限公司 | Heat dissipation module and electronic device |
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