CN116156846A

CN116156846A - Heat dissipation device

Info

Publication number: CN116156846A
Application number: CN202310168714.2A
Authority: CN
Inventors: 赵秀红; 牟永斌
Original assignee: Shanghai Xunke Energy Saving Technology Co ltd
Current assignee: Shanghai Xunke Energy Saving Technology Co ltd
Priority date: 2020-05-21
Filing date: 2020-05-21
Publication date: 2023-05-23
Also published as: CN113710050B; CN113710050A

Abstract

The invention discloses a heat dissipating device which comprises a shell, a tube body and a filling tube. The housing includes an upper cover and a bottom plate that are joined to form a hollow chamber. The chamber has a first capillary tissue and a second capillary tissue therein. The first capillary tissue is locally in direct or indirect contact or connection with the second capillary tissue. The upper cover is provided with a plurality of first openings and second openings with the same number as the first openings, the first openings are covered with second capillary tissues, and the second openings are free of the second capillary tissues, so that the second openings and the cavity penetrate through. The number of the pipe bodies is equal to that of the first holes, and the pipe bodies are provided with two ports which are respectively communicated with the first holes and the second holes. The heat dissipation device has the advantages of high heat dissipation capacity, high heat dissipation efficiency, simplicity and reliability.

Description

Heat dissipation device

This application is a divisional application of the following patent applications:

application number: 202010415518.7;

filing date: 2020.05.21;

the invention name is as follows: heat dissipation device

Technical Field

The invention belongs to the technical field of heat dissipation, and relates to a heat dissipation device of power electronic equipment.

Background

The air-cooled heat dissipation device has the advantages of simplicity, reliability, low cost and the like, and is widely applied to the field of power electronic heat dissipation. However, with the rapid development of industries such as big data, AI, internet of things and the like, the power consumption of the hardware integrated circuit is larger and larger, and the heat productivity and the heat flux density are also larger and larger. The heat dissipation capability of conventional air-cooled heat dissipation devices such as heat pipe radiators and temperature equalizing plates is increasingly difficult to meet the requirements. The heat pipe has small heat transfer capability and small effective contact area with the heat source. The effective contact area of the temperature equalizing plate and the heat source is large, but the condensation area is difficult to expand, so that the heat dissipation capacity is limited. The temperature equalizing plate and the heat pipe are combined together for use in the industry, but the process is difficult, and the liquid working medium in the heat pipe flows back by gravity and has opposite flowing direction with the steam working medium, so that a liquid film gathers on the pipe wall of the heat pipe, and the heat exchange efficiency is poor. Therefore, there is a need for a more efficient and reliable heat dissipation device for electronic devices.

Disclosure of Invention

In order to solve the problem of difficult heat dissipation of the current power electronic equipment, the invention provides the heat dissipation device which can overcome the technical defects of the temperature equalization plate and the heat pipe, has the advantages of large heat dissipation capacity, high efficiency, small volume, convenient use and the like, inherits the advantages of simplicity, reliability and low price of the air cooling heat dissipation device, and provides a more advanced solution for the increasingly severe heat dissipation problem of the power electronic products.

The invention adopts the following technical scheme:

a heat dissipating device, comprising:

the shell comprises an upper cover and a bottom plate, wherein the upper cover is combined with the bottom plate, and a cavity is formed inside the shell;

a first capillary tissue is positioned in the cavity and fixed on the bottom plate, a second capillary tissue is positioned in the cavity and fixed on the upper cover, and the first capillary tissue and the second capillary tissue are locally and directly or indirectly contacted or connected;

the upper cover is provided with a plurality of first openings and second openings with the same number as the first openings, the second capillary tissues are covered at the first openings, and the second capillary tissues are not arranged at the second openings, so that the second openings penetrate through the cavity;

the pipe body is provided with two ports which are respectively communicated with a first opening and a second opening on the upper cover.

Optionally, the first capillary tissue and the second capillary tissue are any one or more of a silk screen, foam metal, metal felt, fiber bundles, powder porous structures, and the first capillary tissue and the second capillary tissue are the same structure or different structures.

Optionally, the first capillary tissue is provided with an uneven pattern or a part of the first capillary tissue is hollowed out.

Optionally, a third capillary tissue is arranged in the cavity, and is respectively contacted or connected with the first capillary tissue and the second capillary tissue so as to realize indirect contact or connection between the first capillary tissue and the second capillary tissue, and the third capillary tissue is a composite structure of any one or more of silk screen, foam metal, metal felt, fiber bundles or powder porous structures.

Optionally, the inner surface of the tube body is smooth or has a micro-rib structure.

Optionally, the tube body is a round tube or a flat tube or a micro-channel tube or a tube body with a round tube part and a flat tube part.

Optionally, the tube body further has a strip-shaped body in the side close to the first opening of the upper cover, and the strip-shaped body is in contact with or connected with the second capillary tissue at the first opening.

Optionally, the strip-shaped body is a solid structure or a capillary structure or a combination of a solid structure and a capillary structure.

Optionally, a first heat radiation fin group is laid on the outer surface of the tube body, and the first heat radiation fin group is one or more groups of fins.

Optionally, the outer surface of the upper cover is provided with a fin or a second heat radiation fin group.

Optionally, a support body is arranged in the cavity, and the support body is connected with the upper cover and the bottom plate.

Optionally, a filling pipe is arranged on the shell, one end of the filling pipe is closed, the other end of the filling pipe is communicated with the cavity, and the communication port can be located at any position of the shell.

In summary, the heat dissipation device of the present invention has a larger effective contact area with the heat source than the heat pipe. The condensation area is extended compared to a temperature equalization plate. And the flow direction of the vapor working medium and the liquid working medium in the tube body is consistent, so that the problems of large liquid film thickness and poor condensation heat exchange efficiency caused by the aggregation of the liquid working medium on the inner wall of the tube body are avoided.

Drawings

FIG. 1 is a schematic view of a heat dissipating device according to a first embodiment of the present invention;

FIG. 2 is a cross-sectional view of a first embodiment of a heat dissipating device according to the present invention;

FIG. 2a is a cross-sectional view of a tube body of a heat dissipating device according to a first embodiment of the present invention;

FIG. 3 is a cross-sectional view of a second embodiment of a heat dissipating device according to the present invention;

FIG. 3a is a schematic view of a first capillary structure of a heat dissipating device according to a second embodiment of the present invention;

fig. 4 is a schematic perspective view of a third embodiment of a heat dissipating device according to the present invention;

in the above figures: 1-shell, 2-tube, 3-filling tube, 4-strip, 5-first heat radiation fin group, 6-second heat radiation fin group, 11-upper cover, 12-bottom plate, 13-first capillary tissue, 14-second capillary tissue, 15-third capillary tissue, 16-support, 21-micro rib structure, 22-micro channel, 100-chamber, 111-first open pore, 112-second open pore.

Detailed Description

In the following detailed description, reference is made to the accompanying drawings which form a part hereof wherein like numerals designate like parts throughout, and in which is shown by way of illustration embodiments in which the subject matter may be practiced.

Fig. 1 and fig. 2 are a schematic external view and a cross-sectional view of a heat dissipating device according to a first embodiment of the present invention. It comprises a shell 1, a tube body 2, a filling tube 3 and a strip-shaped body 4. The casing 1 is provided with a plurality of tubes 2, and the number and positions of the tubes 2 are not limited. The housing 1 includes an upper cover 11 and a bottom plate 12, and the periphery of the upper cover 11 and the bottom plate 12 are welded, and an inner space thereof forms a chamber 100. The chamber 100 has a first capillary tissue 13, a second capillary tissue 14, and a support 16. The first capillary tissue 13 is fixed on the bottom plate 12, and the second capillary tissue 14 is fixed on the upper cover 11. The supporting body 16 connects the upper cover 11 and the bottom plate 12.

The upper cover 11 has a first opening 111 and a second opening 112. The pipe body 2 is provided with two ports, and the two ports are correspondingly inserted into the first opening 111 and the second opening 112 and are welded and fixed. The first opening 111 has the second capillary tissue 14, and the second opening 112 has no second capillary tissue 14, so that the second opening 112 penetrates the chamber 100.

One end of the filling pipe 3 is communicated with the chamber 100 to fill working medium, and the other end is sealed.

In the present embodiment, the first capillary tissue 13 has a portion protruding toward the second capillary tissue 14 to contact or connect the second capillary tissue 14, but is not limited thereto. The second capillary tissue 14 may have a portion protruding toward the first capillary tissue 13 to contact or connect the first capillary tissue 13; or the first capillary tissue 13 and the second capillary tissue 14 each have a portion protruding toward each other to be in contact with or connected to each other. The first capillary tissue 13 and the second capillary tissue 14 may be connected by sintering, but not limited to.

The first capillary tissue 13 and the second capillary tissue 14 may be selected from any one or more of a wire mesh, a metal foam, a metal felt, a fiber bundle, and a powder porous structure. The first capillary tissue 13 and the second capillary tissue 14 are the same structure or different structures.

Fig. 2a is a cross-sectional view of a tube body of a heat dissipating device according to a first embodiment of the present invention. The tube body 2 can be selected from a round tube, a flat tube or a micro-channel tube, and the inner surface is smooth or provided with a micro-rib structure 21. The tube 2 also has a strip-shaped body 4 inside, and the strip-shaped body 4 is adjacent to the first opening 111 side and is in contact with or connected to the second capillary tissue 14 thereat. The strip-shaped body 4 can be selected as a solid structure; or a capillary structure; or a combination of a physical structure and a capillary structure. In a tube 2 having microchannels 22, a strip 4 is positioned within any one or more of the microchannels 22.

The specific working principle is as follows: the cavity 100 is vacuumized through the filling pipe 3, then working medium is filled, and finally the opening end of the filling pipe 3 is welded and sealed. At least one heat source is in contact with the base plate 12 of the heat sink of the present invention. The working substance in the chamber 100 of the heat dissipating device absorbs the heat of the heat source and then evaporates in the first capillary tissue 13. As the first openings 111 are covered with the second capillary tissue 14, the vaporous working substance cannot penetrate there and is forced to enter the tube body 2 from the second openings 112 without capillary structures. The vapor state working medium gradually condenses into a liquid state working medium after heat is released from the outside in the pipe body 2, and the liquid state working medium flows back to the first opening 111 along the pipe body 2 under the action of pressure difference. The strip-shaped body 4 in the pipe body 2 helps the liquid working medium to smoothly flow back to the second capillary tissue 14 at the first opening 111. As the working fluid is vaporized at the first capillary tissue 13, a capillary pressure difference is formed, so that the liquid side of the first capillary tissue 13 has a relatively lower pressure than at the second capillary tissue 14, and the pressure difference guides the liquid working fluid to return from the second capillary tissue 14 into the first capillary tissue 13. With this circulation, heat is dissipated from the heat source to the environment.

Referring to fig. 3, a cross-sectional view of a second embodiment of a heat dissipating device according to the present invention is shown. As shown, the chamber 100 includes a first capillary tissue 13, a second capillary tissue 14, a third capillary tissue 15, and a support 16. The third capillary tissue 15 is in contact with or connected to the first capillary tissue 13 and the second capillary tissue 14, respectively, to achieve indirect contact with or connection of the first capillary tissue 13 and the second capillary tissue 14. The third capillary structure 15 may be selected from any one or more of a wire mesh, a metal foam, a metal felt, a fiber bundle, and a powder porous structure. In order to increase the condensation area and enhance the heat exchange effect, the second fin group 6 (shown in the figure) is laid on the outer surface of the upper cover 11 in this embodiment, but not limited to, and the same effect can be achieved by processing ribs (not shown in the figure) on the outer surface of the upper cover 11. Referring to fig. 3a, in this embodiment, the first capillary 13 has an uneven pattern (the shape of the pattern is not limited in the figure). The first capillary tissue 13 may further have a hollowed-out portion (not shown in the figure). The structure and working principle of other parts of the present embodiment are the same as those of the first embodiment of the heat dissipating device of the present invention, and are not described again.

Fig. 4 is a schematic perspective view of a third embodiment of a heat dissipating device according to the present invention. As shown in fig. 4, the pipe body 2 has a structure in which a round pipe portion is a flat pipe portion. The outer surface of the flat tube part of the tube body 2 is also laid with a plurality of groups of first radiating fin groups 5 with different structures. The tube body 2 is connected and fixed (e.g. brazing) with the shell 1, and then the first heat radiation fin group 5 is laid on the flat tube part, so that the problem that the tube body 2 penetrates through the first heat radiation fin group 5 and is connected and fixed (e.g. brazing) with the shell 1, and the first heat radiation fin group 5 deforms at high temperature is avoided. The filling tube 3 (not shown) is located between two first fin groups 5. The structure and working principle of other parts of the present embodiment are the same as those of the first embodiment of the heat dissipating device of the present invention, and are not described again.

According to the embodiment of the heat dissipation device, the heat dissipation device overcomes the defects of heat dissipation of the heat pipe and the temperature equalization plate, and can better meet the heat dissipation requirements of high power and high efficiency. The heat dissipation device has the advantages of compact structure, reliable performance, flexible use and low cost, provides a more advanced solution for the increasingly severe heat dissipation problem of power electronic products, and has great economic value.

Finally, it should be emphasized that the foregoing description is merely illustrative of the preferred embodiments of the invention, and that various changes and modifications can be made by those skilled in the art without departing from the spirit and principles of the invention, and any such modifications, equivalents, improvements, etc. are intended to be included within the scope of the invention.

Claims

1. A heat sink, comprising:

a housing, a cavity is formed in the housing, and a first opening and a second opening which are communicated with the cavity are formed in the housing;

a capillary tissue arranged on the wall of the chamber and covering the first opening;

the pipe body is arranged outside the shell and is provided with two ports, and the two ports of the pipe body are respectively communicated with the first opening and the second opening;

the capillary tissue is not arranged at the second opening, so that the second opening penetrates through the cavity;

and the cavity is filled with liquid working medium after being vacuumized.

2. The heat sink as recited in claim 1, wherein:

the capillary tissue comprises a first capillary tissue and a second capillary tissue, the first capillary tissue is locally and directly or indirectly contacted or connected with the second capillary tissue, the first capillary tissue is fixed at the bottom of the cavity, and the second capillary tissue covers the first opening.

3. The heat sink according to claim 2, wherein:

the capillary tissue further comprises a third capillary tissue which is in contact with or connected with the first capillary tissue and the second capillary tissue respectively so as to realize indirect contact or connection of the first capillary tissue and the second capillary tissue.

4. The heat sink as recited in claim 1, wherein:

the first opening and the second opening are both arranged at the top of the shell, and the pipe body is arranged at the outer side of the top of the shell.

5. The heat sink as recited in claim 1, wherein:

the pipe body is a U-shaped pipe.

6. The heat sink as recited in claim 1, wherein:

the inner surface of the tube body is smooth or has a micro-rib structure.

7. The heat sink as recited in claim 1, wherein:

the pipe body is a round pipe or a flat pipe or a micro-channel pipe or a pipe body with a part of round pipe and a part of flat pipe.

8. The heat sink as recited in claim 1, wherein:

the tube body is internally provided with a strip-shaped body, and the strip-shaped body is close to the side of the first opening and is contacted or connected with capillary tissues at the first opening.

9. The heat sink as recited in claim 8, wherein:

the strip-shaped body is a solid structure or a capillary structure or a combination of the solid structure and the capillary structure.

10. The heat sink as recited in claim 1, wherein:

and a radiating fin is arranged on the outer surface of the shell or the pipe body.

11. The heat sink as recited in claim 1, wherein:

the cavity is internally provided with a supporting body, and two ends of the supporting body are respectively connected with the top and the bottom of the cavity.